EP0820217A1 - Composition et procédé pour le remplissage de trous de contact - Google Patents

Composition et procédé pour le remplissage de trous de contact Download PDF

Info

Publication number
EP0820217A1
EP0820217A1 EP97110015A EP97110015A EP0820217A1 EP 0820217 A1 EP0820217 A1 EP 0820217A1 EP 97110015 A EP97110015 A EP 97110015A EP 97110015 A EP97110015 A EP 97110015A EP 0820217 A1 EP0820217 A1 EP 0820217A1
Authority
EP
European Patent Office
Prior art keywords
copper
composition
substrate
silver
photoresist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP97110015A
Other languages
German (de)
English (en)
Other versions
EP0820217B1 (fr
Inventor
John James Felten
Stephan Padlewski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of EP0820217A1 publication Critical patent/EP0820217A1/fr
Application granted granted Critical
Publication of EP0820217B1 publication Critical patent/EP0820217B1/fr
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
EP97110015A 1996-07-18 1997-06-19 Composition et procédé pour le remplissage de trous de contact Expired - Lifetime EP0820217B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/683,351 US5744285A (en) 1996-07-18 1996-07-18 Composition and process for filling vias
US683351 1996-07-18

Publications (2)

Publication Number Publication Date
EP0820217A1 true EP0820217A1 (fr) 1998-01-21
EP0820217B1 EP0820217B1 (fr) 2003-01-22

Family

ID=24743659

Family Applications (1)

Application Number Title Priority Date Filing Date
EP97110015A Expired - Lifetime EP0820217B1 (fr) 1996-07-18 1997-06-19 Composition et procédé pour le remplissage de trous de contact

Country Status (7)

Country Link
US (1) US5744285A (fr)
EP (1) EP0820217B1 (fr)
JP (1) JP3338336B2 (fr)
KR (1) KR100266891B1 (fr)
CN (1) CN1123280C (fr)
DE (1) DE69718567T2 (fr)
TW (1) TW373419B (fr)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000062586A1 (fr) * 1999-04-14 2000-10-19 Allied Photochemical, Inc. Composition d'argent durcissable par ultraviolets et procede correspondant
US6500877B1 (en) 1999-11-05 2002-12-31 Krohn Industries, Inc. UV curable paint compositions and method of making and applying same
US6509389B1 (en) 1999-11-05 2003-01-21 Uv Specialties, Inc. UV curable compositions for producing mar resistant coatings and method for depositing same
WO2003019998A1 (fr) * 2001-08-24 2003-03-06 E. I. Du Pont De Nemours And Company Pate electro-conductrice thermodurcissable destinee a etre utilisee pour former des bosses electro-conductrices
US6716893B2 (en) 2000-01-13 2004-04-06 Uv Specialties, Inc. UV curable ferromagnetic compositions
US6767577B1 (en) 1999-10-06 2004-07-27 Allied Photochemical, Inc. Uv curable compositions for producing electroluminescent coatings
US6784223B2 (en) 2000-01-13 2004-08-31 Allied Photochemical, Inc. UV curable transparent conductive compositions
US6805917B1 (en) 1999-12-06 2004-10-19 Roy C. Krohn UV curable compositions for producing decorative metallic coatings
EP2824672A1 (fr) * 2013-07-09 2015-01-14 Heraeus Precious Metals GmbH & Co. KG Pâte électroconductrice comprenant des particules Ag avec une répartition de diamètre multimodal dans la préparation d'électrodes pour cellules solaire MWT

