EP1595138A1 - Appareil de reconnaissance d'image et procédé de reconnaissance d'image - Google Patents

Appareil de reconnaissance d'image et procédé de reconnaissance d'image

Info

Publication number
EP1595138A1
EP1595138A1 EP04700757A EP04700757A EP1595138A1 EP 1595138 A1 EP1595138 A1 EP 1595138A1 EP 04700757 A EP04700757 A EP 04700757A EP 04700757 A EP04700757 A EP 04700757A EP 1595138 A1 EP1595138 A1 EP 1595138A1
Authority
EP
European Patent Office
Prior art keywords
image
recognized
board
light
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP04700757A
Other languages
German (de)
English (en)
Other versions
EP1595138B1 (fr
Inventor
Yasuichi Okada
Kimiyuki Yamasaki
Masahiro Kihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2003003033A external-priority patent/JP4818572B2/ja
Priority claimed from JP2003003032A external-priority patent/JP4818571B2/ja
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of EP1595138A1 publication Critical patent/EP1595138A1/fr
Application granted granted Critical
Publication of EP1595138B1 publication Critical patent/EP1595138B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00—Pattern recognition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
    • B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/10—Image acquisition
    • G06V10/12—Details of acquisition arrangements; Constructional details thereof
    • G06V10/14—Optical characteristics of the device performing the acquisition or on the illumination arrangements
    • G06V10/145—Illumination specially adapted for pattern recognition, e.g. using gratings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Definitions

  • the present invention relates to an image recognition apparatus and an image recognition method in which an image of an object to be recognized is acquired and the image is subjected to a recognizing process.
  • an image recognition method in which the images of objects to be recognized such as electronic parts or boards are picked up by a camera and the images as the image picked-up results are recognized to identify the objects to be recognized and detect positions has been widely employed.
  • a print inspection is performed for the boards after a solder printing carried out before the electronicparts aremounted.
  • the printed state of cream solder printed on an electrode of the board that is, a printed position or an amount of printed solder or the like is detected by recognizing the image to decide whether or not the printed state is good.
  • JP-A-4-104044 or JP-A-2000-2667 it is proposed in JP-A-4-104044 or JP-A-2000-2667.
  • a certain electrode of the board may have a solder leveler with a solder film formed on the surface of the electrode in order to improve a solder joint property.
  • the cream solder printed on the electrode having such a solder leveler is an object to be recognized, the cream solder has been hardly identified in accordance with an image recognition. Further, the electrode on the board and the cream solder on the electrode are hardly identified at the same time. That is, to identify the cream solder, the printedpart of the cream solder needs to be separated from the surface of the solder leveler in accordance with a luminance difference. However, since the solder leveler and the cream solder include the naturally samematerial, an apparent luminance difference hardly appears on the pickedup image. Thus, a highly accurate recognition has been difficult. Further, a plurality of images picked up under different illuminating conditions needtobe obtained, so thatmuch timehasbeen required to obtain the images and a recognition tact time has been hardly shortened. Disclosure of Invention
  • an image obtained by picking up an image of an object to be recognized that includes a background surface, a first surf ce with a glossiness and a second surface with a glossiness lower than that of the first surface in a recognition surface, the first surface being partitioned by a rectangular boundary and the second surface being provided on the first surface in the background surface, is subjected to a recognition process to discriminate the first surface from the second surface in the background surface.
  • the image recognition apparatus comprises: an illuminating part for applying illumination light to the object to be recognized upon picking up the image; a camera for receiving the reflected light of the illumination light to pickup the image of the object to be recognized; and a recognizing process part for recognizing image data obtained by the camera.
  • the illuminating part applies the illumination light to the object to be recognized from a light applying direction in which regularly reflected light from the first surface is not received by the camera.
  • an image obtained by picking up an image of an object to be recognized that includes a background surface, a first surface with a glossiness and a second surface with a glossiness lower than that of the first surface in a recognition surface, the first surface being partitioned by a rectangular boundary and the second surface being provided on the first surface in the background surface, is subjected to a recognition process to discriminate the first surface from the second surface in the background surface.
  • the image recognition apparatus comprises : an illuminating part for applying illumination light to the object to be recognized upon picking up the image; a camera for receiving the reflected light of the illumination light to pick up the color image of the object to be recognized; and a recognizing process part for recognizing image data obtained by the camera.
