EP1035760B1 - Interlaminar insulating adhesive for multilayer printed circuit board - Google Patents
Interlaminar insulating adhesive for multilayer printed circuit board Download PDFInfo
- Publication number
- EP1035760B1 EP1035760B1 EP00104843A EP00104843A EP1035760B1 EP 1035760 B1 EP1035760 B1 EP 1035760B1 EP 00104843 A EP00104843 A EP 00104843A EP 00104843 A EP00104843 A EP 00104843A EP 1035760 B1 EP1035760 B1 EP 1035760B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- type epoxy
- epoxy resins
- printed circuit
- component
- multilayer printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000853 adhesive Substances 0.000 title claims description 46
- 230000001070 adhesive effect Effects 0.000 title claims description 46
- 239000003822 epoxy resin Substances 0.000 claims description 89
- 229920000647 polyepoxide Polymers 0.000 claims description 89
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 38
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 25
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 25
- 239000011889 copper foil Substances 0.000 claims description 24
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical group C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 claims description 23
- 239000004305 biphenyl Chemical group 0.000 claims description 19
- 235000010290 biphenyl Nutrition 0.000 claims description 19
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 16
- 229910052717 sulfur Inorganic materials 0.000 claims description 16
- 239000011593 sulfur Substances 0.000 claims description 16
- 239000004593 Epoxy Substances 0.000 claims description 15
- 229920003986 novolac Polymers 0.000 claims description 14
- 239000004695 Polyether sulfone Substances 0.000 claims description 13
- 229920006393 polyether sulfone Polymers 0.000 claims description 13
- 229920005992 thermoplastic resin Polymers 0.000 claims description 12
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims description 10
- 239000003795 chemical substances by application Substances 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 10
- 239000012790 adhesive layer Substances 0.000 claims description 9
- 239000013034 phenoxy resin Substances 0.000 claims description 7
- 229920006287 phenoxy resin Polymers 0.000 claims description 7
- 229920002492 poly(sulfone) Polymers 0.000 claims description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 5
- 125000000853 cresyl group Chemical class C1(=CC=C(C=C1)C)* 0.000 claims description 4
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 claims description 4
- LTYMSROWYAPPGB-UHFFFAOYSA-N diphenyl sulfide Chemical compound C=1C=CC=CC=1SC1=CC=CC=C1 LTYMSROWYAPPGB-UHFFFAOYSA-N 0.000 claims description 4
- 239000011256 inorganic filler Substances 0.000 claims description 3
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 55
- 229920005989 resin Polymers 0.000 description 29
- 239000011347 resin Substances 0.000 description 29
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 18
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 18
- 239000002966 varnish Substances 0.000 description 16
- 238000001723 curing Methods 0.000 description 15
- 239000000463 material Substances 0.000 description 14
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical group C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 12
- 238000000465 moulding Methods 0.000 description 12
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 10
- 239000011521 glass Substances 0.000 description 9
- 239000004744 fabric Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 5
- 239000007822 coupling agent Substances 0.000 description 5
- 229910052736 halogen Inorganic materials 0.000 description 5
- 150000002367 halogens Chemical class 0.000 description 5
- 150000002460 imidazoles Chemical class 0.000 description 5
- 229910052698 phosphorus Inorganic materials 0.000 description 5
- 239000011574 phosphorus Substances 0.000 description 5
- -1 phosphorus compound Chemical class 0.000 description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000012046 mixed solvent Substances 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 3
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 3
- 229910052794 bromium Inorganic materials 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000003063 flame retardant Substances 0.000 description 3
- 239000005350 fused silica glass Substances 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 125000001174 sulfone group Chemical group 0.000 description 3
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Chemical group 0.000 description 2