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6255039B1 (en) * 1997-04-16 2001-07-03 Isola Laminate Systems Corp. Fabrication of high density multilayer interconnect printed circuit boards
US6276055B1 (en) * 1998-09-02 2001-08-21 Hadco Santa Clara, Inc. Method and apparatus for forming plugs in vias of a circuit board layer
US6592943B2 (en) 1998-12-01 2003-07-15 Fujitsu Limited Stencil and method for depositing solder
US6054761A (en) * 1998-12-01 2000-04-25 Fujitsu Limited Multi-layer circuit substrates and electrical assemblies having conductive composition connectors
TW409490B (en) * 1998-12-31 2000-10-21 World Wiser Electronics Inc The equipment for plug hole process and the method thereof
US6169125B1 (en) * 1999-01-11 2001-01-02 Dymax Corporation Electrically conductive resinous material and radiation curable formulation for producing the same
US6218446B1 (en) * 1999-01-11 2001-04-17 Dymax Corporation Radiation curable formulation for producing electrically conductive resinous material, method of use, and article produced
US6326555B1 (en) 1999-02-26 2001-12-04 Fujitsu Limited Method and structure of z-connected laminated substrate for high density electronic packaging
JP4345153B2 (ja) * 1999-09-27 2009-10-14 ソニー株式会社 映像表示装置の製造方法
TW512467B (en) * 1999-10-12 2002-12-01 North Kk Wiring circuit substrate and manufacturing method therefor
DE10196259T1 (de) 2000-05-31 2003-05-15 Honeywell Int Inc Füllverfahren
US6855385B2 (en) * 2000-05-31 2005-02-15 Ttm Advanced Circuits, Inc. PCB support plate for PCB via fill
KR20030007753A (ko) * 2000-05-31 2003-01-23 허니웰 인터내셔날 인코포레이티드 채움 방법
US6800232B2 (en) * 2000-05-31 2004-10-05 Ttm Advanced Circuits, Inc. PCB support plate method for PCB via fill
US6454154B1 (en) 2000-05-31 2002-09-24 Honeywell Advanced Circuits, Inc. Filling device
US6506332B2 (en) 2000-05-31 2003-01-14 Honeywell International Inc. Filling method
US6589594B1 (en) * 2000-08-31 2003-07-08 Micron Technology, Inc. Method for filling a wafer through-via with a conductive material
US6931723B1 (en) * 2000-09-19 2005-08-23 International Business Machines Corporation Organic dielectric electronic interconnect structures and method for making
US6593534B2 (en) * 2001-03-19 2003-07-15 International Business Machines Corporation Printed wiring board structure with z-axis interconnections
JP3907062B2 (ja) * 2002-05-21 2007-04-18 株式会社ダイワ工業 層間接続構造及びその形成方法
US6600645B1 (en) * 2002-09-27 2003-07-29 Ut-Battelle, Llc Dielectric composite materials and method for preparing
US20050056365A1 (en) * 2003-09-15 2005-03-17 Albert Chan Thermal interface adhesive
EP1622435A1 (fr) * 2004-07-28 2006-02-01 ATOTECH Deutschland GmbH Méthode de fabrication d'un dispositif par des techniques d'écriture directe
KR100632560B1 (ko) * 2004-08-05 2006-10-09 삼성전기주식회사 병렬적 인쇄회로기판 제조 방법
US7452568B2 (en) * 2005-02-04 2008-11-18 International Business Machines Corporation Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formation
JP5021216B2 (ja) * 2006-02-22 2012-09-05 イビデン株式会社 プリント配線板およびその製造方法
US20070212865A1 (en) * 2006-03-08 2007-09-13 Craig Amrine Method for planarizing vias formed in a substrate
US20080057233A1 (en) * 2006-08-29 2008-03-06 Harrison Daniel J Conductive thermal transfer ribbon
JP5350384B2 (ja) 2007-09-13 2013-11-27 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン 導電性組成物
US8205971B2 (en) * 2010-01-19 2012-06-26 Xerox Corporation Electrically grounded inkjet ejector and method for making an electrically grounded inkjet ejector
US9365947B2 (en) 2013-10-04 2016-06-14 Invensas Corporation Method for preparing low cost substrates
JP6406598B2 (ja) * 2014-07-24 2018-10-17 学校法人福岡大学 プリント配線板及びその製造方法
US9820386B2 (en) * 2016-03-18 2017-11-14 Intel Corporation Plasma etching of solder resist openings
CN112714552B (zh) * 2020-11-30 2022-07-29 惠州市特创电子科技股份有限公司 线路板及其棕化方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4383363A (en) * 1977-09-01 1983-05-17 Sharp Kabushiki Kaisha Method of making a through-hole connector
JPS6431874A (en) * 1987-07-29 1989-02-02 Sumitomo Bakelite Co Electroconductive resin paste for semiconductor
JPH0198674A (ja) * 1987-10-09 1989-04-17 Daido Steel Co Ltd 導電性組成物
JPH01143292A (ja) * 1987-11-27 1989-06-05 Matsushita Electric Ind Co Ltd プリント配線板の製造方法
US5156772A (en) * 1988-05-11 1992-10-20 Ariel Electronics, Inc. Circuit writer materials
EP0651602A1 (fr) * 1993-10-29 1995-05-03 Matsushita Electric Industrial Co., Ltd. Composition d'une pâte conductrice pour le remplissage de trous de contact, plaque de circuit imprimé en utilisant cette pâte conductrice, et procédé de sa production
JPH08138437A (ja) * 1994-11-04 1996-05-31 Hitachi Chem Co Ltd 導電性材料及びそれを用いた導電性ペースト