  • the illuminating part includes a first illuminating unit for applying white illumination light to the object to be recognized from a first light applying direction in which regularly reflected light from the first surface is not received by the camera and a second illuminating unit for applying colored illumination light to the object to be recognized from a second light applying direction in which the reflected light from the first surface is received by the camera .
  • the image recognition method comprises the step of: irradiating the object to be recognized with illumination light from a light applying direction in which regularly reflected light from the first surface is not received by the camera when the object to be recognized is irradiated with the illumination light by an illuminating part and the reflected light of the illumination light is received from an upper part to pick up the image of the object to be recognized.
  • the image recognitionmethod comprises the steps of: irradiating the obj ect to be recognized with white illumination light by a first illuminating unit from a first light applying direction in which regularly reflected light from the first surface is not received by the camera when the object to be recognized is irradiated with the illumination light by an illuminating part and the reflected light of the illumination light is received from an upper part to pick up the image of the object to be recognized; and irradiating the object to be recognized with colored illumination light by a second illuminatingunit froma second light applying direction inwhich the reflected light from the first surface is received by the camera.
  • the object to be recognized when the object to be recognized is irradiated with the illumination lights by the illuminating part and the reflected lights of the illumination lights are received from the upper part to pick up the image of the object to be recognized, the object to be recognized is irradiated with the illumination lights from the light applying directions inwhich the regularly reflected lights fromthe first surface having the glossiness are not received by the camera.
  • the first surface can be accurately separated from the second surface having the glossiness lower than that of the first surface.
  • the object to be recognized is irradiated with the illumination lights by the illuminating part and the reflected lights of the illumination lights are received from the upper part to pickup the image of the object to be recognized
  • the object to be recognized is irradiated with the white illumination lights by the first illuminatingunit fromthe first light applyingdirections inwhichthe regularlyreflectedlights from the first surface are not received by the camera and the object to be recognized is irradiated with the colored illumination lights by the second illuminating unit from the second light applying directions in which the reflected lights from the first surface are received by the camera.
  • the first surface and the second surface can be identified on the same recognition screen from the image obtained by one image pick-up operation.
  • Fig.1 is a front view of a screen process printing device according to one embodiment of the present invention.
  • Fig .2 is a side view of the screen process printing device according to one embodiment of the present invention.
  • Fig.3 is a plan view of the screen process printing device according to one embodiment of the present invention.
  • Fig.4(a) and 4(b) are partial plan views of a board print surface by the screen process printing device according to one embodiment of the present invention.
  • Fig. 5(a) is a plan view of a board as an object to be recognized of an image recognition apparatus according to one embodiment of the present invention.
  • Fig. 5 (b) is a partial sectional view of the board as the object to be recognized of the image recognition apparatus according to one embodiment of the present invention.
  • Fig. 6 is a sectional view of an image pick-up unit of the image recognition apparatus according to one embodiment of the present invention.
  • Fig. 7(a) is an explanatory diagram of the structure of an illuminating part of the image pick-up unit of the image recognition apparatus according to one embodiment of the present invention.
  • Fig.7 (b) is an explanatory diagram of the light applying direction of the illumination light by the image pick-up unit of the image recognition apparatus according to one embodiment of the present invention.
  • Figs. 8(a) and 8(b) are explanatory views of the arrangement of a light source of the image pick-up unit of the image recognition apparatus according to one embodiment of the present invention.
  • Figs. 9(a) to 9(c) are explanatory views of the light applying direction of the illumination light by the image pick-up unit of the image recognition apparatus according to one embodiment of the present invention.
  • Figs. 10(a) and 10(b) are explanatory view of the light applying direction of the illumination light by the image pick-up unit of the image recognition apparatus according to one embodiment of the present invention.
  • Fig. 11 is an explanatory view of the light applying direction of the illumination light by the image pick-up unit of the image recognition apparatus according to one embodiment of the present invention.
  • Figs. 12(a) and 12(b) are views of an obtained image of the image recognition apparatus according to one embodiment of the present invention.
  • Fig. 13 is a view of an obtained image of the image recognition apparatus according to one embodiment of the present invention.
