EP3146536B1 - Composant électronique et méthode pour sa fabrication - Google Patents

Composant électronique et méthode pour sa fabrication Download PDF

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Publication number
EP3146536B1
EP3146536B1 EP15727321.0A EP15727321A EP3146536B1 EP 3146536 B1 EP3146536 B1 EP 3146536B1 EP 15727321 A EP15727321 A EP 15727321A EP 3146536 B1 EP3146536 B1 EP 3146536B1
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EP
European Patent Office
Prior art keywords
functional body
body section
body portion
functional
electronic device
Prior art date
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Application number
EP15727321.0A
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German (de)
English (en)
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EP3146536A1 (fr
Inventor
Franz Rinner
Yongli Wang
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TDK Electronics AG
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TDK Electronics AG
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/142—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being coated on the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/102—Varistor boundary, e.g. surface layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/105—Varistor cores

Definitions

  • the present invention relates to an electronic component, for example a varistor component, and a method for producing the same.
  • US 4,157,527 A. describes an electronic component with a varistor functional body, the varistor having a smaller thickness in a central region than in an edge region.
  • One problem to be solved is to provide means for an improved electronic component, in particular a more flexible and / or more robust electronic component.
  • This object is solved by the features of the independent claims.
  • Advantageous refinements and developments are the subject of the dependent claims.
  • a proposed electronic component comprises a functional body.
  • the functional body expediently represents the functional element of the electronic component.
  • the electronic component comprises a contact which is electrically connected to or contacts a first surface of the functional body.
  • the contact can be an electrical contact layer and / or a metallization or another contact.
  • the functional body Via the contact, the functional body is expediently contacted and / or electrically connected to further connections, for example an outer electrode of the electronic component.
  • the surface is preferably a first surface, for example a first main surface of the functional body.
  • the contact has an edge area and a central area.
  • the functional body is designed in such a way that the electrical resistance of the functional body between the first surface and a second surface or main surface of the functional body facing away from the first surface is viewed in a first functional body section, which is viewed from above in view of the electronic component, in particular the first surface overlaps with the edge area is larger than in a second functional body section that overlaps with the central area of the contact.
  • the first and the second functional body section are preferably radial sections of the functional body.
  • the central region of the contact preferably denotes an inner and / or middle region of the contact, while the edge region preferably denotes or defines an outer edge of the contact.
  • the contact is preferably electrically connected to both the first and the second functional body section.
  • the first functional body section preferably designates an outer or edge section of the functional body.
  • the second functional body section preferably designates an inner or central section of the functional body.
  • the second functional body section and the central area are — when viewed from the top of the electronic component — preferably congruent.
  • the said contact is preferably a first contact.
  • the electronic component also expediently comprises a second contact, which is electrically connected to the second surface of the functional body or contacts it.
  • the second contact is preferably configured analogously to the first contact and is arranged in relation to the second surface in the same way as the first contact in relation to the first surface.
  • the first and the second contact can, for example, be arranged symmetrically with respect to a longitudinal axis of the electronic component.
  • the electronic component and / or the functional body is preferably disk-shaped and at least largely rotationally symmetrical with respect to the longitudinal axis.
  • a contact is preferably provided or arranged on an upper side and on a lower side of the disk for the electrical connection or contacting.
  • the first and the second contact are preferably arranged congruently, for example when viewed from the top of the electronic component.
  • the functional body when viewed in a section along the longitudinal axis, is preferably arranged directly or immediately between the contacts.
  • the electronic component is a varistor component.
  • Varistor components are preferably used as overvoltage protection.
  • the functional body is expediently designed such that it represents the functional element of the varistor component.
  • the Functional body comprise a polycrystalline, sintered, material.
  • the electronic component is a disk or block varistor.
  • the first functional body section at least partially, runs around the second functional body section when viewed from the top of the electronic component.
  • the first functional body section preferably completely surrounds or surrounds the second functional body section.