- CPELXLSAUQHCOX-UHFFFAOYSA-N Hydrogen bromide Chemical compound Br CPELXLSAUQHCOX-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 150000003018 phosphorus compounds Chemical class 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- LHENQXAPVKABON-UHFFFAOYSA-N 1-methoxypropan-1-ol Chemical compound CCC(O)OC LHENQXAPVKABON-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- CUGZWHZWSVUSBE-UHFFFAOYSA-N 2-(oxiran-2-ylmethoxy)ethanol Chemical compound OCCOCC1CO1 CUGZWHZWSVUSBE-UHFFFAOYSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- SYEWHONLFGZGLK-UHFFFAOYSA-N 2-[1,3-bis(oxiran-2-ylmethoxy)propan-2-yloxymethyl]oxirane Chemical compound C1OC1COCC(OCC1OC1)COCC1CO1 SYEWHONLFGZGLK-UHFFFAOYSA-N 0.000 description 1
- AGXAFZNONAXBOS-UHFFFAOYSA-N 2-[[3-(oxiran-2-ylmethyl)phenyl]methyl]oxirane Chemical compound C=1C=CC(CC2OC2)=CC=1CC1CO1 AGXAFZNONAXBOS-UHFFFAOYSA-N 0.000 description 1
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 1
- GOYGTBXFJBGGLI-UHFFFAOYSA-N 7a-but-1-enyl-3a-methyl-4,5-dihydro-2-benzofuran-1,3-dione Chemical compound C1=CCCC2(C)C(=O)OC(=O)C21C=CCC GOYGTBXFJBGGLI-UHFFFAOYSA-N 0.000 description 1
- 229910015900 BF3 Inorganic materials 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- UUQQGGWZVKUCBD-UHFFFAOYSA-N [4-(hydroxymethyl)-2-phenyl-1h-imidazol-5-yl]methanol Chemical compound N1C(CO)=C(CO)N=C1C1=CC=CC=C1 UUQQGGWZVKUCBD-UHFFFAOYSA-N 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 150000001491 aromatic compounds Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- 230000031709 bromination Effects 0.000 description 1
- 238000005893 bromination reaction Methods 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 150000002013 dioxins Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 150000002366 halogen compounds Chemical class 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 229910000042 hydrogen bromide Inorganic materials 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 229910017464 nitrogen compound Inorganic materials 0.000 description 1
- 150000002830 nitrogen compounds Chemical class 0.000 description 1
- 239000010680 novolac-type phenolic resin Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- 231100000925 very toxic Toxicity 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J181/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur, with or without nitrogen, oxygen, or carbon only; Adhesives based on polysulfones; Adhesives based on derivatives of such polymers
- C09J181/06—Polysulfones; Polyethersulfones
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
- H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0333—Organic insulating material consisting of one material containing S
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0358—Resin coated copper [RCC]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S525/00—Synthetic resins or natural rubbers -- part of the class 520 series
- Y10S525/936—Encapsulated chemical agent
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
- Y10T428/31522—Next to metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31529—Next to metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31533—Of polythioether
Definitions
- the present invention relates to an interlaminar insulating resin adhesive for multilayer printed circuit board. More particularly, the present invention relates to an interlaminar insulating adhesive of epoxy resin type for multilayer printed circuit board, which has flame retardancy without containing halogen or phosphorus, which has excellent thermal property, which can give an interlaminar insulating layer of uniform thickness, and which is suitable for formation of fine pattern; as well as to a copper foil coated with said interlaminar insulating adhesive.
- Production of a multilayer printed circuit board has been conducted by a process comprising steps of laminating, on an inner layer circuit substrate having a circuit, at least one prepreg obtained by impregnating a glass cloth with an epoxy resin, followed by semi-curing, laminating a copper foil thereon, and molding the resulting material into one piece by hot plate pressing.
- the thickness variation of the interlaminar insulating resin layer after press molding tends to be large because the insulating resin layer contains no glass cloth as a base material; therefore, in such a case, it is necessary to employ strictly controlled molding conditions, making difficult the molding.
- the interlaminar insulating adhesive is required to further have heat resistance and low thermal expansion coefficient so that the accuracy during circuit formation and component mounting can be maintained.
- Many of interlaminar insulating adhesives of conventional type have a glass transition temperature of about 120°C and therefore give rise to delamination of insulating layer.
