EP0868545B1 - Verfahren und schaltungsanordnung zur erzeugung von strompulsen zur elektrolytischen metallabscheidung - Google Patents

Verfahren und schaltungsanordnung zur erzeugung von strompulsen zur elektrolytischen metallabscheidung Download PDF

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Publication number
EP0868545B1
EP0868545B1 EP96934478A EP96934478A EP0868545B1 EP 0868545 B1 EP0868545 B1 EP 0868545B1 EP 96934478 A EP96934478 A EP 96934478A EP 96934478 A EP96934478 A EP 96934478A EP 0868545 B1 EP0868545 B1 EP 0868545B1
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EP
European Patent Office
Prior art keywords
current
pulse
electroplating
bath
direct
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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EP96934478A
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German (de)
English (en)
French (fr)
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EP0868545A1 (de
Inventor
Egon Hübel
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Atotech Deutschland GmbH and Co KG
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Atotech Deutschland GmbH and Co KG
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/18—Electroplating using modulated, pulsed or reversing current
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated

Definitions

  • the invention relates to a method for generating short, cyclical repetitive current pulses with a large current and with a steep slope. It also relates to a circuit arrangement for electrolytic Metal deposition, especially to carry out this process. application finds the method in electrolytic metal deposition, preferably for vertical or horizontal electroplating of printed circuit boards. This The type of electroplating is referred to as pulse plating.
  • the electronic high-current switches cause large energy losses.
  • a voltage drop occurs at the internal non-linear resistor when the current flows. This applies equally to all types of semiconductor elements, but with a different voltage drop.
  • This voltage drop also called saturation voltage or forward voltage U F , increases with increasing current.
  • the forward voltage U F is about 1 volt for diodes and transistors and about 2 volts for thyristors.
  • a galvanizing system consists of several galvanizing cells. They will with large streams of baths. As an example, a horizontal system for Deposition of copper on printed circuit boards from acidic electrolytes considered become.
  • the use of pulse technology improves the amount of copper deposition in the fine holes in the circuit boards. As It has proven particularly effective if the polarity of the pulses is cyclical is changed. With cathodic polarity of the material to be treated z. B. worked with current pulses of 10 millisecond pulse duration. This pulse can followed by an anodic pulse lasting one millisecond.
  • Pulse-like cathodic metallization is preferably a current density chosen that is greater than or equal to the current density that with this electrolyte is used in direct current electroplating during the short anodic A pulse of metallization takes place with an essential higher current density than during the cathodic pulse phase.
  • Advantageous is about the factor 4 of the anodic to cathodic pulse phase.
  • the circuit boards are galvanized on both sides, ie on their front and rear sides with separate bath power supplies.
  • Five electrolytic baths of a horizontal electroplating system are considered as an example. For example, you have five bath power supply units on each side with a nominal current of 1,000 amperes, ie 10 bath power supply units with a total of 10,000 amperes.
  • the bath voltage for electroplating is 1 to 3 volts for acidic copper electrolytes and is dependent on the current density. Because of the high currents, the energy balance for the circuit proposal in DE 40 05 346 A1 is considered as an example (FIG. 7).
  • the semiconductor elements 6, 9, 5 in the circuit arrangement shown in FIG. 7 thus carry the full electroplating current for a period of 10 milliseconds.
  • the semiconductor elements 7 and 8 then carry four times the current according to the task for a period of 1 millisecond.
  • the average high-current switch power loss of an 11 millisecond cycle is 6,000 watts. With 10 bath power supplies, this results in a power loss of 60 kW (kilo watts). To determine the efficiency, this performance must be compared with the performance that is implemented directly on the electrolytic bath for galvanizing and demetallizing.
