EP1640162B1 - Tintenstrahldüsenanordnung mit Paddeln als Teil der Wandung - Google Patents

Tintenstrahldüsenanordnung mit Paddeln als Teil der Wandung Download PDF

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Publication number
EP1640162B1
EP1640162B1 EP05109701A EP05109701A EP1640162B1 EP 1640162 B1 EP1640162 B1 EP 1640162B1 EP 05109701 A EP05109701 A EP 05109701A EP 05109701 A EP05109701 A EP 05109701A EP 1640162 B1 EP1640162 B1 EP 1640162B1
Authority
EP
European Patent Office
Prior art keywords
ink
nozzle
actuator
ink jet
wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
EP05109701A
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English (en)
French (fr)
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EP1640162A1 (de
Inventor
Kia Silverbrook
Gregory Mcavoy
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Silverbrook Research Pty Ltd
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Silverbrook Research Pty Ltd
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Publication date
Priority claimed from AUPO8001A external-priority patent/AUPO800197A0/en
Priority claimed from AUPO8011A external-priority patent/AUPO801197A0/en
Priority claimed from AUPO7941A external-priority patent/AUPO794197A0/en
Priority claimed from AUPO8057A external-priority patent/AUPO805797A0/en
Priority claimed from AUPO8042A external-priority patent/AUPO804297A0/en
Priority claimed from AUPO8002A external-priority patent/AUPO800297A0/en
Priority claimed from AUPO8050A external-priority patent/AUPO805097A0/en
Priority claimed from AUPO7947A external-priority patent/AUPO794797A0/en
Priority claimed from AUPO7945A external-priority patent/AUPO794597A0/en
Priority claimed from AUPO8064A external-priority patent/AUPO806497A0/en
Priority claimed from AUPO8062A external-priority patent/AUPO806297A0/en
Priority claimed from AUPO8074A external-priority patent/AUPO807497A0/en
Priority claimed from AUPO8007A external-priority patent/AUPO800797A0/en
Priority claimed from AUPO7943A external-priority patent/AUPO794397A0/en
Priority claimed from AUPO8046A external-priority patent/AUPO804697A0/en
Priority claimed from AUPO7937A external-priority patent/AUPO793797A0/en
Priority claimed from AUPO8039A external-priority patent/AUPO803997A0/en
Priority claimed from AUPO7948A external-priority patent/AUPO794897A0/en
Priority claimed from AUPO8038A external-priority patent/AUPO803897A0/en
Priority claimed from AUPO8040A external-priority patent/AUPO804097A0/en
Priority claimed from AUPO8043A external-priority patent/AUPO804397A0/en
Priority claimed from AUPO7952A external-priority patent/AUPO795297A0/en
Priority claimed from AUPO8052A external-priority patent/AUPO805297A0/en
Priority claimed from AUPO8056A external-priority patent/AUPO805697A0/en
Priority claimed from AUPO8034A external-priority patent/AUPO803497A0/en
Priority claimed from AUPO8078A external-priority patent/AUPO807897A0/en
Priority claimed from AUPO8075A external-priority patent/AUPO807597A0/en
Priority claimed from AUPO8006A external-priority patent/AUPO800697A0/en
Priority claimed from AUPO8010A external-priority patent/AUPO801097A0/en
Priority claimed from AUPO8008A external-priority patent/AUPO800897A0/en
Priority claimed from AUPO8079A external-priority patent/AUPO807997A0/en
Priority claimed from AUPO7951A external-priority patent/AUPO795197A0/en
Priority claimed from AUPO7933A external-priority patent/AUPO793397A0/en
Priority claimed from AUPO8033A external-priority patent/AUPO803397A0/en
Priority claimed from AUPO8051A external-priority patent/AUPO805197A0/en
Priority claimed from AUPO8068A external-priority patent/AUPO806897A0/en
Priority claimed from AUPO7944A external-priority patent/AUPO794497A0/en
Priority claimed from AUPO8037A external-priority patent/AUPO803797A0/en
Priority claimed from AUPO7946A external-priority patent/AUPO794697A0/en
Priority claimed from AUPO8045A external-priority patent/AUPO804597A0/en
Priority claimed from AUPO8503A external-priority patent/AUPO850397A0/en
Priority claimed from AUPO9393A external-priority patent/AUPO939397A0/en
Priority claimed from AUPO9392A external-priority patent/AUPO939297A0/en
Priority claimed from AUPO9390A external-priority patent/AUPO939097A0/en
Priority claimed from AUPO9391A external-priority patent/AUPO939197A0/en
Priority claimed from AUPO9389A external-priority patent/AUPO938997A0/en
Priority claimed from AUPP0889A external-priority patent/AUPP088997A0/en
Priority claimed from AUPP0873A external-priority patent/AUPP087397A0/en
Priority claimed from AUPP0891A external-priority patent/AUPP089197A0/en
Priority claimed from AUPP0890A external-priority patent/AUPP089097A0/en
Priority claimed from AUPP0893A external-priority patent/AUPP089397A0/en
Priority claimed from AUPP0892A external-priority patent/AUPP089297A0/en
Priority claimed from AUPP0882A external-priority patent/AUPP088297A0/en
Priority claimed from AUPP0872A external-priority patent/AUPP087297A0/en
Priority claimed from AUPP0894A external-priority patent/AUPP089497A0/en
Priority claimed from AUPP0875A external-priority patent/AUPP087597A0/en
Priority claimed from AUPP0888A external-priority patent/AUPP088897A0/en
Priority claimed from AUPP0874A external-priority patent/AUPP087497A0/en
Priority claimed from AUPP1398A external-priority patent/AUPP139898A0/en
Priority claimed from AUPP1396A external-priority patent/AUPP139698A0/en
Priority claimed from AUPP2592A external-priority patent/AUPP259298A0/en
Priority claimed from AUPP2591A external-priority patent/AUPP259198A0/en
Priority claimed from AUPP2593A external-priority patent/AUPP259398A0/en
Priority claimed from AUPP3990A external-priority patent/AUPP399098A0/en
Priority claimed from AUPP3983A external-priority patent/AUPP398398A0/en
Priority claimed from AUPP3991A external-priority patent/AUPP399198A0/en
Priority claimed from AUPP3989A external-priority patent/AUPP398998A0/en
