EP0943701B1 - Procédé d'obtention d'une patine, et solution reactive de mise en oeuvre du procédé - Google Patents
Procédé d'obtention d'une patine, et solution reactive de mise en oeuvre du procédé Download PDFInfo
- Publication number
- EP0943701B1 EP0943701B1 EP99102955A EP99102955A EP0943701B1 EP 0943701 B1 EP0943701 B1 EP 0943701B1 EP 99102955 A EP99102955 A EP 99102955A EP 99102955 A EP99102955 A EP 99102955A EP 0943701 B1 EP0943701 B1 EP 0943701B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- copper
- patina
- salts
- carbonate
- reaction solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 241001311547 Patina Species 0.000 title claims abstract description 56
- 238000000034 method Methods 0.000 title claims abstract description 11
- 230000008569 process Effects 0.000 title abstract description 5
- 239000000243 solution Substances 0.000 claims abstract description 45
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 37
- 239000010949 copper Substances 0.000 claims abstract description 37
- 229910052802 copper Inorganic materials 0.000 claims abstract description 37
- 150000001879 copper Chemical class 0.000 claims abstract description 12
- 239000007864 aqueous solution Substances 0.000 claims abstract description 10
- 150000003839 salts Chemical class 0.000 claims abstract description 8
- 150000007522 mineralic acids Chemical class 0.000 claims abstract description 7
- 239000002562 thickening agent Substances 0.000 claims abstract description 6
- 239000000080 wetting agent Substances 0.000 claims abstract description 6
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 5
- 238000006243 chemical reaction Methods 0.000 claims description 39
- 235000002639 sodium chloride Nutrition 0.000 claims description 11
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims description 8
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 8
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 7
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 claims description 6
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 claims description 6
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 6
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 claims description 6
- 235000019270 ammonium chloride Nutrition 0.000 claims description 4
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 claims description 4
- GEZOTWYUIKXWOA-UHFFFAOYSA-L copper;carbonate Chemical compound [Cu+2].[O-]C([O-])=O GEZOTWYUIKXWOA-UHFFFAOYSA-L 0.000 claims description 4
- OTYBMLCTZGSZBG-UHFFFAOYSA-L potassium sulfate Chemical compound [K+].[K+].[O-]S([O-])(=O)=O OTYBMLCTZGSZBG-UHFFFAOYSA-L 0.000 claims description 4
- 229910052939 potassium sulfate Inorganic materials 0.000 claims description 4
- 235000011151 potassium sulphates Nutrition 0.000 claims description 4
- WBHQBSYUUJJSRZ-UHFFFAOYSA-M sodium bisulfate Chemical compound [Na+].OS([O-])(=O)=O WBHQBSYUUJJSRZ-UHFFFAOYSA-M 0.000 claims description 4
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 4
- 235000017550 sodium carbonate Nutrition 0.000 claims description 4
- 239000011780 sodium chloride Substances 0.000 claims description 4
- ATRRKUHOCOJYRX-UHFFFAOYSA-N Ammonium bicarbonate Chemical compound [NH4+].OC([O-])=O ATRRKUHOCOJYRX-UHFFFAOYSA-N 0.000 claims description 3
- 229910021591 Copper(I) chloride Inorganic materials 0.000 claims description 3
- 239000001099 ammonium carbonate Substances 0.000 claims description 3
- 235000012501 ammonium carbonate Nutrition 0.000 claims description 3
- JMRJRCGXPDVLIZ-UHFFFAOYSA-L copper(1+);carbonate Chemical compound [Cu+].[Cu+].[O-]C([O-])=O JMRJRCGXPDVLIZ-UHFFFAOYSA-L 0.000 claims description 3
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 claims description 3
- 229910000009 copper(II) carbonate Inorganic materials 0.000 claims description 3
- 235000019854 cupric carbonate Nutrition 0.000 claims description 3
- 239000011646 cupric carbonate Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 239000011736 potassium bicarbonate Substances 0.000 claims description 3
- 235000015497 potassium bicarbonate Nutrition 0.000 claims description 3
- 229910000028 potassium bicarbonate Inorganic materials 0.000 claims description 3
- CHKVPAROMQMJNQ-UHFFFAOYSA-M potassium bisulfate Chemical compound [K+].OS([O-])(=O)=O CHKVPAROMQMJNQ-UHFFFAOYSA-M 0.000 claims description 3
- 229910000027 potassium carbonate Inorganic materials 0.000 claims description 3