- Thermosetting resins typified by epoxy resin, etc. are widely used, for their excellent properties, in printed circuit boards and other electric or electronic appliances. They are, in many cases, allowed to have flame retardancy so that they are resistant to fire. Flame retardancy of these resins has generally been achieved by using a halogen-containing compound (e.g. brominated epoxy resin as for example in JP-A-11 035 916). These halogen-containing compounds have high flame retardancy, but have various problems.
- a halogen-containing compound e.g. brominated epoxy resin as for example in JP-A-11 035 916.
- brominated aromatic compounds release corrosive bromine or hydrogen bromide when heat-decomposed and, when decomposed in the presence of oxygen, may generate very toxic so-called dioxins such as polybromodibenzofuran and polydibromobenzoxin; further, disposal of bromine-containing waste materials is difficult.
- dioxins such as polybromodibenzofuran and polydibromobenzoxin
- disposal of bromine-containing waste materials is difficult.
- phosphorus compounds and nitrogen compounds have recently been studied as a flame retardant replacing bromine-containing flame retardants.
- phosphorus compounds there is a fear that when their wastes are used for land reclamation, they may dissolve in water and pollute rivers or soils.
- the present invention provides a multilayer printed circuit board having a glass cloth-free insulating layer, which has excellent thermal property and which is low in thickness variation of the interlaminar insulating resin layer.
- the present invention lies in an interlaminar insulating adhesive for multilayer printed circuit board containing the following components as essential components:
- the component (a) i.e. the sulfur-containing thermoplastic resin having a weight-average molecular weight of 10 3 to 10 5 is used so that (1) the resin flowability during press molding becomes low and the insulating layer formed can maintain an intended thickness, (2) the adhesive composition can have flexibility, and (3) the insulating resin layer can have improved heat resistance and reduced heat history.
- the weight-average molecular weight is smaller than 10 3 , the flowability during molding is too high and the insulating layer formed is unable to maintain an intended thickness.
- the component (a) has low compatibility with the epoxy resins and shows inferior flowability.
- the weight-average molecular weight of the component (a) is preferably 5x10 3 to 10 5 from the standpoint of the flowability.
- the sulfur-containing thermoplastic resin as component (a) is preferably amorphous because no crystal is formed when subjected to heat history of heating and cooling.
- the component (a) preferably includes polysulfone and polyethersulfone.
- the sulfur-containing thermoplastic resin when modified with a hydroxyl group, a carboxyl group or an amino group at the terminal(s), has high reactivity with the epoxy resins; as a result, the phase separation between the sulfur-containing thermoplastic resin and the epoxy resins after heat-curing can be suppressed, and the cured material has increased heat resistance.
- a sulfur-containing thermoplastic resin modified as above is preferred.
- the proportion of the high-molecular, sulfur-containing thermoplastic resin (a) is preferably 20 to 70% by weight based on the total resin.
- the proportion is smaller than 20% by weight, the adhesive composition has no sufficiently high viscosity and is unable to reliably give an intended layer thickness; therefore, the insulating layer after pressing is unable to have a desired thickness, the outer-layer circuit is inferior in flatness, and heat resistance is insufficient.
- the proportion of the sulfur-containing thermoplastic resin (a) is larger than 70% by weight, the adhesive composition is hard and lacks in elasticity; therefore, is inferior in adaptability and adhesion to the uneven surface of an inner layer circuit substrate during press molding, generating voids.
- the component (b) i.e. the sulfur-containing epoxy or phenoxy resin having a weight-average molecular weight of 10 3 to 10 5 is added for adjustment of flowability, better handling, higher tenacity of cured material, etc.
- the sulfur-containing epoxy or phenoxy resin there are ordinarily used bisphenol S type epoxy or phenoxy resin, and epoxy or phenoxy resin having both a bisphenol S skeleton and a bisphenol or biphenyl skeleton.
- An epoxy or phenoxy resin having both a bisphenol S skeleton and a biphenyl skeleton is preferred because it has good compatibility with the component (a), and it preferably has a weight-average molecular weight of 10 4 to 10 5 from the standpoint of flowability. Owing to the presence of sulfur in the component (b), the component (b) can have good compatibility with the component (a), the resulting adhesive varnish can have stability, and the cured material can have uniformity and good thermal property.