  • the bath voltages are assumed for acidic copper baths with 2 volts for electroplating and with 7 volts for demetallization.
  • the mean value of the total bath power for pulse electroplating is approximately 4.5 kW (2 volts x 1,000 amperes for 10 milliseconds and 7 volts x 4,000 amperes for 1 millisecond). With the losses of 6 kW calculated above, the efficiency of the high-current switch alone, based on the total bath output, is clearly below 50%.
  • Electromechanical switches have compared to the electronic ones Switches a significantly lower voltage drop when switched. However, switches or contactors are in for the required high pulse frequency 100 Hertz is completely unsuitable. From the described technical Known pulse electroplating is limited to special applications and preferably to low pulse currents in the galvanotechnical sense.
  • the present invention is therefore based on the problem of a method and to find a circuit arrangement with which it is possible to cyclically repeating unipolar or bipolar pulsed high currents To produce electroplating without the disadvantages mentioned, especially without being generated with considerable power loss.
  • the electronic circuit required for this should also be inexpensive will be realized.
  • the invention is that in a galvanizing DC circuit, short Called high current circuit, comprising a bath direct current source, electrical Conductor and an electrolytic cell with the plating material and anode on it inductive way by means of a suitable component, for example one Current transformer, a pulse-shaped current is coupled in such a polarized manner, that the bath direct current is compensated or overcompensated.
  • a suitable component for example one Current transformer
  • the component is connected in series with the electrolytic electroplating cell.
  • the current transformer secondary winding is used for this purpose low number of turns in the bath DC circuit connected in series so that it is flowed through by the bath direct current.
  • the current transformer has on the primary side a high number of turns, so that the pulses feeding them accordingly a low current with high Can have tension.
  • the induced pulsed low secondary voltage drives the high compensation current.
  • a capacitor serves for the pulse-shaped compensation current is connected in parallel to the bath DC power source.
  • a positively drawn bath current for the electrolytic Metallization applies, d. H. the material to be treated is negative compared to the anode poled. A negative bath current is said to be used for electrolytic demetallization be valid. In this case, the material to be treated is opposite the Anode with positive polarity.
  • FIG. 1a applies to electroplating with direct current.
  • the bath flow is briefly interrupted in FIG. 1b. However, it remains unipolar, that is, the direction of the current is not reversed.
  • the pulse times are preferably on the order of 0.1 milliseconds to seconds. The break times are correspondingly shorter.
  • Figure 1c shows a pulse unipolar current with different amplitudes.
  • Figure 1d shows one bipolar, that is, short-term polarity reversed polarized current with a long Electroplating time and with a short demetallization time.
  • the demetallization amplitude is a multiple of the metallization amplitude. All in all however flows at a plating time of e.g. B.
  • This pulse shape is for double-sided electroplating of printed circuit boards with fine holes preferred. There is a double pulse shape in FIG shown, which can be achieved with the inventive method. Unipolar pulses alternate with bipolar pulses.
  • the electroplating cell provides a good approximation for the electroplating current resistive load. Therefore, with a bath power supply according to FIG. 1b Bath current and bath voltage in phase.
  • the low parasitic inductances the electrical conductor back to the electrolytic cell and power source are negligible.
  • pulse currents contain alternating currents. With The proportion of high frequencies becomes increasingly steep of alternating currents larger. Steep pulse edges have a short pulse rise and waste time.
  • the line inductances represent inductive resistors for these alternating currents represent. They delay the pulse edges.
  • FIGS. 2a and 2b show the feeding of the pulse-shaped compensation current according to the invention by means of the current transformer 1.
  • the bath direct current source 2 is connected by electrical conductors 3 to the electrolytic bath, which is represented here as bath resistance R B with the reference number 4.
