EP3467529A1 - Magnetischer sensor - Google Patents

Magnetischer sensor Download PDF

Info

Publication number
EP3467529A1
EP3467529A1 EP17802743.9A EP17802743A EP3467529A1 EP 3467529 A1 EP3467529 A1 EP 3467529A1 EP 17802743 A EP17802743 A EP 17802743A EP 3467529 A1 EP3467529 A1 EP 3467529A1
Authority
EP
European Patent Office
Prior art keywords
magnetic
sensing elements
converging
area
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP17802743.9A
Other languages
English (en)
French (fr)
Other versions
EP3467529A4 (de
EP3467529B1 (de
Inventor
Kentaro Ushioda
Makoto KAMENO
Chengbin Lin
Shuichi Okawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Corp filed Critical TDK Corp
Publication of EP3467529A1 publication Critical patent/EP3467529A1/de
Publication of EP3467529A4 publication Critical patent/EP3467529A4/de
Application granted granted Critical
Publication of EP3467529B1 publication Critical patent/EP3467529B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00Arrangements or instruments for measuring magnetic variables
    • G01R33/0011Arrangements or instruments for measuring magnetic variables comprising means, e.g. flux concentrators, flux guides, for guiding or concentrating the magnetic flux, e.g. to the magnetic sensor
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00Arrangements or instruments for measuring magnetic variables
    • G01R33/02Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/06Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
    • G01R33/09Magnetoresistive devices
    • G01R33/093Magnetoresistive devices using multilayer structures, e.g. giant magnetoresistance sensors
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00Arrangements or instruments for measuring magnetic variables
    • G01R33/02Measuring direction or magnitude of magnetic fields or magnetic flux
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00Arrangements or instruments for measuring magnetic variables
    • G01R33/02Measuring direction or magnitude of magnetic fields or magnetic flux
    • G01R33/06Measuring direction or magnitude of magnetic fields or magnetic flux using galvano-magnetic devices
    • G01R33/09Magnetoresistive devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N50/00Galvanomagnetic devices
    • H10N50/10Magnetoresistive devices
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R33/00Arrangements or instruments for measuring magnetic variables
    • G01R33/0047Housings or packaging of magnetic sensors ; Holders

