EP1964937A1 - Cu-Ni-Si-basiertes Kupferlegierungsfolienmaterial und Herstellungsverfahren dafür - Google Patents

Cu-Ni-Si-basiertes Kupferlegierungsfolienmaterial und Herstellungsverfahren dafür Download PDF

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Publication number
EP1964937A1
EP1964937A1 EP07013889A EP07013889A EP1964937A1 EP 1964937 A1 EP1964937 A1 EP 1964937A1 EP 07013889 A EP07013889 A EP 07013889A EP 07013889 A EP07013889 A EP 07013889A EP 1964937 A1 EP1964937 A1 EP 1964937A1
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EP
European Patent Office
Prior art keywords
copper alloy
plane
alloy sheet
less
rolling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP07013889A
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English (en)
French (fr)
Inventor
Weilin Gao
Hisashi Suda
Hiroto Narieda
Akira Sugawara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dowa Metaltech Co Ltd
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Dowa Metaltech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Dowa Metaltech Co Ltd filed Critical Dowa Metaltech Co Ltd
Publication of EP1964937A1 publication Critical patent/EP1964937A1/de
Withdrawn legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
EP07013889A 2007-02-13 2007-07-16 Cu-Ni-Si-basiertes Kupferlegierungsfolienmaterial und Herstellungsverfahren dafür Withdrawn EP1964937A1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007032623 2007-02-13

Publications (1)

Publication Number Publication Date
EP1964937A1 true EP1964937A1 (de) 2008-09-03

Family

ID=38777717

Family Applications (1)

Application Number Title Priority Date Filing Date
EP07013889A Withdrawn EP1964937A1 (de) 2007-02-13 2007-07-16 Cu-Ni-Si-basiertes Kupferlegierungsfolienmaterial und Herstellungsverfahren dafür

Country Status (6)

Country Link
US (1) US20080190523A1 (de)
EP (1) EP1964937A1 (de)
JP (1) JP4189435B2 (de)
CN (2) CN101245422A (de)
AT (1) ATE471391T1 (de)
DE (1) DE602008001515D1 (de)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2508634A4 (de) * 2009-12-02 2016-01-06 Furukawa Electric Co Ltd Kupferlegierungs-folienmaterial mit geringem young-modulus und herstellungsverfahren dafür
EP3438300A4 (de) * 2016-03-31 2019-08-14 Dowa Metaltech Co., Ltd Cu-ni-si kupferlegierungsblech und herstellungsverfahren