- the proportion of the component (b) used is ordinarily 10 to 40% by weight based on the total resin. When the proportion is smaller than 10% by weight, the flowability during press molding is not sufficient, the adhesion of the resulting adhesive is low; and voids are generated easily. Meanwhile, a proportion larger than 40% by weight tends to give insufficient heat resistance.
- the component (c) i.e. the multifunctional epoxy resin having an epoxy equivalent of 500 or less is added.
- the polyfunctional epoxy resin preferably has a weight-average molecular weight of 1,000 or less. The proportion of this component is 10 to 70% by weight based on the total resin. When the proportion is smaller than 10% by weight, the above effect is not obtained sufficiently. When the proportion is larger than 70% by weight, the effect of the high-molecular, sulfur-containing thermoplastic resin is small.
- the epoxy resin as component (c) includes bisphenol type epoxy resin, novolac type epoxy resin, biphenyl type epoxy resin, dicyclopentadiene type epoxy resin, alcohol type epoxy resin, alicyclic type epoxy resin, aminophenol type epoxy resin, etc.; when flame retardancy is needed, includes naphthalene type epoxy resin, biphenyl type epoxy resin, bisphenol S type epoxy resin, indene-modified phenolic novolac type epoxy resin, indene-modified cresol novolac type epoxy resin, phenyl ether type epoxy resin, phenyl sulfide type epoxy resin, etc., which are all superior in flame retardancy. These epoxy resins are high in proportion of aromatic ring and are superior in flame retardancy and heat resistance.
- the component (d), i.e. the epoxy-curing agent includes amine compounds, imidazole compounds, acid anhydrides, etc. and there is no particular restriction as to the kind. However, an amine type curing agent having sulfone group is preferred.
- the presence of sulfone group in the curing agent (d) enhances the compatibility between the thermoplastic resin (a) having sulfone group and the components (b) and (c), gives a uniform cured material, and enables formation of a stable insulating resin layer. Further, owing to the enhanced compatibility, better dielectric property, particularly smaller dielectric loss is possible, and higher storage stability, that is, storage stability of 3 months or longer at 20°C can be obtained.
- the proportion of the curing agent is preferably 0.9 to 1.1 in terms of equivalent ratio to the total of the component (b) and the component (c). When the proportion deviates from this range, heat resistance and electrical property decrease.
- Imidazole compounds can cure an epoxy resin sufficiently even when used in a small amount.
- the imidazole compounds can allow the epoxy resin to effectively exhibit the flame retardancy.
- a particularly preferred imidazole compound is one which has a melting point of 130°C or higher, is a solid at ordinary temperature, has low solubility in an epoxy resin, and quickly reacts with the epoxy resin at high temperatures of 150°C or more.
- imidazole compound examples include 2-methylimidazole, 2-phenylimidazole, 2-phenyl-4-mehtylimidazole, bis(2-ethyl-4-methyl-imidazole), 2-phenyl-4-methyl-5-hydrxymethylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole and triazine-added imidazoles.
- These imidazoles are uniformly dispersible in an epoxy resin varnish, in the form of a fine powder.
- Such an imidazole has low compatibility with an epoxy resin; therefore, no reaction takes place at ordinary temperature to 100°C and good storage stability can be obtained. When heated to 150°C or higher during molding under heat and pressure, the imidazole reacts with the epoxy resin, producing a uniform cured material.
- acid anhydrides such as phthalic anhydride, tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylendomethylenetetrahydrophthalic anhydride, methylbutenyltetrahydrophthalic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, trimellitic anhydride, pyromellitic anhydride, benzophenonetetracarboxylic anhydride and the like; amine complexes of boron trifluoride; dicyandiamide or derivatives thereof; and so forth. Epoxy adducts or microencapsulated products of the above compounds can also be used.
- a component reactive with the epoxy resin or the curing agent is possible to further use.
- a component reactive with the epoxy resin or the curing agent examples include epoxy reactive diluents (e.g. monofunctional: phenyl glycidyl ether, bifunctional: resorcin diglycidyl ether and ethylene glycol glycidyl ether, trifunctional: glycerol triglycidyl ether), resole type or novolac type phenolic resins, and isocyanate compounds.