  • the functional body is designed such that the electrical current density in the first functional body section, in particular at a contact point of the first functional body section and the edge region of the contact or between the first functional body section and the edge region, during operation of the electronic component and / or in the case of a Current flow in the functional body reduced or reduced.
  • the electrical current density is preferably reduced or reduced in comparison to a conventional electronic component or a component of the prior art.
  • the electrical current density and the associated temperature load can be particularly high, for example during operation of the electronic component.
  • the cause of this can be an edge effect that occurs during the operation of the electronic component.
  • the heat development in the first functional body section can advantageously be reduced or reduced during operation, for example because of increased electrical resistance and thus reduced electrical current density, as less heat is generated as a rule.
  • the lifespan of the electronic component can advantageously be increased.
  • High temperatures in the functional element can considerably limit the service life and / or the area of use of the electronic component, in particular in the case of a varistor component.
  • the thermal loads described, in particular for varistor components can even lead to the destruction of the component in the event of prolonged overvoltage. This can be counteracted by the above-described configuration of the functional body, in that the first functional body section has a greater electrical resistance than the second functional body section, since this weakens the edge effect described.
  • the surface area of the second functional body section when viewed from the top of the electronic component, is larger than the surface area of the first functional body section.
  • This configuration can in particular ensure that the electrical resistance of the functional body of the electronic component between the first and the second surface is or remains defined overall by the second functional body section.
  • the electrical properties, in the case of a varistor component, for example the varistor voltage remain essentially unchanged.
  • the area of the second functional body section is twice as large, three times as large or ten times as large as the area of the first functional body section.
  • the functional body has a contact-free area in the first functional body section.
  • the contact-free area is preferably an outer radial section of the functional body. Accordingly, the contact-free area is preferably arranged on the edge with respect to the functional body. There is preferably no contact in the non-contact area. With this configuration, improved contacting of the functional body can advantageously be achieved. In particular, electrical flashovers on the edge, edge area or on an edge of the functional body can be prevented or restricted.
  • the contact-free area or an edge thereof preferably runs without kinks when viewed from above on the electronic component.
  • an edge length or edge area of the contact can be reduced or minimized and thus the formation of "hot spots" (English for "hot spots") in which particularly high electrical fields, thermomechanical voltages and / or thermal, mechanical or electrical Stresses occur, are prevented or restricted.
  • the thickness of the functional body in the first functional body section is greater than the thickness of the functional body in the second functional body section.
  • the thickness of the first functional body section and the thickness of the second functional body section are at least predominantly constant or approximately constant. This configuration advantageously allows a means for increasing the electrical resistance in the first functional body section to be specified, as a result of which the electrical current density and thus the temperature load in the first functional body section can be reduced during the operation of the electronic component.
  • the electrical resistance of the first functional body section is increased by the greater distance of the contacts or surfaces in the first functional body section, or by the greater path length along the thickness, in contrast to the second functional body section, with, for example, the same electrical applied to the electronic component Voltage, the current load and thus the overheating or temperature load can be reduced in the first functional body section.
  • the thickness described here preferably extends along the above-mentioned longitudinal axis of the electronic component.
  • the thickness of the functional body is preferably increased only on one side or main surface of the electronic component and / or the functional body, whereas on the other side of the electronic component the surfaces of the first functional body section and the second functional body section of the functional body are flat and / or lie in one plane ,
  • the functional body can be designed such that, for example, an upper and a lower side of the first Functional body section is not arranged in one plane with respect to an upper or an underside of the second functional body section.
  • the thickness of the functional body in the first functional body section is 5% to 15% greater than the thickness of the functional body in the second functional body section.
  • the thickness of the functional body in the first functional body section is particularly preferably at least 10% greater than the thickness of the second functional body section.
  • the thickness mentioned can also be increased by more than 15%, for example.
  • the effect of increasing the thickness with regard to the electrical resistance is qualitatively the same.