Definitions

  • the present invention relates to a magnetic sensor and, more particularly, to a magnetic sensor having four bridge-connected magnetic sensing elements.
  • Magnetic sensors using a magnetic sensing element are widely used in an ammeter, a magnetic encoder, and the like.
  • magnetic sensors can be provided with an external magnetic member for collecting magnetic flux to a magnetic sensing element.
  • magnetic flux to be detected is not sufficiently concentrated on the magnetic sensing element, so that it is difficult to enhance detection accuracy.
  • a magnetic sensor described in Patent Document 2 has a magnetic layer on a sensor substrate on which the magnetic sensing element is formed, and magnetic flux to be detected is concentrated on the magnetic sensing element by the magnetic layer.
  • three magnetic layers are used to form two gaps, and two magnetic sensing elements are disposed in each of the two gaps to constitute a bridge circuit by four magnetic sensing elements in total.
  • the number of the gaps formed by the magnetic layers is two, so that two magnetic sensing elements constituting the bridge circuit are disposed in the same gap.
  • a current flowing in one of the two magnetic sensing elements is reduced, a current flowing in the other one thereof is increased, so that magnetic flux generated by the current flowing in one magnetic sensing element has a non-negligible influence on the other magnetic sensing element, which may deteriorate detection accuracy.
  • a magnetic sensor includes: a sensor substrate; first, second, and third magnetic layers provided on the sensor substrate; and bridge-connected first, second, third, and fourth magnetic sensing elements.
  • the first magnetic layer includes a first main area and first, second, third, and fourth converging areas each having a width gradually reduced with increasing distance from the first main area.
  • the second magnetic layer includes a second main area and fifth and seventh converging areas each having a width gradually reduced with increasing distance from the second main area.
  • the third magnetic layer includes a third main area and sixth and eighth converging areas each having a width gradually reduced with increasing distance from the third main area.
  • the end portions of the first, second, third, and fourth converging areas and the end portions of the fifth, sixth, seventh, and eighth converging areas face each other, respectively, through first, second, third, and fourth gaps, respectively.
  • the first, second, third, and fourth magnetic sensing elements are disposed on magnetic paths formed by the first, second, third, and fourth gaps, respectively.
  • the four magnetic sensing elements are disposed on the magnetic paths formed by the mutually different gaps, thus preventing magnetic flux generated by current flowing in one magnetic sensing element from affecting the other sensing element.
  • the magnetic sensor according to the present invention preferably further includes a first external magnetic member provided on the sensor substrate so as to cover the first main area. This can enhance selectivity of magnetic flux in a direction perpendicular to the sensor substrate.
  • the width of the first external magnetic member in a first direction that is the extending direction of the first to fourth gaps is preferably larger than the width of the first main area in the first direction, whereby the entire width of the first main area in the first direction is preferably covered with the first external magnetic member. This can suppress deterioration in detection accuracy attributable to displacement of the first external magnetic member.
  • the magnetic sensor according to the present invention preferably further includes a second external magnetic member provided near the second main area and a third external magnetic member provided near the third main area. This allows achievement of higher detection accuracy.
  • the first converging area and the fourth converging area are preferably line-symmetric with respect to a first line extending in the first direction that is the extending direction of the first to fourth gaps
  • the second converging area and the third converging area are preferably line-symmetric with respect to the first line.
  • the first converging area and the third converging area are preferably line-symmetric with respect to a second line extending in a second direction perpendicular to the extending direction of the first to fourth gaps
  • the second converging area and the fourth converging area are preferably line-symmetric with respect to the second line
  • the fifth converging area and the seventh converging area are preferably line-symmetric with respect to the second line
  • the sixth converging area and the eighth converging area are preferably line-symmetric with respect to the second line.
  • the first and third magnetic sensing elements may each overlap the first and second magnetic layers, and the second and fourth magnetic sensing elements may each overlap the first and third magnetic layers . This reduces leakage magnetic flux, allowing achievement of higher detection accuracy.
  • a cut part having a loop-shaped outer periphery is preferably formed in the first magnetic layer.
  • the first, second, third, and fourth magnetic sensing elements may each be constituted by a plurality of series-connected magnetic sensing elements disposed on the magnetic path formed by each of the first, second, third, and fourth gaps. This allows achievement of higher detection accuracy.
  • the magnetic sensor according to the present invention preferably further includes fourth magnetic layers disposed, in a plan view, between the plurality of magnetic sensing elements constituting each of the first, second, third, and fourth sensing elements.
  • This can reduce leakage magnetic flux from between the plurality of magnetic sensing elements.
  • the fourth magnetic layer may overlap the plurality of magnetic sensing elements constituting each of the first, second, third, and fourth sensing elements. This can further reduce the leakage magnetic flux from between the plurality of magnetic sensing elements.
  • the fourth magnetic layers may be divided in the first direction that is the extending direction of the first to fourth gaps. With this configuration, the fourth magnetic layers have magnetic anisotropy, allowing achievement of higher detection accuracy.
  • the first to fourth magnetic sensing elements are each preferably a magnetoresistive element.
  • the sensitivity directions of the magnetoresistive elements constituting the respective first to fourth magnetic sensing elements are preferably the same, and the magnetoresistive elements constituting the respective first to fourth magnetic sensing elements are each preferably a spin valve type GMR element.
  • the four magnetic sensing elements are disposed on the magnetic paths formed by mutually different gaps, so that it is possible to obtain a magnetic sensor with high detection accuracy by bridge-connecting the four magnetic sensing elements.
  • FIG. 1 is a schematic perspective view illustrating the outer appearance of a magnetic sensor 100 according to a preferred embodiment of the present invention.
  • FIG. 2 is a schematic exploded perspective view of the magnetic sensor 100
  • FIG. 3 is a schematic cross-sectional view taken along line A-A in FIG. 1 .
  • the magnetic sensor 100 includes a circuit board 10 having an opening 11, a sensor substrate 20 disposed in the opening 11, and first to fourth external magnetic members 31 to 34 fixed to the sensor substrate 20.
  • the sensor substrate 20 is a chip component smaller in size than the circuit board 10 and has a magnetic sensing element to be described later.
  • the first to fourth external magnetic members 31 to 34 are each a block made of a soft magnetic material having high permeability, such as ferrite.
  • the sensor substrate 20 has a substantially rectangular parallelepiped shape, and the first external magnetic member 31 is disposed on an element forming surface 21 constituting the xy plane.
  • the sensor substrate 20 is generally produced by forming a number of the sensor substrates 20 as an aggregate substrate and then separating one from the other as the individual sensor substrates 20.