Priority claimed from AUPP3985A external-priority patent/AUPP398598A0/en
Priority claimed from AUPP3986A external-priority patent/AUPP398698A0/en
Priority claimed from AUPP3987A external-priority patent/AUPP398798A0/en
Priority claimed from AUPP3984A external-priority patent/AUPP398498A0/en
Application filed by Silverbrook Research Pty Ltd filed Critical Silverbrook Research Pty Ltd
Publication of EP1640162A1 publication Critical patent/EP1640162A1/de
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J3/00—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed
    • B41J3/44—Typewriters or selective printing mechanisms having dual functions or combined with, or coupled to, apparatus performing other functions
    • B41J3/445—Printers integrated in other types of apparatus, e.g. printers integrated in cameras
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14314—Structure of ink jet print heads with electrostatically actuated membrane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14427—Structure of ink jet print heads with thermal bend detached actuators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1628—Manufacturing processes etching dry etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1629—Manufacturing processes etching wet etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1635—Manufacturing processes dividing the wafer into individual chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1637—Manufacturing processes molding
    • B41J2/1639—Manufacturing processes molding sacrificial molding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1643—Manufacturing processes thin film formation thin film formation by plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1645—Manufacturing processes thin film formation thin film formation by spincoating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1648—Production of print heads with thermal bend detached actuators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • B41J2/17596—Ink pumps, ink valves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2002/041—Electromagnetic transducer

Definitions

  • the present invention relates to the field of ink jet printing systems.
  • US Patent 3596275 by Sweet also discloses a process of a continuous ink jet printing including the step wherein the ink jet stream is modulated by a high frequency electro-static field so as to cause drop separation. This technique is still utilised by several manufacturers including Elmjet and Scitex (see also US Patent No. 3373437 by Sweet et al)
  • Piezo-electric ink jet printers are also one form of commonly utilised ink jet printing device. Piezo-electric systems are disclosed by Kyser et. al. in US Patent No. 3946398 (1970) which utilises a diaphragm mode of operation, by Zolten in US Patent 3683212 (1970) which discloses a squeeze mode of operation of a piezo electric crystal, Stemme in US Patent No. 3747120 (1972) discloses a bend mode of piezo-electric operation, Howkins in US Patent No. 4459601 discloses a Piezo electric push mode actuation of the ink jet stream and Fischbeck in US 4584590 which discloses a sheer mode type of piezo-electric transducer element.
  • the ink jet printing techniques include those disclosed by Endo et al in GB 2007162 (1979) and Vaught et al in US Patent 4490728. Both the aforementioned references disclosed ink jet printing techniques rely upon the activation of an electrothermal actuator which results in the creation of a bubble in a constricted space, such as a nozzle, which thereby causes the ejection of ink from an aperture connected to the confined space onto a relevant print media.
  • Printing devices utilising the electro-thermal actuator are manufactured by manufacturers such as Canon and Hewlett Packard.
  • a printing technology should have a number of desirable attributes. These include inexpensive construction and operation, high speed operation, safe and continuous long term operation etc. Each technology may have its own advantages and disadvantages in the areas of cost, speed, quality, reliability, power usage, simplicity of construction operation, durability and consumables.
  • esoteric techniques are also often utilised. These can include electroforming of nickel stage (Hewlett-Packard Journal Vol. 36 no 5, pp33-37 (1985)), electro-discharge machining, laser ablation (U.S. Patent No. 5,208,604), micro-punching, etc.
  • a sacrificial material to build up a mechanical system, within the sacrificial material being subsequently etched away so as to release the required mechanical structure.
  • a suitable common sacrificial material includes silicon dioxide which can be etched away in hydrofluoric acid.
  • MEMS devices are often constructed on silicon wafers having integral electronics such as, for example, using a multi-level metal CMOS layer.
  • the CMOS process includes the construction of multiple layers which may include the utilization of materials which can be attacked by the sacrificial etchant. This often necessitates the construction of passivation layers using extra processing steps so as to protect other layers from possible unwanted attack by a sacrificial etchant.
  • WO9712689 is an example of a fluid drop ejector and discloses one wall comprising a thin elastic membrane having an orifice defining a nozzle and means responsive to electrical signals for deflecting the membrane to eject drops of fluid from said nozzle.
  • the invention provides an ink jet nozzle arrangement according to claim 1.
  • Advantageous embodiments are provided in the dependent claims.
  • the invention also provides a printhead according to claim 16.
  • ink is ejected out of a nozzle chamber via an ink ejection hole as the result of the utilisation of a series of radially placed thermal actuator devices that are arranged around the ink ejection nozzle and are activated so as to compress the ink within the nozzle chamber thereby causing ink ejection.