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3971610A (en) * 1974-05-10 1976-07-27 Technical Wire Products, Inc. Conductive elastomeric contacts and connectors
US3989644A (en) * 1974-09-27 1976-11-02 General Electric Company Radiation curable inks
FR2593346B1 (fr) * 1986-01-17 1990-05-25 Nec Corp Substrat de cablage utilisant une ceramique comme isolant
JPH04196290A (ja) * 1990-11-27 1992-07-16 Matsushita Electric Works Ltd 多層積層板の製造方法
JP3057924B2 (ja) * 1992-09-22 2000-07-04 松下電器産業株式会社 両面プリント基板およびその製造方法
US5386627A (en) * 1992-09-29 1995-02-07 International Business Machines Corporation Method of fabricating a multi-layer integrated circuit chip interposer

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4383363A (en) * 1977-09-01 1983-05-17 Sharp Kabushiki Kaisha Method of making a through-hole connector
JPS6431874A (en) * 1987-07-29 1989-02-02 Sumitomo Bakelite Co Electroconductive resin paste for semiconductor
JPH0198674A (ja) * 1987-10-09 1989-04-17 Daido Steel Co Ltd 導電性組成物
JPH01143292A (ja) * 1987-11-27 1989-06-05 Matsushita Electric Ind Co Ltd プリント配線板の製造方法
US5156772A (en) * 1988-05-11 1992-10-20 Ariel Electronics, Inc. Circuit writer materials
EP0651602A1 (fr) * 1993-10-29 1995-05-03 Matsushita Electric Industrial Co., Ltd. Composition d'une pâte conductrice pour le remplissage de trous de contact, plaque de circuit imprimé en utilisant cette pâte conductrice, et procédé de sa production
JPH08138437A (ja) * 1994-11-04 1996-05-31 Hitachi Chem Co Ltd 導電性材料及びそれを用いた導電性ペースト

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 13, no. 221 (C - 598) 23 May 1989 (1989-05-23) *
PATENT ABSTRACTS OF JAPAN vol. 13, no. 313 (C - 618) 17 July 1989 (1989-07-17) *
PATENT ABSTRACTS OF JAPAN vol. 13, no. 396 (E - 815) 4 April 1989 (1989-04-04) *
PATENT ABSTRACTS OF JAPAN vol. 96, no. 9 30 September 1996 (1996-09-30) *

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000062586A1 (fr) * 1999-04-14 2000-10-19 Allied Photochemical, Inc. Composition d'argent durcissable par ultraviolets et procede correspondant
US6290881B1 (en) 1999-04-14 2001-09-18 Allied Photochemical, Inc. Ultraviolet curable silver composition and related method
US6767577B1 (en) 1999-10-06 2004-07-27 Allied Photochemical, Inc. Uv curable compositions for producing electroluminescent coatings
US6500877B1 (en) 1999-11-05 2002-12-31 Krohn Industries, Inc. UV curable paint compositions and method of making and applying same
US6509389B1 (en) 1999-11-05 2003-01-21 Uv Specialties, Inc. UV curable compositions for producing mar resistant coatings and method for depositing same
US6805917B1 (en) 1999-12-06 2004-10-19 Roy C. Krohn UV curable compositions for producing decorative metallic coatings
US6716893B2 (en) 2000-01-13 2004-04-06 Uv Specialties, Inc. UV curable ferromagnetic compositions
US6784223B2 (en) 2000-01-13 2004-08-31 Allied Photochemical, Inc. UV curable transparent conductive compositions
WO2003019998A1 (fr) * 2001-08-24 2003-03-06 E. I. Du Pont De Nemours And Company Pate electro-conductrice thermodurcissable destinee a etre utilisee pour former des bosses electro-conductrices
US6800223B2 (en) 2001-08-24 2004-10-05 E. I. Du Pont De Nemours And Company Thermosetting electroconductive paste for electroconductive bump use
EP2824672A1 (fr) * 2013-07-09 2015-01-14 Heraeus Precious Metals GmbH & Co. KG Pâte électroconductrice comprenant des particules Ag avec une répartition de diamètre multimodal dans la préparation d'électrodes pour cellules solaire MWT
WO2015003807A1 (fr) * 2013-07-09 2015-01-15 Heraeus Precious Metals Gmbh & Co. Kg Pâte électroconductrice contenant des particules d'ag présentant une distribution de diamètres plurimodale, pour la préparation d'électrodes dans des cellules solaires mwt

