EP2267187A4 - Metallwerkstoff für anschlussteil und herstellungsverfahren dafür - Google Patents

Metallwerkstoff für anschlussteil und herstellungsverfahren dafür

Info

Publication number
EP2267187A4
EP2267187A4 EP09728170.3A EP09728170A EP2267187A4 EP 2267187 A4 EP2267187 A4 EP 2267187A4 EP 09728170 A EP09728170 A EP 09728170A EP 2267187 A4 EP2267187 A4 EP 2267187A4
Authority
EP
European Patent Office
Prior art keywords
manufacturing
metal material
connecting component
component metal
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09728170.3A
Other languages
English (en)
French (fr)
Other versions
EP2267187A1 (de
Inventor
Kengo Mitose
Shuichi Kitagawa
Yoshiaki Ogiwara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of EP2267187A1 publication Critical patent/EP2267187A1/de
Publication of EP2267187A4 publication Critical patent/EP2267187A4/de
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0607—Wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9265—Special properties
    • Y10S428/929—Electrical contact feature
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12222—Shaped configuration for melting [e.g., package, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12431—Foil or filament smaller than 6 mils
    • Y10T428/12438—Composite
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y10T428/12715—Next to Group IB metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y10T428/12722—Next to Group VIII metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y10T428/1291—Next to Co-, Cu-, or Ni-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y10T428/12917—Next to Fe-base component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
EP09728170.3A 2008-03-31 2009-03-30 Metallwerkstoff für anschlussteil und herstellungsverfahren dafür Withdrawn EP2267187A4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008092054 2008-03-31
JP2008092053 2008-03-31
PCT/JP2009/056574 WO2009123157A1 (ja) 2008-03-31 2009-03-30 接続部品用金属材料およびその製造方法

Publications (2)

Publication Number Publication Date
EP2267187A1 EP2267187A1 (de) 2010-12-29
EP2267187A4 true EP2267187A4 (de) 2014-01-01

Family

ID=41135531

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09728170.3A Withdrawn EP2267187A4 (de) 2008-03-31 2009-03-30 Metallwerkstoff für anschlussteil und herstellungsverfahren dafür

Country Status (4)

Country Link
US (1) US8101285B2 (de)
EP (1) EP2267187A4 (de)
CN (1) CN101981235A (de)
WO (1) WO2009123157A1 (de)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5897247B2 (ja) * 2009-10-22 2016-03-30 Tdk株式会社 電子部品及び電子部品の製造方法
CN102665473B (zh) * 2009-12-25 2015-04-22 Ykk株式会社 拉链构成部件及拉链
CN102617050A (zh) * 2011-01-28 2012-08-01 鸿富锦精密工业（深圳）有限公司 镀膜玻璃及其制备方法
JP2013033656A (ja) * 2011-08-02 2013-02-14 Yazaki Corp 端子
JP6134103B2 (ja) * 2012-06-01 2017-05-24 矢崎総業株式会社 絶縁電線の製造方法
TWI503196B (zh) * 2012-11-02 2015-10-11 Univ Yuan Ze 具多層介金屬層的銲點結構
US10260159B2 (en) * 2013-07-05 2019-04-16 The Boeing Company Methods and apparatuses for mitigating tin whisker growth on tin and tin-plated surfaces by doping tin with gold
JP2015149218A (ja) * 2014-02-07 2015-08-20 矢崎総業株式会社 固定接点
JP6379416B2 (ja) * 2014-10-31 2018-08-29 北川工業株式会社 接触部材
US20170085016A1 (en) * 2015-09-18 2017-03-23 Aisin Seiki Kabushiki Kaisha Press-fit terminal
CN105344741A (zh) * 2015-12-02 2016-02-24 芜湖楚江合金铜材有限公司 一种加工塑性好的铜合金线材及其加工工艺
DE112017005628B4 (de) * 2016-12-06 2023-09-14 Dowa Metaltech Co., Ltd. Verzinntes Produkt und elektrische Drahtanschlussklemme mit einem verzinnten Produkt
KR102509377B1 (ko) * 2017-07-28 2023-03-10 미쓰비시 마테리알 가부시키가이샤 주석 도금이 형성된 구리 단자재 및 단자 그리고 전선 단말부 구조
DE102017215026A1 (de) * 2017-08-28 2019-02-28 Robert Bosch Gmbh Einpresspin für eine elektrische Kontaktieranordnung
DE102018203800B4 (de) * 2018-03-13 2019-11-21 Te Connectivity Germany Gmbh Kontaktstift und Anordnung zur Verbindung von elektrischen Leitern aus Kupfer und Aluminium
JP2020047500A (ja) * 2018-09-20 2020-03-26 矢崎総業株式会社 端子嵌合構造
JP6957568B2 (ja) * 2019-08-09 2021-11-02 株式会社オートネットワーク技術研究所 端子付き電線
JP6936836B2 (ja) 2019-08-09 2021-09-22 株式会社オートネットワーク技術研究所 端子付き電線
CN110952065B (zh) * 2019-12-23 2021-11-16 深圳市诚威新材料有限公司 一种锂电池用铜箔及其制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030091855A1 (en) * 2001-01-19 2003-05-15 Hitoshi Tanaka Plated material, method of producing same, and electrical/electronic part using same
US20050211461A1 (en) * 2004-01-30 2005-09-29 Hitachi Cable, Ltd. Flat cable conductor, method of making the same and flat cable using the same
EP1784064A1 (de) * 2004-07-08 2007-05-09 Fujikura, Ltd. Anschlussteil einer flexiblen leiterplatte oder anschlussteil eines flexiblen flachkabels
US20070235207A1 (en) * 2006-04-06 2007-10-11 Hitachi Cable, Ltd. Wiring conductor, method for fabricating same, terminal connecting assembly, and Pb-free solder alloy