  • the secondary winding 6 of the current transformer 1 is connected in series with the electrolytic bath.
  • the primary side 7 of the transformer is fed by a power pulse electronics 8.
  • the power pulse electronics 8 is supplied with energy via the mains voltage connection 9.
  • the current and voltage profiles for the pulses according to FIG. 1d also correspond in principle to the pulse shapes of the other diagrams in FIG. 1. They differ only in the instantaneous size of the compensation current. Therefore, the voltages or currents belonging to FIG. 1d are drawn in and considered in the following figures.
  • FIG. 2a shows the operating state during the electroplating. Potentials are shown in parentheses as an example.
  • the capacitor C is charged to the voltage U C ⁇ U GR .
  • the voltage U TS at the current transformer 1 is 0 volts.
  • the rectifier voltage U GR is thus present at the bath resistor R B and causes the electroplating current I G.
  • This temporary state corresponds to electroplating with direct current. According to the invention, no switches are required in the high-current circuit 5.
  • Figure 2b shows the operating state during the demetallization.
  • the potentials can no longer be viewed statically. For this reason, the potentials for the temporal end of the demetallization pulse are entered in brackets in FIG. 2b.
  • the starting point is the potential of FIG. 2a.
  • the power pulse electronics 8 feeds the primary winding 7 of the current transformer 1 with a current that changes in amplitude over time.
  • the current flow time corresponds to the duration of the compensation current flow in the main circuit 5.
  • the primary voltage U TP at the transformer is so great that a transformer pulse voltage U TS , which is able to drive the required compensation current I K , is secondary to the number of transformer turns.
  • the capacitor C with the time constant T R B x C, starting from the voltage U C ⁇ U GR , is further charged with the voltage U TS .
  • the charging current is the compensation current I K and at the same time the demetallization current I E.
  • an accumulator can also be used instead of the capacitor C.
  • the bath direct current source 2 consisting of a rectifier bridge circuit, switches off automatically for the duration of the demetallization time, because the charge makes the voltage U C > U GR .
  • the direct current source 2 therefore does not automatically feed any current into the circuit during the period in which the bath current I GR is fed into the circuit by the induced voltage U TS .
  • the bath current is again supplied by the direct current source.
  • a choke 11 can be inserted into the high-current circuit 5 in order to avoid a brief reverse current at the switch-off torque in the case of inert rectifier elements in the bath direct current source 2.
  • the energy for demetallization is applied on the way via the current transformer 1.
  • the high, but short-term demetallization current I E in the secondary winding 6 is fed primarily.
  • the current is reduced with the current transformer transmission ratio ü.
  • the power loss to be used for pulse generation is very low compared to known methods. Even the calculation of the dominant losses shows the difference:
  • 8 watts are required for the reverse flow of transformer current to saturate the transformer. With 10 bath power supplies, this results in a total power loss of around 160 watts.
  • the current transformer losses must be included in the circuit according to the invention. If a very good coupling of the transformer z.
  • the technical outlay for carrying out the method according to the invention is also significantly less than when using conventional circuit arrangements.
  • the pulse-shaped current profile at the bath resistor R B (electroplating cell 20) is shown schematically in FIG. Because of the ohmic resistance R B , bath current and bath voltage are in phase here.
  • the compensation current flow begins at time t 1 .
  • the size and direction is determined by the instantaneous voltages U C and U TS .
  • the compensation current flow ends at time t 2 .
  • the subsequent electroplating current I G is determined by the rectifier voltage U GR , in each case in connection with the bath resistance R B.
  • the time course of the voltages is shown in more detail in the diagrams in FIGS. 4a and 4b.
  • the electroplating current I G is practically in phase with the electroplating voltage U G. I G is therefore not shown because of the same course.
  • the rectifier voltage U GR the capacitor voltage U C and also the electroplating voltage U G are approximately the same.
