EP0370843B1 - Plateau de polissage - Google Patents
Plateau de polissage Download PDFInfo
- Publication number
- EP0370843B1 EP0370843B1 EP89402889A EP89402889A EP0370843B1 EP 0370843 B1 EP0370843 B1 EP 0370843B1 EP 89402889 A EP89402889 A EP 89402889A EP 89402889 A EP89402889 A EP 89402889A EP 0370843 B1 EP0370843 B1 EP 0370843B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- parts
- plate according
- length
- arcs
- hard
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 10
- 239000011159 matrix material Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 description 8
- 239000011230 binding agent Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000003082 abrasive agent Substances 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 229910000881 Cu alloy Inorganic materials 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000000725 suspension Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 150000002334 glycols Chemical class 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- HGINCPLSRVDWNT-UHFFFAOYSA-N Acrolein Chemical compound C=CC=O HGINCPLSRVDWNT-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910052580 B4C Inorganic materials 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 229910001018 Cast iron Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 239000010431 corundum Substances 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000003350 kerosene Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/12—Lapping plates for working plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
- B24D7/063—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental with segments embedded in a matrix which is rubbed away during the grinding process
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S451/00—Abrading
- Y10S451/905—Metal lap
Definitions
- the present invention relates to polishing or lapping plates, circular, on the flat surface of which are exposed tender parts and hard parts in particular those used in polishing machines comprising a plate driven in rotation about its axis, a workpiece carrier off-center with respect to the plate and driven in rotation, in particular by friction, around its own axis and an abrasive suspension interposed between the parts to be polished and the plate, the parts being applied to the plate, with interposition of the suspension, with a certain pressure.
- a polishing plate is described on the planar surface of which are exposed tender parts in the form of islands disseminated regularly in a continuous hard part.
- hard parts means parts that are harder than the soft parts of the tray.
- the tender parts are distributed regularly on concentric circles of the plate. No importance is attached to the lengths of the intervals between the hard parts which, in the drawing, and in the corresponding tray sold commercially, are very large.
- the invention therefore relates to a polishing plate whose yield is increased.
- the tray according to the invention is characterized in that more than half of the arcs cut in the tender parts by an imaginary circle of radius equal to 9 / 20th of that of the disc and the center of which is at a distance from that of the disc equal at half the radius of the disc, have a length of between 0.5 and 8 mm.
- the curve, on which the arcs are cut, to take into consideration is the trace of the trajectory of a point of a piece to be polished or lapped on the plate.
- Such curves are shown in the figures. However, for the sake of simplification, they can be assimilated to the imaginary circle with an approximation sufficient for the purposes of defining the invention.
- Preferably 80% and better still 90% of the arcs have a length of between 0.5 and 5 mm and, better still, between 1 and 4 mm.
- the criterion laid down by the invention can only be satisfied if the hard parts form isolated islands in a soft matrix, which is continuous, that is to say in one piece. This embodiment is contrary to that known in the state of the art. It is further noted that it makes it possible to give the plate a better flatness.
- the islands are rectangular, the ratio of the length of the long sides to that of the short sides being between 1.5 and 3.
- the results are improved by recesses made in the long sides.
- the hard parts of the tray can be powders of cast iron, iron, copper, stainless steel, chromium, carbide, oxides, in particular alumina oxide, preferably mixed with resins such as polyester resins, acrylic resins and phenolformaldehyde resins.
- the soft parts can be metallic powders, for example copper, bronze, copper and lead alloys, brass, copper and aluminum alloys, aluminum, lead, antimony, tin and zinc, preferably also mixed with resins, in particular polyester, acrylic and phenolformaldehyde resins. In these mixtures of resins and metal powders, the resin advantageously represents from 20 to 40% of the total weight.
- the abrasives used are products having on the Mosh scale a hardness of at least 9 and, on the Knoop scale, a hardness greater than 1200.
- These abrasives, which are harder than the hard parts of the plateau, are in particular corundum, molten alumina, silicon carbide, boron carbide and diamond, the latter being preferred.
- the abrasive is in the form of a suspension of the abrasive products mentioned above, in a binder, the particle size of the abrasives being between 1 micron and 200 microns and, preferably, between 10 microns and 40 microns and the percentage abrasives in the binder being between 0.2 and 5% by weight and the percentage of abrasives in the binder being between 0.2 and 5% by weight and preferably between 1 and 3% by weight.
- the binder can consist of a mixture of water and glycols, the glycols representing from 10 to 60% of the total weight of the binder and, preferably, from 20 to 50% of this weight.
- the binder can also consist of a mixture of water and kerosene, the latter representing from 40 to 60% of the total weight of the binder.
- Figures 1 to 4 are plan views of trays according to the invention with a diameter of 230 mm
- Figure 5 is a graph illustrating the invention.