  • Fig. 14(a) and 14(b) show explanatory views of the light applying direction of the illumination light by the image pick-up unit of the image recognition apparatus according to one embodiment of the present invention. Best Mode for Carrying Out the Invention Now, embodiments of thepresent inventionwill be described by referring to the drawings. Firstly referring to Figs. 1, 2 and 3, the structure of the screen process printing device will be described.
  • the screen process printing device has not only a printing mechanism for printing cream solder on a board on which electronic parts are mounted, but also a function as a print inspection device for deciding whether or not a printed state is good, as described below.
  • a board positioning part 1 comprises a movable table having an X-axis table 2 and a Y-axis table 3,
  • ⁇ -axis table 4 stacked thereon and a Z-axis table 5 disposed
  • aboardholdingpart 7 forholding a board 6 held by a clamper 8 from a lower part is provided.
  • the board 6 to be printed is conveyed to the board positioning part 1 by a loading conveyor 14 shown in Figs. 1 and 3.
  • the board positioning part 1 is driven so that the board 6 moves in XY directions and is positioned at a printing position and a board recognizing position described below.
  • the board 6 on which printing has been subjected is delivered by an unloading conveyor 15.
  • a screen mask 10 is disposed above the board positioning part 1.
  • the screen mask 10 includes a mask plate 12 mounted on a holder 11.
  • the board 6 is aligned with the mask plate 12 by the board positioning part 1 and abuts thereon from a lower part .
  • a squeegee head 13 is provided so as to freely reciprocate in the horizontal direction. While the board 6 abuts on the lower surface of the mask plate 12, cream solder 9 is supplied to the mask plate 12 and squeegees 13a of the squeegee head 13 are allowed to abut on the surface of the mask plate 12 and slide. Thus, the cream solder 9 is printed on the printing surface of the board 6 through pattern holes provided in the mask plate 12. As shown in Fig. 5(a), the cream solder 9 is printed on the solder leveler forming
  • the solder surface 9a of the cream solder 9 under a printed state serves as a second surface with a glossiness lower than that of the solder leveler forming surface 16a.
  • an image pick-up unit 20 as image pick-up means is provided on the screen mask 10.
  • the image pick-up unit 20 moves in X and Y directions by an X-axis table 21 and a Y-axis table 22.
  • the X-axis table 21 and the Y-axis table 22 serve as image pick-up moving means for moving the image pick-up unit 20.
  • the image pick-up unit 20 is moved relative to the mask plate 12 by the image pick-up moving means so that the image pick-up unit 20 picks up the image of an arbitrary position of the mask plate 12.
  • the board positioning part 1 moves in the direction of Y from the lower part of the screen mask 10 by the Y-axis table 3 as shown in Fig. 4(b) to move the held board 6 to a board recognizing position (also see Fig. 2) .
  • the image pick-up unit 20 is moved to the board 6 on the board positioning part 1.
  • the image pick-up unit 20 can pick up the arbitrary position of the board 6.
  • a print inspection after a screen process printing is carried out by picking up the image of the board 6 on which the solder is printed as an object to be recognized by the image pick-up unit 20.
  • the electrodes 16 and 17 are partitioned from the surface of the board 6 by rectangular boundaries and protrude upward by the thickness of solder levelers in the board 6 as the object to be recognized. Further, the cream solder 9 is printed on each solder leveler forming surface l ⁇ a.
  • the image picked up by the image pick-up unit 20 serves as a recognition surface in recognizing the image for the print inspection.
  • the recognition surface includes a background surface as the surface of the board 6, the solder leveler forming surface l ⁇ a (first surface) and the solder surface 9a (second surface) of the cream solder 9 printed on the solder leveler forming surface l ⁇ a.
  • the solder leveler forming surface l ⁇ a is discriminated from the solder surface 9a in the background surface to obtain a solder print area. Then, the solder print area is compared with a preset inspecting threshold value to decide whether or not a printed state is good.
  • a zoom optical system 24 is connected to a camera 23 capable of picking up a color image and an illuminating part 25 is disposedbelowthe zoomoptical system24. The illuminating part 25 applies illumination lights to the surface of the board 6 as the object to be recognized upon picking up the image.
  • the camera 23 receives the reflected lights of the lights applied by the illuminating part 25 and reflected by the board 6 from an upper part through the zoom optical system 24 to pick up the image of the object to be recognized.
