EP1166331A1 - Procede destine a relier un fil d'alimentation de courant a une plaque de contact d'une lampe electrique - Google Patents
Procede destine a relier un fil d'alimentation de courant a une plaque de contact d'une lampe electriqueInfo
- Publication number
- EP1166331A1 EP1166331A1 EP01909509A EP01909509A EP1166331A1 EP 1166331 A1 EP1166331 A1 EP 1166331A1 EP 01909509 A EP01909509 A EP 01909509A EP 01909509 A EP01909509 A EP 01909509A EP 1166331 A1 EP1166331 A1 EP 1166331A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- wire
- contact plate
- power supply
- supply wire
- opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01K—ELECTRIC INCANDESCENT LAMPS
- H01K1/00—Details
- H01K1/42—Means forming part of the lamp for the purpose of providing electrical connection, or support for, the lamp
- H01K1/46—Means forming part of the lamp for the purpose of providing electrical connection, or support for, the lamp supported by a separate part, e.g. base, cap
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/24—Manufacture or joining of vessels, leading-in conductors or bases
- H01J9/245—Manufacture or joining of vessels, leading-in conductors or bases specially adapted for gas discharge tubes or lamps
- H01J9/247—Manufacture or joining of vessels, leading-in conductors or bases specially adapted for gas discharge tubes or lamps specially adapted for gas-discharge lamps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J5/00—Details relating to vessels or to leading-in conductors common to two or more basic types of discharge tubes or lamps
- H01J5/46—Leading-in conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J61/00—Gas-discharge or vapour-discharge lamps
- H01J61/02—Details
- H01J61/36—Seals between parts of vessels; Seals for leading-in conductors; Leading-in conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01K—ELECTRIC INCANDESCENT LAMPS
- H01K1/00—Details
- H01K1/40—Leading-in conductors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
- Y10T29/49162—Manufacturing circuit on or in base by using wire as conductive path
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49174—Assembling terminal to elongated conductor
Definitions
- the invention relates to a method for connecting a power supply wire to a contact plate according to the preamble of patent claim 1.
- an additional wire is used to connect the power supply wire which is passed through the opening in the contact plate to the contact sheet of the lamp, with the wire being between the additional wire and the power supply wire or between the additional
- An arc is generated between the wire and the contact plate in the area of the opening so that at least part of the material of the additional wire is melted and the opening is closed with the aid of the melt.
- This ensures that the power supply wire is embedded in the re-solidified melt.
- the solidified melt ensures a secure connection and electrical contacting between the power supply wire and the contact plate.
- the soldering method according to the invention takes only a short time, does not require preheating of the parts to be soldered and therefore does not lead to overheating and destruction of the ceramic stone or glass stone arranged in the lamp base.
- the arc for soldering the power supply wire to the contact plate is advantageously generated with the aid of an electrical voltage which is polarized such that the positive pole is connected to the additional wire and the negative pole is connected to the contact plate and / or the power supply wire.
- the additional wire acts as an anode during the discharge producing the arc and the contact plate and / or the current supply wire acts as a cathode.
- the additional wire is therefore heated more in the arc than the contact plate or the power supply wire.
- this polarity of the electrical voltage eliminates any contamination of the contact plate which has arisen during lamp cap formation in the arc.
- the negative pole of the voltage source is connected to the contact plate and the contact plate is in electrical contact with the current supply wire during arc soldering, since the contact plate, unlike the current supply wire that mostly runs inside the lamp base, is easily accessible from the outside.
- the arc is nevertheless preferably formed between the additional wire and the power supply wire.
- the melting temperature is lower than the melting temperature of the contact plate in order to ensure that the material of the additional wire is preferably melted. But even if the additional wire is made of the same material how the contact plate or the power supply wire is made, it is ensured by the above-described polarity of the electric voltage generating the arc that the additional wire is heated more than the contact plate and the power supply wire, so that also in this case preferably the material of the additional wire during Arc soldering process is melted.
- the soldering process according to the invention that is to say the generation of the arc, is advantageously carried out under a protective gas atmosphere in order to avoid scaling of the contact plate and undesirable oxidation processes at the soldering point.
