EP0653898A2 - Procédé de fabrication d'éléments chauffants céramiques - Google Patents
Procédé de fabrication d'éléments chauffants céramiques Download PDFInfo
- Publication number
- EP0653898A2 EP0653898A2 EP94117182A EP94117182A EP0653898A2 EP 0653898 A2 EP0653898 A2 EP 0653898A2 EP 94117182 A EP94117182 A EP 94117182A EP 94117182 A EP94117182 A EP 94117182A EP 0653898 A2 EP0653898 A2 EP 0653898A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- metallization
- paste
- ceramic
- weight
- heating element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 53
- 239000000919 ceramic Substances 0.000 title claims abstract description 38
- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 239000004020 conductor Substances 0.000 claims abstract description 30
- 239000000203 mixture Substances 0.000 claims abstract description 15
- 239000000843 powder Substances 0.000 claims abstract description 13
- 239000007787 solid Substances 0.000 claims abstract description 5
- 239000002923 metal particle Substances 0.000 claims abstract description 3
- 238000001465 metallisation Methods 0.000 claims description 34
- 238000007650 screen-printing Methods 0.000 claims description 13
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 11
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 7
- 238000005516 engineering process Methods 0.000 claims description 7
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 6
- 239000010937 tungsten Substances 0.000 claims description 6
- 229910052721 tungsten Inorganic materials 0.000 claims description 6
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 5
- 239000011733 molybdenum Substances 0.000 claims description 5
- 229910052750 molybdenum Inorganic materials 0.000 claims description 5
- 238000005245 sintering Methods 0.000 claims description 4
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims description 3
- 239000012298 atmosphere Substances 0.000 claims description 3
- 239000007789 gas Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 238000007639 printing Methods 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 238000007654 immersion Methods 0.000 claims description 2
- 238000007645 offset printing Methods 0.000 claims description 2
- 239000001301 oxygen Substances 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 238000007649 pad printing Methods 0.000 claims description 2
- 239000000523 sample Substances 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 claims description 2
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 claims description 2
- 238000010276 construction Methods 0.000 claims 1
- 238000009413 insulation Methods 0.000 abstract 2
- 239000003921 oil Substances 0.000 description 9
- 235000019198 oils Nutrition 0.000 description 9
- 229910010293 ceramic material Inorganic materials 0.000 description 7
- 239000011521 glass Substances 0.000 description 7
- 238000005259 measurement Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000011888 foil Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 3
- 235000012239 silicon dioxide Nutrition 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000004870 electrical engineering Methods 0.000 description 2
- 238000007496 glass forming Methods 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 238000013021 overheating Methods 0.000 description 2
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- IIZPXYDJLKNOIY-JXPKJXOSSA-N 1-palmitoyl-2-arachidonoyl-sn-glycero-3-phosphocholine Chemical compound CCCCCCCCCCCCCCCC(=O)OC[C@H](COP([O-])(=O)OCC[N+](C)(C)C)OC(=O)CCC\C=C/C\C=C/C\C=C/C\C=C/CCCCC IIZPXYDJLKNOIY-JXPKJXOSSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 235000012216 bentonite Nutrition 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010344 co-firing Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000003925 fat Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229940067606 lecithin Drugs 0.000 description 1
- 235000010445 lecithin Nutrition 0.000 description 1
- 239000000787 lecithin Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- 235000010446 mineral oil Nutrition 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 description 1
- 150000003021 phthalic acid derivatives Chemical class 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 235000015112 vegetable and seed oil Nutrition 0.000 description 1
- 239000008158 vegetable oil Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
- H05B3/286—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an organic material, e.g. plastic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
- H05B3/283—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
Definitions
- the invention relates to a method for producing an electrical heating element in which metallic heating conductors are embedded between ceramic insulating layers, contacting recesses in the ceramic insulating layers being filled with electrically conductive material as current leads and as current conductors.