  • the radial extent of the first functional body section is between the single and double the thickness of the functional body in the first functional body section.
  • the material properties of the functional body in the first functional body section are different from those in the second functional body section. This configuration can expediently achieve that the electrical resistance in the first functional body section is increased in comparison to the second functional body section.
  • the functional body is designed such that the first functional body section is one in comparison to the second functional body section has greater specific electrical resistance.
  • the current density in the first functional body section can be reduced or reduced during operation of the electronic component.
  • Corresponding differences in the material properties can preferably be generated or formed during the manufacturing process of the electronic component and / or during sintering of the functional body (see below).
  • the greater specific electrical resistance advantageously allows the current densities and thus the temperature loads in the first functional body section to be reduced in the first functional body section given the current pulses.
  • the functional body has a sintered material.
  • the contact is a first contact
  • the electronic component additionally having a second contact which is electrically connected to the second surface of the functional body
  • the functional body being designed such that the electrical current or current density distribution when a current flows is homogenized in the functional body between the contacts in the first and the second functional body section.
  • This can mean that discrepancies or the scatter of the electrical current densities, which are present, for example, during operation of the electronic component and / or when there is a current flow in the functional body, are reduced.
  • the second contact has an edge area and a central area.
  • the functional body is, preferably largely, polycrystalline.
  • the functional body can have a polycrystalline material, for example, as the main component.
  • the functional body has a ceramic, for example as the main component.
  • the ceramic is preferably a sintered ceramic.
  • the functional body is designed in such a way that, after the application of an electrical voltage above a characteristic threshold, in the case of a varistor component, for example the varistor voltage, it conducts electrically between the first and the second surface without the functional body having electrically insulating regions ,
  • a method for producing the functional body for the electronic component described above is also specified.
  • the functional body and / or the electronic component can preferably be produced or produced using the method described here.
  • all the features disclosed for the method can also relate to the functional body and / or the electronic component, and vice versa.
  • the method comprises providing a basic material for the functional body for the electronic component and forming the functional body using the Base material such that the electrical resistance of the functional body, measured between two opposite surfaces, that is to say the above-mentioned first and second surfaces, is greater in the first functional body section than in the second functional body section.
  • this comprises providing the functional body with a contact on the opposite surfaces, each contact, for example the above-mentioned first and second contact, being electrically connected to the first and second functional body sections.
  • the base material has a more homogeneous material composition than the functional body.
  • the material composition of the base material is preferably largely homogeneous, whereas the material composition of the functional body, in particular when comparing the material compositions of the first and second functional body sections with one another and with respect to individual material components, is inhomogeneous.
  • the base material is formed in the first functional body section with a greater thickness than the second functional body section. This configuration advantageously enables the electrical resistance of the first functional body section to be increased in comparison to the second functional body section.
  • the base material is sintered to form the functional body in such a way that the specific electrical resistance of the functional body is greater in the first functional body section than in the second functional body section.
  • the base material is sintered in such a way that crystal grains or corresponding grain sizes in the first functional body section of the functional body are smaller or are formed than in the second functional body section. Due to the smaller grain sizes or greater density of grain boundaries of the first functional body section in comparison to the second functional body section, the specific electrical resistance of the functional body in the first functional body section is advantageously made larger than in the second functional body section.
  • the material composition of the base material is changed in a first section thereof during the sintering in order to form the first functional body section.
  • the first functional body section is preferably formed from the first section of the base material by sintering.
  • the base material is exposed to a temperature gradient during the sintering, the base material not being provided with material additives during the sintering and preferably likewise before the sintering.
  • no further material is added to the base material from outside, for example from outside the sintering furnace, during sintering.
  • the material composition of the base material in the first functional body section preferably changes instead by migration and / or diffusion processes of material components originally contained in the base material.
  • the base material is provided with a dopant before sintering, which diffuses into the base material during sintering in order to form the first functional body section.
  • the dopant or the additional material is preferably applied to the base material or the base material is dipped into the dopant or a solution containing it before sintering.