- the lapping plate represented in FIG. 1 consists of a matrix 1 made of a mixture of resin and copper, the resin representing 2/3 by weight of the mixture.
- the matrix 1 is continuous and represents the tender parts.
- the hard parts are made up of islands 2 whose faces are flush with the surface of the plate are circular, having a diameter of 25 mm.
- curve C1 which is the trace of a point of an object to be polished on the polishing plate.
- This curve C1 cuts, in the soft matrix, arcs of which more than 50% have a length of between 1 and 5 mm.
- This curve with the imaginary circle C of radius equal to half that of the disc and whose center is at a distance from that of the disc equal to half of the radius of the disc.
- This circle cuts, on the soft matrix, the arcs 3 to 13 whose respective lengths are 8, 3, 6, 12, 2, 17, 10, 7, 8, 6, 2 and 12.
- the islands 22 have substantially the shape of a rectangle whose long sides have recesses.
- the interval between two short sides 23 of a rectangle is 2 mm.
- the interval between the two recessed portions 24 of the long sides of the rectangle is also 2 mm.
- the interval between the long sides immediately adjacent to the short sides 23 is 2 mm.
- the interval in the sections connecting the recessed parts to the rest of the long sides is only 1 mm.
- the hard rectangular islands 32 are scattered in a matrix 33.
- the distance separating two islands, counted along their sides, is 2 mm.
- the hard islands 42 are disseminated in the tender matrix 41, the distance separating two islands is such that the arcs cut out in the tender parts have lengths between 0.5 and 5 mm.
- the removal of materials is 615. This value of the removal of materials is taken as an index base equal to 100.
- the yield is 144.
- Table III gives the results for a plate of the same type as that of FIG. 1, but in which the diameter of the islands is 20 mm. The percentage of islets is 70%. The yield is 141.
- Table IV gives the results for a plate of the same type as that of FIG. 1, but the islands of which have a diameter of 13 mm. The percentage of islets is 72. The yield is 135.
- Tables V to X give the results obtained with plates conforming to FIG. 2, but the intervals between the two short sides of the hard pads and the recessed portions of the long sides of the hard pads are respectively 0.5 mm, 1 mm , 2 mm, 4 mm, 6 mm and 8 mm.
- the hard island percentages are 95, 91, 81, 69, 57 and 51, respectively.
- Returns are 126, 131, 148, 137, 122, 103.
- FIG. 5 the variation in the removal of materials has been plotted as a function of the intervals between the hard parts. It is clearly seen that a maximum of material removal appears for a value close to 2 mm, the range going from 0.5 to 6 mm corresponding to material removals greater than 750. There is a close correlation between the length of the arcs cut in the tender parts and the lengths of the intervals between the hard parts.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Removal Of Insulation Or Armoring From Wires Or Cables (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Prostheses (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT89402889T ATE78205T1 (de) | 1988-11-22 | 1989-10-19 | Polierscheibe. |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR8813919 | 1988-11-22 | ||
FR8813919A FR2639278B1 (fr) | 1988-11-22 | 1988-11-22 | Plateau de polissage |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0370843A1 EP0370843A1 (fr) | 1990-05-30 |
EP0370843B1 true EP0370843B1 (fr) | 1992-07-15 |
Family
ID=9371247
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP89402889A Expired - Lifetime EP0370843B1 (fr) | 1988-11-22 | 1989-10-19 | Plateau de polissage |
Country Status (13)
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2985490B2 (ja) * | 1992-02-28 | 1999-11-29 | 信越半導体株式会社 | 研磨機の除熱方法 |
FR2740716B1 (fr) * | 1995-11-08 | 1998-01-02 | Lam Plan Sa | Rodoir et son procede de fabrication |
TW349896B (en) * | 1996-05-02 | 1999-01-11 | Applied Materials Inc | Apparatus and chemical mechanical polishing system for polishing a substrate |