- Otsuka et al. describe in CERAMIC BULLETIN 60, pp. 540 ff (1981) that components made of ceramic materials, which mainly contain aluminum oxide or aluminum nitride, can be metallized with refractory metals such as tungsten or molybdenum, and that this metallization is then covered by a further layer of green ceramic and the composite can then be sintered to form the material.
- Foil technology is particularly suitable for this.
- an application as a heating element is possible in which large amounts of heat are preferably generated by the action of an electric current at those locations in the metallization pattern which have a high resistance.
- the present invention was based on the object of specifying a manufacturing method for thin-walled ceramic heating elements, in which the structure is initially pre-formed with ceramic foils and with a high-temperature-resistant metallization, and in which a miniaturized high-performance heating element with permanent long-term stability can then be created by sintering the multilayer structure.
- the heating conductors, the current leads and the current conductors are used as metallization paste containing 60 to 95% by weight of metal particles and 5 to 40% by weight of inorganic powder, based on the total solids content of the paste, are applied to the ceramic layers in the green state, that then the ceramic Layers with the applied metallization pastes are stacked on top of one another and then sintered.
- the high-temperature-resistant metallization paste is applied using thick-film technology. Layers with layer thicknesses of up to 100 ⁇ m are achieved using the screen printing process. The ceramic insulating layers with the applied metallization pastes are then preferably first dried. The drying conditions depend on the screen printing oil used, with drying generally over a period of 5 to 30 minutes at temperatures in the range from 40 to 150 ° C.
- a metallization paste is preferably used which contains at least 70% by weight of metal powder consisting of tungsten or molybdenum or mixtures thereof and at most 35% by weight of a non-glass-phase-forming ceramic powder or powder mixture containing aluminum oxide, aluminum nitride, titanium nitride, titanium carbide or tungsten carbide and in addition Contains 5 to 35 wt .-% of an organic pasting medium.
- Oils such as mineral oil, vegetable oils or synthetic oils such as screen printing oil or recycling oil are particularly suitable as organic pasting media, but fats, waxes, adjusting agents such as thixotropic agents, rosin or lecithin can also be used to achieve better fill levels, bentonites to improve the strength of the unfired paste and / or organic solvents can be used.
- contacting recesses also called “vias” in the context of the present invention
- the metallizing paste is transferred to still unfired ceramic films using a printing process such as screen printing, roller screen printing, offset printing or pad printing, the desired pattern being produced on the film surface becomes.
- the fully filled vias have a diameter of 0.1 to 0.5 mm, preferably 0.3 mm.
- the layer thickness of the metallization for the conductor tracks can be between 5 and 100 ⁇ m, preferably between 10 and 15 ⁇ m.
- the width of the conductor track should be at least 0.25 mm in order to reliably avoid burning through, preferably about 0.5 mm.
- the paste For the processing of the paste, it is recommended to use the paste to fill the vias with a viscosity of 150 to 500 Pa ⁇ s, for the flat metallization printing, however, it is advantageous to add a small amount of screen printing oil to the paste to a viscosity in the Range from 50 to 90 Pa ⁇ s.
- the metallization paste is matched to the shrinkage of the film in such a way that during the sintering, there are no voids or star cracks in the via due to the metallization paste shrinking too little compared to the ceramic shrinkage, nor because of the metallization paste shrinkage too high.
- the shrinkage is matched to the composition and grain size of the powder.
- the non-glass-phase-forming ceramic powder contained in the metallization paste preferably has an average grain size of ⁇ 10 ⁇ m, particularly preferably ⁇ 2 ⁇ m. The grain sizes are measured with a laser granulometer ®CILAS 850 from ALCATEL.
- a constant total resistance should be set, which is based on the surface resistance of the burned-in conductor track and the The area of the conductor track in the film layer level is obtained by multiplication. In practice, total resistances of approximately 1 to 1000 ohms are required with such miniature heating elements.
- the distance between adjacent conductor tracks should be ⁇ 0.4 mm if possible to avoid burning out.
- the overall arrangement of the conductor tracks should be selected so that the loop has a heating temperature that is as uniform as possible over its extent. Then the outer metallization parts of the contact surfaces can be nickel-plated.