  • the dopant can be yttrium oxide, for example Y 2 O 3 , or other rare earth metals or their oxides.
  • the first functional body section is designed such that the maximum temperature which occurs in the first functional body section under an electrical test pulse with a current strength of 30 A of pulse shape 8/20, for example in comparison to a conventional electronic component, is reduced by at least 500 ° C.
  • a method for producing an electronic component is furthermore specified which comprises the method steps of the above-mentioned method for producing the functional body.
  • the Figures 5A to 5D show simulation results of the operation of the electronic component.
  • Figure 6 shows a table with values for the simulation of the operation of the electronic component.
  • Figure 1 shows a schematic perspective view of an electronic component 100.
  • the electronic component 100 is preferably a varistor component, in particular a disk or block varistor.
  • the electronic component 100 is particularly preferably a disk varistor.
  • the electronic component 100 is in accordance with Figure 1 designed disc-shaped and has a longitudinal axis or axis of symmetry X, which runs through the center of the disc. With regard to the longitudinal axis X, the electronic component is preferably at least approximately rotationally symmetrical.
  • the electronic component points in accordance with Figure 1 furthermore a disc-shaped functional body 1.
  • the functional body 1 preferably comprises a semiconductor material and / or a sintered ceramic, for example. Accordingly, the functional body 1 preferably further comprises polycrystalline material, or material which comprises grain boundaries and or grains of different electrical conductivity.
  • the functional body 1 is preferably designed such that it can be switched from the electrically insulating to the electrically conductive state after the application of an electrical voltage above the varistor voltage.
  • the functional body 1 comprises a first functional body section 3 and a second functional body section 2.
  • the first functional body section 3 rotates or surrounds the second functional body section 2, as viewed from the top, preferably viewed at its outer edge, and is preferably cohesive and / or in one piece with it connected to form the functional body 1.
  • the boundary of the sections mentioned is indicated by the dashed line.
  • the electronic component, or the disk or block varistor for example, has a diameter of about 30 mm and a thickness of about 3 mm.
  • the thickness mentioned preferably relates to the thickness of the second functional body section 2 along the longitudinal axis.
  • this or a corresponding functional body has a rectangular shape. Accordingly, according to the invention, the electronic component can be, for example, an angular block varistor.
  • Figure 2 shows a schematic sectional view of an embodiment of the electronic component 100 according to the invention.
  • Figure 2 preferably shows a section through the electronic component 100 according to FIG Figure 1 along the longitudinal axis X.
  • the functional body 1 has a thickness D1 in its first functional body section 3.
  • the functional body 1 has a thickness D2.
  • the thickness D2 is smaller than the thickness D1.
  • the thickness D1 can for example be 5%, 10% or 15% larger or even larger than the second thickness.
  • the functional body 1 also has a first surface 5 and a second surface 6 facing away from the first surface 5.
  • the second surface 6 is in accordance with Figure 1 flat, while the first surface 5 is not flat due to the increase in the thickness D1 in the first functional body section 3 compared to D2.
  • the greater thickness D1 of the first functional body section 3 compared to the second functional body section 2 can also be realized in such a way that both surfaces 5, 6 in the first functional body section 3 compared to the second Functional body section 2 raised, that is, are not flat overall.
  • the thickness of the functional body 1 can increase, for example, from the first to the second functional body section (from the inside to the outside) over an oblique course (cf. also FIG Figures 5A to 5D further down).
  • an abrupt change in the thickness over a step in the course of the thickness of the functional body 1 is also conceivable (not explicitly shown in the figures).
  • the electrical resistance of the functional body 1 between the first surface 5 and the second surface 6 can be made larger than in the second functional body section 2, in particular due to the increased distance in the first functional body section 3.
  • the electronic component 100 also has a first contact 4a, which is electrically connected to the first surface 5.
  • the first contact 4a is preferably connected both to the first functional body section 3 and to the second functional body section 2.