  • Fig. 638 illustrates a single nozzle chamber arrangement 4401 when it is in its quiescent state.
  • the arrangement 4401 includes a nozzle chamber 4402 which is normally filled with ink so as to form a meniscus 4403 around an ink ejection nozzle 4404.
  • the nozzle chamber 4402 is formed within a wafer 4405.
  • the nozzle chamber 4402 supplied from an ink supply channel 4406 which can be etched through the wafer 4405 through the utilisation of a highly isotropic plasma etching system.
  • a suitable etcher can be the Advance Silicon Etch (ASE) system available from Surface Technology Systems of the United Kingdom.
  • the top of the nozzle chamber arrangement 4401 includes a series of radially placed thermoactuator devices e.g. 4408, 4409. These devices comprise polytetrafluoroethylene (PTFE) layer actuators having an internal serpentine copper core. Upon heating of the copper core, the surrounding PTFE expands rapidly resulting in a generally downward movement of the actuator 4408, 4409. Hence, when it is desired to eject ink from the ink ejection nozzle 4404, a current is passed through the actuators 4408, 4409 which results in them generally rapidly bending downwards as illustrated in Fig. 639. The downward bending movement of actuators 4408, 4409 results in a substantial increase in pressure within the nozzle chamber 4402. The rapid increase in pressure in nozzle chamber 4402, in turn results in a rapid expansion of the meniscus 4403 as illustrated in Fig. 639.
  • PTFE polytetrafluoroethylene
  • the actuators are turned on for a limited time only and subsequently deactivated. A short time later the situation is as illustrated in Fig. 640 with the actuators 4408, 4409 rapidly returning to their original positions.
  • the necking and breaking of the meniscus is a consequence of the forward momentum of the ink associated with drop 4412 and the backward pressure experienced as a result of the return of the actuators 4408, 4409 to their original positions.
  • the return of the actuator also results in a general inflow of ink 4406 from the supply channel as a result of surface tension effects and, eventually, the state returns to the quiescent position as illustrated in Fig. 638.
  • Fig. 641(a) and Fig. 641(b) illustrate the principle of operation of the thermal actuator.
  • the thermal actuator is preferably constructed from a material 4414 having a high coefficient of thermal expansion.
  • Embedded within the material 4414 is a series of heater elements e.g. 4415 which can be a series of conductive elements designed to carry a current.
  • the conductive elements 4415 are heated by means of passing a current through the elements with the heating resulting in a general increase in temperature in the area around the heating elements.
  • the increase in temperature causes a corresponding expansion of the PTFE which has a high coefficient of thermal expansion.
  • the PTFE is bent generally in a down direction.
  • Fig. 642 there is illustrated a side perspective view of one nozzle arrangement constructed in accordance with the principles previously outlined.
  • the nozzle chamber 4402 can be constructed by means of an isotropic surface etch of the wafer surface 4405.
  • the wafer surface 4405 can include a CMOS layer including all the required power and drive circuits.
  • a series of leaf or petal type actuators e.g. 4408, 4409 are provided each having an internal copper core e.g. 4417 which winds in a serpentine nature so as to provide for substantially unhindered expansion of the actuator device.
  • the operation of the actuator is similar to that as illustrated in Fig. 641 (a) and Fig. 641(b) such that, upon activation, the petals e.g.
  • the ink supply channel 4406 can be created via a deep silicon back edge of the wafer utilising a plasma etcher or the like.
  • the copper or aluminium coil e.g. 4417 can provide a complete circuit around each petal.
  • a central arm 4418 which can include both metal and PTFE portions provides the main structural support for the petal arrangement in addition to providing a current trace for the conductive heaters.
  • the device is preferably constructed utilising microelectromechanical (MEMS) techniques and can include the following construction techniques:
  • the initial processing starting material is a standard semi-conductor wafer 4420 have a complete CMOS level 4421 to the first level metal step.
  • the first level metal includes portions eg. 4422 which are utilized for providing power to the thermal actuator.
  • the first step is to etch a nozzle region down to the silicon wafer 4420 utilizing an appropriate mast
  • a 2 micron layer of polytetrafluoroethylene (PTFE) is deposited and etched so as to include vias eg. 4424 for interconnecting multiple levels.
  • PTFE polytetrafluoroethylene
  • the second level metal layer is deposited, masked and etched so as to form heater structure 4425.
  • the heater structure 4425 including via interconnect 4426 with the lower aluminium layer.
  • a further 2 ⁇ m layer of PTFE is deposited and etched to the depth of 1 ⁇ m utilizing a nozzle rim mask so as to form nozzle rim eg. 4428 in addition to ink flow guide rails eg. 4429 which generally restrain any wicking along the surface of the PTFE layer.
  • the guide rails eg. 4429 surround small thin slots and, as such, surface tension effects are a lot higher around these slots which in turn results in minimal outflow of ink during operation.
  • the PTFE is etched utilizing a nozzle and paddle mask so as to define nozzle portion 4430 and slots eg. 4431 and 4432.
  • the wafer is crystal calligraphically etched on the ⁇ 111 > plane utilizing a standard crystallographic etchant such as KOH.
  • the etching forms chamber 4432, directly below the ink ejection nozzle.
  • the ink supply channel 4434 can be etched from the back of the wafer utilizing a highly anisotropic etcher such as the STS etcher from Silicon Technology Systems of United Kingdom.
  • an array of ink jet nozzles can be formed simultaneously with a portion of an array 4436 being illustrated in Fig. 651 with a portion of the printhead being formed simultaneously and diced by the ST etch etching process.