- a commercially available metallizing bath for example based on hypophosphite, can be used as a reducing agent for this purpose. If necessary, a copper and / or silver-containing solder layer can also be applied.
- an adhesive aid made of an organic mixture with a binder can be applied over the entire surface of the ceramic films.
- Such adhesive aids are known from US Pat. No. 5,021,287 and contain organic resins such as polyvinyl butyral or acrylic resins in an organic solvent and possibly also plasticizers such as phthalic acid esters or polyethylene glycols.
- the separation must now take place, the later shape of the heating element being produced at the same time.
- the separation can take place, for example, by cutting or punching.
- the final size of the heating element is generated by the sintering process at temperatures ⁇ 1600 ° C in a reducing, humid atmosphere.
- the furnace atmosphere preferably has a composition of about 75% Hydrogen and 25% nitrogen, the mixture being saturated with water vapor at a temperature of 55 ° C.
- the heating element is particularly miniaturized, special care must be taken with the temperature distribution and heat dissipation. In the heating area, care must be taken to ensure that the layer thickness of the conductor tracks is as uniform as possible in order to avoid local overheating in narrow spaces and places with a smaller layer thickness. In addition, poor coordination between the geometry and the thermal conductivity of the aluminum oxide material, the composition of the metallization and the conductor track design lead to burnout due to local overheating.
- a continuous operating temperature between 50 and, depending on the material composition, 1100 h at temperatures up to 1800 ° C. can be achieved.
- the upper operating temperature limit is primarily dependent on the chemical composition of the ceramic insulating layers and their content of softening phases. Materials such as aluminum oxide, aluminum nitride, zirconium oxide, silicon dioxide or titanium nitride are preferably used for the ceramic insulating layers.
- the heating elements can be used as heating elements for oxygen sensors or other measuring probes, in particular for automotive technology, in laboratory measuring devices and infrared measuring transmitters or in heating technology, for example as an ignition element for igniting escaping flammable gases or as immersion heaters.
- a 0.8 mm thick green film primarily contained aluminum oxide and 4% of a quartz-containing, glass-forming mixture.
- the foil was cut into cards with blades, the recesses for the vias were mechanically punched.
- the vias were screen-printed with a metallizing paste which, in addition to 84% by weight of tungsten with an average grain size of 2.5 ⁇ m, also 16% by weight of fine-grained alumina with an average grain size of 1 ⁇ m and an additional 15 as an organic pasting medium %
- screen printing oil based on the weight of the solids content, contained.
- a viscosity of 75 Pa ⁇ s for the surface pressure and 175 Pa ⁇ s for the pressure of the vias was set for the processing of the paste.
- a loop-shaped structure was printed on the unfired and via-filled cards using the paste described using a screen printing machine using thick-film technology.
- the printed cards were dried in air at 70 ° C.
- a flat pattern was printed on other unfired cards, also with the described metallizing paste, using a screen printing machine. These metallization surfaces should be on the outside of the finished heating element and enable the electrical connection as contact surfaces. All printed cards were air dried at 70 ° C.
- FIG. 1 A graphic representation of this arrangement is illustrated in FIG. 1.
- the ceramic films 1 with the vias 2 can be recognized by reference numerals.
- the vias 2 are filled with via fillings, not shown.
- the metallizations 4 are arranged in such a way that interconnect leads 5 and heating loops 6 result, the latter forming the heating area 7.
- the outer contact surfaces 8 can also be seen.
- This stack of cards was pressed under a pressure of 90,000 hPa at a temperature of 90 ° C.
- Several individual parts were cut from the laminate using a cutting tool.
- the distance between the loop-shaped structure inside the heating element and the lateral outer edge of the heating element was 0.5 mm.
- the rod-shaped heating elements were sintered under protective gas (moist mixture of nitrogen and hydrogen) at a temperature of 1630 ° C. in a hood furnace.