- inorganic fillers such as fused silica, crystalline silica, calcium carbonate, aluminum hydroxide, alumina, clay, barium sulfate, mica, talc, white carbon, E glass fine powder and the like.
- the proportion of the filler used is ordinarily 40% by weight or smaller based on the resin content. When the proportion is larger than 40% by weight, the viscosity of the interlaminar insulating resin is high and the flowability of the resin into the inner-layer circuit is low.
- silane coupling agent e.g. epoxy silane
- titanate type coupling agent for higher adhesion to copper foil or inner-layer circuit substrate or for higher moisture resistance
- an antifoaming agent for prevention of void generation
- a flame retardant of liquid or fine powder type e.g. flame retardant of liquid or fine powder type
- the solvent used in the present adhesive it is necessary to select a solvent which does not remain in the adhesive after the adhesive has been coated on a copper foil and dried at 80 to 130°C.
- a solvent which does not remain in the adhesive after the adhesive has been coated on a copper foil and dried at 80 to 130°C.
- MEK methyl ethyl ketone
- DMF dimethylformamide
- the copper foil as defined in claim 10, coated with an interlaminar insulating adhesive according to the present invention is produced by coating an adhesive varnish which is obtained by dissolving individual adhesive components in a particular solvent at given concentrations, on the anchorage side of a copper foil, followed by drying at 80 to 130°C so that the concentration of volatile component in the adhesive becomes 4.0% or less, preferably 3.0 to 1.5%.
- the thickness of the adhesive is preferably 100 ⁇ m or less. When the thickness exceeds 100 ⁇ m, variation in thickness appears and no uniform insulating layer is secured.
- the adhesive layer When in the copper foil coated with an interlaminar insulating adhesive, the adhesive layer is formed in two layers of different flowability and the adhesive layer adjacent to the copper foil has lower flowability than the outer adhesive layer, excellent moldability is obtained and there can be produced a multilayer printed circuit board which has no void and which is low in variation in thickness of the interlaminar insulating layer.
- the copper foil coated with an interlaminar insulating adhesive is laminated on an inner-layer circuit substrate by using an ordinary vacuum press or laminator, followed by curing, whereby a multilayer printed circuit board having an outer-layer circuit can be produced easily.
- part refers to “part by weight”.
- the adhesive varnish was coated on the anchorage surface of a copper foil of 18 ⁇ m in thickness by using a comma coater, followed by drying at 170°C for 5 minutes, to obtain a copper foil coated with an insulating adhesive in a thickness of 40 ⁇ m.
- On the adhesive layer was coated the same adhesive varnish by using a comma coater, followed by drying at 150°C for 5 minutes, to newly form an insulating adhesive layer of 40 ⁇ m in thickness.
- the surface of each copper foil of the inner-layer circuit sheet was subjected to a blackening treatment.
- thermoplastic resin modified with hydroxyl group was converted to a non-modified amorphous polysulfone (weight-average molecular weight: 26,000), whereby multilayer printed circuit boards were produced.
- TMA thermo mechanical analyzer
- the presence or absence of voids between circuits and in clearance holes was examined visually.
- Variation in thickness of insulating layer on inner-layer circuit was observed by sectional observation.
- the sites of observation were (1) line (circuit) of fine circuit and (2) line (copper foil) between slits, of inner-layer circuit sheet.
- the thickness of insulating layer was measured at the above observation sites for 5 samples, the average of 5 measurements was calculated for each site, and the difference between the two averages was taken as variation in insulating layer thickness.
- V-0 and V-1 are the levels of combustibility specified by UL-94 specification.
- the V-0 and V-1 shown in Table 1 indicate that these levels are met by individual samples.
- V-0 refers to lower combustibility, i.e. higher flame retardancy than V-1.
