JP6792080B2 - 硬化性シリコーン組成物 - Google Patents
硬化性シリコーン組成物 Download PDFInfo
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- JP6792080B2 JP6792080B2 JP2019531686A JP2019531686A JP6792080B2 JP 6792080 B2 JP6792080 B2 JP 6792080B2 JP 2019531686 A JP2019531686 A JP 2019531686A JP 2019531686 A JP2019531686 A JP 2019531686A JP 6792080 B2 JP6792080 B2 JP 6792080B2
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- 239000000203 mixture Substances 0.000 title claims description 42
- 229920001296 polysiloxane Polymers 0.000 title claims description 41
- -1 polysiloxane Polymers 0.000 claims description 47
- 230000003287 optical effect Effects 0.000 claims description 19
- 125000000217 alkyl group Chemical group 0.000 claims description 13
- 125000003342 alkenyl group Chemical group 0.000 claims description 12
- 238000006459 hydrosilylation reaction Methods 0.000 claims description 9
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 9
- 239000003054 catalyst Substances 0.000 claims description 8
- 239000003431 cross linking reagent Substances 0.000 claims description 7
- 238000006116 polymerization reaction Methods 0.000 claims description 7
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 5
- 229910052739 hydrogen Inorganic materials 0.000 claims description 5
- 239000001257 hydrogen Substances 0.000 claims description 5
- 238000002834 transmittance Methods 0.000 claims description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 230000032683 aging Effects 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 15
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 14
- 238000000034 method Methods 0.000 description 9
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000004205 dimethyl polysiloxane Substances 0.000 description 6
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 6
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 6
- 239000012530 fluid Substances 0.000 description 4
- 229920002554 vinyl polymer Polymers 0.000 description 4
- 239000002253 acid Substances 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- 150000003058 platinum compounds Chemical class 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 239000003643 water by type Substances 0.000 description 3
- 125000006656 (C2-C4) alkenyl group Chemical group 0.000 description 2
- 125000006374 C2-C10 alkenyl group Chemical group 0.000 description 2
- 125000000882 C2-C6 alkenyl group Chemical group 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 229910004283 SiO 4 Inorganic materials 0.000 description 2
- 125000005376 alkyl siloxane group Chemical group 0.000 description 2
- 229940045985 antineoplastic platinum compound Drugs 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 125000006659 (C1-C20) hydrocarbyl group Chemical group 0.000 description 1
- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical compound C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 1
- 238000011088 calibration curve Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011258 core-shell material Substances 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 125000000596 cyclohexenyl group Chemical group C1(=CCCCC1)* 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 238000007405 data analysis Methods 0.000 description 1
- 238000013480 data collection Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 229920005645 diorganopolysiloxane polymer Polymers 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 239000003480 eluent Substances 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- XYIBRDXRRQCHLP-UHFFFAOYSA-N ethyl acetoacetate Chemical compound CCOC(=O)CC(C)=O XYIBRDXRRQCHLP-UHFFFAOYSA-N 0.000 description 1