  • the present invention is not limited to this, and the sensor substrate 20 may be produced individually from scratch.
  • four magnetic sensing elements R1 to R4 and three magnetic layers 41 to 43 are formed on the element forming surface 21.
  • four bonding pads 51 to 54 are provided on the element forming surface 21, which are connected to bonding pads 61 to 64 provided on the circuit board 10 through corresponding bonding wires BW.
  • the second and third external magnetic members 32 and 33 are disposed respectively on both sides of the sensor substrate 20 in the x-direction.
  • the second and third external magnetic members 32 and 33 are connected to each other through the fourth external magnetic member 34 positioned at the bottom of the sensor substrate 20.
  • the second to fourth external magnetic members 32 to 34 constitute a single magnetic block 35.
  • the magnetic block 35 is disposed so as to be inserted into the opening 11 of the circuit board 10.
  • the magnetic block 35 has a recessed part 36 for housing the sensor substrate 20. In a state where the sensor substrate 20 is housed in the recessed part 36, the element forming surface 21 of the sensor substrate 20 and leading ends of the respective second and third external magnetic members 32 and 33 are close to each other to constitute substantially the same plane.
  • FIG. 4 is a schematic plan view for explaining the structure of the element forming surface 21 of the sensor substrate 20.
  • FIG. 5 is a schematic cross-sectional view taken along line B-B in FIG. 4 .
  • first to third magnetic layers 41 to 43 are formed on the element forming surface 21 of the sensor substrate 20.
  • the first magnetic layer 41 is positioned at substantially the center of the element forming surface 21, and the second and third magnetic layers 42 and 43 are disposed respectively on both sides of the first magnetic layer 41 in the x-direction.
  • the magnetic layers 41 to 43 may each be a film made of a composite magnetic material in which magnetic filler is dispersed in a resin material, may each be a thin film or foil made of a soft magnetic material such as nickel or permalloy, or may each be a thin film or bulk sheet made of ferrite.
  • the first magnetic layer 41 includes a first main area M1 positioned at the center thereof and first to fourth converging areas S1 to S4 each having a width in the y-direction gradually reduced with increasing distance from the first main area M1 in the x-direction.
  • the first main area M1 is a part that is covered with the first external magnetic member 31.
  • the width of the first external magnetic member 31 in the y-direction is preferably larger than the width of the first main area M1 in the y-direction, whereby the entire width of the first main area M1 in the y-direction is preferably covered with the first external magnetic member 31.
  • the displacement mentioned above can include rotational displacement as well as displacement in the xy direction.
  • the first to fourth converging areas S1 to S4 are each a taper-shaped portion having a width in the y-direction gradually reduced with increasing distance from the first main area M1 in the x-direction and, in the present embodiment, the first and third converging areas S1 and S3 are positioned on the negative x-direction side (left side) with respect to the first main area M1, and the second and fourth converging areas S2 and S4 are positioned on the positive x-direction side (right side) with respect to the first main area M1.
  • the first magnetic layer 41 has a dyad-symmetric shape.
  • the first converging area S1 and the fourth converging area S4 are line-symmetric with respect to a virtual line L1 extending in the y-direction and, similarly, the second converging area S2 and the third converging area S3 are line-symmetric with respect to the virtual line L1.
  • the first converging area S1 and the third converging area S3 are line-symmetric with respect to a virtual line L2 extending in the x-direction and, similarly, the second converging area S4 and the fourth converging area S4 are line-symmetric with respect to the virtual line L2.
  • the magnetic flux ⁇ is substantially evenly distributed to the first to fourth converging areas S1 to S4 as illustrated in FIG. 6 .
  • the distributed magnetic flux ⁇ passes the taper-shaped first to fourth converging areas S1 to S4 and thereby the magnetic flux density is increased.
  • the second magnetic layer 42 includes a second main area M2 and fifth and seventh converging areas S5 and S7 each having a width in the y-direction gradually reduced with increasing distance from the second main area M2 in the x-direction (positive side).
  • the third magnetic layer 43 includes a third main area M3 and sixth and eighth converging areas S6 and S8 each having a width in the y-direction gradually reduced with increasing distance from the third main area M3 in the x-direction (negative side) .
  • the second main area M2 is positioned near the end portion of the sensor substrate 20 on the negative x-direction side and is thus close to the second external magnetic member 32.
  • the third main area M3 is positioned near the end portion of the sensor substrate 20 on the positive x-direction side and is thus close to the third external magnetic member 33.
  • the leading end portion of the fifth converging area S5 faces the leading end portion of the first converging area S1 through a first gap G1.
  • the leading end portion of the seventh converging area S7 faces the leading end portion of the third converging area S3 through a third gap G3.
  • the fifth converging area S5 and the seventh converging area S7 are line-symmetric with respect to the virtual line L2 extending in the x-direction.
  • the leading end portion of the sixth converging area S6 faces the leading end portion of the second converging area S2 through a second gap G2.
  • the leading end portion of the eighth converging area S8 faces the leading end portion of the fourth converging area S4 through a fourth gap G4.
  • the sixth converging area S6 and the eighth converging area S8 are line-symmetric with respect to the virtual line L2 extending in the x-direction.
  • first to fourth magnetic sensing elements R1 to R4 each extending in the y-direction are disposed in the first to fourth gaps G1 to G4, respectively.
  • the widths of the first to fourth gaps G1 to G4 in the x-direction are equal to each other.
  • the first to fourth magnetic sensing elements R1 to R4 do not contact the first to third magnetic layers 41 to 43.
  • the magnetic sensing elements R1 to R4 are not particularly limited in type as long as they are elements whose physical characteristics change according to magnetic flux density. More specifically, the magnetic sensing elements R1 to R4 are preferably magnetoresistive elements whose electrical resistance changes according to the direction of a magnetic field and, more preferably, spin valve type GMR elements. In the present embodiment, the sensitivity directions (fixed magnetization directions) of the magnetic sensing elements R1 to R4 are all set in the direction (positive x-direction) denoted by the arrow C of FIGs. 4 and 5 .
  • the first external magnetic member 31 plays a role of collecting magnetic flux ⁇ in the z-direction and releasing the collected magnetic flux ⁇ to the first main area M1 of the first magnetic layer 41.
  • the height of the first external magnetic member 31 in the z-direction is not particularly limited, the selectivity of the magnetic flux in the z-direction can be enhanced by increasing the height thereof in the z-direction.
  • the height of the first external magnetic member 31 in the z-direction is too high, support for the first external magnetic member 31 may become unstable. Therefore, it is preferable to set the height of the first external magnetic member 31 in a range where stable support can be ensured.
  • the magnetic flux ⁇ collected to the first main area M1 through the first external magnetic member 31 is substantially evenly distributed to the first to fourth converging areas S1 to S4 as illustrated in FIG. 6 and then released to the fifth to eighth converging areas S5 to S8 through the first to fourth magnetic sensing elements R1 to R4, respectively.