- the interlaminar insulating adhesive for multilayer printed circuit board according to the present invention has flame retardancy without containing any halogen or phosphorus, has excellent heat resistance without containing glass cloth, is low in variation in insulating layer thickness between circuit layers, and is suitable for formation of fine pattern; therefore, a multilayer printed circuit board can be easily produced using the above adhesive.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6425199 | 1999-03-11 | ||
JP6425199 | 1999-03-11 |
Publications (3)
Publication Number | Publication Date |
---|---|
EP1035760A2 EP1035760A2 (en) | 2000-09-13 |
EP1035760A3 EP1035760A3 (en) | 2001-12-12 |
EP1035760B1 true EP1035760B1 (en) | 2004-12-22 |
Family
ID=13252773
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP00104843A Expired - Lifetime EP1035760B1 (en) | 1999-03-11 | 2000-03-07 | Interlaminar insulating adhesive for multilayer printed circuit board |
Country Status (7)
Country | Link |
---|---|
US (1) | US6447915B1 (ko) |
EP (1) | EP1035760B1 (ko) |
KR (1) | KR100632169B1 (ko) |
CN (1) | CN1170908C (ko) |
DE (1) | DE60016823T2 (ko) |
ES (1) | ES2233232T3 (ko) |
TW (1) | TW491016B (ko) |
Families Citing this family (22)
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JP4423779B2 (ja) * | 1999-10-13 | 2010-03-03 | 味の素株式会社 | エポキシ樹脂組成物並びに該組成物を用いた接着フィルム及びプリプレグ、及びこれらを用いた多層プリント配線板及びその製造法 |
JP3485513B2 (ja) * | 2000-01-19 | 2004-01-13 | 沖電気工業株式会社 | 半導体装置の製造方法 |
KR100315158B1 (ko) * | 2000-08-02 | 2001-11-26 | 윤덕용 | 비솔더 플립 칩 본딩용 고신뢰성 비전도성 접착제 및 이를이용한 플립 칩 본딩 방법 |
US7370982B2 (en) * | 2002-10-02 | 2008-05-13 | Gentex Corporation | Environmentally improved rearview mirror assemblies |
US6899437B2 (en) * | 2002-10-02 | 2005-05-31 | Gentax Corporation | Environmentally improved rearview mirror assembly |
JP3949676B2 (ja) * | 2003-07-22 | 2007-07-25 | 三井金属鉱業株式会社 | 極薄接着剤層付銅箔及びその極薄接着剤層付銅箔の製造方法 |
TW200533692A (en) * | 2003-11-06 | 2005-10-16 | Showa Denko Kk | Curable polyester having an oxetanyl group at end and process for preparing the same, resist composition, jet printing ink composition, curing methods and uses thereof |
JP5085125B2 (ja) * | 2004-03-29 | 2012-11-28 | 住友ベークライト株式会社 | 樹脂組成物、樹脂付き金属箔、基材付き絶縁シートおよび多層プリント配線板 |
JP4829766B2 (ja) * | 2006-12-13 | 2011-12-07 | 横浜ゴム株式会社 | 繊維強化複合材料用エポキシ樹脂組成物 |
CN101928538B (zh) * | 2010-08-30 | 2012-12-26 | 黑龙江省科学院石油化学研究院 | 含聚砜低聚物热固化环氧树脂胶粘剂及其制备方法 |
US9068040B2 (en) * | 2010-10-12 | 2015-06-30 | Hexcel Corporation | Solvent resistant thermoplastic toughened epoxy |
CN102898779B (zh) * | 2011-06-01 | 2015-05-27 | 深圳光启高等理工研究院 | 复合材料和基于复合材料制备基材的方法 |
CN102796346A (zh) * | 2011-06-01 | 2012-11-28 | 深圳光启高等理工研究院 | 改性环氧树脂和基于改性环氧树脂制备基材的方法 |
CN105949716B (zh) * | 2011-11-29 | 2019-01-04 | 三菱化学株式会社 | 环氧树脂组合物、预浸料以及纤维强化复合材料 |