  • the array 4436 shown provides for four column printing with each separate column attached to a different colour ink supply channel being supplied from the back of the wafer.
  • the bond pads 4437 provide for electrical control of the ejection mechanism.
  • An embodiment of the present invention discloses an inkjet printing device made up of a series of nozzle arrangements.
  • Each nozzle arrangement includes a thermal surface actuator device which includes an L-shaped cross sectional profile and an air breathing edge such that actuation of the paddle actuator results in a drop being ejected from a nozzle utilizing a very low energy level.
  • Fig. 661 there is illustrated schematically a sectional view of a single nozzle arrangement 4501 which includes an ink nozzle chamber 4502 containing an ink supply which is resupplied by means of an ink supply channel 4503.
  • a nozzle rim 4504 is provided, across which a meniscus 4505 forms, with a slight bulge when in the quiescent state.
  • a bend actuator device 4507 is formed on the top surface of the nozzle chamber and includes a side arm 4508 which runs generally parallel to the surface 4509 of the nozzle chamber wall so as to form an "air breathing slot" 4510 which assists in the low energy actuation of the bend actuator 4507.
  • the front surface of the bend actuator 4507 is hydrophobic such that a meniscus 4512 forms between the bend actuator 4507 and the surface 4509 leaving an air pocket in slot 4510.
  • the bend actuator 4507 When it is desired to eject a drop via the nozzle rim 4504, the bend actuator 4507 is actuated so as to rapidly bend down as illustrated in Fig. 662.
  • the rapid downward movement of the actuator 4507 results in a general increase in pressure of the ink within the nozzle chamber 4502. This results in a outflow of ink around the nozzle rim 4504 and a general bulging of the meniscus 4505.
  • the meniscus 4512 undergoes a low amount of movement.
  • the actuator device 4507 is then turned off so as to slowly return to its original position as illustrated in Fig. 663.
  • the return of the actuator 4507 to its original position results in a reduction in the pressure within the nozzle chamber 4502 which results in a general back flow of ink into the nozzle chamber 4502.
  • the forward momentum of the ink outside the nozzle chamber in addition to the back flow of ink 4515 results in a general necking and breaking off of the drop 4514.
  • Surface tension effects then draw further ink into the nozzle chamber via ink supply channel 4503. Ink is drawn in the nozzle chamber 4503 until the quiescent position of Fig. 661 is again achieved.
  • the actuator device 4507 can be a thermal actuator which is heated by means of passing a current through a conductive core.
  • the thermal actuator is provided with a conductive core encased in a material such as polytetrafluoroethylene which has a high level coefficient of expansion.
  • the conductive core 4523 is preferably of a serpentine form and encased within a material 4524 having a high coefficient of thermal expansion.
  • the material 4524 expands to a greater extent and is therefore caused to bend down in accordance with requirements.
  • Fig. 665 there is illustrated a side perspective view, partly in section, of a single nozzle arrangement when in the state as described with reference to Fig. 662.
  • the nozzle arrangement 4501 can be formed in practice on a semiconductor wafer 4520 utilizing standard MEMS techniques.
  • the silicon wafer 4520 preferably is processed so as to include a CMOS layer 4521 which can include the relevant electrical circuitry required for the full control of a series of nozzle arrangements 4501 formed so as to form a print head unit
  • CMOS layer 4521 On top of the CMOS layer 4521 is formed a glass layer 4522 and an actuator 4507 which is driven by means of passing a current through a serpentine copper coil 4523 which is encased in the upper portions of a polytetrafluoroethylene (PTFE) layer 4524.
  • PTFE polytetrafluoroethylene
  • the coil 4523 constructed in a serpentine nature is able to expand substantially with the expansion of the PTFE layer 4524.
  • the PTFE layer 4524 includes a lip portion 4508 which upon expansion, bends in a scooping motion as previously described.
  • the meniscus 4505 generally bulges and results in a consequential ejection of a drop of ink.
  • the nozzle chamber 4504 is later replenished by means of surface tension effects in drawing ink through an ink supply channel 4503 which is etched through the wafer through the utilization of a highly an isotropic silicon trench etcher.
  • ink can be supplied to the back surface of the wafer and ejected by means of actuation of the actuator 4507.
  • the gap between the side arm 4508 and chamber wall 4509 allows for a substantial breathing effect which results in a low level of energy being required for drop ejection.
  • a large number of arrangements 4501 of Fig. 665 can be formed together on a wafer with the arrangements being collected into print heads which can be of various sizes in accordance with requirements.
  • Fig. 666 there is illustrated one form of an array 4530 which is designed so as to provide three colour printing with each colour providing two spaced apart rows of nozzle arrangements 4534.
  • the three groupings can comprise groupings 4531, 4532 and 4533 with each grouping supplied with a separate ink colour so as to provide for full colour printing capability.
  • a series of bond pads e.g. 4536 are provided for TAB bonding control signals to the print head 4530.
  • the arrangement 4530 of Fig. 666 illustrates only a portion of a print head which can be of a length as determined by requirements.
  • thermal actuator construction could be used and there will now be described one form of more complex thermal actuator construction of general use in MEMS devices such as ink jet printers.
  • Fig. 678 there are illustrated 4 MEMS actuators 4520, 4521, 4522, 4523 as constructed in accordance with a further embodiment.
  • Fig. 679 there is illustrated a close-up perspective view, partly in section, of a single thermal actuator constructed in accordance with the further embodiment.