  • magnetic fluxes in mutually opposite directions are given to the magnetic sensing elements R1, R3 and magnetic sensing elements R2, R4.
  • the fixed magnetization directions of the magnetic sensing elements R1 to R4 are all set in the positive x-direction denoted by the arrow C, so that the magnetic sensing elements R1 to R4 have sensitivity to the x-direction component of the magnetic flux.
  • the magnetic flux reaching the fifth and seventh converging areas S5 and S7 are collected by the second external magnetic member 32 through the second main area M2.
  • the magnetic flux reaching the sixth and eighth converging areas S6 and S8 are collected by the third external magnetic member 33 through the third main area M3.
  • FIG. 7 is a circuit diagram for explaining a connection relationship between the magnetic sensing elements R1 to R4 and the bonding pads 51 to 54.
  • a ground potential Gnd and a power supply potential Vdd are supplied from the circuit board 10 side to the bonding pads 51 and 54, respectively. Further, between the bonding pads 51 and 54, the magnetic sensing elements R1 and R2 are connected in series to each other, and the magnetic sensing elements R4 and R3 are connected in series to each other. A connection point between the magnetic sensing elements R3 and R4 is connected to the bonding pad 52, and a connection point between the magnetic sensing element R1 and R2 is connected to the bonding pad 53.
  • the magnetic sensing elements R1 to R4 have the same fixed magnetization direction, so that a difference occurs between the resistance variations of the magnetic sensing elements R1 and R3 positioned on one side as viewed from the first external magnetic member 31 and the resistance variations of the magnetic sensing elements R2 and R4 positioned on the other side as viewed from the first external magnetic member 31.
  • This difference is amplified doubly by the differential bridge circuit of FIG. 7 and appears at the bonding pads 52 and 53.
  • the circuit board 10 is mounted with a not-shown voltage detection circuit and detects a difference between the potentials Va and Vb appearing respectively at the bonding pads 52 and 53, whereby magnetic flux density can be measured.
  • the magnetic sensor 100 has the first to third magnetic layers 41 to 43 on the element forming surface 21 of the sensor substrate 20, and the magnetic sensing elements R1 to R4 are disposed respectively in the four gaps G1 to G4 formed by the magnetic layers 41 to 43, preventing magnetic flux generated by current flowing in one magnetic sensing element from affecting the other sensing element.
  • it is possible to achieve higher detection accuracy than heretofore.
  • the eight converging areas S1 to S8 constituting the gaps G1 to G4 have the taper-shape having a width in the y-direction gradually reduced toward their corresponding magnetic sensing elements R1 to R4, so that the density of the magnetic flux to be given to the magnetic sensing elements R1 to R4 is increased.
  • the first main area M1 included in the first magnetic layer 41 has an area wide enough to be connected with the base portions of all the four converging areas S1 to S4, so that magnetism collection effect of the magnetic flux ⁇ through the first external magnetic member 31 is improved, whereby high detection accuracy can be achieved.
  • the magnetic sensor 100 has the first external magnetic member 31 and can thus selectively detect magnetic flux in the z-direction.
  • the second and third external magnetic members 32 and 33 are integrated, thereby allowing reduction in the magnetic resistance of the magnetic flux intruding to the back of the sensor substrate 20.
  • FIG. 8 is a schematic cross-sectional view for explaining the configuration of the main part of a magnetic sensor 101 according to a first modification.
  • insulating layers 22 and 23 are laminated in this order on the surface of the sensor substrate 20, and the surface of the insulating layer 22 constitutes the element forming surface 21.
  • the magnetic sensing elements R1 to R4 are provided on the surface of the insulating layer 22 serving as the element forming surface 21, and the magnetic layers 41 to 43 are provided on the surface of the insulating layer 23 positioned in the upper layer.
  • the magnetic sensing elements R1 to R4 and the magnetic layers 41 to 43 are positioned in mutually different layers, the magnetic sensing element R1 (R3) is disposed at a position overlapping the gap G1 (G3) formed by the magnetic layers 41 and 42 in a plan view, and the magnetic sensing element R4 (R2) is disposed at a position overlapping the gap G4 (G2) formed by the magnetic layers 41 and 43 in a plan view.
  • the z-position of the magnetic sensing elements R1 to R4 and that of the magnetic layers 41 to 43 may differ mutually.
  • the magnetic sensing elements R1 to R4 are not strictly positioned in the gaps G1 to G4, respectively; however, they are disposed on the magnetic paths formed respectively by the gaps G1 to G4, so that the magnetic flux passing the gaps G1 to G4 can be properly detected.
  • FIG. 9 is a schematic cross-sectional view for explaining the configuration of the main part of a magnetic sensor 102 according to a second modification.
  • the magnetic sensing element R1 (R3) partially overlaps the magnetic layers 41 and 42 in the z-direction
  • the magnetic sensing elements R1 to R4 are not strictly positioned in the gaps G1 to G4, respectively; however, they are disposed on the magnetic paths formed respectively by the gaps G1 to G4.
  • FIG. 10 is a schematic cross-sectional view for explaining the configuration of the main part of a magnetic sensor 103 according to a third modification.
  • insulating layers 24, 25, and 26 are laminated in this order on the surface of the sensor substrate 20, and the surface of the insulating layer 25 constitutes the element forming surface 21.
  • the magnetic sensing elements R1 to R4 are provided on the surface of the insulating layer 25 serving as the element forming surface 21, the magnetic layers 42 and 43 are provided on the surface of the insulating layer 24 positioned in the lower layer, and the magnetic layer 41 is provided on the surface of the insulating layer 26 positioned in the upper layer.
  • the magnetic layer 41 and magnetic layers 42 and 43 are positioned in mutually different layers, and they partially overlap each other to form three-dimensional gaps G1 to G4.
  • the magnetic sensing elements R1 to R4 are disposed in the thus formed gaps G1 to G4, respectively.
  • the gaps G1 to G4 may not necessarily be formed two-dimensionally and may be formed three-dimensionally.
  • FIG. 11 is a schematic cross-sectional view for explaining the configuration of the main part of a magnetic sensor 104 according to a fourth modification.
  • the magnetic layer 41 and magnetic layers 42 and 43 are positioned in mutually different layers and do not overlap each other.
  • the gaps G1 to G4 are formed in the oblique direction by the magnetic layer 41 and magnetic layers 42 and 43, and the magnetic sensing elements R1 to R4 are disposed at locations corresponding to the gaps G1 to G4, respectively.
  • the magnetic sensing elements R1 to R4 and magnetic layers 41 to 43 may or may not overlap each other.
  • FIG. 12 is a schematic cross-sectional view for explaining the configuration of the main part of a magnetic sensor 105 according to a fifth modification.
  • the second external magnetic member 32 and third external magnetic member 33 are not integrated but separated from each other.
  • the magnetic resistance of the magnetic flux intruding to the back of the sensor substrate 20 is slightly increased in such a configuration, substantially the same effects as those in the above-described magnetic sensor 100 can be obtained.
  • FIG. 13 is a schematic cross-sectional view for explaining the configuration of the main part of a magnetic sensor 106 according to a sixth modification.
  • the second and third external magnetic members 32 and 33 are omitted. Although magnetism collection effect by the second and third external magnetic members 32 and 33 is lost in such a configuration, substantially the same effects as those in the above-described magnetic sensor 100 can be obtained.
  • FIG. 14 is a schematic plan view for explaining the configuration of the main part of a magnetic sensor 107 according to a seventh modification.
