EP3146536A1 - Composant électronique et son procédé de fabrication - Google Patents

Composant électronique et son procédé de fabrication

Info

Publication number
EP3146536A1
EP3146536A1 EP15727321.0A EP15727321A EP3146536A1 EP 3146536 A1 EP3146536 A1 EP 3146536A1 EP 15727321 A EP15727321 A EP 15727321A EP 3146536 A1 EP3146536 A1 EP 3146536A1
Authority
EP
European Patent Office
Prior art keywords
functional body
electronic component
body portion
functional
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP15727321.0A
Other languages
German (de)
English (en)
Other versions
EP3146536B1 (fr
Inventor
Franz Rinner
Yongli Wang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Publication of EP3146536A1 publication Critical patent/EP3146536A1/fr
Application granted granted Critical
Publication of EP3146536B1 publication Critical patent/EP3146536B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/142—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being coated on the resistive element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/102—Varistor boundary, e.g. surface layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/105—Varistor cores

Definitions

  • the present invention relates to an electronic component
  • a varistor device for example, a varistor device, and a method for producing the same.
  • An object to be solved is to provide means for an improved electronic component, in particular a flexible one
  • a proposed electronic component comprises a functional body.
  • the functional body expediently represents the functional element of the electronic component.
  • the electronic component comprises a contact which is electrically connected to a first surface of the electronic component
  • the contact may be an electrical contact layer and / or a metallization or another
  • the surface is preferably a first surface, for example a first main surface of the functional body.
  • the contact has a marginal area and a central area.
  • the functional body is designed such that the electrical resistance of the
  • first and second functional body sections are preferably radial sections of the functional body.
  • the central region of the contact preferably designates an inner and / or middle region of the contact, while the edge region preferably designates or defines an outer edge of the contact.
  • the contact is electrically connected both to the first and to the second functional body portion.
  • the first functional body section preferably designates an outer or edge section of the functional body.
  • the second functional body section designates
  • the second functional body portion and the central area are - in supervision of the electronic
  • said contact is a first contact.
  • the electronic component also includes a second contact which is electrically connected to the second surface of the functional body or contacted.
  • the second contact is preferably formed analogous to the first contact and arranged with respect to the second surface as the first contact with respect to the first surface.
  • the first and the second contact may, for example, be arranged symmetrically with respect to a longitudinal axis of the electronic component.
  • Component is preferably each a contact on an upper side and on an underside of the disc for the electrical
  • Connection or contacting provided or arranged.
  • the functional body is preferably arranged directly or directly between the contacts.
  • the electronic component is a varistor component.
  • Varistor components are preferably used as overvoltage protection.
  • the functional body is expediently designed such that it represents the functional element of the varistor component.
  • the Functional body comprise a polycrystalline, sintered, material.
  • the electronic component is a disk or block varistor.
  • the second functional body portion in view of the electronic component viewed at least partially.
  • the first functional body portion encloses or surrounds the second
  • the functional body is such
  • Function body portion in particular at a contact point of the first functional body portion and the edge region of the contact or between the first functional body portion and the edge region, during operation of the electronic component and / or reduced in a flow of current in the functional body or reduced.
  • the electrical current density is preferably reduced or reduced in comparison to a conventional electronic component or a component of the prior art.
  • Temperature stress for example, be particularly high during operation of the electronic device.
  • the cause of this can be an edge effect that occurs during operation of the electronic component.
  • the proposed electronic component can advantageously be reduced or reduced during operation, the heat generation, for example, by resulting Joule heat in the first functional body portion, as a result of increased electrical resistance and thus reduced electrical current density usually less heat.
  • the electronic component is temperature-resistant and versatile
  • the life of the electronic component can be advantageously increased.
  • Embodiment of the functional body to the effect that the first functional body portion has a greater electrical resistance than the second functional body portion are counteracted, since characterized the described
  • the surface area of the second functional body portion is in plan view of the
  • Varistor voltage essentially unchanged.
  • the surface area of the second functional body portion is twice as large, three times or ten times as large as the area of the first functional body portion.
  • the functional body in the first functional body portion on a non-contact area is preferably an outer radial section of the functional body.
  • Functional body preferably arranged at the edge. In the non-contact area is preferably no contact
  • kink-free embodiment in turn, in turn, reduces or minimizes an edge length or edge surface of the contacting and thus the emergence of "hotspots"
  • the thickness of the first layer is a preferred embodiment.
  • Functional body in the first functional body portion greater than the thickness of the functional body in the second functional body portion.
  • the thickness of the first functional body portion and the thickness of the second functional body portion at least predominantly constant or approximately constant.
  • Functional body section can be specified, whereby the electrical current density and thus the temperature load in the first functional body portion can be reduced during operation of the electronic component.
  • the electrical resistance of the first functional body portion is due to the greater spacing of the contacts or surfaces in the first
  • the thickness described herein preferably extends along the above-mentioned longitudinal axis of the electronic component.
  • the thickness of the functional body is only on one side or main surface of the electronic
  • Functional body are flat and / or lie in a plane.
  • the functional body may be configured such that, for example, a top and a bottom of the first Functional body section opposite an upper ⁇ or a bottom of the second
  • Functional body section is not arranged in a plane.
  • the thickness of the first layer is the same as that of the second layer.
  • Functional body in the first functional body portion 5% to 15% greater than the thickness of the functional body in the second functional body portion. Particularly preferred is the thickness of the functional body in the first
  • Functional body portion at least 10% greater than the thickness of the second functional body portion.
  • said thickness may for example be increased more than 15%.
  • the effect of increasing the thickness in terms of electrical resistance is qualitatively the same.
  • the functional body is designed such that the first functional body portion in comparison to the second functional body portion a has greater specific electrical resistance.
  • Functional body portion is increased, the current density in the first functional body portion during operation of the electronic component can be reduced or reduced.
  • Corresponding differences in the material properties may preferably be generated or formed during the manufacturing process of the electronic component and / or during sintering of the functional body (see below). Due to the larger specific electrical
  • the functional body has a sintered material.
  • the contact is a first contact
  • the electronic component additionally has a second contact, which is electrically connected to the second surface of the functional body, and wherein the functional body is formed such that the electrical current or current density distribution at a current flow is homogenized in the functional body between the contacts in the first and the second functional body portion. This may mean that discrepancies or the dispersion of the
  • the second contact has an edge region and a central region analogously to the first contact.
  • the functional body preferably substantially polycrystalline.
  • the functional body for example, as a main component have a polycrystalline material.
  • the functional body for example as a main component, a ceramic.
  • the ceramic is preferably a sintered ceramic.
  • the varistor voltage between the first and the second surface consistently electrically conducts, without the
  • Functional body has electrically insulating regions.
  • Functional body specified for the electronic component described above The functional body and / or the electronic component can preferably be produced or manufactured by means of the method described here.
  • Obtained features also relate to the functional body and / or the electronic component, and vice versa.
  • the method comprises providing a base material for the functional body for the electronic component and forming the functional body using the Base material such that the electrical resistance of the functional body, between two opposite
  • this comprises the provision of the functional body to the
  • each contact for example, the above-mentioned first and second contact, is electrically connected to the first and the second functional body portion.
  • the base material has a more homogeneous material composition than the functional body.
  • Base material is preferably substantially homogeneous
  • This embodiment advantageously makes it possible to increase the electrical resistance of the first functional body section in comparison to the second functional body section.
  • the base material is sintered to the functional body, such that the specific electrical resistance of the functional body in the first functional body portion is greater than in the second functional body portion.
  • the base material is sintered in such a way that crystal grains or corresponding particle sizes in the first
  • Functional body portion of the functional body are smaller or formed than in the second
  • the material composition of the base material in a first portion thereof is changed during sintering to form the first functional body portion.
  • the first functional body portion is preferably formed by sintering.
  • the base material is subjected to a temperature gradient during sintering, wherein the base material during sintering, and preferably also before sintering not with
  • the base material is no further
  • the base material prior to sintering, is provided with a dopant which diffuses into the base material during sintering to form the first functional body portion.
  • the dopant or additive material is preferably applied to the base material or the base material is dipped in the dopant or a solution containing it prior to sintering.
  • the dopant may be yttrium oxide,
  • the first functional body portion is formed such that the maximum temperature, which in the first
  • Functional body section under an electrical test pulse with a current of 30 A of the pulse shape 8/20 occurs, for example, compared to a conventional
  • Production of the functional body comprises.
  • FIG. 1 shows a schematic perspective view of an electronic component.
  • FIG. 2 shows a schematic sectional view of a
  • FIG. 3 shows a schematic sectional view of a
  • inventive electronic component according to an alternative embodiment.
  • FIG. 4 shows an exemplary voltage-current characteristic of the electronic component embodied as a varistor component.
  • FIGS 5A to 5D show simulation results of
  • FIG. 6 shows a table with values for the simulation of the operation of the electronic component.
  • the same, similar and equally acting elements are provided in the figures with the same reference numerals.
  • the figures and the proportions of the elements shown in the figures with each other are not to scale
  • FIG. 1 shows a schematic perspective view of an electronic component 100.
  • the electronic component 100 is preferably a varistor component, in particular a disk or block varistor. Particularly preferably, the electronic component 100 is a disc varistor.
  • the electronic component 100 is configured disc-shaped according to Figure 1 and has a longitudinal axis or axis of symmetry X, which extends through the center of the disc. With regard to the longitudinal axis X, the electronic component is preferably at least approximately
  • the electronic component according to FIG. 1 furthermore has a disc-shaped
  • the functional body 1 comprises in the case of
  • Varistorbauelements preferably a semiconductor material and / or an example sintered ceramic. Accordingly, the functional body 1 further preferably comprises
  • a functional component of a varistor component of the functional body 1 is preferably formed such that it can be switched after the application of an electrical voltage above the varistor voltage, from the electrically insulating to the electrically conductive state.
  • the functional body 1 comprises a first
  • Function body section 3 rotates or surrounds the
  • the second functional body section 2 is preferably viewed at its outer edge and is preferably integrally and / or integrally connected to it
  • the electronic component, or the discs ⁇ or block varistor for example, has a diameter of about 30 mm and a thickness of about 3 mm. Said thickness preferably refers to the thickness of the second
  • the electronic component may be, for example, an angular block varistor.
  • Figure 2 shows a schematic sectional view of a
  • FIG. 2 preferably shows a section through the electronic component 100 according to FIG. 1 along the longitudinal axis X. It can also be seen that the
  • Functional body 1 in its first functional body portion 3 has a thickness Dl.
  • the functional body 1 has a thickness D2.
  • the thickness D2 is smaller than the thickness D1.
  • the thickness D1 may be 5% 10% or 15% larger or even greater than the second thickness.
  • the functional body 1 furthermore has a first surface 5 and a second one remote from the first surface 5
  • the second surface 6 is planar according to FIG. 1, while the first surface 5 is not plane due to the increase in the thickness D1 in the first functional body section 3 in comparison to D2.
  • the larger thickness Dl of the first functional body portion 3 compared to the second functional body portion 2 can also be realized such that both surfaces 5, 6 in the first functional body portion 3 relative to the second Functional body section 2 sublime, so overall are not flat.
  • Functional body 1 for example, from the first to the second functional body portion (from inside to outside) on an oblique course increase (see also Figures 5A to 5D below).
  • an abrupt change in the thickness over a step in the course of the thickness of the functional body 1 is also conceivable (not explicitly shown in the figures).
  • Functional body portion 2 (see D2 in Figure 2), the electrical resistance of the functional body 1 between the first surface 5 and the second surface 6 in particular by the increased distance in the first
  • the electronic component 100 further has a first contact 4a, which is electrically connected to the first surface 5.
  • the first contact 4a is preferably connected both to the first functional body section 3 and to the second functional body section 2.
  • the contact 4a in turn has an edge region 7 and a central region 8.
  • the edge region 7 encloses the
  • the electronic component has a second
  • the second contact 4b preferably has an edge region 7 and a central region 8.
  • the first and second contacts 4a, 4b viewed in plan view of the electronic component 100 are arranged congruent.
  • the contacts 4a, 4b preferably contact the
  • the contacts can, for example
  • the contacts 4a, 4b for an electrical connection or contacting a
  • Functional body 1 may be provided.
  • the functional body 1 is suitably electrically conductive, for example, to protect a further electrical component from an overvoltage or a component damaging electrical voltage.
  • the first functional body section 3 overlaps in a plan view of the electronic component 100, ie
  • the second functional body portion 2 overlaps in a plan view of the electronic component 100, preferably with the central region 8.
  • Functional body portion 2 may advantageously in the operation of the electronic component 100 in the second
  • Functional body section 3 occurring electric power or in particular the electric current density can be reduced or reduced. Due to the reduced current load can simultaneously heat generation and thus
  • Temperature load in the first functional body portion can be reduced.
  • the electronic component 100 preferably has up to the thickness Dl of the first
  • Functional body section 3 compared to a conventional electronic component or an electronic
  • the contact surfaces that is to say the surfaces in which the contacts 4a, 4b are connected to the functional body 1, are similar in this respect or
  • the edge effect can be caused by electric fields which are greater during operation of the component 100 at or in the edge region 7 than in the central region 8, for example. Although the electric current density is reduced by the greater distance of the contacts in the first functional body portion 3, further electrical properties of the
  • the area of the second functional body portion 2 is preferably larger than that of the first one
  • Varistorbauelements example, the varistor voltage of the electronic component, preferably independent of the configuration of the first functional body portion.
  • a radial extension of the first functional body section 3 is identified in FIG. 2 by Rl. Furthermore, a radial extent, in particular the diameter of the second functional body portion 2 is indicated by R2.
  • the radial extent Rl is between the single and the double thickness Dl of the functional body 1 in the first functional body section 3.
  • a contact-free edge 9 of the functional body 1 is furthermore shown in the first functional body section 3, in which the contacts 4a, 4b are not electrically connected to the functional body 1.
  • Region 9 preferably designates a radial outer portion of the functional body 1.
  • the contacts 4a, 4b are preferably arranged and configured such that they
  • Figure 3 shows a schematic sectional view of the
  • Functional body portion preferably selected differently.
  • the first functional body portion 3 has a greater specific electrical resistance than the second
  • the functional body 1 preferably comprises a sintered, polycrystalline material. in case of a
  • the first metal oxide preferably silicon carbide, zinc oxide or another metal oxide such as bismuth oxide, chromium oxide or manganese oxide.
  • Functional body section 3 preferably produced or obtained by a starting material for the
  • Functional body 1 for example, was sintered or the composition of the starting material for the
  • the second functional body portion 2 has a greater electrical resistivity. This can in the present case by the formulation of the starting material and the sintering conditions, in particular the
  • Process conditions can be achieved during sintering.
  • the component itself preferably comprises providing a green body or base material 1 for the functional body 1, forming the functional body 1 using the base material 1 such that the electrical resistance of the functional body 1 in the first functional body section 3 is greater than in the second functional body section 2.
  • the thickness Dl of the first becomes
  • Functional body portion 3 configured larger than the thickness D2 of the second functional body portion second
  • the base material 1 can be sintered to the functional body 1 such that the
  • Base material 1 are exposed to a temperature gradient during sintering, for example, without the
  • Base material 1 during sintering more material is added.
  • the properties of the functional body 1 with respect to the specific electrical resistance are preferably formed solely by the formulation or composition, for example due to migration and / or diffusion processes of material components originally contained in the base material 1.
  • Base material 1 are withdrawn, so in the functional body 1 in contrast to the main body inhomogeneous
  • Functional body portion 3 of the functional body 1 are smaller or formed than in the second
  • the base material 1 may be provided with a dopant before sintering, which diffuses into the base material 1 during sintering, for example, to form the first functional body portion 3.
  • the dopant may include or consist of, for example, yttrium oxide, in particular Y 2 O 3 , or other rare earth metals or their oxides.
  • the dopant or additive is preferably applied to the base material or the base material is dipped into the dopant prior to sintering or, for example, a solution or compound contained therein.
  • FIG. 4 shows an exemplary voltage-current characteristic of an electronic component according to the invention
  • the electric field strength is plotted as a function of the electric current density in logarithmic scales.
  • the Characteristics preferably describe a working range of the relevant components (compare, in particular, the range above 10 A / mm 2 ).
  • the dashed voltage-current characteristic describes
  • Varistor component according to the invention in which the thickness of the above-mentioned first functional body portion 3 (see.
  • Conventional varistor component is here preferably identical or similar to the component according to the invention, except for the greater thickness described. It can be seen, for example, in FIG. 4 that, given a given electric field strength, the electrical current density of the component according to the invention is taken into account in view of FIG. 4
  • logarithmic scale on the X-axis, at least in the middle, flat-running characteristic region is significantly smaller than in the conventional varistor device.
  • FIGS 5A to 5D show simulation results of
  • FEM finite element
  • FIGS. 5A to 5D each describe four different geometries or partial figures of disc varistors (cf.
  • Dotted lines in FIGS. 5A to 5D define the above-described first functional body portion of the respective components and optically delimit this from the second functional body portion. At least the thickness of the first contact is 10 ym. In the circled areas in each case the edge region 7 of the contacts (see FIG.
  • FIGS. 5A and 5C each show results for the electrical current density in A / mm 2 .
  • FIGS. 5B and 5D respectively show results for the temperature in ° C. (compare the corresponding color scales in the lower region of FIG.
  • both the temperature and the electrical current density is selectively much higher than in the corresponding other functional body.
  • Edge region 7 of the contact arises, according to the invention can be reduced by up to 750 ° C.
  • Corresponding results of the electrical current densities at the pulse maximum of the test pulse and the maximum temperature at the end of the pulse on the basis of numerical values are shown in the table of FIG. 5 for all subfigures (1) to (4). Furthermore, the electrical voltage of the test pulse and the maximum temperature at the end of the pulse on the basis of numerical values are shown in the table of FIG. 5 for all subfigures (1) to (4). Furthermore, the electrical voltage of the
  • the temperature and electric current density for the subfigures (4) that is to say for the combination of the embodiments according to the invention from FIGS. 2 and 3, in contrast to the subfigures (1), are significantly reduced (compare likewise the numerical values on the right in FIG. ,
  • the invention is not limited by the description with reference to the embodiments. Rather, the includes

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Thermistors And Varistors (AREA)

Abstract

L'invention concerne un composant électronique (100) comportant un élément fonctionnel (1) et un contact (4a, 4b) qui est relié électriquement à une première surface (5) de l'élément fonctionnel (1), le contact (4a, 4b) comportant une zone de bordure (7) et une zone centrale (8), l'élément fonctionnel (1) étant conçu de telle sorte que la résistance électrique de l'élément fonctionnel (1) entre la première surface (5) et une seconde surface (6) de l'élément fonctionnel (1), opposée à la première surface (5), dans une première partie de l'élément fonctionnel (3), qui chevauche la zone de bordure (7) lorsque l'on regarde le composant électronique (100) en vue de dessus, est plus grande que dans une seconde partie de l'élément fonctionnel (2) qui chevauche la zone centrale (8) du contact (4a, 4b).
EP15727321.0A 2014-05-19 2015-05-18 Composant électronique et méthode pour sa fabrication Active EP3146536B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102014107040.2A DE102014107040A1 (de) 2014-05-19 2014-05-19 Elektronisches Bauelement und Verfahren zu dessen Herstellung
PCT/EP2015/060882 WO2015177085A1 (fr) 2014-05-19 2015-05-18 Composant électronique et son procédé de fabrication

Publications (2)

Publication Number Publication Date
EP3146536A1 true EP3146536A1 (fr) 2017-03-29
EP3146536B1 EP3146536B1 (fr) 2020-02-19

Family

ID=53298323

Family Applications (1)

Application Number Title Priority Date Filing Date
EP15727321.0A Active EP3146536B1 (fr) 2014-05-19 2015-05-18 Composant électronique et méthode pour sa fabrication

Country Status (6)

Country Link
US (1) US10204722B2 (fr)
EP (1) EP3146536B1 (fr)
JP (1) JP6850608B2 (fr)
CN (1) CN106463219A (fr)
DE (1) DE102014107040A1 (fr)
WO (1) WO2015177085A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017105673A1 (de) * 2017-03-16 2018-09-20 Epcos Ag Varistor-Bauelement mit erhöhtem Stoßstromaufnahmevermögen
DE102017210472A1 (de) * 2017-06-22 2018-12-27 Phoenix Contact Gmbh & Co. Kg Varistor mit Durchlegierungsoptimierung
DE102018116221B4 (de) * 2018-07-04 2022-03-10 Tdk Electronics Ag Vielschichtvaristor mit feldoptimiertem Mikrogefüge und Modul aufweisend den Vielschichtvaristor

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL239104A (fr) * 1958-05-26 1900-01-01 Western Electric Co
JPS5074444U (fr) 1973-11-12 1975-06-30
IE47121B1 (en) * 1977-07-29 1983-12-28 Gen Electric Stabilized varistor
US4364021A (en) * 1977-10-07 1982-12-14 General Electric Company Low voltage varistor configuration
US4157527A (en) * 1977-10-20 1979-06-05 General Electric Company Polycrystalline varistors with reduced overshoot
JPS56115501A (en) 1980-02-18 1981-09-10 Hitachi Ltd Voltage nonnlinear resistor
DE3405834A1 (de) * 1984-02-17 1985-08-22 Siemens AG, 1000 Berlin und 8000 München Varistor aus einer scheibe aus durch dotierung halbleitendem zinkoxid-material und verfahren zur herstellung dieses varistors
JPS6329902A (ja) 1986-07-23 1988-02-08 富士電機株式会社 電圧非直線抵抗体の製造方法
JPH05335114A (ja) 1992-05-29 1993-12-17 Taiyo Yuden Co Ltd 容量性磁器バリスタ
DE4221309A1 (de) * 1992-06-29 1994-01-05 Abb Research Ltd Strombegrenzendes Element
US5594613A (en) * 1992-10-09 1997-01-14 Cooper Industries, Inc. Surge arrester having controlled multiple current paths
JP3114425B2 (ja) 1993-04-23 2000-12-04 富士電機株式会社 電圧非直線抵抗体及びその製造方法
JP3423623B2 (ja) 1998-08-10 2003-07-07 三菱電機株式会社 抵抗体
US7772961B2 (en) 2004-09-15 2010-08-10 Panasonic Corporation Chip-shaped electronic part
CN101010754A (zh) 2004-09-15 2007-08-01 松下电器产业株式会社 芯片型电子元件
JP2007173313A (ja) 2005-12-19 2007-07-05 Toshiba Corp 電流−電圧非直線抵抗体
JP2007251102A (ja) 2006-03-20 2007-09-27 Matsushita Electric Ind Co Ltd チップ形電子部品
JP2007329178A (ja) 2006-06-06 2007-12-20 Toshiba Corp 電流−電圧非直線抵抗体および避雷器

Also Published As

Publication number Publication date
JP6850608B2 (ja) 2021-03-31
DE102014107040A1 (de) 2015-11-19
WO2015177085A1 (fr) 2015-11-26
EP3146536B1 (fr) 2020-02-19
CN106463219A (zh) 2017-02-22
US20170092394A1 (en) 2017-03-30
JP2017516315A (ja) 2017-06-15
US10204722B2 (en) 2019-02-12