- 235000011181 potassium carbonates Nutrition 0.000 claims description 3
- 239000001103 potassium chloride Substances 0.000 claims description 3
- 235000011164 potassium chloride Nutrition 0.000 claims description 3
- TYJJADVDDVDEDZ-UHFFFAOYSA-M potassium hydrogencarbonate Chemical compound [K+].OC([O-])=O TYJJADVDDVDEDZ-UHFFFAOYSA-M 0.000 claims description 3
- 239000001120 potassium sulphate Substances 0.000 claims description 3
- 229910052938 sodium sulfate Inorganic materials 0.000 claims description 3
- 235000011152 sodium sulphate Nutrition 0.000 claims description 3
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 claims 2
- 239000002966 varnish Substances 0.000 claims 2
- 239000004128 Copper(II) sulphate Substances 0.000 claims 1
- 229940086066 potassium hydrogencarbonate Drugs 0.000 claims 1
- 235000017557 sodium bicarbonate Nutrition 0.000 claims 1
- 229910000030 sodium bicarbonate Inorganic materials 0.000 claims 1
- 238000001035 drying Methods 0.000 abstract description 8
- 238000004140 cleaning Methods 0.000 abstract description 3
- -1 inorganic acid salts Chemical class 0.000 abstract 2
- 239000010410 layer Substances 0.000 description 14
- 239000003973 paint Substances 0.000 description 8
- 239000004922 lacquer Substances 0.000 description 7
- 239000011241 protective layer Substances 0.000 description 7
- 150000001880 copper compounds Chemical group 0.000 description 5
- 239000005749 Copper compound Substances 0.000 description 4
- 239000007921 spray Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 229910000365 copper sulfate Inorganic materials 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical class [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- UIIMBOGNXHQVGW-DEQYMQKBSA-M Sodium bicarbonate-14C Chemical compound [Na+].O[14C]([O-])=O UIIMBOGNXHQVGW-DEQYMQKBSA-M 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- 229910000366 copper(II) sulfate Inorganic materials 0.000 description 2
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 description 2
- 239000000383 hazardous chemical Substances 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 239000004848 polyfunctional curative Substances 0.000 description 2
- 238000001556 precipitation Methods 0.000 description 2
- 229910000342 sodium bisulfate Inorganic materials 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- HJTAZXHBEBIQQX-UHFFFAOYSA-N 1,5-bis(chloromethyl)naphthalene Chemical compound C1=CC=C2C(CCl)=CC=CC2=C1CCl HJTAZXHBEBIQQX-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 229910021592 Copper(II) chloride Inorganic materials 0.000 description 1
- 206010013710 Drug interaction Diseases 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- GOLCXWYRSKYTSP-UHFFFAOYSA-N arsenic trioxide Inorganic materials O1[As]2O[As]1O2 GOLCXWYRSKYTSP-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229940116318 copper carbonate Drugs 0.000 description 1
- LBJNMUFDOHXDFG-UHFFFAOYSA-N copper;hydrate Chemical compound O.[Cu].[Cu] LBJNMUFDOHXDFG-UHFFFAOYSA-N 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910000343 potassium bisulfate Inorganic materials 0.000 description 1
- VKJKEPKFPUWCAS-UHFFFAOYSA-M potassium chlorate Chemical compound [K+].[O-]Cl(=O)=O VKJKEPKFPUWCAS-UHFFFAOYSA-M 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- AKHNMLFCWUSKQB-UHFFFAOYSA-L sodium thiosulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=S AKHNMLFCWUSKQB-UHFFFAOYSA-L 0.000 description 1
- 235000019345 sodium thiosulphate Nutrition 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/04—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in markedly acid liquids
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/60—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using alkaline aqueous solutions with pH greater than 8
- C23C22/63—Treatment of copper or alloys based thereon
Definitions
- the invention relates to a method and a reaction solution for producing a patina on surfaces of objects made of copper or a copper alloy.
- patina In the air, a thin green protective layer of basic copper compounds forms on copper surfaces. This is called patina.
- the formation of natural patina sometimes takes several decades, depending on the environment. Artificial patination, for example by application of soluble copper salts or ammonium salts, serves to imitate this natural patina, which often forms over long periods of time.