  • the contact 4a in turn has an edge area 7 and a central area 8.
  • the edge region 7 preferably encloses the central region 8.
  • the electronic component has a second contact 4b, which on the second surface 6 to the first functional body section 3 and the second functional body section 2 is connected.
  • the second contact 4b preferably has an edge region 7 and a central region 8.
  • the first and the second contacts 4a, 4b are preferably congruently arranged when viewed from the top of the electronic component 100.
  • the contacts 4a, 4b preferably contact the functional body 1.
  • the contacts can, for example, be electrodes metallized, in particular metallic contact layers.
  • the contacts 4a, 4b can be provided for an electrical connection or contacting of an outer electrode (not explicitly shown) on the functional body 1.
  • the functional body 1 expediently becomes electrically conductive in order, for example, to protect a further electrical component from an overvoltage or an electrical voltage damaging the component.
  • the first functional body section 3 overlaps the electronic component 100, that is to say, for example, in the view of the surface 5, preferably with the edge region 7.
  • the second functional body section 2 overlaps when viewed from the top, preferably with the central region 8.
  • the electrical current occurring in the operation of the electronic component 100 in the second functional body section 3 or in particular the electrical current density can advantageously be reduced or reduced. Due to the reduced current load, the generation of heat and thus the temperature load in the first functional body section can be reduced at the same time.
  • the electronic component 100 preferably has dimensions comparable to the thickness D1 of the first functional body section 3 compared to a conventional electronic component or an electronic component of the prior art.
  • the contact areas that is to say the areas in which the contacts 4a, 4b are connected to the functional body 1, are dimensioned or configured similarly or comparably in this respect.
  • the electrical current density and the associated temperature load can be particularly high due to an "edge effect".
  • the edge effect can be caused by electrical fields which are larger in operation of the component 100 on or in the edge region 7 than, for example, in the central region 8.
  • the area of the second functional body section 2 is preferably larger than that of the first functional body section 3.
  • the area of the second functional body section 3 is twice as large, three times as large or ten times as large as the area of the first functional body section 3.
  • the electrical properties, im In the case of a varistor component, for example the varistor voltage, the electronic component is preferably independent of the configuration of the first functional body section 3.
  • a radial expansion of the first functional body section 3 is shown in FIG Figure 2 marked with R1. Furthermore, a radial extension, in particular the diameter of the second functional body section 2, is identified by R2. The radial extent R1 is preferably between the single and double the thickness D1 of the functional body 1 in the first functional body section 3.
  • a non-contact edge 9 of the functional body 1 is further shown in the first functional body section 3, in which the contacts 4a, 4b are not electrically connected to the functional body 1.
  • the contact-free area 9 preferably designates a radial outer section of the functional body 1.
  • the contacts 4a, 4b close at the outer edge of the Electronic component 100 is not flush with the functional body 1, but the edge region 7 of the contacts 4a, 4b is offset inwards in comparison to the outer edge of the component.
  • the contacts 4a, 4b are preferably arranged and designed such that they completely contact the functional body 1 except for the contact-free edge.
  • Figure 3 shows a schematic sectional view of the electronic component 100 according to a further embodiment of the invention. It is in Figure 3 It can be seen that the functional area 2 has a constant thickness over its entire extent, which for example corresponds to the thickness D2 in Figure 2 corresponds.
  • the material properties of the first and the second functional body section are preferably selected differently here.
  • the first functional body section 3 has a greater specific electrical resistance than the second functional body section 2 analogous to the above embodiment with the increased thickness, by the greater resistance, a current density and thus the heat development in the first functional body section 3, in particular in or at the contact point with the edge region 7.
  • the functional body 1 preferably has a sintered, polycrystalline material.
  • the material is preferably silicon carbide, zinc oxide or another metal oxide, such as bismuth oxide, chromium oxide or manganese oxide.