  • the image data of the recognition surface obtained by the camera 23 undergoes a recognizing process by a recognizing process part 30 and the recognized result is supplied a control part 33.
  • the illuminating part 25 includes a plurality of illuminating units having a lower stage illuminating unit 26, an intermediate stage illuminating unit 27, an upper stage illuminating unit 28 and a coaxial illuminating unit 29, which are described below, to irradiate the board 6 located in the lower part with illumination lights under various kinds of illuminating conditions. These illuminating units are controlledby the control part 33 through an illumination control part 31.
  • the lower stage illuminating unit 26, the intermediate illuminating unit 27 and the upper stage illuminating unit 28 are respectively ring shaped illuminating units in which light sources are arranged around circular image pick-up ranges 25abythe camera 23.
  • the lower stage illuminating unit 26 of these illuminating units can rotate by a prescribed angle about the image pick-up range 25a by a lower stage illumination rotating and driving part 32.
  • the image pick-up unit 20, the recognizing process part 30, the illumination control part 31 and the lower stage illumination rotating and driving part 32 constitute an image recognition apparatus for carrying out a recognizing process for picking up the image of the board in the screen process printing device to inspect the print .
  • each of the illuminating units will be described.
  • light source parts 35 respectively having a plurality of LEDs 36 are arranged in the radial directions around the image pick-up ranges 25a.
  • the lower stage illuminating unit 26 and the intermediate illuminating unit 27 respectively apply illumination lights to objects to be recognized located within the image pick-up ranges 25a at
  • the upper stage illuminating unit 28 has a light source part composed of LEDs arranged in a ring form in a part above the intermediate stage illuminating unit 27 and applies illumination lights to an object to be recognized located within the image pick-up range 25a from an upper part. Further, the coaxial illuminating unit 29 is located in the side of a half mirror 29a disposed below the zoom optical system 24.
  • Illumination lights horizontally applied from a light source part composed of LEDs are reflected downward by the half mirror 29a to illuminate an object to be recognized from a coaxial direction.
  • FIGs. 8(a) and 8(b) respectively show horizontal positions of the light source parts in the lower stage illuminating unit 26 and the intermediate stage illuminating unit 27.
  • eight light source parts are arranged in the radial directions about the image pick-up position 25a.
  • the illumination light is applied to the center of the image pick-up position 25a from each of the light source parts.
  • red color light source parts 35R having the LEDs emitting red color lights are arranged in the four directions of 0°, 90°, 180°, and 270° of the eight light source parts disposed in the lower stage illuminating unit 26 .
  • white color light source parts 35W having the LEDs emitting white color lights are arranged in four directions forming angles of 45° with the red color light source parts 35R.
  • the white color lights and the red color lights are respectively applied only from the determined directions within a horizontal plane.
  • the unit 26 is set so that the illumination angle ⁇ 1 is 45° or smaller.
  • the eight light source parts arranged in the intermediate stage illuminating unit 27 are the red color light source parts 35R all having the LEDs emitting the red color lights.
  • the electrode 16 formed on the surface of the board 6 in a horizontal position and the cream solder 9 on the electrode 16 are irradiated with the red color lights at the illumination
  • the upper stage illuminating unit 28 and the coaxial illuminating unit 29 light source parts respectively having LEDs emitting red color lights are arranged.
  • the electrode 16 formed on the surface of theboard 6 andthe cream solder 9 on the electrode 16 are irradiated with red color lights from slightly inclined directions (see arrow marks c) relative to a vertical direction, as shown in Fig.7 (b) .
  • red color lights reflected downward by the half mirror 29a are applied to the electrode and the cream solder from coaxial directions (see arrow marks d) .
  • the image recognition apparatus is formed as described above.
  • the solder leveler forming surface 16a is discriminated from the solder surface 9a in the background surface of a screen obtainedbypicking up the image of the surf ce of the board 6 to obtain the solder print area. Then, the solder print area is compared with a preset inspecting threshold value to decide whether or not the printed state is good.
  • a printed board 6 is moved to an image pick-up position and an image pick-up unit 20 is positioned on the position of the board 6 to be inspected.