  • Each actuator, e.g. 4520 is based around three corrugated heat elements 4511, 4512 and 4513 which are interconnected 4514 to a cooler common current carrying line 4516.
  • the two heater elements 4511, 4512 are formed on a bottom layer of the actuator 4520 with the heater element 4513 and common line 4516 being formed on a top layer of the actuator 4520.
  • Each of the elements 4511, 4512, 4513, 4514 and 4516 can be formed from copper via means of deposition utilising semi-conductor fabrication techniques.
  • the lines 4511, 4512, 4513, 4514 and 4516 are "encased" inside a polytetrafluoroethylene (PTFE) layer, e.g. 4518 which has a high coefficient of thermal expansion.
  • the PTFE layer has a coefficient of thermal expansion which is much greater than that of the corresponding copper layers 4512, 4513, 4514 and 4516.
  • the heater elements 4511-4513 are therefore constructed in a serpentine manner so as to allow the concertinaing of the heater elements upon heating and cooling so as to allow for their expansion substantially with the expansion of the PTFE layer 4518.
  • the common line 4516 also constructed from copper is provided with a series of slots, e.g. 4519 which provide minimal concertinaing but allow the common layer 16 bend upwards and sideways when required.
  • the actuator e.g. 4520
  • the actuator can be operated in a number of different modes.
  • the bottom two heater elements 4511 and 4512 (Fig. 679) are activated. This causes the bottom portion of the polytetrafluoroethylene layer 4518 (Fig. 679) to expand rapidly while the top portion of the polytetrafluoroethylene layer 4518 (Fig. 679) remains cool.
  • the resultant forces are resolved by an upwards bending of the actuator 4520 as illustrated in Fig. 678.
  • a second operating mode as illustrated in Fig. 678, the two heaters 4512, 4513 (Fig. 679) are activated causing an expansion of the PTFE layer 4518 (Fig. 679) on one side while the other side remains cool.
  • the resulting expansion provides for a movement of the actuator 4520 to one side as illustrated in Fig. 678.
  • Fig. 680 there is provided a further form of movement this time being up and to a side.
  • This form of movement is activated by heating each of the resistive elements 4511-4513 (Fig. 679) which is resolved a movement of the actuator 4520 up and to the side.
  • the position of the end point 4530 of the actuator 4520 (Fig. 678) can be fully controlled.
  • the PTFE portion 4518 is extended beyond the copper interconnect 4514 so as to provide a generally useful end portion 4530 for movement of objects to the like.
  • Fig. 681 there is illustrated an explosive perspective view of the construction of a single actuator.
  • the actuator can be constructed utilising semi-conductor fabrication techniques and can be constructed on a wafer 4542 or other form of substrate.
  • a sacrificial etch layer to form an underside portion utilising a mask shape of a actuator device.
  • a first layer of PTFE layer 4564 is deposited followed by the bottom level copper heater level 4545 forming the bottom two heaters.
  • a second copper layer 4548 is provided for the top heater and common line with interconnection 4514 to the bottom copper layer.
  • a further polytetrafluoroethylene layer of layer 4544 with the depositing of polytetrafluoroethylene layer 4544 including the filling of the gaps, e.g. 4549 in the return common line of the copper layer.
  • the filling of the gaps allows for a significant reduction in the possibilities of laminar separation of the polytetrafluoroethylene layers from the copper layer.
  • the two copper layers also allow the routing of current drive lines to each actuator.
  • an array of actuators could be formed on a single wafer and activated together so as to move an object placed near the array.
  • Each actuator in the array can then be utilised to provide a circular motion of its end tip.
  • the actuator can be in a rest position and then moved to a side position as illustrated for actuator 4520 in Fig. 678 then moved to an elevated side position as illustrated in Fig. 680 thereby engaging the object to be moved.
  • the actuator can then be moved to nearly an elevated position as shown for actuator 4520 in Fig. 678. This resulting in a corresponding force being applied to the object to be moved.
  • the actuator is returned to its rest position and the cycle begins again.
  • an object can be made to move in accordance with requirements.
  • the reverse cycle can be utilised to move an object in the opposite direction.
  • an array of actuators are utilised thereby forming the equivalent of a cilia array of actuators.
  • Multiple cilia arrays can then be formed on a single semi-conductor wafer which is later diced into separate cilia arrays.
  • the actuators on each cilia array are divided into groups with adjacent actuators being in different groups.
  • the cilia array can then be driven in four phases with one in four actuators pushing the object to be moved in each portion of the phase cycle.
  • the cilia arrays can then be utilised to move an object, for example to move a card past an information sensing device in a controlled manner for reading information stored on the card.
  • the cilia arrays can be utilised to move printing media past a printing head in an ink jet printing device.
  • the cilia arrays can be utilised for manipulating means in the field of nano technology, for example in atomic force microscopy (AFM).
  • AFM atomic force microscopy
  • the PTFE end 4520 is preferably treated by means of an ammonia plasma etch so as to increase the coefficient of friction of the end portion.