  • the voltage U TS is 0 volts at this time.
  • the voltage pulse U TS1 begins to rise at the secondary winding 6 of the current transformer 1.
  • the voltage U TS1 is polarized in such a way that the galvanizing voltage U G1 becomes negative, so that it can be demetallized.
  • U G is formed from the sum of the instantaneous voltages U C and U TS .
  • the voltage U TS is polarized on the capacitor C in the direction of the existing charge.
  • T R B x C.
  • the voltage pulse U TS1 begins to drop. Because of the finite inductance of the current transformer secondary circuit, the falling voltage pulse does not end at the zero line.
  • a voltage U TS2 with reverse polarity occurs due to voltage induction . This now adds up to the capacitor voltage U C.
  • a brief voltage surge U G2 occurs at the bath resistor R B.
  • the voltage U TS is therefore 0 volts.
  • the bath DC power source U GR again takes over the supply of the bath resistance R B , so that U G ⁇ U GR .
  • the voltages U GR , U C and U G are then approximately the same size again.
  • the brief voltage increase at the bath resistor R B is undesirable for reasons of electroplating. In practice, this tip and the other tips, unlike shown here, are clearly rounded.
  • FIG. 5 shows an example of the primary-side control of the current transformer 1.
  • An auxiliary voltage source 12 is supported by a charging capacitor 13 with the capacitance C.
  • An electronic switch 14, here an IGBT (isolated gate bipolar transistor), is driven by voltage pulses 15.
  • IGBT isolated gate bipolar transistor
  • a primary current flows into the partial winding I of the primary winding 7 of the current transformer, and a desaturation current flows in the partial winding II to simplify the circuit.
  • a desaturation current flows in the partial winding II
  • Electricity dispenses with a possible further electronic switch.
  • the number of turns of the partial windings I and II and the series resistor 17, through which a current of small magnitude flows permanently, are matched to one another in such a way that the transformer iron is not saturated.
  • the primary current I TP is shown schematically in the current diagram 18 in FIG. 5.
  • FIG. 6 shows the application of the pulse current units 19 in a plating bath 20 with a vertically arranged plating material, for which two bath direct current sources 2 for the front and the back of the flat plating material, for example a printed circuit board, are used.
  • Each side of the printed circuit board 21 is supplied with galvanizing current separately from one of these current sources 2.
  • An anode 22 is arranged opposite each circuit board side. During the short demetallization pulse, these anodes act as cathodes against the material to be treated, which is then anodically poled. Both pulse current units can work asynchronously or synchronously with each other.
  • the pulse trains of the same frequency of both pulse current units are synchronized and if there is a phase shift of the pulses at the same time.
  • the phase shift must be such that during the electroplating phase on one side of the circuit board the demetallization pulse occurs on the other side and vice versa.
  • the metal scattering that is the hole plating, is improved.
  • the pulse trains with the same frequency can also run asynchronously to one another in the case of separate electrolytic treatment of the front and back of the items to be treated.
  • the invention is suitable for all pulse electroplating processes. It can be vertical or horizontally working electroplating systems, immersion and continuous systems, come into use. In the latter, plate-shaped electroplating material is used kept in horizontal or vertical position during treatment. In the times and amplitudes mentioned in this description can be in practical Use cases can be changed in wide areas.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Ac-Ac Conversion (AREA)
  • Physical Vapour Deposition (AREA)
EP96934478A 1995-12-21 1996-09-27 Verfahren und schaltungsanordnung zur erzeugung von strompulsen zur elektrolytischen metallabscheidung Expired - Lifetime EP0868545B1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19547948A DE19547948C1 (de) 1995-12-21 1995-12-21 Verfahren und Schaltungsanordnung zur Erzeugung von Strompulsen zur elektrolytischen Metallabscheidung
DE19547948 1995-12-21
PCT/EP1996/004232 WO1997023665A1 (de) 1995-12-21 1996-09-27 Verfahren und schaltungsanordnung zur erzeugung von strompulsen zur elektrolytischen metallabscheidung