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JP3545549B2 (ja) * 1996-09-26 2004-07-21 株式会社大和化成研究所 電気・電子回路部品
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JP3871018B2 (ja) * 2000-06-23 2007-01-24 上村工業株式会社 錫−銅合金電気めっき浴及びそれを使用するめっき方法
US20050037229A1 (en) * 2001-01-19 2005-02-17 Hitoshi Tanaka Plated material, method of producing same, and electrical / electronic part using same
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JP3926355B2 (ja) 2004-09-10 2007-06-06 株式会社神戸製鋼所 接続部品用導電材料及びその製造方法
KR100872622B1 (ko) * 2004-10-21 2008-12-09 에프씨엠 가부시끼가이샤 기재상에 주석-은-구리 3원합금 박막을 형성하는 방법
JP4626542B2 (ja) * 2006-03-03 2011-02-09 日立電線株式会社 はんだめっき導体の製造方法
WO2009117639A2 (en) * 2008-03-20 2009-09-24 Interplex Nas, Inc. Press fit (compliant) terminal and other connectors with tin-silver compound
JP2010016320A (ja) * 2008-04-15 2010-01-21 Hitachi Cable Ltd 太陽電池用リード線およびその製造方法並びにそれを用いた太陽電池

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030091855A1 (en) * 2001-01-19 2003-05-15 Hitoshi Tanaka Plated material, method of producing same, and electrical/electronic part using same
US20050211461A1 (en) * 2004-01-30 2005-09-29 Hitachi Cable, Ltd. Flat cable conductor, method of making the same and flat cable using the same
EP1784064A1 (de) * 2004-07-08 2007-05-09 Fujikura, Ltd. Anschlussteil einer flexiblen leiterplatte oder anschlussteil eines flexiblen flachkabels
US20070235207A1 (en) * 2006-04-06 2007-10-11 Hitachi Cable, Ltd. Wiring conductor, method for fabricating same, terminal connecting assembly, and Pb-free solder alloy

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2009123157A1 *

Also Published As

Publication number Publication date
US20110020664A1 (en) 2011-01-27
EP2267187A1 (de) 2010-12-29
US8101285B2 (en) 2012-01-24
CN101981235A (zh) 2011-02-23
WO2009123157A1 (ja) 2009-10-08

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