- the diameter of the opening in the contact plate is advantageously smaller than the sum of the wire diameters of the power supply wire and the additional wire. In this way, it is prevented that the additional wire is inadvertently inserted into the opening during the generation of the arc and an undefined arc is formed, which leads to the soldering process being interrupted.
- the method according to the invention has proven to be particularly advantageous for power supply wires which consist of a material from the group of copper, nickel, copper alloy or nickel alloy.
- the additional wire advantageously consists of copper or a copper alloy.
- a sheet which is made of a material from the group of stainless steel, brass, copper or nickel is advantageously used as the contact sheet.
- the method according to the invention is particularly well suited for the production of corrosion-resistant copper-nickel welded or soldered connections.
- FIG. 1 shows a schematic, partially sectioned illustration of a lamp base with a contact plate, power supply wire and an additional wire which is used as a solder for producing the soldered connection between the contact plate and the power supply wire.
- the soldering device is not shown in the figure.
- the method according to the invention will be explained by way of example using a generally known Edison screw base of an electric lamp and with the aid of schematic FIG.
- the screw base has a metallic base sleeve 1 equipped with a screw thread, a contact plate 2, which forms the bottom contact of the screw base, and an insulating body 3, which ensures electrical insulation between the base sleeve 1 and the bottom contact plate 2.
- the lamp usually has two power supply wires 4, one of which (not shown) is connected to the base sleeve 1 and the other 4 is connected to the ground contact plate 2 in an electrically conductive manner.
- the contact plate 2 is provided with an opening 2a. Before the power supply wire 4 is soldered to the contact plate 2, an end of the power supply wire 4 that may protrude too far beyond the level of the contact plate 2 is cut off.
- an additional wire 5 which consists of copper or a copper alloy, is used as filler material. The additional wire 5 is positioned over the opening 2a and over the end of the power supply wire 4 by means of a holder 6 of a soldering device (not shown).
- the additional wire 5 is connected via its holder 6 to the positive pole 8 of a DC voltage source, while the contact plate 2 and the power supply wire 4 in electrical contact therewith are connected to the negative pole 9 of the DC power source by the soldering device (not shown).
- the distance between these two wires 4, 5 is first reduced to such an extent that they touch and an electrical current flows over the contact.
- the power supply wire 4 is contacted by the ascending wire 5 with the edge of the opening 2a.
- an arc 7 is formed between the additional wire 5 and the power supply wire 4 or between the additional wire 5 and the contact plate 2.
- the additional wire 5 acts as an anode and the power supply wire 4 or the contact plate 2 acts as a cathode.
- the end of the additional wire 5 is heated in the arc above its melting temperature.
- the melt closes the opening 2a in the contact plate 2 completely and after solidification creates a permanent mechanical and electrical connection between the contact plate 2 and the power supply wire 4.
- the soldering process is carried out under a protective gas atmosphere, for example under an argon atmosphere.
- the soldering point is arranged during the arc soldering in a gas purging chamber (not shown) which is part of the soldering device (not shown) and which, for example by means of ventilation openings, ensures a constant protective gas pressure in the gas purging chamber.
- the soldering process takes a maximum time of 200 ms.
- the contact plate 2 consists of a stainless steel and has a thickness of approximately 0.2 mm to 0.4 mm.
- the power supply wire 4 is a nickel wire and has a diameter between 0.5 mm and 1.0 mm.
- the additional wire 5 used as a solder consists of copper or a copper alloy and has a diameter between 0.8 mm and 1.0 mm.
- the invention is not limited to the exemplary embodiment described in more detail above.
- the method according to the invention can also be used if the contact plate consists of a material from the group of stainless steel, brass, copper or nickel and the power supply consists of a material from the group of copper, nickel, copper alloy or nickel alloy.
- FIG. 1 A further exemplary embodiment of the invention is also shown in FIG.
- the same reference numerals have been used for identical parts as in the first exemplary embodiment explained above.
- the only difference from the first exemplary embodiment is that in the second exemplary embodiment of the invention, a metallic hollow rivet 10 is drawn into the opening 2a of the contact plate 2 and into the opening in the insulating body 3 for the power supply 4, the outer diameter of which rivets to the inner diameter of the opening 2a Contact plate 2 and the opening in the insulating body 3 is matched.