- basic copper compounds are applied as color pigments with organic or inorganic film formers to a copper surface.
- the US-A-3,497,401 discloses a method and reaction solution for producing a patina on the surface of a copper article.
- the reaction solution consists of an aqueous solution containing potassium chlorate and copper sulfate.
- a reaction solution is used to produce a patina on copper objects, which in aqueous solution contains hydrochloric acid, copper carbonate, ammonium chloride, copper acetate, arsenic trioxide and copper nitrate.
- reaction solutions do not always provide the desired results in terms of layer quality and coloration. Also, their handling and storage is sometimes expensive. They are therefore only of limited suitability for industrial use for factory production of a patina or when used on the construction site. Also, when using some of these reaction solutions on preoxidized or partially patinated copper surfaces, for example for repair of damaged patina, there is a risk of uneven layer formation and staining.
- the WO 97/35046 describes a process in which an artificial patina is to be produced with the aid of a reaction solution of copper sulfate, sodium thiosulfate and lead (II) acetate.
- This reaction solution has by their lead component the great disadvantage that it is classified in terms of their health and environmental hazards as critical and it does not meet the requirement of the invention for environmentally friendly use.
- the invention is therefore based on the object to provide a method for producing a mechanically stable patina on preferably pre-weathered copper surfaces, wherein the patina produced has a reduced copper solubility and as in a natural patina, an interaction with the atmosphere is possible. Furthermore, the invention aims at an improved reaction solution for producing a patina on copper surfaces, which is also easy to handle and storage.
- a reaction solution consisting of an aqueous solution of copper salts in the form of copper (I) carbonate, copper (II) carbonate, copper (I) chloride, copper (II) sulfate, copper nitrate or mixtures thereof is applied to the surface of a copper article after its purification in a concentration between 0.5% and 50% and salts of inorganic acids in the form of sodium carbonate, potassium carbonate, ammonium carbonate, sodium bicarbonate, potassium bicarbonate, sodium chloride, potassium chloride, ammonium chloride, sodium sulphate, sodium bisulphate, potassium sulphate, potassium bisulphate or mixtures thereof in a concentration between 0, 5% and 50% applied.
- the thus treated copper object is then exposed to weathering the drying exposed.
- the patina produced according to the method is mechanically stable and has only a low copper solubility. The time for producing the patina is comparatively low.
- the generated patina is provided after drying with a transparent protective layer of paint.
- this is a two-component water-based paint is used, which contains rubber.
- the paint is colorless.
- the paint Before application, the paint is applied with hardener.
- the ratio of hardener to paint is usually 1: 4.
- the starting time is a maximum of 20 minutes.
- the finished mixed paint is then preferably applied to the patina with a sprayer.
- the paint After the drying phase, the paint is cured and can be weathered. Depending on the prevailing ambient conditions (temperature, humidity, etc.), the dry phase can take 15 to 24 hours.
- a copper article according to the invention is characterized according to claim 2 by its transparent lacquer layer on the patinated surface.
- An inventive copper article or its patina surface is improved in resistance to external environmental influences and damage.
- the patinated copper objects can be machined without the patina flaking off.
- reaction solution consists of an aqueous solution of copper salts and salts of inorganic acids and contains a wetting agent and / or a thickener in a proportion of up to 5%.
- the reaction solution according to the invention uses the combination of two different principles for patina formation.
- the reaction solution contains reactive components in the form of salts of inorganic acids, which react with the copper oxides of the patinated surfaces to form basic copper compounds.
- the speed of this reaction step depends on the weathering conditions.
- the solution already contains the forming in these reactions copper compounds in the form of copper salts as a kind of color pigments. For this reason, a very good color impression is already achieved immediately after the application. The imitation of the otherwise often only in long periods forming natural patina happens in a short time.
- the subsequent chemical reaction intensifies the color impression and solidifies the entire patina layer.
- the best success with the reaction solution according to the invention arises when used on a preoxidized or already partially patinated copper surface. For this reason, the copper articles should receive a corresponding surface pretreatment.
- the copper surface may be pre-oxidized or pre-patinated at the factory.
- the copper surface may also have a natural patina caused by natural weathering.
- An untreated copper surface should be exposed to natural weathering for about two months or more.