- 229940093858 ethyl acetoacetate Drugs 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 150000004687 hexahydrates Chemical class 0.000 description 1
- 125000006038 hexenyl group Chemical group 0.000 description 1
- 238000004128 high performance liquid chromatography Methods 0.000 description 1
- 125000001183 hydrocarbyl group Chemical group 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 238000001802 infusion Methods 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- 125000000555 isopropenyl group Chemical group [H]\C([H])=C(\*)C([H])([H])[H] 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- SYQBFIAQOQZEGI-UHFFFAOYSA-N osmium atom Chemical compound [Os] SYQBFIAQOQZEGI-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 125000002255 pentenyl group Chemical group C(=CCCC)* 0.000 description 1
- CLSUSRZJUQMOHH-UHFFFAOYSA-L platinum dichloride Chemical compound Cl[Pt]Cl CLSUSRZJUQMOHH-UHFFFAOYSA-L 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000002683 reaction inhibitor Substances 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 125000005372 silanol group Chemical group 0.000 description 1
- 238000002174 soft lithography Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/06—Preparatory processes
- C08G77/08—Preparatory processes characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2312/00—Crosslinking
- C08L2312/08—Crosslinking by silane
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
(A−1)25〜10,000のDPを有し、2〜25個のR’基を含む直鎖状ポリシロキサンと、
(A−2)構造(R3SiO1/2)a、(RSiO3/2)b、及び(R’SiO3/2)c[式中、Rはアルキルであり、R’はアルケニルであり、a+b+cは0.90〜1であり、0.2<a<0.5、0.2<b<0.7、0.02<c<0.3である。]を有する単位を含有する樹脂型ポリシロキサンと、(B)架橋剤と、(C)ポリシロキサン中に含有される0.1〜20ppmのヒドロシリル化触媒と、
を含む、硬化性シリコーン組成物を提供する。
ビニル末端ポリジメチルシロキサン、ビニル官能性シリコーン樹脂、Pt触媒、水素官能性架橋剤、及びヒドロシリル化抑制剤を、通常の容器に加え、遊星型ミキサ(Hauschild SpeedMixer DAZ 150FVZ)上にて、3,540rpmで20秒間、混合する。光透過性液体をアルミニウムの型(3.0mmの厚さ)内に注ぎ、次に125℃で30分間プレス成形し、固体試料にした。固体試料を型から取出し、機械的特性及び光学特性を試験するため、150℃で1時間、後硬化させた。
機械的特性の測定を、Instron Mechanical Tester上にて、ASTM D412−06Aに従い、2インチ/分の速度で行った。硬度を、ショアAデュロメータ上にて、ASTM D2240に従って測定した。
試料の光学特性を、Perkin Elmer Lambda950デュアルビーム分光光度計により収集した。分光光度計を、200nm〜800nmの波長範囲にわたって1nmのスリット幅にて、遅い走査速度で動作させた。記録された光透過率は、空気とシリコーン物品との屈折率の差による表面反射の補正なしのもの(いわゆるFrensel反射)である。
試料を、閉じたオーブン内にて150℃で500時間エージングした。
アルケニル官能性樹脂の分子量を求めるには、トリプル検出ゲル浸透クロマトグラフィによった。クロマトグラフィ装置の構成は、Waters515ポンプ、Waters717自動サンプラ、及びWaters2410示差屈折率計であった。2つの(300mm×7.5mm)Polymer Laboratories PLgel5μm Mixed−Cカラム(分子量分離範囲200〜2,000,000、PLgel5μmガードカラム(50mm×7.5mm)が先行)により、分離を行った。溶離剤として1.0mL/分で流動するHPLCグレードのトルエンを使用し、分析を行い、カラム及び検出器を、両方とも45℃に制御した。試料を、適宜振盪しながら室温で約3時間時溶媒和させ、0.45μmのPTFEシリンジフィルタを通して濾過し、5mg/mLのトルエン液として調製後、分析した。75μLの注入量を使用し、データを25分間収集した。ThermoLabsystems Atlasクロマトグラフィソフトウェア、及びPolymer Laboratories Cirrus GPCソフトウェアを使用し、データ収集及び分析を行った。平均分子量を、580〜2,300,000の分子量範囲に及ぶ標準ポリスチレンを使用して作成された較正曲線(3次)に対して求めた。
Claims (10)
- (A−1)25〜10,000の重合度を有し、2〜25個のR’基を含む直鎖状ポリシロキサンと、
(A−2)構造(R3SiO1/2)a、(RSiO3/2)b、及び(R’SiO3/2)c[式中、Rはアルキルであり、R’はアルケニルであり、下付き文字a、b、及びcは各々、樹脂型ポリシロキサン分子内のそれぞれの構造(R3SiO1/2)、(RSiO3/2)、及び(R’SiO3/2)のモル比を示し、a+b+cは1であり、0.2<a<0.5、0.2<b<0.7、0.02<c<0.3である。]を有する単位を含有する樹脂型ポリシロキサンと、
(B)(A−1)と(A−2)との組み合わせにおける全アルケニル1モル当たり0.8〜2.5モルのケイ素結合水素を提供する量で、ケイ素原子に直接結合した少なくとも2個の水素原子を有する架橋剤と、
(C)0.1〜20ppmのヒドロシリル化触媒と、
を含む、硬化性シリコーン組成物であって、
(A−1)及び(A−2)の重量の合計が、前記硬化性シリコーン組成物の80〜98重量%である、硬化性シリコーン組成物。 - (A−1)中のR’基が末端鎖単位上にのみに存在する、請求項1に記載の組成物。
- (A−1)+(A−2)が、40〜80重量%(A−1)及び20〜60重量%(A−2)を含む、請求項1又は2に記載の組成物。
- 前記架橋剤の量が、(A−1)と(A−2)との組み合わせにおける全アルケニル1モル当たり1.0〜2.3モルのケイ素結合水素を提供する量である、請求項1〜3のいずれか一項に記載の組成物。
- 前記ヒドロシリル化触媒が白金族金属を含む、請求項1〜4のいずれか一項に記載の組成物。
