DE69718567D1 - Zusammensetzung und Verfahren zum Füllen von Kontaktlöchern - Google Patents

Zusammensetzung und Verfahren zum Füllen von Kontaktlöchern

Info

Publication number
DE69718567D1
DE69718567D1 DE69718567T DE69718567T DE69718567D1 DE 69718567 D1 DE69718567 D1 DE 69718567D1 DE 69718567 T DE69718567 T DE 69718567T DE 69718567 T DE69718567 T DE 69718567T DE 69718567 D1 DE69718567 D1 DE 69718567D1
Authority
DE
Germany
Prior art keywords
composition
contact holes
filling contact
filling
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69718567T
Other languages
English (en)
Other versions
DE69718567T2 (de
Inventor
John James Felten
Stephan Padlewski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of DE69718567D1 publication Critical patent/DE69718567D1/de
Application granted granted Critical
Publication of DE69718567T2 publication Critical patent/DE69718567T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0548—Masks
    • H05K2203/0554—Metal used as mask for etching vias, e.g. by laser ablation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Conductive Materials (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
DE69718567T 1996-07-18 1997-06-19 Zusammensetzung und Verfahren zum Füllen von Kontaktlöchern Expired - Fee Related DE69718567T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/683,351 US5744285A (en) 1996-07-18 1996-07-18 Composition and process for filling vias

Publications (2)

Publication Number Publication Date
DE69718567D1 true DE69718567D1 (de) 2003-02-27
DE69718567T2 DE69718567T2 (de) 2003-11-27

Family

ID=24743659

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69718567T Expired - Fee Related DE69718567T2 (de) 1996-07-18 1997-06-19 Zusammensetzung und Verfahren zum Füllen von Kontaktlöchern

Country Status (7)

Country Link
US (1) US5744285A (de)
EP (1) EP0820217B1 (de)
JP (1) JP3338336B2 (de)
KR (1) KR100266891B1 (de)
CN (1) CN1123280C (de)
DE (1) DE69718567T2 (de)
TW (1) TW373419B (de)