  • the presently disclosed ink jet printing technology is potentially suited to a wide range of printing system including: colour and monochrome office printers, short run digital printers, high speed digital printers, offset press supplemental printers, low cost scanning printers high speed pagewidth printers, notebook computers with inbuilt pagewidth printers, portable colour and monochrome printers, colour and monochrome copiers, colour and monochrome facsimile machines, combined printer, facsimile and copying machines, label printers, large format plotters, photograph copiers, printers for digital photographic "minilabs", video printers, PhotoCD printers, portable printers for PDAs, wallpaper printers, indoor sign printers, billboard printers, fabric printers, camera printers and fault tolerant commercial printer arrays.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)

Claims (16)

  1. Tintenstrahldüsenanordnung, umfassend:
    eine Düsenkammer zum Aufnehmen von auszustoßender Tinte;
    und gekennzeichnet durch:
    wenigstens ein bewegliches Aktuatorpaddel, das wenigstens einen Teilbereich einer ersten Wand der Düsenkammer bildet; und
    eine in der ersten Wand gebildete Tintenausstoßdüse,
    wobei eine Stellbewegung des wenigstens einen Aktuatorpaddels ein Ausstoßen von Tinte aus der Düse hervorruft.
  2. Tintenstrahldüsenanordnung nach Anspruch 1, wobei die Stellbewegung eine Verschiebung des wenigstens einen Aktuatorpaddels nach innen in Richtung zur Mitte der Düsenkammer verursacht.
  3. Tintenstrahldüsenanordnung nach Anspruch 1 oder 2, wobei das wenigstens eine Aktuatorpaddel mittels einer thermischen Aktuatorbaugruppe betätigt wird.
  4. Tintenstrahldüsenanordnung nach einem der vorhergehenden Ansprüche, wobei die thermische Aktuatorbaugruppe ein leitfähiges Widerstandsheizelement umfasst, das in einem zweiten Material mit einem hohen Wärmeausdehnungskoeffizienten eingeschlossen ist.
  5. Tintenstrahldüsenanordnung nach einem der vorhergehenden Ansprüche, wobei das Element mäanderförmig ausgebildet ist, um eine im Wesentlichen ungehinderte Ausdehnung des zweiten Materials zu ermöglichen.
  6. Tintenstrahldüsenanordnung nach einem der vorhergehenden Ansprüche, wobei die erste Wand einen Düsenrand und mehrere am Düsenrand angebrachte Aktuatorpaddel umfasst.
  7. Tintenstrahldüsenanordnung nach Anspruch 6, wobei die Aktuatorpaddel alle gemeinsam betätigt werden, um Tinte aus der Düsenkammer über die Tintenausstoßdüse auszustoßen.
  8. Tintenstrahldüsenanordnung nach Anspruch 6, wobei die Aktuatorpaddel radial um den Düsenrand herum angeordnet sind.
  9. Tintenstrahldüsenanordnung nach einem der Ansprüche 6 bis 8, wobei die Aktuatorpaddel eine Membran zwischen der Düsenkammer und einer Außenatmosphäre bilden, wobei die Paddel sich von der Außenatmosphäre weg nach innen biegen, um einen Druckanstieg in der Düsenkammer zu verursachen, wodurch ein Ausstoßen von Tinte aus der Düsenkammer hervorgerufen wird.
  10. Tintenstrahldüsenanordnung nach einem der vorhergehenden Ansprüche, wobei die Anordnung auf einem Wafer unter Einsatz von mikroelektromechanischen Techniken gebildet wird, welcher Wafer darüber hinaus einen Tintenzufuhrkanal in Fluidverbindung mit der Düsenkammer hat, und der Tintenzufuhrkanal durch den Wafer hindurch geätzt ist.
  11. Tintenstrahldüsenanordnung nach einem der Ansprüche 1 bis 5, wobei ein Ende des Aktuatorpaddels während des Tintenausstoßes entlang einer zweiten Wand der Düsenkammer verfährt, wobei die zweite Wand im Wesentlichen senkrecht zur ersten Wand ist.
  12. Tintenstrahldüsenanordnung nach Anspruch 11, wobei das eine Ende darüber hinaus einen Ansatz umfasst, der dichtend an der zweiten Wand angreift.
  13. Tintenstrahldüsenanordnung nach Anspruch 12, darüber hinaus einen Tintenzufuhrkanal umfassend, der mit der Düsenkammer verbunden ist, um diese wieder mit Tinte aufzufüllen, wobei die Verbindung einen Schlitz in einer Wand der Kammer umfasst, der im Wesentlichen einem Ende des Ansatzes gegenüberliegend angeordnet ist.
  14. Tintenstrahldüsenanordnung nach Anspruch 13, wobei der Schlitz in einer Ecke einer dritten Wand der Kammer angeordnet ist und die zweite Wand der Kammer darüber hinaus eine Wand des Tintenzufuhrkanals bildet.
  15. Tintenstrahldüsenanordnung nach Anspruch 12, wobei der Ansatz so konfiguriert ist, dass er den Strom von Tinte in die Düsenkammer während der Verschiebung des Aktuatorpaddels beschränkt.