  • an alignment is carried out so that the outlines of four sides of a rectangular electrode 16 on which a cream solder 9 is printed, that is, boundaries on the surface of the board 6 respectively substantially correspond to the directions of 0°, 90°, 180° and 270°.
  • a lower stage illuminating unit 26 is used.
  • only four white light source parts 35W of eight light source parts are lighted to pick up the image of the position on the board 6 to be inspected.
  • the solder surface 9a of the cream solder 9 and a solder leveler surface 16a are irradiated with white color lights from directions shown by arrow marks a (see Fig. 7 (b) ) .
  • the illumination lights (see arrow marks al) of these illumination lights with which the solder surface 9a is irradiated are irregularly reflected by the solder surface 9a with a low glossiness.
  • the irregularly reflected lights are received by the upper camera 23 (see Fig. 6) .
  • the light applying directions of the illumination lights emitted from the white color light source parts 35W in the horizontal plane are substantially set to directions of 45° relative to the boundaries of the electrode 16.
  • the reflecting directions of the regularly reflected lights in the horizontal plane are biased as shown in broken line arrow marks in Fig. 9(c). Accordingly, the regularly reflected lights are not received by the upper camera 23. Then, only the solder leveler forming surfaces 16a in the corner parts of the electrode 16 regularly reflect upward the illumination lights fromoblique directions andthe regularlyreflectedlights
  • ⁇ 3 is set to 45°, an angle at which the regularly reflected lights are not received by the camera 23 may be employed and the angle may be set to 75° or smaller under practical conditions.
  • Fig.12(a) shows a recognition surface obtainedby picking up the image under the above-described illuminating conditions .
  • This recognition surface has the image including the electrode 16 and the cream solder 9 printed on the electrode 16 in a background surface showing the surface of the board 6.
  • leveler parallel parts 16c of parts corresponding to the solder leveler forming surface l ⁇ a of the electrode 16 have illuminating conditions under which the regularly reflected lights of the white color illumination lights are not received by the camera 23 as described above, they have low luminance on a screen. Only the corner parts 16d of the electrode are high in their luminance in which the regularly reflected lights are received by the camera as described above.
  • the irregularly reflected lights of a solder surface 9a are received so that the solder part 9 whose image is picked up with a certain degree of luminance can be clearly separated from the leveler parallel parts 16c on the image due to a luminance difference and the cream solder 9 on the electrode 16 on which the solder leveler is formed can be identified with high accuracy.
  • Fig.12 (b) shows a recognition screen obtained by a usual image recognition method, for comparison, in which white color illumination lights are applied from all directions when an electrode 16 on which a cream solder 9 is likewise printed is used as an object to be recognized.
  • the illumination lights are incident on a solder leveler surface 16a not only from oblique directions, but also from normal directions, regularly reflected lights from the solder leveler surface 16a with a glossiness are incident on a camera 23. Therefore, the solder leveler surface 16a is taken substantially completely or partly as an image with high luminance. Accordingly, since the luminance difference between the image and an image receiving the irregularly reflected lights of the cream solder 9 is obscure, the cream solder 9 on the electrode 16 is obscurely identified.
  • the board 6 that has the solder leveler forming surface 16a partitioned by the rectangular boundary on the surface of the boardandthe cream solder 9 printed on the solder leveler forming surface 16a is provided as the object to be recognized.
  • the upper surface of the board 6 as the recognition surface for the object to be recognized by the image pick-up unit 20 includes the electrode 16 having the solder leveler forming surface 16a as a first surface with the glossiness and the solder surface 9a as a second surface with the glossiness lower than that of the solder leveler forming surface 16a inthe surface oftheboard 6 as thebackgroundsurface .
  • the upper surface of the board 6 is irradiated with the illumination lights by an illuminating part 25 and the reflected lights of the illumination lights are received from the upper part to pick up the image of the upper surface of the board 6, the upper surface of the board 6 is irradiated with the illumination lights from the light applying direction in which the regularly reflected lights from the solder leveler surface 16a are not received by the camera 23.
  • the upper surface of the board is irradiated with the white illumination lights from a direction in which
  • solder leveler surface l ⁇ a and the solder surface 9a can be identified in accordance with an obvious luminance difference. Even when the cream solder 9 naturally including the naturally same material is printed on the solder leveler surface l ⁇ a, a recognition accuracy can be improved to detect a solder area with high accuracy.