- protective gas moist mixture of nitrogen and hydrogen
- the ceramic material aluminum oxide with a content of 96 wt .-% Al2O3 was generated, on the other hand, the conductor tracks were sintered in a co-firing process.
- the fully filled vias were 0.3 mm in diameter.
- the layer thickness of the conductor track metallization was 12 ⁇ m and its width was 0.5 mm.
- the surface resistance achieved with the conductor tracks according to Example 1 was 5 m ⁇ / cm2.
- the finished heating element each had a width and height of approximately 2.5 mm and a length of its heating area of approximately 18 mm. The measurements made on the finished heating element are described after the examples and are compared in a table.
- Example 2 Analogously to Example 1, a heating element with the same dimensions was produced from the same ceramic material consisting of 96% by weight of aluminum oxide and 4% by weight of quartz-containing, glass-forming mixture. The only difference was that the metallizing paste consisted of 100 wt .-% tungsten with an average particle size of 2.5 microns plus the amount of screen printing oil necessary for processing as a paste. Reference is made to the measurement results following the examples.
- the manufacturing process for a rod-shaped heating element, each with a contact surface at each of the rod ends and consisting of only two layers of ceramic film, is analogous to the manufacturing process of Example 1.
- An aluminum nitride with 3% by weight aluminum oxide and 4% by weight was used as the ceramic material.
- Yttrium oxide produced.
- a card made of an unfired ceramic film was printed with the aid of the metallization paste described below with a wavy or meandering structure. Vias were mechanically punched into a second unfired ceramic card using a metal needle.
- the metallization paste consisted of 84% by weight of molybdenum and 8% by weight of aluminum oxide and a further 8% by weight of aluminum nitride.
- the powders had fine grain sizes as described in Example 1.
- the metallization paste was adjusted to the viscosity described in Example 1 using screen printing oil.
- the manufacturing process for an essentially annular heating element was identical in all points to the manufacturing processes of Examples 1 and 2.
- Ceramic material aluminum nitride with 10 wt .-% aluminum oxide and 3 wt .-% yttrium oxide was used.
- cards made of an unfired ceramic film were printed with the aid of the metallizing paste of Example 2 with an essentially ring-shaped and, if necessary, undulating or meandering structure.
- the superimposed conductor tracks have different shapes or lengths, their electrical resistances and heating temperatures can be adjusted over the cross section of the conductor tracks.
- the heatable zone can become almost circular due to a slight displacement of the contact surfaces and the vias on the outer edge of the component.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Surface Heating Bodies (AREA)
- Resistance Heating (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4338539A DE4338539A1 (de) | 1993-11-11 | 1993-11-11 | Verfahren zum Herstellen von keramischen Heizelementen |
DE4338539 | 1993-11-11 |
Publications (3)
Publication Number | Publication Date |
---|---|
EP0653898A2 true EP0653898A2 (fr) | 1995-05-17 |
EP0653898A3 EP0653898A3 (fr) | 1996-01-17 |
EP0653898B1 EP0653898B1 (fr) | 2003-05-14 |
Family
ID=6502368
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP94117182A Expired - Lifetime EP0653898B1 (fr) | 1993-11-11 | 1994-10-31 | Procédé de fabrication d'éléments chauffants céramiques |
Country Status (4)
Country | Link |
---|---|
US (1) | US5560851A (fr) |
EP (1) | EP0653898B1 (fr) |
JP (1) | JP3664757B2 (fr) |