Also Published As

Publication number Publication date
DE69718567T2 (de) 2003-11-27
US5744285A (en) 1998-04-28
JP3338336B2 (ja) 2002-10-28
KR100266891B1 (ko) 2000-09-15
DE69718567D1 (de) 2003-02-27
CN1171602A (zh) 1998-01-28
KR980013551A (ko) 1998-04-30
CN1123280C (zh) 2003-10-01
EP0820217B1 (fr) 2003-01-22
JPH10107431A (ja) 1998-04-24
TW373419B (en) 1999-11-01

Similar Documents

Publication Publication Date Title
EP0820217B1 (fr) Composition et procédé pour le remplissage de trous de contact
EP0955795B1 (fr) Pâte conductrice pour le remplissage de trous de contact, plaques à circuit imprimé à double face et multicouche en l'utilisant, et son procédé de production
EP0653904B1 (fr) Compositions pour le remplissage de trous d'interconnexion pour l'attachement direct de dispositifs et procédés de leur application
US6127025A (en) Circuit board with wiring sealing filled holes
KR930000776B1 (ko) 도전성 조성물 및 그의 제조방법
KR100463434B1 (ko) 매립된 레지스터를 갖는 인쇄회로기판 및 이의 제조방법
US6692664B2 (en) Printed wiring board conductive via hole filler having metal oxide reducing capability
KR20010089702A (ko) 다층프린트배선판 및 다층프린트배선판의 제조 방법
JPS6140316A (ja) 直接はんだ付け可能な導電性組成物
JPH10256687A (ja) ビアホール充填用導体ペースト組成物とそれを用いたプリント配線基板
US7438969B2 (en) Filling material, multilayer wiring board, and process of producing multilayer wiring board
KR100776725B1 (ko) 열경화성 에폭시수지조성물과 그 성형체 및다층프린트배선판
JP2002305367A (ja) 高性能電子基板の開口を埋める方法及び部材
JPH0759691B2 (ja) アデイテイブ印刷配線板用接着剤
JPH11181250A (ja) スルーホール充填用ペースト及びそれを用いたプリント配線板
JPH05175649A (ja) 回路基板の製造方法
JPH0575225A (ja) 金属ベース印刷配線基板及びその製造方法
JP3111010B2 (ja) 導電性ペースト
JP2000082332A (ja) ビア充填用導電ペ―スト組成物
JPH05175650A (ja) 回路基板の製造方法
US6776852B2 (en) Process of removing holefill residue from a metallic surface of an electronic substrate
JPH0426560B2 (fr)
JPH0418642B2 (fr)
JPH07307110A (ja) 導電ペースト
JPH07262822A (ja) 導電ペースト

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): DE FR GB

AX Request for extension of the european patent

Free format text: AL;LT;LV;RO;SI

17P Request for examination filed

Effective date: 19980219

AKX Designation fees paid

Free format text: DE FR GB

RBV Designated contracting states (corrected)

Designated state(s): DE FR GB

17Q First examination report despatched

Effective date: 19991112

GRAG Despatch of communication of intention to grant

Free format text: ORIGINAL CODE: EPIDOS AGRA

GRAG Despatch of communication of intention to grant

Free format text: ORIGINAL CODE: EPIDOS AGRA

GRAH Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOS IGRA

GRAH Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOS IGRA

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): DE FR GB

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REF Corresponds to:

Ref document number: 69718567

Country of ref document: DE

Date of ref document: 20030227

Kind code of ref document: P

ET Fr: translation filed
PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed

Effective date: 20031023

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20090617

Year of fee payment: 13

Ref country code: DE

Payment date: 20090615

Year of fee payment: 13

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20100619

REG Reference to a national code

Ref country code: FR

Ref legal event code: ST

Effective date: 20110228

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20110101

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: FR

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20100630

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20100619

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20090611

Year of fee payment: 13