  • the example that the alignment is carried out in such a way that the boundaries of four sides showing the external form of the electrode 16 respectively substantially correspond to the directions of 0°, 90°, 180°, and 270° is described.
  • a lower illuminating unit 26 is rotated by the same angle of ⁇ by a lower stage illumination rotating and driving part 32 (see Fig. 6) .
  • white illumination lights are applied to the solder leveler forming surface from the same light applying direction as that of the example shown in Fig. 9(c) .
  • the above-described embodiment shows the example that the board 6 in which the cream solder 9 is printed on the electrode 16 having the solder leveler forming sur ace 16a serves as the object to be recognized.
  • the present invention may be applied to other combinations than the above-described object to be recognized and an object to be recognized including a background surface, a first surface with a glossiness and a second surface with a glossiness lower than that of the first surface in a recognition surface, the first surface being partitioned by a rectangular boundary in the background surface and the second surface being provided on the first surface. (Second Mode of Embodiment)
  • a printed board 6 is moved to an image pick-up position and an image pick-up unit 20 is positioned on the position of the board 6 to be inspected.
  • an alignment is carried out so that the outlines of four sides of a rectangular electrode 16 on which a cream solder 9 is printed, that is, boundaries on the surface of the board 6 respectively substantially correspond to the directions of 0°, 90°, 180° and 270°.
  • a lower stage illuminating unit 26 an intermediate stage illuminating unit 27 and an upper stage illuminating unit 28 are used together .
  • the illuminating state of the lower stage illuminating unit 26 will be described.
  • Fig. 9(a) upon picking up the image, all of four white color light source parts 35W and four red color light source parts 35 are lighted to irradiate the position of the board 6 to be inspected with illumination lights.
  • Fig. 9(b) shows the reflected states of white illumination lights emitted from the white color light source parts 35W.
  • the solder surface 9a of a cream solder 9 and a solder leveler surface 16a are irradiated with the white color illumination lights emitted from directions shownby arrowmarks a (see Fig. 7(b)) .
  • the illumination lights (see arrow marks al) of these illumination lights with which the solder surface 9a is irradiated are irregularly reflectedby the solder surface 9a with a low glossiness and the irregularly reflected lights are received by the upper camera 23 (see Fig. 6) .
  • the illumination lights (see arrow marks a2) with which the solder leveler surface 16a is irradiated corresponding parts are regularly reflectedby the solder leveler surface 16a with a glossiness in specific directions corresponding to light
  • the light applying directions of the illumination lights emitted from the white color light source parts 35W in the horizontal plane are substantially set to directions of about 45° relative to the boundaries of the electrode 16.
  • the reflecting directions of the regularly reflected lights in the horizontal plane are biased as shown in broken line arrow marks in Fig. 9(c) . Accordingly, the regularly reflected lights are
  • an angle at which the regularly reflected lights are not received by the camera 23 may be employed and the angle may be set to 75° or smaller under practical conditions.
  • Fig. 10 shows the incident directions and the reflected conditions of red color illumination lights emitted from the red color light source parts 35R.
  • these red illumination lights are incident on the boundaries of the four sides of the rectangular electrode 16 fromnormal directions .
  • the solder surface 9a of the cream solder 9 and the solder leveler surface 16a are irradiated with the red color illumination lights applied from directions shown by arrow marks e.
  • the illumination lights of these illumination lights (see arrow marks el) with which the solder surface 9a is irradiated are irregularly reflected by the solder surface 9a with the low glossiness and the irregularly reflected lights are received by the upper camera 23 (see Fig.
  • Fig. 11 shows the reflected conditions of illumination lights applied by the intermediate stage illuminating unit 27 andthe upper stage illuminating unit 28.
  • both the intermediate stage illuminating unit 27 and the upper stage illuminating unit 28 respectively apply red color illumination lights to the solder surface 9a of the cream solder 9 and the solder leveler surface l ⁇ a from directions of arrow marks b and c.
  • the illumination lights of these illumination lights with which the solder surface 9a is irradiated are irregularly reflected by the solder surface 9a with the low glossiness and the irregularly reflected lights are likewise received by the upper camera 23.