- the treatment can be carried out with the reaction solution according to the invention.
- a patina layer By applying the reaction solution on a pre-oxidized or already partially patinated copper surface, a patina layer can be produced directly on site or else at the factory. Also, copper surfaces that are not completely patinated green or damaged patina layers obtained when applying the reaction solution according to the invention a uniform patina layer. Depending on the composition of the reaction solution, the color of the patina to be produced can be varied and otherwise adapted to the respective environment.
- the processing and handling of the reaction solution according to the invention is simple.
- the order on the copper surfaces can be done for example by means of a brush, roller or a spray device.
- a storage of the reaction solution is possible over a longer period of several months at room temperature, without aging damage.
- copper (I) carbonate, copper (II) carbonate, copper (I) chloride, copper (II) chloride, copper (II) sulfate, copper acetate, copper nitrate or mixtures thereof are well suited.
- the advantageous concentration range is between 5 and 500 g / l.
- the reactive component used is preferably sodium carbonate, potassium carbonate, ammonium carbonate, sodium bicarbonate, potassium bicarbonate, sodium chloride, potassium chloride, ammonium chloride, sodium sulfate, sodium hydrogensulfate, potassium sulfate, sodium hydrogensulfate, potassium sulfate, potassium hydrogensulfate or mixtures thereof.
- concentration range of these salts of inorganic acids is preferably between 5 and 500 g / l.
- the reaction solution according to the invention can be changed in its consistency by the addition of wetting agents or thickeners and be tailored to the particular conditions of use.
- wetting agents for example surfactants, and / or come Thickeners of known type for use. They are added to the reaction solution to a level of 5%.
- the reaction solution according to the invention produces a high quality patina from basic copper compounds and is particularly well suited for preoxidized or already partially patinated copper surfaces.
- the treatment can be done on site or at the factory.
- the reaction solution is also good for that
- the reaction solution can be prepared and processed at room temperature. It has been found to be expedient that a patinated surface after treatment with the reaction solution should be protected from rain for at least 48 hours.
- the patina layer produced in this way can then be coated with a transparent protective layer to avoid damage and to reduce the copper solubility.
- a transparent protective layer to avoid damage and to reduce the copper solubility.
- water-vapor-permeable paints are used, which produce an open-pored protective layer and thus allow the natural interaction of the patina surface with the atmosphere.
- An aqueous solution containing 200 g / l of copper sulfate is first mixed with 200 g / l of sodium carbonate and stirred for one hour at room temperature. Thereafter, 200 g / l of sodium chloride are added and stirred for another hour at room temperature. Subsequently, the solution can be applied directly to the surface to be patinated.
- a wetting agent for example a surfactant, in a concentration of 50 g / l is added.
- the solution is thickened with a commercially available thickener in a concentration of 50 g / l.
- the reaction solution thus prepared can be stored without restriction at room temperature.
- the copper surface to be patinated has a dark brown copper oxide layer, which in places is already covered with copper salts (patina).
- the surface is freed from grease and loosely attached dirt before patinating.
- the removal of loosely adhered dirt particles can be done using water and manual or mechanical means.
- the surfaces which should not be patinated are masked off. Thereafter, the already prepared ready reaction solution is shaken or stirred and applied.
- a sprayer has proven particularly suitable for this purpose. Depending on the performance of the sprayer used nozzles between 0.2 mm and 0.6 mm diameter are used. For uniform coating of the surface, spray angles of 60 ° to 90 ° considered advantageous. Care should be taken during treatment to avoid dripping on the surface.
- the drying process should be as slow and even as possible. This improves the quality of the patina.
- the protective layer of lacquer can then be applied.
- a sprayer preferably with nozzles between 0.2 mm and 0.3 mm in diameter, and a spray angle of 90 ° is recommended.
- a single application of the protective layer is sufficient.