DE (2) | DE4338539A1 (fr) |
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CN104582024A (zh) * | 2014-12-19 | 2015-04-29 | 苏州路路顺机电设备有限公司 | 一种分段冷却用加热管及其使用方法 |
EP2975951B1 (fr) * | 2013-03-22 | 2018-12-05 | British American Tobacco (Investments) Ltd | Chauffage de matériau à fumer |
US11318264B2 (en) | 2017-01-13 | 2022-05-03 | Nicoventures Trading Limited | Aerosol generating device and article |
US11589617B2 (en) | 2017-01-05 | 2023-02-28 | Nicoventures Trading Limited | Aerosol generating device and article |
US11623053B2 (en) | 2017-12-06 | 2023-04-11 | Nicoventures Trading Limited | Component for an aerosol-generating apparatus |
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US5726621A (en) * | 1994-09-12 | 1998-03-10 | Cooper Industries, Inc. | Ceramic chip fuses with multiple current carrying elements and a method for making the same |
US6133557A (en) * | 1995-01-31 | 2000-10-17 | Kyocera Corporation | Wafer holding member |
JPH08264269A (ja) * | 1995-03-28 | 1996-10-11 | Rohm Co Ltd | シート材に対する加熱体 |
US5657532A (en) * | 1996-01-16 | 1997-08-19 | Ferro Corporation | Method of making insulated electrical heating element using LTCC tape |
JP3826961B2 (ja) * | 1996-03-25 | 2006-09-27 | ローム株式会社 | 加熱体およびその製造方法 |
US5889462A (en) * | 1996-04-08 | 1999-03-30 | Bourns, Inc. | Multilayer thick film surge resistor network |
KR20000015858A (ko) * | 1997-03-21 | 2000-03-15 | 크리스티안 반겔 | 광물성 절연 도선 |
WO2000004085A1 (fr) | 1998-07-15 | 2000-01-27 | Thermon Manufacturing Company | Materiau de transfert thermique electriquement non conducteur, thermiquement conducteur et articles produits dans ce materiau |
JP2000268944A (ja) * | 1998-08-03 | 2000-09-29 | Denso Corp | セラミックヒータおよびその製造方法,並びにガスセンサ |
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- 1994-10-31 DE DE59410284T patent/DE59410284D1/de not_active Expired - Lifetime
- 1994-11-09 US US08/338,097 patent/US5560851A/en not_active Expired - Lifetime
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WO2007130398A2 (fr) * | 2006-05-03 | 2007-11-15 | Watlow Electric Manufacturing Company | Bornes d'alimentation pour dispositif chauffant en céramique et procédé de fabrication de ces bornes d'alimentation |
WO2007130398A3 (fr) * | 2006-05-03 | 2008-03-20 | Watlow Electric Mfg | Bornes d'alimentation pour dispositif chauffant en céramique et procédé de fabrication de ces bornes d'alimentation |
US7696455B2 (en) | 2006-05-03 | 2010-04-13 | Watlow Electric Manufacturing Company | Power terminals for ceramic heater and method of making the same |
US8242416B2 (en) | 2006-05-03 | 2012-08-14 | Watlow Electric Manufacturing Company | Methods of making ceramic heaters with power terminals |
EP2975951B1 (fr) * | 2013-03-22 | 2018-12-05 | British American Tobacco (Investments) Ltd | Chauffage de matériau à fumer |
EP3494815A1 (fr) * | 2013-03-22 | 2019-06-12 | British American Tobacco (Investments) Limited | Chauffage de matériau fumable |
CN104582024A (zh) * | 2014-12-19 | 2015-04-29 | 苏州路路顺机电设备有限公司 | 一种分段冷却用加热管及其使用方法 |
US11589617B2 (en) | 2017-01-05 | 2023-02-28 | Nicoventures Trading Limited | Aerosol generating device and article |
US11318264B2 (en) | 2017-01-13 | 2022-05-03 | Nicoventures Trading Limited | Aerosol generating device and article |
US11623053B2 (en) | 2017-12-06 | 2023-04-11 | Nicoventures Trading Limited | Component for an aerosol-generating apparatus |
Also Published As
Publication number | Publication date |
---|---|
DE4338539A1 (de) | 1995-05-18 |
EP0653898B1 (fr) | 2003-05-14 |
US5560851A (en) | 1996-10-01 |
JPH07192906A (ja) | 1995-07-28 |
DE59410284D1 (de) | 2003-06-18 |
EP0653898A3 (fr) | 1996-01-17 |
JP3664757B2 (ja) | 2005-06-29 |
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