  • correspondingparts are regularly reflected upwardby the solder leveler surface 16awith the glossiness andreceivedbythe camera 23.
  • Fig. 13 shows a recognition screen obtained by picking up an image under the above-described illuminating conditions.
  • This recognition screen shows a color image including an electrode 16 and a cream solder 9 printed on the electrode 16 in a background surface showing the surface of a board 6.
  • the solder leveler forming surface 16a of the electrode 16 appears as a red colored part with the regularly reflected lights of red color illumination lights emitted from the lower stage illuminating unit 26, the intermediate stage illuminating unit 27 and the upper stage illuminating unit 28.
  • the solder leveler forming surface 16a is also irradiated with the white color illumination lights of the lower stage illuminating unit 26.
  • the solder leveler forming surface 16a does not light with high luminance by the white color illumination lights.
  • the solder surface 9a of the cream solder 9 reflects upward the irregularly reflected lights ofwhite color illumination lights emitted from the lower stage illuminating unit 26 and the irregularly reflected lights of the red color illumination lights emitted from the lower stage illuminating unit 26, the intermediate stage illuminating unit 27 and the upper stage illuminating unit 28.
  • the camera 23 receives the irregularly reflected lights so that the cream solder 9 appears as a white colored part slightly including a red color and can be obviously discriminated from the solder leveler surface 16a appearing as a red colored part.
  • the board 6 that has the solder leveler forming surface 16a partitioned by the rectangular boundaryonthe surface of the board andthe cream solder 9 printed on the solder leveler forming surface 16a is provided as the object to be recognized.
  • the upper surface of the board 6 as the recognition surface of the object to be recognized by the image pick-up unit 20 includes the electrode 16 having the solder leveler forming surface 16a as a first surface with the glossiness and the solder surface 9a as a second surface with the glossiness lower than that of the solder leveler forming surface 16a inthe surface of theboard 6 as thebackgroundsurface .
  • the upper surface of the board 6 is irradiated with the illumination lights by an illuminating part 25 and the reflected lights of the illumination lights are received from the upper part to pick up the image of the upper surface of the board 6, the upper surface of the board 6 is irradiated with the illumination lights from the light applying direction in which the regularly reflected lights from the solder leveler surface 16a are not received by the camera 23.
  • the upper surface of theboard is irradiated with the white illumination lights from a direction in which
  • the upper surface of the board 6 is irradiated with the red color illumination lights
  • the white color light source parts 35W of the lower stage illuminating unit 26 serve first illuminating means for emitting the white color illumination lights.
  • the red color light source parts 35R of the lower stage illuminating unit 26, the intermediate stage illuminating unit 27 and the upper stage illuminating unit 28 serve as second illuminating means for emitting colored illumination lights.
  • the solder leveler surface 16a and the solder surface 9a can be identified in accordance with an obvious color difference between a red color part and a white color part . Even when the cream solder 9 naturally including the same material is printed on the solder leveler surface 16a, a recognition accuracy canbe improvedto detect a solder areawithhigh accuracy. Further, in this embodiment, since the cream solder 9 can be separated from the solder leveler surface 16a on the same recognition screen, a recognition tact time canbemore shortened than a usual recognition method in which a plurality of images picked up under different illuminating conditions need to be obtained.
  • the above-described embodiment shows the example that the board 6 in which the cream solder 9 is printed on the electrode 16 having the solder leveler forming surface 16a serves as the object to be recognized.
  • the present invention may be applied to other combinations than the above-described object to be recognized and an object to be recognized including a background surface, a first surface with a glossiness and a second surface with a glossiness lower than that of the first surface in a recognition surface, the first surface being partitioned by a rectangular boundary and the second surface being provided on the first surface in the background surface.
  • the object to be recognized is irradiated with the illumination lights by the illuminating part and when the reflected lights of the illumination lights are received from the upper part to pick up the image of the object to be recognized, the object to be recognized is irradiated with the illumination lights from the light applying directions inwhichthe regularlyreflected lights from the first surface having the glossiness are not received by the camera.
  • the first surface can be accurately separated from the second surface having the glossiness lower than that of the first surface.