- the protective layer which can be between 20 minutes and 24 hours depending on weather conditions, the copper object should be protected from precipitation.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Chemical Treatment Of Metals (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Sampling And Sample Adjustment (AREA)
Claims (3)
- Procédé d'obtention d'une patine à la surface d'un objet en cuivre ou en alliage de cuivre, selon lequel on nettoie d'abord la surface puis on applique sur la surface, une solution de réaction constituée d'une solution aqueuse de sels de cuivre sous forme de carbonate de cuivre (I), de carbonate de cuivre (II), de chlorure de cuivre (I), de sulfate de cuivre (II), de nitrate de cuivre ou des mélanges de ces substances dans une concentration comprise entre 0,5 et 50 %, et de sels d'acides inorganiques sous forme de carbonate de sodium, de carbonate de potassium, de carbonate d'ammonium, d'hydrogénocarbonate de sodium, d'hydrogénocarbonate de potassium, de chlorure de sodium, de chlorure de potassium, de chlorure d'ammonium, de sulfate de sodium, d'hydrogénosulfate de sodium, de sulfate de potassium, d'hydrogénosulfate de potassium ou de mélanges de ces substances à une concentration comprise entre 0,5 et 50 %, et ensuite à l'abri des intempéries, on la soumet à un séchage et on applique une couche de vernis transparent sur la patine.
- Objet en cuivre ou en alliage de cuivre qui présente au moins sur une surface, une couche de patine obtenue avec le procédé de la revendication 1,
caractérisé en ce que
la couche de patine est pourvue d'une couche de vernis transparent. - Solution de réaction d'une patine sur des surfaces d'objets en cuivre ou en alliage de cuivre constituée d'une solution aqueuse de sels de cuivre et de sels d'acides inorganiques selon la revendication 1, à laquelle on ajoute un réticulant jusqu'à une proportion de 5 % et/ou un épaississant jusqu'à une proportion de 5 %.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19809904A DE19809904A1 (de) | 1998-03-07 | 1998-03-07 | Verfahren und Reaktionslösung zur Erzeugung einer Patina |
DE19809904 | 1998-03-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0943701A1 EP0943701A1 (fr) | 1999-09-22 |
EP0943701B1 true EP0943701B1 (fr) | 2007-07-04 |
Family
ID=7860120
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP99102955A Expired - Lifetime EP0943701B1 (fr) | 1998-03-07 | 1999-02-13 | Procédé d'obtention d'une patine, et solution reactive de mise en oeuvre du procédé |
Country Status (9)
Country | Link |
---|---|
US (1) | US6176905B1 (fr) |
EP (1) | EP0943701B1 (fr) |
KR (1) | KR19990077468A (fr) |
AT (1) | ATE366329T1 (fr) |
DE (2) | DE19809904A1 (fr) |
DK (1) | DK0943701T3 (fr) |
ES (1) | ES2286866T3 (fr) |
PT (1) | PT943701E (fr) |
SG (1) | SG75920A1 (fr) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FI20020669A (fi) * | 2002-04-09 | 2003-10-10 | Outokumpu Oy | Menetelmä keinotekoisen patinan valmistamiseksi ja patinapasta |
KR100467939B1 (ko) * | 2002-05-13 | 2005-01-24 | 김부현 | 건축자재 산화 동판 제조용 산화제 조성물 |
KR20020089223A (ko) * | 2002-08-29 | 2002-11-29 | 서상환 | 녹청동판 제조방법 |
US7060325B2 (en) * | 2003-07-17 | 2006-06-13 | Percy Greenberg | Simulated patina for copper |
US7018677B2 (en) * | 2003-07-17 | 2006-03-28 | Crown-Pn L.L.C. | Simulated patina for copper |
DE10354527B4 (de) * | 2003-11-17 | 2008-08-28 | Kme Germany Ag | Verfahren zur Patinierung von Kupfer |
DE102004036082A1 (de) * | 2004-07-24 | 2006-02-09 | Km Europa Metal Ag | Verfahren zur Erzeugung einer anorganischen Deckschicht auf der Oberfläche eines Produkts und tafel- oder bandförmiges Produkt |