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JP5243744B2 (ja) * 2007-08-01 2013-07-24 Ｄｏｗａメタルテック株式会社 コネクタ端子
EP2351862B1 (de) * 2008-10-22 2014-11-26 Furukawa Electric Co., Ltd. Kupferlegierungsblech, elektrische und elektronische bauteile sowie herstellungsverfahren für das kupferlegierungsblech
JP4563480B2 (ja) * 2008-11-28 2010-10-13 Ｄｏｗａメタルテック株式会社 銅合金板材およびその製造方法
CN101748308B (zh) * 2008-11-28 2013-09-04 同和金属技术有限公司 Cu-Ti系铜合金板材及其制造方法
JP4930527B2 (ja) * 2009-03-05 2012-05-16 日立電線株式会社 銅合金材及び銅合金材の製造方法
JP4563495B1 (ja) * 2009-04-27 2010-10-13 Ｄｏｗａメタルテック株式会社 銅合金板材およびその製造方法
JP5466879B2 (ja) * 2009-05-19 2014-04-09 Ｄｏｗａメタルテック株式会社 銅合金板材およびその製造方法
JP5550856B2 (ja) * 2009-06-12 2014-07-16 株式会社Ｓｈカッパープロダクツ 銅合金材及び銅合金材の製造方法
JP5587593B2 (ja) * 2009-11-10 2014-09-10 Ｄｏｗａメタルテック株式会社 銅合金の製造方法
JP5643503B2 (ja) * 2009-11-19 2014-12-17 株式会社Ｓｈカッパープロダクツ Ｃｕ−Ｓｉ−Ｎｉ系銅合金材
WO2011068126A1 (ja) 2009-12-02 2011-06-09 古河電気工業株式会社 銅合金板材およびその製造方法
CN102639732B (zh) 2009-12-02 2017-08-04 古河电气工业株式会社 铜合金板材
KR101419147B1 (ko) 2009-12-02 2014-07-11 후루카와 덴키 고교 가부시키가이샤 구리합금 판재 및 그 제조방법
CN102985572B (zh) * 2010-07-07 2014-09-03 三菱伸铜株式会社 深冲压加工性优异的Cu-Ni-Si系铜合金板及其制造方法
CN103080347A (zh) * 2010-08-27 2013-05-01 古河电气工业株式会社 铜合金板材及其制造方法
US9845521B2 (en) 2010-12-13 2017-12-19 Kobe Steel, Ltd. Copper alloy
JP5522692B2 (ja) 2011-02-16 2014-06-18 株式会社日本製鋼所 高強度銅合金鍛造材
JP4857395B1 (ja) * 2011-03-09 2012-01-18 Ｊｘ日鉱日石金属株式会社 Ｃｕ−Ｎｉ−Ｓｉ系合金及びその製造方法
JP4987155B1 (ja) * 2011-03-09 2012-07-25 Ｊｘ日鉱日石金属株式会社 Ｃｕ−Ｎｉ−Ｓｉ系合金及びその製造方法
JP6205105B2 (ja) * 2011-04-18 2017-09-27 Ｊｘ金属株式会社 電子材料用Ｃｕ−Ｎｉ−Ｓｉ系合金、Ｃｕ−Ｃｏ−Ｓｉ系合金及びその製造方法
WO2012160684A1 (ja) * 2011-05-25 2012-11-29 三菱伸銅株式会社 深絞り加工性に優れたＣｕ－Ｎｉ－Ｓｉ系銅合金板及びその製造方法
US9159985B2 (en) * 2011-05-27 2015-10-13 Ostuka Techno Corporation Circuit breaker and battery pack including the same
KR20140025607A (ko) * 2011-08-04 2014-03-04 가부시키가이샤 고베 세이코쇼 구리 합금
JP5802150B2 (ja) * 2012-02-24 2015-10-28 株式会社神戸製鋼所 銅合金
US9002499B2 (en) * 2012-03-20 2015-04-07 GM Global Technology Operations LLC Methods for determining a recovery state of a metal alloy
JP5688744B2 (ja) * 2012-10-04 2015-03-25 株式会社日本製鋼所 高強度高靱性銅合金鍛造材
JP6039999B2 (ja) * 2012-10-31 2016-12-07 Ｄｏｗａメタルテック株式会社 Ｃｕ−Ｎｉ−Ｃｏ−Ｓｉ系銅合金板材およびその製造法
CN102925746B (zh) * 2012-11-29 2014-09-17 宁波兴业鑫泰新型电子材料有限公司 高性能Cu-Ni-Si系铜合金及其制备和加工方法
CN102983083B (zh) * 2012-12-24 2015-11-18 厦门永红科技有限公司 引线框架及其生产方法
WO2014115307A1 (ja) * 2013-01-25 2014-07-31 三菱伸銅株式会社 端子・コネクタ材用銅合金板及び端子・コネクタ材用銅合金板の製造方法
JP5647703B2 (ja) * 2013-02-14 2015-01-07 Ｄｏｗａメタルテック株式会社 高強度Ｃｕ−Ｎｉ−Ｃｏ−Ｓｉ系銅合金板材およびその製造法並びに通電部品
TWI621721B (zh) * 2014-07-10 2018-04-21 Furukawa Electric Co Ltd Copper alloy sheet, connector, and method for manufacturing copper alloy sheet
KR20160117210A (ko) * 2015-03-30 2016-10-10 제이엑스금속주식회사 Cu-Ni-Si 계 압연 구리 합금 및 그 제조 방법
CN106282654B (zh) * 2015-05-26 2017-11-24 宁波金田铜业(集团)股份有限公司 一种高弹性低成本锡磷青铜合金带及其制备方法
JP6493047B2 (ja) * 2015-07-13 2019-04-03 日立金属株式会社 銅合金材およびその製造方法
JP6166414B1 (ja) * 2016-03-30 2017-07-19 株式会社神戸製鋼所 ベーパチャンバー用銅又は銅合金条
JP6385383B2 (ja) * 2016-03-31 2018-09-05 Ｊｘ金属株式会社 銅合金板材および銅合金板材の製造方法
CN107541613B (zh) * 2016-06-28 2019-03-08 沈阳慧坤新材料科技有限公司 一种铜合金及其制备方法和应用
KR102104252B1 (ko) * 2017-06-07 2020-04-24 가부시키가이샤 에스에이치 카퍼프로덕츠 무산소동판 및 세라믹스 배선기판
CN107119247B (zh) * 2017-06-08 2018-10-30 西安交通大学 一种可改善中高吨位熔炼CuNiSiCr合金性能稳定性的热处理方法
CN108774700B (zh) * 2018-08-22 2020-05-08 中南大学 一种高性能CuNiSiTiBMg系弹性铜合金及其制备方法
CN109786338B (zh) * 2019-01-21 2021-07-09 盘星新型合金材料(常州)有限公司 一种非晶合金柔性基板
KR102021442B1 (ko) 2019-07-26 2019-09-16 주식회사 풍산 강도와 도전율이 우수한 동합금 판재의 제조 방법 및 이로부터 제조된 동합금 판재
WO2023140314A1 (ja) * 2022-01-20 2023-07-27 古河電気工業株式会社 銅合金板材およびその製造方法
CN115652134B (zh) * 2022-10-26 2023-08-29 浙江惟精新材料股份有限公司 一种高强度高折弯性铜镍硅合金及其制备方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4115998A1 (de) * 1991-05-16 1992-11-19 Diehl Gmbh & Co Verfahren zur herstellung von kupferlegierungen
US5463247A (en) * 1992-06-11 1995-10-31 Mitsubishi Shindoh Co., Ltd. Lead frame material formed of copper alloy for resin sealed type semiconductor devices
EP0949343A1 (de) * 1998-03-26 1999-10-13 KABUSHIKI KAISHA KOBE SEIKO SHO also known as Kobe Steel Ltd. Bleche aus Kupferlegierung für Elektronikbauteile
US20020119071A1 (en) * 2000-12-15 2002-08-29 Takayuki Usami High-mechanical strength copper alloy
US20020127133A1 (en) * 2000-07-25 2002-09-12 Takayuki Usami Copper alloy material for parts of electronic and electric machinery and tools
US20040079456A1 (en) * 2002-07-02 2004-04-29 Onlin Corporation Copper alloy containing cobalt, nickel and silicon