  • the first functional body section 3 is preferably produced or obtained by sintering a starting material for the functional body 1, for example, or by selecting the composition of the starting material for the functional body before the sintering such that the first functional body section 3 is compared to the second functional body section 2 has a greater specific electrical resistance. In the present case, this can be achieved by the formulation of the starting material and the sintering conditions, in particular the process conditions during the sintering.
  • a manufacturing method of the functional body 1 for the electronic component 100 and / or the electronic component itself preferably comprises the provision of a green compact or base material 1 for the functional body 1, the formation of the functional body 1 using the base material 1 such that the electrical resistance of the functional body 1 is larger in the first functional body section 3 than in the second functional body section 2.
  • the thickness D1 of the first functional body section 3 is made larger than the thickness D2 of the second functional body section 2.
  • the base material 1 can be sintered into the functional body 1 in such a way that the specific electrical resistance of the functional body 1 in the first functional body section 3 is larger than in the second functional body section 2.
  • the base material 1 can be exposed to a temperature gradient during the sintering, for example, without further material being added to the base material 1 during the sintering.
  • the properties of the functional body 1 with respect to the specific electrical resistance are preferably formed solely by the formulation or composition, for example on the basis of migration and / or diffusion processes of material components originally contained in the base material 1.
  • the composition can comprise, for example, materials which, during the sintering, preferably migrate, diffuse or accumulate in the first functional body section 3 due to the temperature gradient described.
  • certain original materials of the base material 1 can be removed from the stoichiometry of the base material 1 by evaporation from the base material 1 or evaporation from a surface of the base material 1, so as to produce a more inhomogeneous material composition in the functional body 1 in contrast to the base body.
  • the effects or processes described can expediently lead to crystal grains or their grain sizes in the first functional body section 3 of the functional body 1 being smaller or being formed than in the second functional body section 2 and thus the specific electrical resistance in the first functional body section 3 is enlarged in contrast to the second functional body section 2.
  • the base material 1 can be provided with a dopant before sintering, which diffuses into the base material 1, for example during the sintering, in order to form the first functional body section 3.
  • the dopant can comprise or consist of, for example, yttrium oxide, in particular Y 2 O 3 , or other rare earth metals or their oxides.
  • the dopant or the additional material is preferably applied to the base material or the base material is immersed in the dopant or, for example, a solution or compound contained therein before sintering.
  • Figure 4 shows an exemplary voltage-current characteristic of an electronic component according to the invention (dashed line) and an exemplary voltage-current characteristic of a conventional corresponding electronic component (solid line).
  • the electric field strength is plotted as a function of the electric current density in logarithmic scales.
  • Characteristic curves preferably describe a working range of the components in question (cf. in particular the range above 10 A / mm 2 ).
  • the dashed voltage-current characteristic curve describes in particular the electrical behavior of a varistor component according to the invention, in which the thickness of the above-mentioned first functional body section 3 (cf. for example Figure 2 ) is enlarged by 10% compared to the second functional body section.
  • the conventional varistor component here is preferably identical or similar to the component according to the invention, except for the greater thickness described.
  • the Figures 5A to 5D show simulation results of the operation of varistor components according to the invention and conventional varistor components according to the characteristic curve (s) Figure 4 ,
  • the simulations preferably relate to "finite element (FEM) simulations.
  • FEM finite element
  • the Figures 5A to 5D each describe four different geometries or partial figures of disk varistors (cf. numbering (1) to (4)), at least in the Figures 5A and 5B each about the right half or an upper right quarter of a sectional view similar or corresponding to that Figures 2 and 3 is shown.
  • the results relate to disk varistors with a diameter of 30 mm and a thickness of a corresponding second functional body section (cf. reference number 2 above) of 3 mm.
  • the vertical dashed lines in the Figures 5A to 5D define the first functional body section of the respective components described above and visually delimit this from the second functional body section. At least the thickness of the first contact is 10 ⁇ m. In the circled areas, the edge area 7 of the contacts can be seen (see reference number 4a above).