- the edge 11 of the hollow rivet 10 protruding over the contact plate 2 is flanged.
- the power supply 4 to be connected to the contact plate 2 is threaded through the hollow rivet 10 and a possibly protruding from the base, separated from the edge 11 of the hollow rivet 10 end of the power supply 4.
- the additional wire 5 is positioned above the hollow rivet 10 and over the end of the power supply wire 4 by means of a holder 6 of a soldering device (not shown).
- the additional wire 5 is connected via its holder 6 to the positive pole 8 of a DC voltage source, while the contact plate 2 and the hollow rivet 10 in electrical contact therewith and the power supply wire 4 are connected to the negative pole 9 of the DC power source by the soldering device (not shown) is.
- the distance between these two wires 4, 5 is first reduced to such an extent that they touch and an electrical current flows over the contact.
- the power supply wire 4 is contacted by the ascending wire 5 with the hollow rivet 10.
- an arc 7 is formed between the additional wire 5 and the power supply wire 4 or between the additional wire 5 and the hollow rivet 10 or the contact plate 2.
- the additional wire 5 acts as an anode and the power supply wire 4 or the hollow rivet 10 or the contact plate 2 acts as a cathode.
- the end of the additional wire 5 is heated in the arc above its melting temperature.
- the melt completely closes the opening in the hollow rivet 10 and thus also the opening 2a in the contact plate 2 and, after solidification, establishes a permanent mechanical and electrical connection between the contact plate 2, the hollow rivet 10 and the power supply wire 4.
- the use of the hollow rivet 10 enables better contact to be made with the power supply wire 4.
- the flanged edge 11 of the hollow rivet 10 reduces the thermal load on the base during the soldering process. As a result, a correspondingly thinner contact plate 2 can be used.
- the opening 2a in the contact plate 2 and the opening in the insulating body 3, as well as the channel 10a of the hollow rivet 10 are preferably not rotationally symmetrical in order to enable the contact plate 2 to be arranged such that it cannot rotate.
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Common Detailed Techniques For Electron Tubes Or Discharge Tubes (AREA)
- Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10003434 | 2000-01-27 | ||
DE10003434A DE10003434A1 (de) | 2000-01-27 | 2000-01-27 | Verfahren zum Verbinden eines Stromzuführungsdrahtes mit einem Kontaktblech einer elektrischen Lampe |
PCT/DE2001/000249 WO2001056061A1 (fr) | 2000-01-27 | 2001-01-22 | Procede destine a relier un fil d'alimentation de courant a une plaque de contact d'une lampe electrique |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1166331A1 true EP1166331A1 (fr) | 2002-01-02 |
EP1166331B1 EP1166331B1 (fr) | 2006-04-19 |
Family
ID=7628853
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP01909509A Expired - Lifetime EP1166331B1 (fr) | 2000-01-27 | 2001-01-22 | Procede destine a relier un fil d'alimentation de courant a une plaque de contact d'une lampe electrique |
Country Status (9)
Country | Link |
---|---|
US (1) | US6759618B2 (fr) |
EP (1) | EP1166331B1 (fr) |
JP (1) | JP4767469B2 (fr) |
KR (1) | KR100723074B1 (fr) |
CA (1) | CA2368761A1 (fr) |
DE (2) | DE10003434A1 (fr) |
HU (1) | HU226839B1 (fr) |
MX (1) | MXPA01009765A (fr) |
WO (1) | WO2001056061A1 (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060108928A1 (en) * | 2004-11-24 | 2006-05-25 | Patent-Treuhand-Gesellschaft Fur Elektrisch Gluhlampen Mbh | Process for producing a supply conductor for a lamp, and supply conductor for a lamp, as well as lamp having a supply conductor |
US7823353B2 (en) * | 2005-11-22 | 2010-11-02 | Masonite Corporation | Door, method of making door, and stack of doors |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DD68293B (fr) * | ||||
US1925986A (en) * | 1932-11-25 | 1933-09-05 | Gen Electric | Electric lamp or similar device |
US2749528A (en) * | 1953-07-01 | 1956-06-05 | Gen Electric | Welded fluorescent lamp base pins |
US3493718A (en) * | 1968-10-15 | 1970-02-03 | Gen Electric | Semi-conductor welding circuit |
DD137992A1 (de) | 1978-07-21 | 1979-10-03 | Becker Wolf Ruediger | Schweissverbindung zwischen den stromzufuehrungen und dem sockel elektrischer lampen |
JPS57123647A (en) * | 1981-01-23 | 1982-08-02 | Tokyo Shibaura Electric Co | Method of producing tubular bulb |
DD211299A1 (de) | 1981-08-14 | 1984-07-11 | Narva Rosa Luxemburg K | Verbinden drahtfoermiger teile mit anderen metallteilen mittels schweissen |
DD237934A1 (de) | 1985-05-30 | 1986-07-30 | Narva Rosa Luxemburg K | Verfahren und vorrichtung zur herstellung einer lampengefaess-sockelverbindung |
JPS6273552A (ja) * | 1985-09-27 | 1987-04-04 | 株式会社東芝 | 管球の製造方法 |
JPH06275244A (ja) * | 1993-03-22 | 1994-09-30 | Toshiba Lighting & Technol Corp | 管球製造用溶接治具、管球製造方法および白熱電球 |
JPH08138631A (ja) * | 1994-11-15 | 1996-05-31 | Origin Electric Co Ltd | 管球のアーク溶接装置及び溶接方法 |
JPH10275602A (ja) * | 1997-01-31 | 1998-10-13 | Toshiba Lighting & Technol Corp | 管球および照明器具 |
HUP9702173A3 (en) | 1997-11-20 | 1999-10-28 | Gen Electric Co Cleveland | Contact plate for lamp heads of electric bulb |
FR2776464B1 (fr) | 1998-03-23 | 2000-06-02 | Minilampe Sa | Procede de fabrication d'une lampe et lampes obtenues par un tel procede |
JP2000094140A (ja) | 1998-09-17 | 2000-04-04 | Origin Electric Co Ltd | 管球の製造方法 |
JP3578662B2 (ja) * | 1999-05-21 | 2004-10-20 | 松下電器産業株式会社 | 管球の口金付け方法 |
JP3324564B2 (ja) * | 1999-05-25 | 2002-09-17 | 松下電器産業株式会社 | 管球の製造方法 |
-
2000
- 2000-01-27 DE DE10003434A patent/DE10003434A1/de not_active Withdrawn
-
2001
- 2001-01-22 MX MXPA01009765A patent/MXPA01009765A/es active IP Right Grant
- 2001-01-22 US US09/937,503 patent/US6759618B2/en not_active Expired - Fee Related
- 2001-01-22 HU HU0200885A patent/HU226839B1/hu not_active IP Right Cessation
- 2001-01-22 CA CA002368761A patent/CA2368761A1/fr not_active Abandoned
- 2001-01-22 EP EP01909509A patent/EP1166331B1/fr not_active Expired - Lifetime
- 2001-01-22 WO PCT/DE2001/000249 patent/WO2001056061A1/fr active IP Right Grant
- 2001-01-22 KR KR1020017012044A patent/KR100723074B1/ko not_active IP Right Cessation
- 2001-01-22 JP JP2001555118A patent/JP4767469B2/ja not_active Expired - Fee Related
- 2001-01-22 DE DE50109529T patent/DE50109529D1/de not_active Expired - Lifetime
Non-Patent Citations (1)
Title |
---|
See references of WO0156061A1 * |
Also Published As
Publication number | Publication date |
---|---|
US20030070293A1 (en) | 2003-04-17 |
DE10003434A1 (de) | 2001-08-02 |
CA2368761A1 (fr) | 2001-08-02 |
HU226839B1 (en) | 2009-12-28 |
HUP0200885A2 (en) | 2002-06-29 |
DE50109529D1 (de) | 2006-05-24 |
MXPA01009765A (es) | 2003-06-24 |
KR20020001794A (ko) | 2002-01-09 |
JP4767469B2 (ja) | 2011-09-07 |
KR100723074B1 (ko) | 2007-05-29 |
JP2003521097A (ja) | 2003-07-08 |
US6759618B2 (en) | 2004-07-06 |
WO2001056061A1 (fr) | 2001-08-02 |
EP1166331B1 (fr) | 2006-04-19 |
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