DE112012006529T5 (de) * | 2012-06-15 | 2015-03-12 | Mitsubishi Electric Corporation | Flüssige, wärmeaushärtende Harzzusammensetzung zum Isolieren einer Statorspule einer drehenden elektrischen Maschine, drehende elektrische Maschine, die diese verwendet, und Herstellungsverfahren dafür |
CN103724944A (zh) * | 2013-12-31 | 2014-04-16 | 广东生益科技股份有限公司 | 一种无卤环氧树脂组合物及其用途 |
US9867284B2 (en) * | 2014-08-05 | 2018-01-09 | At & S Austria Technologie & Systemtechnii | Warpage control with intermediate material |
US10886506B2 (en) * | 2015-03-30 | 2021-01-05 | Dai Nippon Printing Co., Ltd. | Cell packaging material, method for manufacturing same, and cell |
JP6174287B1 (ja) * | 2015-11-24 | 2017-08-02 | 日東シンコー株式会社 | 樹脂組成物および電気絶縁シート |
CN108676533B (zh) * | 2018-05-03 | 2021-05-11 | 广东生益科技股份有限公司 | 树脂组合物及其制作的涂树脂铜箔 |
CN113897163B (zh) * | 2021-12-09 | 2022-03-11 | 武汉市三选科技有限公司 | 一种粘接剂、芯片键合膜及其制备方法 |
CN115109387B (zh) * | 2022-07-11 | 2023-09-22 | 陕西生益科技有限公司 | 一种树脂组合物及其应用 |
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US4661559A (en) * | 1983-05-20 | 1987-04-28 | Union Carbide Corporation | Impact resistant matrix resins for advanced composites |
JPS60243113A (ja) | 1984-05-17 | 1985-12-03 | Sumitomo Chem Co Ltd | 強靭性に優れたエポキシ樹脂組成物 |
KR920014611A (ko) | 1991-01-22 | 1992-08-25 | 베르너 발데크 | 가요성 적층물 및 그의 제조방법 |
EP0498766A3 (en) | 1991-02-04 | 1992-11-04 | Ciba-Geigy Ag | Modified polyarylenethers |
GB2259812B (en) | 1991-09-06 | 1996-04-24 | Toa Gosei Chem Ind | Method for making multilayer printed circuit board having blind holes and resin-coated copper foil used for the method |
DE4217509A1 (de) | 1992-05-27 | 1993-12-02 | Basf Ag | Epoxidharzmischungen |
DE69323129T2 (de) | 1992-08-11 | 1999-08-19 | Hexcel Corp | Mit Sulfonpolymeren zäher gemachte hitzehärtbare Harze |
TW305860B (ko) * | 1994-03-15 | 1997-05-21 | Toray Industries | |
JP3669663B2 (ja) | 1997-07-18 | 2005-07-13 | 住友ベークライト株式会社 | 多層プリント配線板用層間絶縁接着剤 |
JP4423779B2 (ja) * | 1999-10-13 | 2010-03-03 | 味の素株式会社 | エポキシ樹脂組成物並びに該組成物を用いた接着フィルム及びプリプレグ、及びこれらを用いた多層プリント配線板及びその製造法 |
-
2000
- 2000-03-03 US US09/518,250 patent/US6447915B1/en not_active Expired - Fee Related
- 2000-03-06 TW TW089103980A patent/TW491016B/zh not_active IP Right Cessation
- 2000-03-07 DE DE60016823T patent/DE60016823T2/de not_active Expired - Fee Related
- 2000-03-07 EP EP00104843A patent/EP1035760B1/en not_active Expired - Lifetime
- 2000-03-07 ES ES00104843T patent/ES2233232T3/es not_active Expired - Lifetime
- 2000-03-10 KR KR1020000012034A patent/KR100632169B1/ko not_active IP Right Cessation
- 2000-03-10 CN CNB001068830A patent/CN1170908C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1170908C (zh) | 2004-10-13 |
KR100632169B1 (ko) | 2006-10-11 |
DE60016823D1 (de) | 2005-01-27 |
DE60016823T2 (de) | 2005-12-08 |
EP1035760A3 (en) | 2001-12-12 |
KR20000062822A (ko) | 2000-10-25 |
TW491016B (en) | 2002-06-11 |
CN1267696A (zh) | 2000-09-27 |
EP1035760A2 (en) | 2000-09-13 |
US6447915B1 (en) | 2002-09-10 |
ES2233232T3 (es) | 2005-06-16 |
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