  • the partial figures (2) each show the thickness (cf. D1 in Figure 2 ) of the first functional body section compared to the second functional body section enlarged by 10% (see right edge of the partial figures (2) of the Figures 5A to 5D ).
  • the partial figures (3) each show corresponding simulation results for the configuration of the component according to the invention, in which the functional body sections are of the same thickness, but the first functional body section has a greater specific electrical resistance than the second functional body section due to the material composition ( Figure 3 including description).
  • the sub-figures (4) combine the configurations of the sub-figures (2) and (3), each showing and simulating both a greater thickness of the first functional body section and an increased specific electrical resistance due to the material composition.
  • both the temperature and the electrical current density are considerably higher at points than in the corresponding other functional body.
  • the temperature of the varistor component which arises in response to the test pulse described in the first functional body section, in particular in the vicinity of the edge region 7 of the contact, can be reduced by up to 750 ° C. according to the invention.
  • Corresponding results of the electrical current densities at the pulse maximum of the test pulse and the maximum temperature at the end of the pulse on the basis of numerical values are in the table of Figure 5 shown for all sub-figures (1) to (4).
  • the electrical voltage of the varistor is also shown.
  • the invention is not limited by the description based on the exemplary embodiments. Rather, the invention encompasses every new feature and every combination of features, which in particular includes every combination of features in the patent claims, even if this feature or this combination itself is not explicitly specified in the patent claims or exemplary embodiments.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermistors And Varistors (AREA)

Claims (15)

  1. Module électronique (100) présentant un corps fonctionnel (1) et un contact (4a), qui est relié électriquement à une première surface (5) du corps fonctionnel (1), le contact (4a) présentant une zone de bord (7) et une zone centrale (8) et le corps fonctionnel (1) étant conçu de manière telle que la résistance électrique du corps fonctionnel (1) entre la première surface (5) et une deuxième surface (6), opposée à la première surface (5), du corps fonctionnel (1), dans une première section (3) du corps fonctionnel qui, en vue du dessus sur le module électronique, (100) recouvre la zone de bord (7), est supérieure à celle dans une deuxième section (2) du corps fonctionnel qui, en vue du dessus sur le module électronique (100), chevauche la zone centrale (8) du contact (4a), caractérisé en ce que le corps fonctionnel (1) est conçu de manière telle que la première section (3) du corps fonctionnel présente une résistance électrique spécifique supérieure à celle de la deuxième section (2) du corps fonctionnel.
  2. Module électronique (100) selon la revendication 1, la première section (3) du corps fonctionnel, en vue du dessus sur le module électronique (100), entourant au moins partiellement la deuxième section (2) du corps fonctionnel.
  3. Module électronique (100) selon la revendication 1 ou 2, la superficie de la deuxième section (2) du corps fonctionnel, en vue du dessus sur le module électronique (100), étant supérieure à la superficie de la première section (3) du corps fonctionnel.
  4. Module électronique (100) selon l'une quelconque des revendications précédentes, le corps fonctionnel (1) présentant, dans la première section (3) du corps fonctionnel, une zone sans contact (9) dans laquelle le contact (4a) n'est pas relié électriquement au corps fonctionnel (1).
  5. Module électronique (100) selon l'une quelconque des revendications précédentes, l'épaisseur (D1) du corps fonctionnel (1) dans la première section (3) du corps fonctionnel étant supérieure à l'épaisseur (D2) du corps fonctionnel (1) dans la deuxième section (2) du corps fonctionnel.
  6. Module électronique (100) selon la revendication 5, l'épaisseur (D1) du corps fonctionnel (1) dans la première section (3) du corps fonctionnel étant supérieure de 5% à 15% à l'épaisseur (D2) du corps fonctionnel (1) dans la deuxième section (2) du corps fonctionnel.