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6255039B1 (en) * 1997-04-16 2001-07-03 Isola Laminate Systems Corp. Fabrication of high density multilayer interconnect printed circuit boards
US6276055B1 (en) 1998-09-02 2001-08-21 Hadco Santa Clara, Inc. Method and apparatus for forming plugs in vias of a circuit board layer
US6054761A (en) 1998-12-01 2000-04-25 Fujitsu Limited Multi-layer circuit substrates and electrical assemblies having conductive composition connectors
US6592943B2 (en) 1998-12-01 2003-07-15 Fujitsu Limited Stencil and method for depositing solder
TW409490B (en) * 1998-12-31 2000-10-21 World Wiser Electronics Inc The equipment for plug hole process and the method thereof
US6218446B1 (en) * 1999-01-11 2001-04-17 Dymax Corporation Radiation curable formulation for producing electrically conductive resinous material, method of use, and article produced
US6169125B1 (en) * 1999-01-11 2001-01-02 Dymax Corporation Electrically conductive resinous material and radiation curable formulation for producing the same
US6326555B1 (en) 1999-02-26 2001-12-04 Fujitsu Limited Method and structure of z-connected laminated substrate for high density electronic packaging
US6290881B1 (en) * 1999-04-14 2001-09-18 Allied Photochemical, Inc. Ultraviolet curable silver composition and related method
JP4345153B2 (ja) 1999-09-27 2009-10-14 ソニー株式会社 映像表示装置の製造方法
US6767577B1 (en) 1999-10-06 2004-07-27 Allied Photochemical, Inc. Uv curable compositions for producing electroluminescent coatings
TW512467B (en) * 1999-10-12 2002-12-01 North Kk Wiring circuit substrate and manufacturing method therefor
US6509389B1 (en) 1999-11-05 2003-01-21 Uv Specialties, Inc. UV curable compositions for producing mar resistant coatings and method for depositing same
US6500877B1 (en) 1999-11-05 2002-12-31 Krohn Industries, Inc. UV curable paint compositions and method of making and applying same
US6805917B1 (en) 1999-12-06 2004-10-19 Roy C. Krohn UV curable compositions for producing decorative metallic coatings
WO2001051567A1 (en) 2000-01-13 2001-07-19 Uv Specialties, Inc. Uv curable transparent conductive compositions
AU2001226390A1 (en) 2000-01-13 2001-07-24 Uv Specialties, Inc. Uv curable ferromagnetic compositions
AU2001264968A1 (en) 2000-05-31 2001-12-11 Honeywell International, Inc. Filling device
AU2001274958A1 (en) * 2000-05-31 2001-12-11 Honeywell International, Inc. Filling method
US6506332B2 (en) 2000-05-31 2003-01-14 Honeywell International Inc. Filling method
US6454154B1 (en) 2000-05-31 2002-09-24 Honeywell Advanced Circuits, Inc. Filling device
US6800232B2 (en) * 2000-05-31 2004-10-05 Ttm Advanced Circuits, Inc. PCB support plate method for PCB via fill
US6855385B2 (en) * 2000-05-31 2005-02-15 Ttm Advanced Circuits, Inc. PCB support plate for PCB via fill
US6589594B1 (en) * 2000-08-31 2003-07-08 Micron Technology, Inc. Method for filling a wafer through-via with a conductive material
US6931723B1 (en) * 2000-09-19 2005-08-23 International Business Machines Corporation Organic dielectric electronic interconnect structures and method for making
US6593534B2 (en) * 2001-03-19 2003-07-15 International Business Machines Corporation Printed wiring board structure with z-axis interconnections
US6800223B2 (en) * 2001-08-24 2004-10-05 E. I. Du Pont De Nemours And Company Thermosetting electroconductive paste for electroconductive bump use
KR100536933B1 (ko) * 2002-05-21 2005-12-14 가부시키가이샤 다이와 고교 층간 접속 구조 및 그 형성 방법
US6600645B1 (en) 2002-09-27 2003-07-29 Ut-Battelle, Llc Dielectric composite materials and method for preparing
US20050056365A1 (en) * 2003-09-15 2005-03-17 Albert Chan Thermal interface adhesive
EP1622435A1 (de) * 2004-07-28 2006-02-01 ATOTECH Deutschland GmbH Verfahren zur Herstellung einer elektronischer Anordnung mittels Direktschreibtechniken
KR100632560B1 (ko) * 2004-08-05 2006-10-09 삼성전기주식회사 병렬적 인쇄회로기판 제조 방법
US7452568B2 (en) * 2005-02-04 2008-11-18 International Business Machines Corporation Centrifugal method for filing high aspect ratio blind micro vias with powdered materials for circuit formation
JP5021216B2 (ja) * 2006-02-22 2012-09-05 イビデン株式会社 プリント配線板およびその製造方法
US20070212865A1 (en) * 2006-03-08 2007-09-13 Craig Amrine Method for planarizing vias formed in a substrate
US20080057233A1 (en) * 2006-08-29 2008-03-06 Harrison Daniel J Conductive thermal transfer ribbon
PL2191482T3 (pl) * 2007-09-13 2017-08-31 Henkel Ag & Co. Kgaa Kompozycja przewodząca prąd elektryczny
US8205971B2 (en) * 2010-01-19 2012-06-26 Xerox Corporation Electrically grounded inkjet ejector and method for making an electrically grounded inkjet ejector
ES2649662T3 (es) * 2013-07-09 2018-01-15 Heraeus Deutschland GmbH & Co. KG Una pasta electroconductora que comprende partículas de Ag con una distribución multimodal del diámetro en la preparación de electrodos en células solares MWT
US9365947B2 (en) 2013-10-04 2016-06-14 Invensas Corporation Method for preparing low cost substrates
JP6406598B2 (ja) * 2014-07-24 2018-10-17 学校法人福岡大学 プリント配線板及びその製造方法
US9820386B2 (en) * 2016-03-18 2017-11-14 Intel Corporation Plasma etching of solder resist openings
CN112714552B (zh) * 2020-11-30 2022-07-29 惠州市特创电子科技股份有限公司 线路板及其棕化方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3971610A (en) * 1974-05-10 1976-07-27 Technical Wire Products, Inc. Conductive elastomeric contacts and connectors
US3989644A (en) * 1974-09-27 1976-11-02 General Electric Company Radiation curable inks
US4383363A (en) * 1977-09-01 1983-05-17 Sharp Kabushiki Kaisha Method of making a through-hole connector
FR2593346B1 (fr) * 1986-01-17 1990-05-25 Nec Corp Substrat de cablage utilisant une ceramique comme isolant
JPS6431874A (en) * 1987-07-29 1989-02-02 Sumitomo Bakelite Co Electroconductive resin paste for semiconductor
JPH0198674A (ja) * 1987-10-09 1989-04-17 Daido Steel Co Ltd 導電性組成物
JPH01143292A (ja) * 1987-11-27 1989-06-05 Matsushita Electric Ind Co Ltd プリント配線板の製造方法
US5156772A (en) * 1988-05-11 1992-10-20 Ariel Electronics, Inc. Circuit writer materials
JPH04196290A (ja) * 1990-11-27 1992-07-16 Matsushita Electric Works Ltd 多層積層板の製造方法
JP3057924B2 (ja) * 1992-09-22 2000-07-04 松下電器産業株式会社 両面プリント基板およびその製造方法
US5404044A (en) * 1992-09-29 1995-04-04 International Business Machines Corporation Parallel process interposer (PPI)
EP0651602B1 (de) * 1993-10-29 1999-04-07 Matsushita Electric Industrial Co., Ltd. Leitfähige Pastenzusammensetzung zum Füllen von Kontaktlöchern, Leiterplatte unter Anwendung dieser leifähigen Paste und Verfahren zur Herstellung
JPH08138437A (ja) * 1994-11-04 1996-05-31 Hitachi Chem Co Ltd 導電性材料及びそれを用いた導電性ペースト

Also Published As

Publication number Publication date
CN1123280C (zh) 2003-10-01
JP3338336B2 (ja) 2002-10-28
KR980013551A (ko) 1998-04-30
JPH10107431A (ja) 1998-04-24
KR100266891B1 (ko) 2000-09-15
EP0820217B1 (de) 2003-01-22
TW373419B (en) 1999-11-01
US5744285A (en) 1998-04-28
CN1171602A (zh) 1998-01-28
EP0820217A1 (de) 1998-01-21
DE69718567T2 (de) 2003-11-27

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee