EP3061138A1 - Agent d'encapsulation de del - Google Patents

Agent d'encapsulation de del

Info

Publication number
EP3061138A1
EP3061138A1 EP14787196.6A EP14787196A EP3061138A1 EP 3061138 A1 EP3061138 A1 EP 3061138A1 EP 14787196 A EP14787196 A EP 14787196A EP 3061138 A1 EP3061138 A1 EP 3061138A1
Authority
EP
European Patent Office
Prior art keywords
led
encapsulant
surfactant
led encapsulant
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP14787196.6A
Other languages
German (de)
English (en)
Inventor
Kyuha Chung
Doo Jin Kang
Chang Sic KIM
Kyung-Hak Kim
JiHye PARK
Youngjin Kim
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wacker Chemie AG
Original Assignee
Wacker Chemie AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wacker Chemie AG filed Critical Wacker Chemie AG
Publication of EP3061138A1 publication Critical patent/EP3061138A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0091—Scattering means in or on the semiconductor body or semiconductor body package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials

Definitions

  • the present invention relates to an LED encapsulant comprising scattering particles which scatter light produced from a light emitting diode (hereinafter, this will be referred to as X LED' ) chip.
  • An LED package is mainly constituted by a chip, an adhesive, an encapsulant, a fluorescent substance and a heat-radiant material.
  • the LED chip is the part that produces light, and through a p-n junction constitution possessed by the chip, light is produced when electric current is applied and electrons combine with positive holes.
  • the adhesive is often used for bonding other materials together in the LED package.
  • the function includes allowing mechanical contact between faces of a chip and a package, a package and a substrate, a substrate and a heat sink or the like; electrical conduction with a substrate or a package; heat release; or the like.
  • the LED fluorescent substance is a typical wavelength conversion substance of a dye, a semiconductor or the like and refers to a substance that absorbs energy of electron beam, X-rays, ultraviolet rays and the like and then emits some of the absorbed energy as visible rays. It played an important role in developing an LED package for white light.
  • the heat-radiant material includes a heat sink, a slug and the like, and is closely related to the life of an LED package.
  • the basic function of the encapsulant is to protect an LED chip and emit light to the outside by allowing penetration of light.
  • epoxy series and silicone series are mainly suggested.
  • silicone encapsulants are used for high-power LED packaging materials.
  • silicone encapsulants are more durable against blue and ultraviolet rays and also highly resistant to heat and moisture.
  • silicone encapsulants are used for lighting LEDs and backlight LEDs nowadays, however, there is a problem such as that the gas barrier properties are poor and thus degradation of elements or corrosion of electrodes may be produced.
  • LEDs are configured in the manner that an LED encapsulant covers a blue LED chip and a yellow fluorescent substance (YAG) is dispersed in an LED encapsulant resin.
  • YAG yellow fluorescent substance
  • the white light obtained in this manner provides high brightness, but there are disadvantages such as that it is difficult to control the hue and there is a phenomenon of changing in colour due to a change in the surrounding temperature.
  • the colour temperature is controlled by adjusting the amount of a fluorescent substance dispersed in an LED encapsulant resin, the content of the fluorescent substance has to be increased in order to lower the colour temperature. This results in increasing the cost of manufacturing an LED package, and consequently, a technique of reducing the used amount of a yellow fluorescent substance is required.
  • KR20090017346A describes an LED package including diffusion means comprising reflective particles .
  • An objective of the present invention is to provide an LED encapsulant providing high brightness and efficient control of a colour temperature, and an LED package comprising the same.
  • the present invention provides an LED encapsulant comprising a scattering particle mixture, which includes: (i) a linear polymer including a dimethylsiloxane group which has a vinyl end substituent and/or a linear polymer including a methylphenylsiloxane group which has a vinyl end substituent; and (ii) at least one vinyl-based resin selected from the group consisting of a vinyl-based ViMQ resin, a vinyl-based ViT ph QM resin, and a vinyl- based ViT H T ph QM resin which has an Si-H functional group, and an LED package comprising the encapsulant.
  • the present invention in a package that converts blue light emitted by an LED chip to white light by using a yellow fluorescent substance, high luminous efficiency is provided and the colour temperature is efficiently controlled. In addition, the equal colour temperature is obtained without lowering the luminous efficiency even if the amount of a yellow fluorescent substance used is reduced.
  • Figure 1 is a graph showing the results of luminous intensity measurement of encapsulants according to Examples 1 to 8 and Comparative Example 1.
  • Figure 2 is a graph showing the results of colour temperature (CCT) measurement of encapsulants according to Examples 1 to 8 and Comparative Example 1.
  • Figure 3 is a graph showing a graph integration value of encapsulants according to Examples 1 to 8 and Comparative Example 1.
  • Figure 4 is a graph showing the results of luminous intensity measurement of encapsulants according to Examples 9 to 16 and Comparative Example 1
  • Figure 5 is a graph showing the results of colour temperature (CCT) measurement of encapsulants according to Examples 9 to 16 and Comparative Example 1.
  • Figure 6 is a graph showing a graph integration value of encapsulants according to Examples 9 to 16 and Comparative Example 1.
  • Figure 7 is a graph showing the results of luminous intensity measurement of encapsulants according to Examples 17 to 22 and Comparative Examples 2 to 7.
  • Figure 8 is a graph showing the results of colour temperature (CCT) measurement of encapsulants according to Examples 17 to 22 and Comparative Examples 2 to 7.
  • Figure 9 is a graph showing a colour temperature and luminous intensity value of encapsulants according to Examples 17 to 22 and Comparative Examples 2 to 7.
  • Figure 10 is a graph showing the results of luminous intensity measurement of encapsulants according to Examples 23 to 33.
  • Figure 11 is a graph showing the results of colour temperature (CCT) measurement of encapsulants according to Examples 23 to 33.
  • Figure 12 is a graph showing the results of luminous intensity measurement of encapsulants according to Examples 34 to 39 and Comparative Example
  • Figure 13 is a graph showing the results of colour temperature (CCT) measurement of encapsulants according to Examples 34 to 39 and Comparative Example 8.
  • Figure 14 is a graph showing the results of luminous intensity measurement of encapsulants according to Examples 17 to 22 and Comparative Examples
  • Figure 15 is a graph showing the results of colour temperature (CCT) measurement of encapsulants according to Examples 17 to 22 and Comparative Examples 9 to 14.
  • the invention relates to a LED encapsulant comprising a scattering particle mixture, comprising:
  • the above mentioned resin has preferably following structures M vi D H D ph T ph , M vi M H D ph T ph ,
  • An LED encapsulant includes a basic silicone matrix and scattering particles which do not mix with each other.
  • (i) acts as silicone matrix and (ii) as scattering particles.
  • (ii) acts as silicone matrix and (i) as scattering particles.
  • the basic silicone matrix can be largely divided into a methylsiloxane matrix and a phenylsiloxane matrix.
  • the basic silicone matrix is a methylsiloxane matrix
  • a linear polymer (- (C3 ⁇ 4) 2 SiO) n ⁇ ) including a dimethylsiloxane group which has a vinyl end substituent and/or
  • a vinyl-based ViMQ resin are/is used as the basic silicone matrix.
  • a substance that does not mix with the methylsiloxane matrix is used as scattering particles, such as one or more of (i) a linear polymer (- ( (CH3) (Ph)SiO) n ⁇ ) including a methylphenylsiloxane group which has a vinyl end substituent, (ii) a linear polymer ( - ( ( Ph) 2 SiO) n _ ) including a diphenylsiloxane group which has a vinyl end substituent, (iii) a MDT resin or MT resin, which has desirably M vi D H D ph T ph , M vi M H D ph T ph , M Vl D H T ph , M Vl M H T ph , or M Vl (D)T ph structure, and a vinyl-based resin which has an Si-H functional group and aryl functional group in which hydrogen crosslinking is possible are used.
  • a linear polymer - (
  • the basic silicone matrix is a phenylsiloxane matrix
  • one or more of a linear polymer (- ( ( (CH3) (Ph)SiO) n ) ⁇ ) including a methylphenylsiloxane group which has a vinyl end substituent, (ii) a linear polymer ((Ph)2SiO) n including a diphenylsiloxane group which has a vinyl end substituent, (iii) a MDT resin or MT resin, which has desirably M vi D H D ph T ph , M vi M H D ph T ph , M vi D H T ph , M vi M H T Ph ⁇ Qr M vi ( D) T ph structure, and a vinyl- based resin which has an Si-H functional group and aryl functional group as the basic silicone matrix.
  • the basic silicone matrix is a phenylsiloxane matrix
  • a substance that does not mix with the phenylsiloxane matrix is used as scattering particles, such as (i) a linear polymer ( ( (CH 3 ) 2 SiO) n ) including a dimethylsiloxane group which has a vinyl end substituent and/or (ii) a vinyl-based ViMQ resin are/is used.
  • the content of scattering particles is controlled according to used vinyl base resin, linear polymer, surfactant and/or other additives. As the content of scattering particles increasing, light loss would be increased. So the contents of scattering particles should be controlled to make optimized light scattering. And as scattering particles, liquid type or solid type scattering particles is used. Liquid type scattering particles are better to control optical properties but solid type scattering particles are better for stability and lower viscosity.
  • the linear polymer may be a linear polymer ( ( (CH3) 2 S1O) n ) including a dimethylsiloxane group which has a vinyl end substituent. Since the vinyl polymer has a methyl group, high heat resistance is exhibited. For example, the heat resistance for yellowing stability is exhibited up to about 150°C.
  • a linear polymer including a methylphenylsiloxane group which has a vinyl end substituent or a linear polymer including a diphenylsiloxane group which has a vinyl end substituent may also be suggested. These polymers exhibit excellent gas barrier properties.
  • a vinyl-based resin a vinyl-based ViMQ resin, a MDT resin or MT resin, which has desirably M vi D H D ph T ph ,
  • T Trifunctional structural silicone-units
  • An LED encapsulant may further include a surfactant having a (CH 3 ) 2 Si-0 structure and a (CH 3 ) PhSi-0 structure, in addition to the scattering particle mixture.
  • the surfactant corresponds to a stabilizer for scattering particle dispersion.
  • the surfactant has any one structure of ABA, BAB and AB Examples include ( (CH 3 ) (Ph) SiO) n - ( (CH 3 ) 2 SiO) m ,
  • methyltriethoxysilane, allyltriethoxysilane, octyltriethoxysilane, tetraethoxysilane, or the like may be used as the surfactant.
  • the content of scattering particles is 5 to 20 wt% based on the total weight of the scattering particle mixture .
  • At least one surfactant selected from the group consisting of Ti02, ZnO and silica may be additionally added.
  • the sum of contents of Ti02, ZnO and silica is 0.05 to 5 wt% based on the whole content of the scattering particle mixture.
  • the average particle size of Ti02, ZnO and silica is between 1 and 50 nm.
  • An example includes
  • Ethynylcyclohexanol or the like may be used as a curing inhibitor for controlling a curing rate.
  • a catalyst for example, a platinum catalyst, and as a fluorescent substance, YAG or the like may be used.
  • nanoparticles may also be included.
  • the present invention provides an LED package comprising the LED encapsulant described above.
  • the LED chip preferably emits blue light when electric current is applied.
  • a yellow fluorescent substance is additionally included.
  • the LED package is prepared by encapsulating an LED chip that emits blue light when electric current is applied, with the LED encapsulant obtained by mixing a yellow fluorescent substance.
  • Vinyl resin A as (M vi D H D ph T ph ) which has an Si-H functional group and aryl functional group, Liquid type scattering particles B-l (viscosity: 1000 cps, molecular weight: 16500 g/mol, dimethylpolysiloxane having a vinyl end substituent) , surfactant M 15%, and as an inhibitor ECH (Ethynylcyclehexanol ) 0.01 ⁇ 6 were mixed in the respective amount shown in Table 1.
  • the surfactant M may have a [H(CH 3 ) 2 Si (OSi (CH 3 )2) a(CH 3 )2Si] (CH 2 ) 2 [ Si (CH 3 ) 2 ( (CH 3 ) (C 6 H 5 ) Si 0) b (OSi (CH 3 ) 2 ) c Si (CH 3 (CH 2 ) 2 [ (CH 3 ) 2 Si (OSi (CH 3 ) 2 ) a (CH 3 ) 2 SiH] st ructure .
  • M2 to M6 are as follows:
  • the surfactant M may have a
  • the surfactant M may have a
  • the surfactant M may have a [ (OCH 3 ) 3 Si ] (CH 2 ) 2 [Si (CH 3 ) 2 (OSi (CH 3 ) 2 ) a (CH 3 ) 2 Si] (CH 2 ) 2 [ (OCH 3 ) 3 Si] structure.
  • the surfactant M may have a [ (OCH 3 ) 3 Si ] (CH 2 ) 2 [Si (CH 3 ) 2 (0(CH 3 ) (C 6 H 5 ) Si) a (OSi (CH 3 ) 2 ) b OSi (CH 3 ) 2 (C 2 H 2 ) ] structure.
  • the surfactant M may have a
  • the surfactant M may have a [ (CeHi 3 ) 3 Si] (CH 2 ) 2 [Si (CH 3 ) 2 ( (CH 3 ) (C 6 H 5 ) SiO) a (OSi (CH 3 ) 2 ) b (CH 3 ) 2 Si ] (CH 2 ) 2 [ Si (CH 3 ) 2 (OSi (CH 3 ) 2 ) c (CH 3 ) 2 Si ] (CH 2 ) 2 [ (CH 3 ) 2 Si ( (CH 3 ) (C 6 H 5 ) SiO) a (OSi ( CH 3 ) 2 ) b (CH 3 ) 2 Si] (CH 2 ) 2 [ (C 6 H 13 ) 3 Si] structure.
  • Scattering particles and the surfactant M18 were dispersed using a mixer.
  • Ethynylcyclohexanol (ECH) was added in an amount of 0.01 wt% as a curing inhibitor, and then mixed using a speed mixer (2000 rpm/1 minute) .
  • a Pt catalyst (Platinum (0) -1, 3-divinyl-l, 1, 3, 3- tetramethyl-disiloxane complex) was added in an amount of 1 ppm, and then mixed using a speed mixer (2000 rpm/ 1 minute) .
  • yellow phosphor which has excited wavelength at 540 ⁇ 570nm range and red phosphor which has excited wavelength at 630-670 nm range were added in an amount of proper parts by weight with respect to 100 parts by weight of the total sample (Table 1), and then it was thoroughly mixed.
  • An encapsulant was prepared in the same manner as in Examples 1 to 11, except that OE6631 (Dow Corning) was used in place of the vinyl resin A, B-l, and surfactant M which were used in the Examples.
  • Vinyl resin A as (M vi D H D ph T ph ) which has an Si-H functional group and aryl functional group, solid type scattering particle B-2 (Zinc Oxide) and surfactant M18 15% were mixed in the respective amount shown in Table 2 below.
  • Scattering particles and the surfactant M18 15% were dispersed using a mixer.
  • Ethynylcyclohexanol (ECH)0.01% was added in an amount of 0.16 wt% as a curing inhibitor, and then mixed using a mixer.
  • a Pt catalyst (Platinum (0) -1, 3-divinyl-l, 1, 3, 3- tetramethyl-disiloxane complex) was added in an amount of 1 ppm, and then mixed using a mixer.
  • Example 16 4.0 ⁇ Examples 17 to 21>
  • Vinyl resin-A as MDT or MT resin which has an Si-H functional group and aryl functional group, Liquid type scattering particles B-l (viscosity: 1000 cps, molecular weight: 16500 g/mol, dimethylpolysiloxane having a vinyl end substituent) , , surfactant M 15%, and as an inhibitor ECH (Ethynylcyclehexanol ) 0.01 ⁇ 6 were mixed .
  • Scattering particles B-l 7% and various surfactant Ms 15% were dispersed using a mixer in the respective amount shown in Table 3.
  • Ethynylcyclohexanol (ECH) was added in an amount of 0.01 wt% as a curing inhibitor, and then mixed using a mixer.
  • a Pt catalyst (Platinum (0) -1, 3-divinyl-l, 1, 3, 3- tetramethyl-disiloxane complex) was added in an amount of 1 ppm, and then mixed using a mixer.
  • Each encapsulant was prepared in the same manner as in Examples 17 to 21, except that OE6631 (Dow
  • Vinyl resin-A as MDT or MT resin which has an
  • Liquid type scattering particles B-l viscosity: 1000 cps, molecular weight: 16500 g/mol, dimethylpolysiloxane having a vinyl end substituent
  • surfactant M 15% surfactant M 15%
  • ECH Ethynylcyclehexanol 0.01 ⁇ 6
  • Inhibitor ECH was not used to compare light efficiency according to curing speed .
  • Scattering particles B-l and the surfactant M5 were dispersed using mixer.
  • Ethynylcyclohexanol (ECH) was added in an amount of 0.01 wt% as a curing inhibitor, and then mixed using a mixer.
  • a Pt catalyst (Platinum (0) -1, 3-divinyl-l, 1, 3, 3- tetramethyl-disiloxane complex solution) was added in an amount of 1 ppm, and then mixed using a mixer.
  • Each encapsulant was prepared in the same manner as in Examples 22 to 23, except that OE6631 (Dow Corning) was used in place of the vinyl resin-A, B-1 and surfactant M which were used in the Examples. ⁇ Examples 24 to 25>
  • Vinyl resin-A as MDT or MT resin which has an Si-H functional group and aryl functional group, Liquid type scattering particles B-1 (viscosity: 1000 cps, molecular weight: 16500 g/mol, dimethylpolysiloxane having a vinyl end substituent) , , surfactant M18 15%, and as an inhibitor ECH (Ethynylcyclehexanol ) 0.01 ⁇ 6 were mixed.
  • Inhibitor ECH was not used to compare light efficiency according to curing speed .
  • Scattering particles B-1 and the surfactant M18 were dispersed using mixer.
  • Ethynylcyclohexanol (ECH) was added in an amount of 0.01 wt% as a curing inhibitor, and then mixed using a mixer.
  • a Pt catalyst (Platinum (0) -1, 3-divinyl-l, 1, 3, 3- tetramethyl-disiloxane complex solution) was added in an amount of 1 ppm, and then mixed using a mixer.
  • Example 24 yellow phosphor which has excited wavelength at 540 ⁇ 570nm range and red phosphor which has excited wavelength at 630-670 nm range, were added in an amount of proper parts by weight with respect to 100 parts by weight of the total sample, and then it was thoroughly mixed.
  • Vinyl resin-A as MDT or MT resin which has an
  • Liquid type scattering particles B-1 (viscosity: 1000 cps, molecular weight: 16500 g/mol, dimethylpolysiloxane having a vinyl end substituent) , , surfactant M18, and as an inhibitor ECH (Ethynylcyclehexanol ) 0.01 ⁇ 6 were mixed .
  • Scattering particles B-1 and the surfactant M18 were dispersed using mixer. Surfactant M18 was mixed as proper amount which is shown in Table 6.
  • Ethynylcyclohexanol (ECH) was added in an amount of 0.01 wt% as a curing inhibitor, and then mixed using a mixer.
  • a Pt catalyst (Platinum (0) -1, 3-divinyl-l, 1, 3, 3- tetramethyl-disiloxane complex solution) was added in an amount of 1 ppm, and then mixed using a mixer.
  • Each encapsulant was prepared in the same manner as in Examples 26-33, except that OE6631 (Dow Corning) was used in place of the vinyl resin-A, B-1 and surfactant M which were used in the Examples. [Table 6]
  • Vinyl resin-A as MDT or MT resin which has an Si-H functional group and aryl functional group, Liquid type scattering particles B-1 (viscosity: 1000 cps, molecular weight: 16500 g/mol, dimethylpolysiloxane having a vinyl end substituent) , , surfactant M18 15%, and as an inhibitor ECH (Ethynylcyclehexanol ) 0.01 ⁇ 6 were mixed .
  • Scattering particles B-1 and the surfactant M18 15% were dispersed using mixer.
  • Ethynylcyclohexanol (ECH) was added in an amount of 0.01 wt% as a curing inhibitor, and then mixed using a mixer.
  • a Pt catalyst (Platinum (0) -1, 3-divinyl-l, 1, 3, 3- tetramethyl-disiloxane complex solution) was added in an amount of 1 ppm, and then mixed using a mixer.
  • Each encapsulant was prepared in the same manner as in Examples 34-40, except that OE6631 (Dow Corning) was used in place of the vinyl resin-A, B-1 and surfactant M which were used in the Examples. [Table 7]

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Luminescent Compositions (AREA)

Abstract

La présente invention concerne un agent d'encapsulation de DEL qui comprend un mélange de particules de diffusion, qui comprend : (i) un polymère linéaire comprenant un groupe diméthylsiloxane qui possède un substituant d'extrémité vinyle et/ou un polymère linéaire comprenant un groupe méthylphénylsiloxane qui possède un substituant d'extrémité vinyle; et (ii) au moins une résine à base de vinyle sélectionnée dans le groupe comprenant une résine ViMQ à base de vinyle. L'invention concerne également un boîtier de DEL comprenant l'agent d'encapsulation.
EP14787196.6A 2013-10-24 2014-10-24 Agent d'encapsulation de del Withdrawn EP3061138A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20130127331 2013-10-24
PCT/EP2014/072811 WO2015059258A1 (fr) 2013-10-24 2014-10-24 Agent d'encapsulation de del

Publications (1)

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EP3061138A1 true EP3061138A1 (fr) 2016-08-31

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Country Status (7)

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US (1) US20160254425A1 (fr)
EP (1) EP3061138A1 (fr)
JP (1) JP2016537810A (fr)
KR (1) KR20150047448A (fr)
CN (1) CN105917479A (fr)
TW (2) TWI535792B (fr)
WO (2) WO2015059258A1 (fr)

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JP2016537810A (ja) 2016-12-01
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TW201522515A (zh) 2015-06-16
TWI535792B (zh) 2016-06-01
US20160254425A1 (en) 2016-09-01
KR20150047448A (ko) 2015-05-04
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WO2015059258A1 (fr) 2015-04-30

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