US20090045169A1 (en) * | 2004-08-31 | 2009-02-19 | Timothy Ray Poe | Mirror etching composition |
FI120048B (fi) * | 2004-09-29 | 2009-06-15 | Luvata Espoo Oy | Menetelmä monikerrospatinan valmistamiseksi ja monikerrospatina |
DE102005059421B4 (de) * | 2005-12-07 | 2007-12-20 | Susan Krieger | Verfahren zur Herstellung von Patina auf textile Oberflächen von aus künstlichen oder natürlichen Fasern bestehenden Geweben |
DE102006053192A1 (de) * | 2006-11-09 | 2008-05-15 | Kme Germany Ag | Verfahren zum Schutz von patinierten Oberflächen von Kupferprodukten sowie patiniertes Kupferprodukt |
KR100890607B1 (ko) * | 2007-07-02 | 2009-03-27 | 김부현 | 산화 녹청 동판의 제조방법 |
DE102009012461A1 (de) | 2009-03-12 | 2010-09-16 | Kme Germany Ag & Co. Kg | Schadstoffabbauendes Metallband für das Bauwesen |
US10119038B2 (en) | 2015-05-08 | 2018-11-06 | PatinaNow, LLC | Patina solution, method for producing patina on object, and patina kit |
CN114323842B (zh) * | 2021-12-14 | 2022-08-26 | 北京科技大学 | 一种带锈金属文物模拟样品及其制作方法 |
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US3497401A (en) * | 1967-09-20 | 1970-02-24 | Intern Copper Research Ass Inc | Patination of copper |
US4325177A (en) * | 1979-01-19 | 1982-04-20 | Depoorter Lieven L | Modular art wall systems |
JPS6041710B2 (ja) * | 1979-02-15 | 1985-09-18 | 松下電工株式会社 | 人工緑青液 |
JPS62192586A (ja) * | 1986-02-18 | 1987-08-24 | Yamaki Kogyo Kk | 人工緑青発生液 |
DE4034249A1 (de) * | 1990-10-27 | 1992-04-30 | Kabelmetal Ag | Verfahren zur herstellung von braunen deckschichten auf kupfer |
DE4041854A1 (de) * | 1990-12-24 | 1992-06-25 | Kabelmetal Ag | Verfahren zur herstellung einer gruenen patina auf aus kupfer bestehendem halbzeug |
US5160381A (en) * | 1991-06-26 | 1992-11-03 | Fumigation Maritime Ltee | Method for forming artificially and rapidly patina on copper, products thereof and solutions therefor |
DE4202779A1 (de) * | 1991-12-21 | 1993-06-24 | Guenther Wottrich | Verfahren und mittel zur veredelung des optischen erscheinungsbildes einer oberflaeche |
JPH0835072A (ja) * | 1994-07-25 | 1996-02-06 | Shigeyoshi Tashiro | 緑青発生用液組成物及び緑青銅板の製作法 |
JP2920610B2 (ja) * | 1995-08-31 | 1999-07-19 | 元旦ビューティ工業株式会社 | 緑青皮膜の形成方法及び形成装置 |
DE19548261A1 (de) * | 1995-12-22 | 1997-06-26 | Km Europa Metal Ag | Verfahren zur Herstellung einer Bronchantitpatina auf Kupferhalbzeug |
LU88726A1 (fr) * | 1996-03-15 | 1997-03-15 | Brumagne Jean Claude | Procédé de traitement de surface métallique d'un matériau composé ou revêtu du cuivre et/ou de zinc |
-
1998
- 1998-03-07 DE DE19809904A patent/DE19809904A1/de not_active Withdrawn
-
1999
- 1999-02-13 ES ES99102955T patent/ES2286866T3/es not_active Expired - Lifetime
- 1999-02-13 DE DE59914396T patent/DE59914396D1/de not_active Expired - Lifetime
- 1999-02-13 AT AT99102955T patent/ATE366329T1/de active
- 1999-02-13 EP EP99102955A patent/EP0943701B1/fr not_active Expired - Lifetime
- 1999-02-13 DK DK99102955T patent/DK0943701T3/da active
- 1999-02-13 PT PT99102955T patent/PT943701E/pt unknown
- 1999-02-25 KR KR1019990006228A patent/KR19990077468A/ko not_active Application Discontinuation
- 1999-02-27 SG SG1999001034A patent/SG75920A1/en unknown
- 1999-03-05 US US09/263,315 patent/US6176905B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
ATE366329T1 (de) | 2007-07-15 |
DK0943701T3 (da) | 2007-11-05 |
KR19990077468A (ko) | 1999-10-25 |
DE59914396D1 (de) | 2007-08-16 |
EP0943701A1 (fr) | 1999-09-22 |
DE19809904A1 (de) | 1999-09-09 |
ES2286866T3 (es) | 2007-12-01 |
PT943701E (pt) | 2007-08-01 |
SG75920A1 (en) | 2000-10-24 |
US6176905B1 (en) | 2001-01-23 |
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