  • a slit is formed in each of the magnetic layers 41 to 43, and the magnetic layers 41 to 43 are each divided by the slit into a plurality of parts.
  • a cross-shaped slit is formed in the magnetic layer 41, whereby the first to fourth converging areas S1 to S4 are separated from each other.
  • a slit extending in the x-direction is formed in each of the magnetic layers 42 and 43, whereby the fifth and seventh converging areas S5 and S7 are separated from each other, and the sixth and eighth converging areas S6 and S8 are separated from each other.
  • each of the magnetic layers 41 to 43 may not necessarily be formed completely integrally.
  • FIG. 15 is a schematic plan view for explaining the configuration of the main part of a magnetic sensor 108 according to an eighth modification.
  • cut parts 71 are formed in each of the first to third magnetic layers 41 to 43.
  • the cut parts 71 are each an independent space pattern having a loop-shaped outer periphery.
  • the cut parts 71 each have an elliptical shape with the Y-axis being the long axis.
  • the independent space pattern indicates that the outer periphery is closed.
  • four cut parts 71 are formed in the first magnetic layer 41, and two cut parts 71 are formed in each of the second and third magnetic layers 42 and 43.
  • the cut parts 71 are disposed avoiding the first main area M1, thereby preventing deterioration in magnetism collection effect in the first main area M1.
  • residual magnetic flux of the first to third magnetic layers 41 to 43 circulates around the outer periphery of each cut part 71, thus making it possible to prevent deterioration in detection accuracy attributable to the residual magnetic flux.
  • FIG. 16 is a schematic plan view for explaining the configuration of the main part of a magnetic sensor 109 according to a ninth modification.
  • the example of FIG. 16 differs from the example of FIG. 15 in that an island-shaped independent pattern 72 is provided in the inner diameter area of the cut part 71.
  • the independent pattern 72 is separated from each of the first to third magnetic layers 41 to 43 with the cut part 71 interposed therebetween. By adding such an independent pattern 72, it is possible to minimize an increase in magnetic resistance due to the formation of the cut parts 71.
  • FIG. 17 is a schematic plan view for explaining the configuration of the main part of a magnetic sensor 110 according to a tenth modification.
  • the example of FIG. 17 differs from the example of FIG. 15 in that two cut parts 73 are formed in the first magnetic layer 41.
  • the cut parts 73 are also each an independent space pattern having a loop-shaped outer periphery and each have an elliptical shape with the Y-axis being the long axis. Even with such a configuration, the same effects as those in the example of FIG. 15 can be obtained.
  • FIG. 18 is a schematic plan view for explaining the configuration of the main part of a magnetic sensor 111 according to an eleventh modification.
  • the example of FIG. 18 differs from the example of FIG. 17 in that an island-shaped independent pattern 74 is provided in the inner diameter area of the cut part 73.
  • the independent pattern 74 is separated from the first magnetic layer 41 with the cut part 73 interposed therebetween. By adding such an independent pattern 74, it is possible to minimize an increase in magnetic resistance due to the formation of the cut parts 73.
  • FIG. 19 is a schematic plan view for explaining the configuration of the main part of a magnetic sensor 112 according to a twelfth modification.
  • each of the first to eighth converging areas S1 to S8 has a curved edge. This makes the flow of magnetic flux in the first to eighth converging areas S1 to S8 smoother, reducing magnetic resistance.
  • FIG. 20 is a schematic plan view for explaining the configuration of the main part of a magnetic sensor 113 according to a thirteenth modification.
  • two magnetic sensing elements are provided in each of the gaps G1 to G4 to constitute each of the first to fourth magnetic sensing elements R1 to R4.
  • the first magnetic sensing element R1 is constituted by two series-connected magnetic sensing elements R11 and R12
  • the second magnetic sensing element R2 is constituted by two series-connected magnetic sensing elements R21 and R22
  • the third magnetic sensing element R3 is constituted by two series-connected magnetic sensing elements R31 and R32
  • the fourth magnetic sensing element R4 is constituted by two series-connected magnetic sensing elements R41 and R42.
  • a fourth magnetic layer 44 may be additionally provided between the two series-connected magnetic sensing elements (e.g., between R11 and R12). Further, each of the first to fourth magnetic sensing elements R1 to R4 may be constituted by three or more series-connected magnetic sensing elements.
  • FIG. 21 is a schematic cross-sectional view for explaining the configuration of the main part of a magnetic sensor 114 according to a fourteenth modification.
  • the magnetic sensing element R1 is constituted by two magnetic sensing elements R11 and R12, the magnetic sensing element R11 partially overlaps the magnetic layers 41 and 44, and the magnetic sensing element R12 partially overlaps the magnetic layers 42 and 44.
  • Other not-shown magnetic sensing elements R2 to R4 have the same configuration.
  • FIG. 22 is a schematic plan view for explaining the configuration of the main part of a magnetic sensor 115 according to a fifteenth modification.
  • the fourth magnetic layer 44 is divided into a plurality of parts in the y-direction that is the extending direction of the gap G1.
  • the fourth magnetic layers 44 on not-shown other respective gaps G2 to G4 have the same configuration.
  • the flow of magnetic flux passing the gaps G1 to G4 is restricted to the x-direction that is the magnetism sensing direction, with the result that magnetic flux hardly flows in the y-direction. That is, by dividing the fourth magnetic layer 44 in the y-direction, magnetic anisotropy occurs, allowing achievement of higher detection accuracy.
  • FIG. 23 is a schematic cross-sectional view for explaining the configuration of the main part of a magnetic sensor 116 according to a sixteenth modification.
  • the film thickness of the first to third magnetic layers 41 to 43 is continuously reduced toward the gaps G1 to G4. With this configuration, magnetic flux is concentrated more on the first to fourth magnetic sensing elements R1 to R4, making it possible to enhance detection accuracy.
  • FIG. 24 is a schematic cross-sectional view for explaining the configuration of the main part of a magnetic sensor 117 according to a seventeenth modification.
  • the film thickness of the first to third magnetic layers 41 to 43 is reduced stepwise near the gaps G1 to G4. Even with this configuration, magnetic flux is concentrated more on the first to fourth magnetic sensing elements R1 to R4, making it possible to enhance detection accuracy.
  • FIG. 25 is a schematic cross-sectional view for explaining the configuration of the main part of a magnetic sensor 118 according to an eighteenth modification.
  • the film thickness of the first to third magnetic layers 41 to 43 is reduced in a stairway pattern toward the gaps G1 to G4. Even with this configuration, magnetic flux is concentrated more on the first to fourth magnetic sensing elements R1 to R4, making it possible to enhance detection accuracy.
  • FIG. 26 is a schematic cross-sectional view for explaining the configuration of the main part of a magnetic sensor 119 according to a nineteenth modification.
  • the sensor substrate 20 is mounted sideways on the surface (xy plane) of the circuit board 10. That is, the element forming surface 21 of the sensor substrate 20 constitutes the xz plane, and the first external magnetic member 31 extends in the y-direction.
  • This configuration eliminates the need to form the opening 11 in the circuit board 10 and allows magnetic flux in a direction parallel to the main surface of the circuit board 10 to be selectively detected. Further, even when the height (length in the y-direction) of the first external magnetic member 31 is increased, support for the first external magnetic member 31 does not become unstable.