Similar Documents

Publication Publication Date Title
EP0103748B1 (fr) Circuit combiné avec un varistor
DE2235783C2 (de) Metalloxid-Varistorelement
DE1925765C3 (de) Thyristor
EP2614508A2 (fr) Composant résistance et procédé de fabrication d'un composant résistance
DE112005002980T5 (de) Scheibenvaristor und Verfahren zu seiner Herstellung
EP2862185B1 (fr) Procédé de fabrication d'un élément électrique
EP3146536B1 (fr) Composant électronique et méthode pour sa fabrication
DE102013106810A1 (de) Verfahren zur Herstellung eines Vielschicht-Varistorbauelements und Vielschicht-Varistorbauelement
DE112012007277T5 (de) Zinkoxid-basierter Varistor und Herstellungsverfahren
DE2528090C2 (de) Mehrphasen-Stoßspannungsunterdrücker
DE2500431A1 (de) Stossueberspannungsableiter mit verbesserter spannungsabstufungsschaltung
WO2015181014A1 (fr) Composant électronique
DE102015214057B4 (de) Verfahren zur Herstellung einer Zündkerze mittels einer mit Pulver befüllten Kapsel sowie Zündkerze
WO2003028185A1 (fr) Composant electrique
DE102013203639A1 (de) Gassensor
DE102017105673A1 (de) Varistor-Bauelement mit erhöhtem Stoßstromaufnahmevermögen
DE102018115085B4 (de) Keramisches Vielschichtbauelement und Verfahren zur Herstellung eines keramischen Vielschichtbauelements
EP3417518A1 (fr) Appareil de protection contre les surtensions
DE102004062183B3 (de) Thyristoranordnung mit integriertem Schutzwiderstand und Verfahren zu deren Herstellung
DE1765097B2 (de) Spannungsabhaengiger widerstand aus einer gesinterten scheibe aus zinkoxid
DE2832735A1 (de) Stabilisierter varistor
EP2989643A1 (fr) Dispositif et procédé permettant d'établir une liaison électroconductrice et mécanique
DE10134751C1 (de) Elektrokeramisches Bauelement
EP3695473B1 (fr) Élément résistant de bougie d'allumage avec proportion de phase de zrsio4 augmentée
DE102012109250A1 (de) Elektrisches Bauelement und Verfahren zur Herstellung einer Kontaktierung eines Elektrischen Bauelements

Legal Events

Date Code Title Description
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE

PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20161018

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

DAV Request for validation of the european patent (deleted)
DAX Request for extension of the european patent (deleted)
RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: EPCOS AG

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: TDK ELECTRONICS AG

REG Reference to a national code

Ref country code: DE

Ref legal event code: R079

Ref document number: 502015011781

Country of ref document: DE

Free format text: PREVIOUS MAIN CLASS: H01C0007102000

Ipc: H01C0007100000

RIC1 Information provided on ipc code assigned before grant

Ipc: H01C 1/142 20060101ALI20190812BHEP

Ipc: H01C 7/102 20060101ALI20190812BHEP

Ipc: H01C 7/10 20060101AFI20190812BHEP

Ipc: H01C 7/105 20060101ALI20190812BHEP

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: GRANT OF PATENT IS INTENDED

INTG Intention to grant announced

Effective date: 20191007

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE PATENT HAS BEEN GRANTED

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 502015011781

Country of ref document: DE

REG Reference to a national code

Ref country code: AT

Ref legal event code: REF

Ref document number: 1235893

Country of ref document: AT

Kind code of ref document: T

Effective date: 20200315

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

Free format text: LANGUAGE OF EP DOCUMENT: GERMAN

REG Reference to a national code

Ref country code: NL

Ref legal event code: MP

Effective date: 20200219

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: RS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200219

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200219

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200519

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG4D

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200619

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200219

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200219

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200219

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200520

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200519

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200219

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200219

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200219

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200219

Ref country code: SM

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200219

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200219

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200219

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200219

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200712

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200219

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 502015011781

Country of ref document: DE

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed

Effective date: 20201120

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200531

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200531

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200219

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200219

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200219

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200219

REG Reference to a national code

Ref country code: BE

Ref legal event code: MM

Effective date: 20200531

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20200519

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200518

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200531

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200518

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200519

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200531

REG Reference to a national code

Ref country code: AT

Ref legal event code: MM01

Ref document number: 1235893

Country of ref document: AT

Kind code of ref document: T

Effective date: 20200518

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20200518

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200219

Ref country code: MT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200219

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200219

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200219

Ref country code: AL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20200219

P01 Opt-out of the competence of the unified patent court (upc) registered

Effective date: 20230521

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20230523

Year of fee payment: 9