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1327016C (zh) * 2002-05-14 2007-07-18 同和矿业株式会社 具有改善的冲压冲制性能的铜基合金及其制备方法
JP4660735B2 (ja) * 2004-07-01 2011-03-30 Ｄｏｗａメタルテック株式会社 銅基合金板材の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4115998A1 (de) * 1991-05-16 1992-11-19 Diehl Gmbh & Co Verfahren zur herstellung von kupferlegierungen
US5463247A (en) * 1992-06-11 1995-10-31 Mitsubishi Shindoh Co., Ltd. Lead frame material formed of copper alloy for resin sealed type semiconductor devices
EP0949343A1 (de) * 1998-03-26 1999-10-13 KABUSHIKI KAISHA KOBE SEIKO SHO also known as Kobe Steel Ltd. Bleche aus Kupferlegierung für Elektronikbauteile
US20020127133A1 (en) * 2000-07-25 2002-09-12 Takayuki Usami Copper alloy material for parts of electronic and electric machinery and tools
US20020119071A1 (en) * 2000-12-15 2002-08-29 Takayuki Usami High-mechanical strength copper alloy
US20040079456A1 (en) * 2002-07-02 2004-04-29 Onlin Corporation Copper alloy containing cobalt, nickel and silicon

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2508634A4 (de) * 2009-12-02 2016-01-06 Furukawa Electric Co Ltd Kupferlegierungs-folienmaterial mit geringem young-modulus und herstellungsverfahren dafür
EP3438300A4 (de) * 2016-03-31 2019-08-14 Dowa Metaltech Co., Ltd Cu-ni-si kupferlegierungsblech und herstellungsverfahren

Also Published As

Publication number Publication date
CN101503770A (zh) 2009-08-12
ATE471391T1 (de) 2010-07-15
CN101245422A (zh) 2008-08-20
CN101503770B (zh) 2011-03-02
JP4189435B2 (ja) 2008-12-03
US20080190523A1 (en) 2008-08-14
JP2008223136A (ja) 2008-09-25
DE602008001515D1 (de) 2010-07-29

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