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Magnetic Variables (AREA)
  • Hall/Mr Elements (AREA)
EP17802743.9A 2016-05-24 2017-05-22 Magnetischer sensor Active EP3467529B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016103210 2016-05-24
PCT/JP2017/019009 WO2017204151A1 (ja) 2016-05-24 2017-05-22 磁気センサ

Publications (3)

Publication Number Publication Date
EP3467529A1 true EP3467529A1 (de) 2019-04-10
EP3467529A4 EP3467529A4 (de) 2020-03-04
EP3467529B1 EP3467529B1 (de) 2021-12-01

Family

ID=60412322

Family Applications (1)

Application Number Title Priority Date Filing Date
EP17802743.9A Active EP3467529B1 (de) 2016-05-24 2017-05-22 Magnetischer sensor

Country Status (5)

Country Link
US (1) US10890630B2 (de)
EP (1) EP3467529B1 (de)
JP (1) JP7014159B2 (de)
CN (1) CN109154640B (de)
WO (1) WO2017204151A1 (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3633399A4 (de) * 2017-05-23 2021-03-03 TDK Corporation Magnetischer sensor
US11237228B2 (en) 2017-12-27 2022-02-01 Tdk Corporation Magnetic sensor
EP4036996A4 (de) * 2019-09-26 2023-10-18 TDK Corporation Magnetischer sensor