- 0.25<a<0.45、0.3<b<0.65、0.06<c<0.25である、請求項1〜5のいずれか一項に記載の組成物。
- 下付き文字cが0.2未満である、請求項1〜6のいずれか一項に記載の組成物。
- 150℃で500時間エージングした後、3mmの厚さを通した265nmでの透過率が40%より高い、請求項1〜7のいずれか一項に記載の組成物。
- 請求項1に記載の組成物を硬化させて含む、光学機器構成要素又は光学部品。
- 請求項9に記載の光学機器構成要素又は光学部品を備える、光学デバイス。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201662436493P | 2016-12-20 | 2016-12-20 | |
US62/436,493 | 2016-12-20 | ||
PCT/US2017/063589 WO2018118356A1 (en) | 2016-12-20 | 2017-11-29 | Curable silicone composition |
Publications (2)
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JP2020513466A JP2020513466A (ja) | 2020-05-14 |
JP6792080B2 true JP6792080B2 (ja) | 2020-11-25 |
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Country Status (7)
Country | Link |
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US (1) | US20200157345A1 (ja) |
EP (1) | EP3559117B1 (ja) |
JP (1) | JP6792080B2 (ja) |
KR (1) | KR102216289B1 (ja) |
CN (1) | CN110072942B (ja) |
TW (1) | TWI763756B (ja) |
WO (1) | WO2018118356A1 (ja) |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0699634B2 (ja) * | 1989-09-28 | 1994-12-07 | 信越化学工業株式会社 | 熱硬化型シリコーンゴム組成物 |
EP0700951B1 (en) * | 1994-09-08 | 2000-12-27 | Showa Denko Kabushiki Kaisha | Polyorganosiloxane and process for producing the same |
JP2005126503A (ja) * | 2003-10-22 | 2005-05-19 | Ge Toshiba Silicones Co Ltd | 液状付加硬化型シリコーンゴム組成物及びその調製方法 |
JP4648099B2 (ja) * | 2005-06-07 | 2011-03-09 | 信越化学工業株式会社 | ダイボンディング用シリコーン樹脂組成物 |
JP5667740B2 (ja) * | 2008-06-18 | 2015-02-12 | 東レ・ダウコーニング株式会社 | 硬化性オルガノポリシロキサン組成物及び半導体装置 |
CN101712800B (zh) * | 2009-11-06 | 2012-10-03 | 陈俊光 | 大功率led的有机硅树脂封装料及其制备方法 |
CN101747632A (zh) * | 2009-12-15 | 2010-06-23 | 陈俊光 | 一种大功率led的有机硅橡胶封装料 |
WO2011087146A1 (ja) * | 2010-01-13 | 2011-07-21 | 東レ・ダウコーニング株式会社 | シリコーン系再剥離性粘着剤組成物、該組成物を硬化させてなる再剥離粘着層を有するシート状基材、その保護フィルムまたは固定シートとしての使用 |
EP2554601A4 (en) * | 2010-03-31 | 2013-10-09 | Sekisui Chemical Co Ltd | SEALANT FOR OPTICAL SEMICONDUCTORS AND OPTICAL SEMICONDUCTOR ELEMENT |
TWI519605B (zh) * | 2010-12-22 | 2016-02-01 | 邁圖高新材料日本合同公司 | 紫外線硬化型聚矽氧樹脂組成物,以及使用該組成物的圖像顯示裝置 |
TWI435914B (zh) * | 2010-12-31 | 2014-05-01 | Eternal Chemical Co Ltd | 可固化之有機聚矽氧烷組合物及其製法 |
JP6146856B2 (ja) | 2012-03-06 | 2017-06-14 | 公立大学法人首都大学東京 | ポリシルセスキオキサン液体及びポリシルセスキオキサンガラスならびにその製造方法 |
GB201308704D0 (en) * | 2013-05-15 | 2013-06-26 | Rolls Royce Plc | Electrical apparatus encapsulant |
TWI535792B (zh) * | 2013-10-24 | 2016-06-01 | 瓦克化學公司 | Led封裝材料 |
JP6277974B2 (ja) * | 2015-02-26 | 2018-02-14 | 信越化学工業株式会社 | 付加硬化性シリコーン樹脂組成物及び光半導体装置用ダイアタッチ材 |
JPWO2017122712A1 (ja) * | 2016-01-15 | 2018-11-01 | 株式会社ダイセル | 硬化性樹脂組成物、硬化物、封止材、及び半導体装置 |
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2017
- 2017-11-29 KR KR1020197019689A patent/KR102216289B1/ko active IP Right Grant
- 2017-11-29 WO PCT/US2017/063589 patent/WO2018118356A1/en unknown
- 2017-11-29 US US16/465,204 patent/US20200157345A1/en not_active Abandoned
- 2017-11-29 EP EP17812228.9A patent/EP3559117B1/en active Active
- 2017-11-29 JP JP2019531686A patent/JP6792080B2/ja active Active
- 2017-11-29 CN CN201780076343.8A patent/CN110072942B/zh active Active
- 2017-12-14 TW TW106143903A patent/TWI763756B/zh active
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EP3559117B1 (en) | 2023-12-06 |
JP2020513466A (ja) | 2020-05-14 |
EP3559117A1 (en) | 2019-10-30 |
CN110072942B (zh) | 2022-01-25 |
KR102216289B1 (ko) | 2021-02-18 |
TWI763756B (zh) | 2022-05-11 |
TW201831601A (zh) | 2018-09-01 |
KR20190090002A (ko) | 2019-07-31 |
CN110072942A (zh) | 2019-07-30 |
US20200157345A1 (en) | 2020-05-21 |
WO2018118356A1 (en) | 2018-06-28 |
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