  • the object to be recognized is irradiated with the illumination lights by the illuminating part and when the reflected lights of the illumination lights are received from the upper part to pick up the image of the object to be recognized, the object to be recognized is irradiated with the white illumination lights by the first illuminating unit from the first light applying directions in which the regular reflected lights from the first surface are not received by the camera and the object to be recognized is irradiated with the colored illumination lights by the second illuminating unit from the second light applying directions in which the reflected lights from the first surface are received by the camera.
  • the first surface and the second surface can be identified on the same recognition screen from the image obtained by one image pick-up operation.

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Abstract

Dans un procédé de reconnaissance d'image, l'image d'une soudure en pâte (9) imprimée sur une électrode rectangulaire (16) présentant un vérin de soudure formé est recueillie et reconnue afin d'identifier la soudure en pâte (9). Une unité d'éclairage possédant des parties de source de lumière blanche de 35W arrangées dans les sens obliques radiaux de 45° sert à appliquer des lumière d'éclairage de couleur blanche à partir d'un sens d'application de lumière dans lequel un angle de ? 1 formé par le sens d'application de lumière et un plan horizontal dans un plan vertical est de 45° maximum et à partir d'un sens d'application de lumière dans lequel un angle de ? 3 formé par le sens d'application de lumière et la limite de l'électrode (16) dans un plan horizontal est de 75° maximum. Par conséquent, les lumières régulièrement réfléchies à partir de la surface de formation du vérin de soudure (16a) avec une brillance ne sont pas reçues par une caméra supérieure afin d'identifier une surface de soudure (9a) et la surface de formation de vérin de soudure (16a) avec une bonne précision.
EP04700757A 2003-01-09 2004-01-08 Appareil de reconnaissance d'image et procédé de reconnaissance d'image Expired - Lifetime EP1595138B1 (fr)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2003003033A JP4818572B2 (ja) 2003-01-09 2003-01-09 画像認識装置および画像認識方法
JP2003003032A JP4818571B2 (ja) 2003-01-09 2003-01-09 画像認識装置および画像認識方法
JP2003003033 2003-01-09
JP2003003032 2003-01-09
PCT/JP2004/000064 WO2004063733A1 (fr) 2003-01-09 2004-01-08 Appareil de reconnaissance d'image et procédé de reconnaissance d'image

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EP1595138A1 true EP1595138A1 (fr) 2005-11-16
EP1595138B1 EP1595138B1 (fr) 2010-07-07

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US (1) US7551768B2 (fr)
EP (1) EP1595138B1 (fr)
KR (1) KR101079686B1 (fr)
DE (1) DE602004027990D1 (fr)
WO (1) WO2004063733A1 (fr)

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US20080156207A1 (en) * 2006-12-28 2008-07-03 Dan Ellenbogen Stencil printers and the like, optical systems therefor, and methods of printing and inspection
DE102009017694B3 (de) * 2009-04-15 2010-12-02 Göpel electronic GmbH Anordnung einer rotatorischen Bildaufnahmeeinheit für die Abbildung von Objekten auf Leiterplatten unter einem polaren Betrachtungswinkel von 45°
US20130169959A1 (en) * 2011-07-08 2013-07-04 Optopo Inc. d/b/a Centice Corp. Zero order sensing to increase light collection in a spectrometer
JP5830644B2 (ja) * 2011-12-06 2015-12-09 パナソニックＩｐマネジメント株式会社 下受けピン配置判定装置および下受けピン配置判定方法
JP6272676B2 (ja) * 2013-11-07 2018-01-31 東レエンジニアリング株式会社 ボンディング装置
DE102015013500A1 (de) * 2015-10-16 2017-04-20 Mühlbauer Gmbh & Co. Kg Bildgebender Sensor für eine Bauteilhandhabungsvorrichtung
KR102172566B1 (ko) 2015-12-14 2020-11-02 주식회사 엘지화학 아이소소바이드 폴리카보네이트 수지 조성물 및 이를 포함하는 성형품
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CN116109879B (zh) * 2023-04-13 2023-07-04 东莞市杰达机械有限公司 整平机的控制系统及其控制方法

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WO2004063733A1 (fr) 2004-07-29
DE602004027990D1 (de) 2010-08-19
US20040213450A1 (en) 2004-10-28
KR20050085957A (ko) 2005-08-29
KR101079686B1 (ko) 2011-11-04
US7551768B2 (en) 2009-06-23

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