  16. Tintenstrahldruckkopf mit einer Tintenstrahldüsenanordnung nach einem der vorhergehenden Ansprüche.
EP05109701A 1997-07-15 1998-07-15 Tintenstrahldüsenanordnung mit Paddeln als Teil der Wandung Expired - Lifetime EP1640162B1 (de)

Applications Claiming Priority (72)

Application Number Priority Date Filing Date Title
AUPO7946A AUPO794697A0 (en) 1997-07-15 1997-07-15 A device (MEMS10)
AUPO8008A AUPO800897A0 (en) 1997-07-15 1997-07-15 A device (MEMS04)
AUPO7941A AUPO794197A0 (en) 1997-07-15 1997-07-15 A method of manufacture of an image creation apparatus (IJM24)
AUPO8057A AUPO805797A0 (en) 1997-07-15 1997-07-15 Image creation method and apparatus (IJ09)
AUPO8042A AUPO804297A0 (en) 1997-07-15 1997-07-15 Image creation method and apparatus (IJ29)
AUPO8002A AUPO800297A0 (en) 1997-07-15 1997-07-15 Image creation method and apparatus (IJ20)
AUPO8050A AUPO805097A0 (en) 1997-07-15 1997-07-15 A method of manufacture of an image creation apparatus (IJM19)
AUPO7947A AUPO794797A0 (en) 1997-07-15 1997-07-15 A device (MEMS07)
AUPO7945A AUPO794597A0 (en) 1997-07-15 1997-07-15 A device (MEMS08)
AUPO8064A AUPO806497A0 (en) 1997-07-15 1997-07-15 Image creation method and apparatus (IJ30)
AUPO8062A AUPO806297A0 (en) 1997-07-15 1997-07-15 Image creation method and apparatus (IJ22)
AUPO8074A AUPO807497A0 (en) 1997-07-15 1997-07-15 A method of manufacture of an image creation apparatus (IJM23)
AUPO8007A AUPO800797A0 (en) 1997-07-15 1997-07-15 A device (MEMS03)
AUPO7943A AUPO794397A0 (en) 1997-07-15 1997-07-15 A device (MEMS01)
AUPO8046A AUPO804697A0 (en) 1997-07-15 1997-07-15 A method of manufacture of an image creation apparatus (IJM30)
AUPO7937A AUPO793797A0 (en) 1997-07-15 1997-07-15 A method of manufacture of an image creation apparatus (IJM03)
AUPO8039A AUPO803997A0 (en) 1997-07-15 1997-07-15 Image creation method and apparatus (IJ24)
AUPO7948A AUPO794897A0 (en) 1997-07-15 1997-07-15 A method of manufacture of an image creation apparatus (IJM21)
AUPO8038A AUPO803897A0 (en) 1997-07-15 1997-07-15 Image creation method and apparatus (IJ18)
AUPO8040A AUPO804097A0 (en) 1997-07-15 1997-07-15 Image creation method and apparatus (IJ03)
AUPO8043A AUPO804397A0 (en) 1997-07-15 1997-07-15 Image creation method and apparatus (IJ28)
AUPO7952A AUPO795297A0 (en) 1997-07-15 1997-07-15 A method of manufacture of an image creation apparatus (IJM29)
AUPO8052A AUPO805297A0 (en) 1997-07-15 1997-07-15 A method of manufacture of an image creation apparatus (IJM20)
AUPO8056A AUPO805697A0 (en) 1997-07-15 1997-07-15 Image creation method and apparatus (IJ10)
AUPO8034A AUPO803497A0 (en) 1997-07-15 1997-07-15 Image creation method and apparatus (IJ23)
AUPO8078A AUPO807897A0 (en) 1997-07-15 1997-07-15 A method of manufacture of an image creation apparatus (IJM09)
AUPO8075A AUPO807597A0 (en) 1997-07-15 1997-07-15 A method of manufacture of an image creation apparatus (IJM17)
AUPO8006A AUPO800697A0 (en) 1997-07-15 1997-07-15 A device (MEMS02)
AUPO8010A AUPO801097A0 (en) 1997-07-15 1997-07-15 A device (MEMS05)
AUPO8011A AUPO801197A0 (en) 1997-07-15 1997-07-15 A device (MEMS06)
AUPO8079A AUPO807997A0 (en) 1997-07-15 1997-07-15 A method of manufacture of an image creation apparatus (IJM18)
AUPO7951A AUPO795197A0 (en) 1997-07-15 1997-07-15 A method of manufacture of an image creation apparatus (IJM22)
AUPO7933A AUPO793397A0 (en) 1997-07-15 1997-07-15 A method of manufacture of an image creation_apparatus (IJM10)
AUPO8033A AUPO803397A0 (en) 1997-07-15 1997-07-15 Image creation method and apparatus (IJ19)
AUPO8051A AUPO805197A0 (en) 1997-07-15 1997-07-15 A method of manufacture of an image creation apparatus (IJM27)
AUPO8068A AUPO806897A0 (en) 1997-07-15 1997-07-15 Image creation method and apparatus (IJ21)
AUPO7944A AUPO794497A0 (en) 1997-07-15 1997-07-15 A device (MEMS09)
AUPO8037A AUPO803797A0 (en) 1997-07-15 1997-07-15 Image creation method and apparatus (IJ27)
AUPO8001A AUPO800197A0 (en) 1997-07-15 1997-07-15 Image creation method and apparatus (IJ17)
AUPO8045A AUPO804597A0 (en) 1997-07-15 1997-07-15 A method of manufacture of an image creation apparatus (IJM28)
AUPO8503A AUPO850397A0 (en) 1997-08-11 1997-08-11 A method of manufacture of an image creation apparatus (ijm30a)
AUPO9393A AUPO939397A0 (en) 1997-09-23 1997-09-23 A device and method (MEMS11)
AUPO9392A AUPO939297A0 (en) 1997-09-23 1997-09-23 A method of manufacture of an image creation apparatus (IJM32)
AUPO9390A AUPO939097A0 (en) 1997-09-23 1997-09-23 A method of manufacture of an image creation apparatus (IJM31)