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019139110A1 (ja) * 2018-01-11 2019-07-18 Tdk株式会社 磁気センサ
JP6981299B2 (ja) * 2018-02-21 2021-12-15 Tdk株式会社 磁気センサ
JP7020176B2 (ja) * 2018-02-27 2022-02-16 Tdk株式会社 磁気センサ
JP7077679B2 (ja) * 2018-03-12 2022-05-31 Tdk株式会社 磁気センサ
JP7192227B2 (ja) * 2018-03-19 2022-12-20 Tdk株式会社 磁気センサ
JP7095350B2 (ja) * 2018-03-27 2022-07-05 Tdk株式会社 磁気センサ
JP7069960B2 (ja) * 2018-03-29 2022-05-18 Tdk株式会社 磁気センサ
JP7070020B2 (ja) * 2018-04-20 2022-05-18 Tdk株式会社 磁路形成部材及びこれを用いた磁気センサ
JP7115242B2 (ja) * 2018-06-07 2022-08-09 Tdk株式会社 磁気センサ
JP2019215182A (ja) * 2018-06-11 2019-12-19 Tdk株式会社 磁気センサ
JP2019219182A (ja) * 2018-06-15 2019-12-26 Tdk株式会社 磁気センサ
WO2020040168A1 (ja) * 2018-08-22 2020-02-27 旭化成エレクトロニクス株式会社 磁場計測装置、磁場計測方法、磁場計測プログラム
JP7147462B2 (ja) * 2018-10-23 2022-10-05 Tdk株式会社 磁気センサ
JP7115224B2 (ja) * 2018-11-02 2022-08-09 Tdk株式会社 磁気センサ
JP2020106309A (ja) * 2018-12-26 2020-07-09 Tdk株式会社 磁気センサ
JP6936405B2 (ja) 2018-12-26 2021-09-15 旭化成エレクトロニクス株式会社 磁場計測装置
CN111766293A (zh) * 2019-04-02 2020-10-13 中国石油天然气集团有限公司 多规格连续管缺陷检测装置
JP7006670B2 (ja) * 2019-10-24 2022-01-24 Tdk株式会社 磁気センサ
JP7316719B2 (ja) 2020-08-25 2023-07-28 株式会社東芝 磁気センサ及び検査装置
JP7284739B2 (ja) 2020-09-14 2023-05-31 株式会社東芝 磁気センサ及び検査装置
JP7414703B2 (ja) 2020-12-14 2024-01-16 株式会社東芝 磁気センサ及び検査装置
JP7553388B2 (ja) * 2021-03-18 2024-09-18 Tdk株式会社 磁気センサ

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49135587A (de) * 1973-04-28 1974-12-27
FR2713782B1 (fr) 1993-12-14 1996-01-05 Thomson Csf Capteur magnétique à effet magnéto-résistif.
JP2715997B2 (ja) 1995-06-16 1998-02-18 日本電気株式会社 磁気センサ
FR2754905B1 (fr) * 1996-10-22 1998-11-20 Commissariat Energie Atomique Procede de realisation d'un capteur magnetique magnetoresistif et capteur obtenu par ce procede
JP2004158668A (ja) 2002-11-07 2004-06-03 Asahi Kasei Corp ハイブリッド磁気センサ及びその製造方法
JP2005159273A (ja) 2003-05-27 2005-06-16 Matsushita Electric Works Ltd 磁電変換素子、磁気検出装置及び地磁気センサ
JP4287905B2 (ja) * 2003-07-31 2009-07-01 光照 木村 半導体磁気センサとこれを用いた磁気計測装置
JP4899877B2 (ja) * 2007-01-15 2012-03-21 三菱電機株式会社 磁界検出装置
US8378674B2 (en) 2007-05-28 2013-02-19 Mitsubishi Electric Corporation Magnetic field detection device
JP5500785B2 (ja) 2008-05-14 2014-05-21 新科實業有限公司 磁気センサ
US8451003B2 (en) * 2009-07-29 2013-05-28 Tdk Corporation Magnetic sensor having magneto-resistive elements on a substrate
US8659292B2 (en) * 2010-03-05 2014-02-25 Headway Technologies, Inc. MR sensor with flux guide enhanced hard bias structure
JP5494591B2 (ja) 2010-09-28 2014-05-14 株式会社村田製作所 長尺型磁気センサ
CN102435961B (zh) * 2010-09-28 2014-10-08 株式会社村田制作所 长型磁传感器
CN202083786U (zh) * 2011-01-07 2011-12-21 江苏多维科技有限公司 薄膜磁电阻传感元件、多个传感元件的组合及与该组合耦合的电子装置
EP2664940B1 (de) * 2011-01-13 2020-02-12 Alps Alpine Co., Ltd. Magnetischer sensor
JP5464198B2 (ja) 2011-11-24 2014-04-09 Tdk株式会社 三次元磁界センサおよびその製造方法
JP2013172040A (ja) * 2012-02-22 2013-09-02 Alps Electric Co Ltd 磁気センサとその製造方法
JP5701807B2 (ja) * 2012-03-29 2015-04-15 株式会社東芝 圧力センサ及びマイクロフォン
CN103116143B (zh) * 2013-01-22 2015-01-14 中国人民解放军国防科学技术大学 一体式高精度三轴磁传感器
JP6021239B2 (ja) * 2013-02-13 2016-11-09 マグネデザイン株式会社 3次元磁界検出素子および3次元磁界検出装置
US9274180B2 (en) * 2013-07-29 2016-03-01 Innovative Mion Technology Microfabricated magnetic field transducer with flux guide
JP6074344B2 (ja) * 2013-09-20 2017-02-01 株式会社東芝 圧力センサ、マイクロフォン、血圧センサ及びタッチパネル
JP6190226B2 (ja) * 2013-09-20 2017-08-30 株式会社東芝 慣性センサ
JP2015219061A (ja) * 2014-05-15 2015-12-07 Tdk株式会社 磁界検出センサ及びそれを用いた磁界検出装置
DE102014116953B4 (de) * 2014-11-19 2022-06-30 Sensitec Gmbh Verfahren und Vorrichtung zur Herstellung einer Magnetfeldsensorvorrichtung, sowie diesbezüglicheMagnetfeldsensorvorrichtung
CN104931900B (zh) * 2015-06-15 2017-12-29 中国科学院空间科学与应用研究中心 一种基于异常磁阻效应的高灵敏度矢量磁场传感器
JP6480837B2 (ja) * 2015-09-04 2019-03-13 株式会社東芝 センサ、情報端末、マイクロフォン、血圧センサ及びタッチパネル
DE112018005674T5 (de) * 2018-01-25 2020-09-24 Murata Manufacturing Co., Ltd. Magnetsensor und stromsensor
JP6791237B2 (ja) * 2018-12-28 2020-11-25 Tdk株式会社 磁気センサ装置
JP7006633B2 (ja) * 2019-02-13 2022-01-24 Tdk株式会社 磁気センサシステム