  7. Module électronique (100) selon l'une quelconque des revendications précédentes, le contact étant un premier contact (4a), le module électronique (100) présentant un deuxième contact (4b) qui est relié électriquement à la deuxième surface (6) du corps fonctionnel (1) et le corps fonctionnel (1) étant conçu de manière telle que la distribution de la densité de courant, dans le cas d'un courant dans le corps fonctionnel (1) entre les contacts (4a, 4b), est homogénéisée dans la première et dans la deuxième section (3, 2) du corps fonctionnel.
  8. Module électronique (100) selon l'une quelconque des revendications précédentes, qui est un module de varistance, par exemple une varistance disque ou une varistance bloc.
  9. Module électronique (100) selon l'une quelconque des revendications précédentes, le corps fonctionnel (1) étant polycristallin.
  10. Procédé pour la fabrication d'un corps fonctionnel (1) pour un module électronique (100) comprenant les étapes suivantes :
    - mise à disposition d'un matériau de base pour le corps fonctionnel (1) pour le module électronique (100),
    - formation du corps fonctionnel (1) avec utilisation du matériau de base de manière telle que la résistance électrique du corps fonctionnel (1), mesurée entre deux surfaces (5, 6) opposées, dans une première section (3) du corps fonctionnel est supérieure à celle dans une deuxième section (2) du corps fonctionnel,
    caractérisé en ce que le matériau de base est fritté en corps fonctionnel (1) de manière telle que la résistance électrique spécifique du corps fonctionnel (1) dans la première section (3) du corps fonctionnel est supérieure à celle dans la deuxième section (2) du corps fonctionnel.
  11. Procédé selon la revendication 10, le matériau de base présentant une composition homogène de matière en tant que corps fonctionnel (1).
  12. Procédé selon la revendication 10 ou 11, le matériau de base dans la première section (3) du corps fonctionnel étant formé avec une épaisseur plus grande par rapport à celle de la deuxième section (2) du corps fonctionnel.
  13. Procédé selon l'une quelconque des revendications 10 à 12, la composition de matière du matériau de base dans une première section (3) de celui-ci étant modifiée pendant le frittage pour former la première section (3) du corps fonctionnel.
  14. Procédé selon l'une quelconque des revendications 10 à 13, le matériau de base étant soumis, pendant le frittage, à un gradient de température et le matériau de base n'étant pas pourvu d'additifs de matière pendant le frittage.
  15. Procédé selon l'une quelconque des revendications 10 à 14, le matériau de base étant pourvu, avant le frittage, d'une substance de dopage qui diffuse dans le matériau de base pendant le frittage pour former la première section (3) du corps fonctionnel.
EP15727321.0A 2014-05-19 2015-05-18 Composant électronique et méthode pour sa fabrication Active EP3146536B1 (fr)

Applications Claiming Priority (2)

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DE102014107040.2A DE102014107040A1 (de) 2014-05-19 2014-05-19 Elektronisches Bauelement und Verfahren zu dessen Herstellung
PCT/EP2015/060882 WO2015177085A1 (fr) 2014-05-19 2015-05-18 Composant électronique et son procédé de fabrication

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EP3146536B1 true EP3146536B1 (fr) 2020-02-19

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EP (1) EP3146536B1 (fr)
JP (1) JP6850608B2 (fr)
CN (1) CN106463219A (fr)
DE (1) DE102014107040A1 (fr)
WO (1) WO2015177085A1 (fr)

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DE102018116221B4 (de) * 2018-07-04 2022-03-10 Tdk Electronics Ag Vielschichtvaristor mit feldoptimiertem Mikrogefüge und Modul aufweisend den Vielschichtvaristor

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Publication number Publication date
JP6850608B2 (ja) 2021-03-31
DE102014107040A1 (de) 2015-11-19
WO2015177085A1 (fr) 2015-11-26
EP3146536A1 (fr) 2017-03-29
CN106463219A (zh) 2017-02-22
US20170092394A1 (en) 2017-03-30
JP2017516315A (ja) 2017-06-15
US10204722B2 (en) 2019-02-12

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