AUPO9391A AUPO939197A0 (en) 1997-09-23 1997-09-23 Image creation method and apparatus (IJ32)
AUPO9389A AUPO938997A0 (en) 1997-09-23 1997-09-23 Image creation method and apparatus (IJ31)
AUPP0891A AUPP089197A0 (en) 1997-12-12 1997-12-12 Image creation method and apparatus (IJ34)
AUPP0873A AUPP087397A0 (en) 1997-12-12 1997-12-12 Image creation method and apparatus (IJ36)
AUPP0889A AUPP088997A0 (en) 1997-12-12 1997-12-12 A method of manufacture of an image creation apparatus (IJM35)
AUPP0890A AUPP089097A0 (en) 1997-12-12 1997-12-12 Image creation method and apparatus (IJ35)
AUPP0893A AUPP089397A0 (en) 1997-12-12 1997-12-12 Image creation method and apparatus (IJ37)
AUPP0892A AUPP089297A0 (en) 1997-12-12 1997-12-12 Image creation method and apparatus (IJ38)
AUPP0882A AUPP088297A0 (en) 1997-12-12 1997-12-12 A method of manufacture of an image creation apparatus (IJM37)
AUPP0872A AUPP087297A0 (en) 1997-12-12 1997-12-12 Image creation method and apparatus (IJM36)
AUPP0894A AUPP089497A0 (en) 1997-12-12 1997-12-12 An interconnection system (MEMS13)
AUPP0875A AUPP087597A0 (en) 1997-12-12 1997-12-12 A device (MEMS12)
AUPP0888A AUPP088897A0 (en) 1997-12-12 1997-12-12 Image creation method and apparatus (IJ33)
AUPP0874A AUPP087497A0 (en) 1997-12-12 1997-12-12 A method of manufacture of an image creation apparatus (IJM38)
AUPP1398A AUPP139898A0 (en) 1998-01-19 1998-01-19 An image creation method and apparatus (ij39)
AUPP1396A AUPP139698A0 (en) 1998-01-19 1998-01-19 A method of manufacture of an image creation apparatus (ijm39)
AUPP2592A AUPP259298A0 (en) 1998-03-25 1998-03-25 Image creation method and apparatus (IJ40)
AUPP2591A AUPP259198A0 (en) 1998-03-25 1998-03-25 Image creation method and apparatus (IJM41)
AUPP2593A AUPP259398A0 (en) 1998-03-25 1998-03-25 Image creation method and apparatus (IJ41)
AUPP3990A AUPP399098A0 (en) 1998-06-09 1998-06-09 A method of manufacture of image creation apparatus (ijm42)
AUPP3983A AUPP398398A0 (en) 1998-06-09 1998-06-09 Image creation method and apparatus (ij45)
AUPP3991A AUPP399198A0 (en) 1998-06-09 1998-06-09 Image creation method and apparatus (ij42)
AUPP3989A AUPP398998A0 (en) 1998-06-09 1998-06-09 A method of manufacture of an image creation apparatus (ijm40)
AUPP3985A AUPP398598A0 (en) 1998-06-09 1998-06-09 Image creation method and apparatus (ij44)
AUPP3986A AUPP398698A0 (en) 1998-06-09 1998-06-09 A method of manufacture of an image creation apparatus (ijm43)
AUPP3987A AUPP398798A0 (en) 1998-06-09 1998-06-09 Image creation method and apparatus (ij43)
AUPP3984A AUPP398498A0 (en) 1998-06-09 1998-06-09 A method of manufacture of an image creation apparatus (ijm44)
EP98933352A EP0999934B1 (de) 1997-07-15 1998-07-15 Thermisch betätigter tintenstrahl

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EP98933352A Division EP0999934B1 (de) 1997-07-15 1998-07-15 Thermisch betätigter tintenstrahl

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EP1640162A1 EP1640162A1 (de) 2006-03-29
EP1640162B1 true EP1640162B1 (de) 2007-03-28

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EP98933352A Expired - Lifetime EP0999934B1 (de) 1997-07-15 1998-07-15 Thermisch betätigter tintenstrahl
EP05109707A Expired - Lifetime EP1650030B1 (de) 1997-07-15 1998-07-15 Düsenkammer mit Paddelschaufel und externem thermischen Betätigungselement
EP05109756A Expired - Lifetime EP1650031B1 (de) 1997-07-15 1998-07-15 Tintenstrahldüse mit geschlitzter Seitenwand und beweglichem Flügel
EP05109701A Expired - Lifetime EP1640162B1 (de) 1997-07-15 1998-07-15 Tintenstrahldüsenanordnung mit Paddeln als Teil der Wandung
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EP05109707A Expired - Lifetime EP1650030B1 (de) 1997-07-15 1998-07-15 Düsenkammer mit Paddelschaufel und externem thermischen Betätigungselement
EP05109756A Expired - Lifetime EP1650031B1 (de) 1997-07-15 1998-07-15 Tintenstrahldüse mit geschlitzter Seitenwand und beweglichem Flügel

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ATE359915T1 (de) 2007-05-15
JP2003521389A (ja) 2003-07-15
EP1650031B1 (de) 2008-02-20
EP0999934A4 (de) 2001-06-27
ATE409119T1 (de) 2008-10-15
ES2302134T3 (es) 2008-07-01
WO1999003681A1 (en) 1999-01-28
EP0999934B1 (de) 2005-10-26
ATE386638T1 (de) 2008-03-15
JP4160250B2 (ja) 2008-10-01
ATE358019T1 (de) 2007-04-15
EP1640162A1 (de) 2006-03-29
EP0999934A1 (de) 2000-05-17
EP1650030B1 (de) 2008-09-24
EP1650031A1 (de) 2006-04-26
EP1637330B1 (de) 2007-04-18
EP1637330A1 (de) 2006-03-22
EP1650030A1 (de) 2006-04-26

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