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3633399A4 (de) * 2017-05-23 2021-03-03 TDK Corporation Magnetischer sensor
US11567148B2 (en) 2017-05-23 2023-01-31 Tdk Corporation Magnetic sensor
US11237228B2 (en) 2017-12-27 2022-02-01 Tdk Corporation Magnetic sensor
US11754645B2 (en) 2017-12-27 2023-09-12 Tdk Corporation Magnetic sensor
US12105165B2 (en) 2017-12-27 2024-10-01 Tdk Corporation Magnetic sensor
EP4036996A4 (de) * 2019-09-26 2023-10-18 TDK Corporation Magnetischer sensor

Also Published As

Publication number Publication date
JPWO2017204151A1 (ja) 2019-03-22
EP3467529A4 (de) 2020-03-04
US20190293735A1 (en) 2019-09-26
CN109154640B (zh) 2021-03-23
JP7014159B2 (ja) 2022-02-01
EP3467529B1 (de) 2021-12-01
US10890630B2 (en) 2021-01-12
WO2017204151A1 (ja) 2017-11-30
CN109154640A (zh) 2019-01-04

Similar Documents

Publication Publication Date Title
EP3467529B1 (de) Magnetischer sensor
EP2682773B1 (de) Magnetwinkelsensor mit separat verpackter brücke
CN110709720B (zh) 磁传感器
US9599681B2 (en) Magnetic sensor and magnetic detecting method of the same
US9182458B2 (en) Magnetoresistive sensing device
JP5297442B2 (ja) 磁気センサ
WO2017158900A1 (ja) 磁気センサ
JP2018004618A (ja) 磁気センサ
JP7020176B2 (ja) 磁気センサ
JP2013172040A (ja) 磁気センサとその製造方法
JP2009175120A (ja) 磁気センサ及び磁気センサモジュール
US20230251331A1 (en) Sensor unit
WO2019139110A1 (ja) 磁気センサ
JPWO2016047782A1 (ja) 磁気センサ
JP6972900B2 (ja) 磁気センサ
CN111693911B (zh) 磁传感器装置
CN109655767B (zh) 一种集成磁结构
JP6185298B2 (ja) 磁気センサ
JP7077679B2 (ja) 磁気センサ
JP2016206006A (ja) 磁気センサ
JP7070020B2 (ja) 磁路形成部材及びこれを用いた磁気センサ
KR20230089608A (ko) 3축 자기저항 센서
JP2019095319A (ja) 磁気センサ
JP2020073905A (ja) 磁気センサ

Legal Events

Date Code Title Description
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE

PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20181221

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

DAV Request for validation of the european patent (deleted)
DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20200205

RIC1 Information provided on ipc code assigned before grant

Ipc: G01R 33/09 20060101AFI20200130BHEP

Ipc: H01L 43/08 20060101ALI20200130BHEP

Ipc: G01R 33/02 20060101ALI20200130BHEP

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: GRANT OF PATENT IS INTENDED

INTG Intention to grant announced

Effective date: 20210625

RIN1 Information on inventor provided before grant (corrected)

Inventor name: USHIODA, KENTARO

Inventor name: KAMENO, MAKOTO

Inventor name: LIN, CHENGBIN

Inventor name: OKAWA, SHUICHI

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE PATENT HAS BEEN GRANTED

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

RAP3 Party data changed (applicant data changed or rights of an application transferred)

Owner name: TDK CORPORATION

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: AT

Ref legal event code: REF

Ref document number: 1452284

Country of ref document: AT

Kind code of ref document: T

Effective date: 20211215

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 602017050313

Country of ref document: DE

REG Reference to a national code

Ref country code: DE

Ref legal event code: R082

Ref document number: 602017050313

Country of ref document: DE

Representative=s name: EPPING HERMANN FISCHER PATENTANWALTSGESELLSCHA, DE

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG9D

REG Reference to a national code

Ref country code: NL

Ref legal event code: MP

Effective date: 20211201

REG Reference to a national code

Ref country code: AT

Ref legal event code: MK05

Ref document number: 1452284

Country of ref document: AT

Kind code of ref document: T

Effective date: 20211201

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: RS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211201

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211201

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211201

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220301

Ref country code: AT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211201

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211201

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211201

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220301

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211201

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211201

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220302

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211201

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211201

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SM

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211201

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211201

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211201

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220401

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211201

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211201

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 602017050313

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20220401

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211201

Ref country code: AL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211201

26N No opposition filed

Effective date: 20220902

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211201

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

REG Reference to a national code

Ref country code: BE

Ref legal event code: MM

Effective date: 20220531

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211201

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20220522

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20220531

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20220531

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20220522

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211201

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20220531

P01 Opt-out of the competence of the unified patent court (upc) registered

Effective date: 20230512

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: HU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO

Effective date: 20170522

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211201

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211201

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20240328

Year of fee payment: 8

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20240402

Year of fee payment: 8

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20240328

Year of fee payment: 8

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20211201