Publications (2)

Publication Number Publication Date
EP0868545A1 EP0868545A1 (de) 1998-10-07
EP0868545B1 true EP0868545B1 (de) 1999-10-27

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EP96934478A Expired - Lifetime EP0868545B1 (de) 1995-12-21 1996-09-27 Verfahren und schaltungsanordnung zur erzeugung von strompulsen zur elektrolytischen metallabscheidung

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US (1) US6132584A (enExample)
EP (1) EP0868545B1 (enExample)
JP (1) JP4028892B2 (enExample)
KR (1) KR100465545B1 (enExample)
CN (1) CN1093337C (enExample)
AT (1) ATE186081T1 (enExample)
BR (1) BR9612163A (enExample)
CA (1) CA2241055A1 (enExample)
CZ (1) CZ290052B6 (enExample)
DE (2) DE19547948C1 (enExample)
ES (1) ES2139388T3 (enExample)
WO (1) WO1997023665A1 (enExample)

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DE10311575B4 (de) * 2003-03-10 2007-03-22 Atotech Deutschland Gmbh Verfahren zum elektrolytischen Metallisieren von Werkstücken mit Bohrungen mit einem hohen Aspektverhältnis
US20070068821A1 (en) * 2005-09-27 2007-03-29 Takahisa Hirasawa Method of manufacturing chromium plated article and chromium plating apparatus
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EP1890004A1 (de) 2006-08-08 2008-02-20 Siemens Aktiengesellschaft Verfahren zum Herstellen einer Nutzschicht aus wiederverwendetem Schichtmaterial
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US11225727B2 (en) 2008-11-07 2022-01-18 Lam Research Corporation Control of current density in an electroplating apparatus
US10011917B2 (en) 2008-11-07 2018-07-03 Lam Research Corporation Control of current density in an electroplating apparatus
US9011706B2 (en) * 2008-12-16 2015-04-21 City University Of Hong Kong Method of making foraminous microstructures
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JP6161863B2 (ja) * 2010-12-28 2017-07-12 株式会社荏原製作所 電気めっき方法
US9028666B2 (en) 2011-05-17 2015-05-12 Novellus Systems, Inc. Wetting wave front control for reduced air entrapment during wafer entry into electroplating bath
CN102277603A (zh) * 2011-08-03 2011-12-14 深圳大学 一种感应热/电沉积制备涂层或薄膜的装置及方法
PE20171124A1 (es) * 2013-11-19 2017-08-08 Hecker Electronica Potencia Y Procesos S A Proceso de superposicion de corriente alterna sobre la corriente continua para procesos de electroobtencion o electrorefinacion de cobre u otros productos, en que la fuente de corriente alterna se conecta entre dos celdas consecutivas del grupo de celdas electroliticas utilizando un inductor para inyectar corriente alterna y un condensador para cerrar el circuito electrico
EP3029178A1 (en) 2014-12-05 2016-06-08 ATOTECH Deutschland GmbH Method and apparatus for electroplating a metal onto a substrate
SG11202005062SA (en) 2016-07-13 2020-06-29 Alligant Scientific Llc Electrochemical methods, devices and compositions
RU2722754C1 (ru) * 2019-04-23 2020-06-03 Общество с ограниченной ответственностью "Керамик тех" (ООО "Керамик тех") Устройство для формирования электрохимическим оксидированием покрытий на вентильных металлах или сплавах
CN114836797B (zh) * 2022-05-12 2023-08-29 广州市慧科高新材料科技有限公司 一种基于脉冲搭桥的通孔填孔电镀工艺

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EP1828440A4 (en) * 2004-12-14 2011-08-03 Polymer Kompositer I Goeteborg ELECTRODEPOSITION METHOD AND APPARATUS UNDER PULSES

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HK1017392A1 (en) 1999-11-19
US6132584A (en) 2000-10-17
CA2241055A1 (en) 1997-07-03
KR19990071793A (ko) 1999-09-27
ATE186081T1 (de) 1999-11-15
DE19547948C1 (de) 1996-11-21
EP0868545A1 (de) 1998-10-07
KR100465545B1 (ko) 2005-02-28
DE59603510D1 (de) 1999-12-02
BR9612163A (pt) 1999-07-13
ES2139388T3 (es) 2000-02-01
CN1205745A (zh) 1999-01-20
WO1997023665A1 (de) 1997-07-03
JP4028892B2 (ja) 2007-12-26
JP2000505145A (ja) 2000-04-25
CN1093337C (zh) 2002-10-23
CZ290052B6 (cs) 2002-05-15
CZ170098A3 (cs) 1998-10-14

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