CN1118354C (zh) * | 1997-05-09 | 2003-08-20 | 罗德尔控股公司 | 镶嵌式抛光垫及其制造方法 |
JP3056714B2 (ja) * | 1997-10-06 | 2000-06-26 | 松下電子工業株式会社 | 半導体基板の研磨方法 |
FR2786118B1 (fr) * | 1998-11-19 | 2000-12-22 | Lam Plan Sa | Dispositif de rodage ou polissage |
US6634929B1 (en) * | 1999-04-23 | 2003-10-21 | 3M Innovative Properties Company | Method for grinding glass |
US6616513B1 (en) * | 2000-04-07 | 2003-09-09 | Applied Materials, Inc. | Grid relief in CMP polishing pad to accurately measure pad wear, pad profile and pad wear profile |
USD502378S1 (en) * | 2002-11-18 | 2005-03-01 | Ehwa Diamond Industrial Co., Ltd. | Pad for grinding stone |
USD538313S1 (en) | 2005-09-16 | 2007-03-13 | 3M Innovative Properties Company | Abrasive article with holes |
USD536714S1 (en) | 2005-09-16 | 2007-02-13 | 3M Innovative Properties Company | Abrasive article with holes |
USD538312S1 (en) * | 2005-09-16 | 2007-03-13 | 3M Innovative Properties Company | Abrasive article with holes |
USD541317S1 (en) | 2006-02-01 | 2007-04-24 | 3M Innovative Properties Company | Abrasive article with holes |
USD532800S1 (en) * | 2006-02-01 | 2006-11-28 | 3M Innovative Properties Company | Abrasive article with holes |
USD533200S1 (en) * | 2006-02-01 | 2006-12-05 | 3M Innovative Properties Company | Abrasive article with holes |
USD543562S1 (en) | 2006-02-01 | 2007-05-29 | 3M Innovative Properties Company | Abrasive article with holes |
USD645065S1 (en) | 2008-05-22 | 2011-09-13 | 3M Innovative Properties Company | Abrasive article with holes |
WO2017033280A1 (ja) * | 2015-08-25 | 2017-03-02 | 株式会社クリスタル光学 | 研磨工具及び研磨工具の製造方法 |
CN108188945B (zh) * | 2018-03-12 | 2023-08-01 | 桂林创源金刚石有限公司 | 一种薄片齿拼合式金刚石砂轮及制作方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US342943A (en) * | 1886-06-01 | Process of and apparatus for making felt boots | ||
US1622942A (en) * | 1923-01-17 | 1927-03-29 | Elroy A Chase | Buffing wheel |
US1926321A (en) * | 1930-10-10 | 1933-09-12 | Turek Johann | Grinding wheel |
FR1104941A (fr) * | 1954-05-19 | 1955-11-25 | Perfectionnement aux meules notamment aux meules diamant | |
FR2203301A5 (enrdf_load_stackoverflow) * | 1972-10-18 | 1974-05-10 | Lam Plan Sa | |
USRE27962E (en) * | 1973-03-05 | 1974-04-02 | Abrasive disc | |
US3921342A (en) * | 1973-12-17 | 1975-11-25 | Spitfire Tool & Machine Co Inc | Lap plate |
JPS6013789B2 (ja) * | 1975-07-01 | 1985-04-09 | イプレツツ エス.エイ. | 複合板状つや出し工具 |
US4037367A (en) * | 1975-12-22 | 1977-07-26 | Kruse James A | Grinding tool |
JPS5894965A (ja) * | 1981-11-30 | 1983-06-06 | Yoshiaki Hagiuda | 複合ラツプ工具 |
US4581853A (en) * | 1982-02-01 | 1986-04-15 | Marcus Ralph S | Apparatus for internal finishing of metal parts |
-
1988
- 1988-11-22 FR FR8813919A patent/FR2639278B1/fr not_active Expired - Lifetime
-
1989
- 1989-10-19 DE DE8989402889T patent/DE68902131T2/de not_active Expired - Lifetime
- 1989-10-19 ES ES198989402889T patent/ES2033542T3/es not_active Expired - Lifetime
- 1989-10-19 EP EP89402889A patent/EP0370843B1/fr not_active Expired - Lifetime
- 1989-10-19 AT AT89402889T patent/ATE78205T1/de not_active IP Right Cessation
- 1989-11-08 HU HU895835A patent/HUT53001A/hu unknown
- 1989-11-13 US US07/434,846 patent/US5022191A/en not_active Expired - Lifetime
- 1989-11-20 JP JP1299903A patent/JPH02262957A/ja active Pending
- 1989-11-20 CA CA002003381A patent/CA2003381C/en not_active Expired - Fee Related
- 1989-11-21 IE IE372889A patent/IE62270B1/en not_active IP Right Cessation
- 1989-11-21 KR KR1019890016913A patent/KR0150779B1/ko not_active Expired - Fee Related
- 1989-11-21 DK DK584189A patent/DK169061B1/da not_active IP Right Cessation
-
1992
- 1992-09-07 GR GR920401951T patent/GR3005624T3/el unknown
Also Published As
Publication number | Publication date |
---|---|
HUT53001A (en) | 1990-09-28 |
ES2033542T3 (es) | 1993-03-16 |
DK584189D0 (da) | 1989-11-21 |
DE68902131T2 (de) | 1993-01-14 |
CA2003381A1 (en) | 1990-05-22 |
GR3005624T3 (enrdf_load_stackoverflow) | 1993-06-07 |
HU895835D0 (en) | 1990-01-28 |
FR2639278B1 (fr) | 1991-01-11 |
US5022191A (en) | 1991-06-11 |
KR900007550A (ko) | 1990-06-01 |
CA2003381C (en) | 1999-07-13 |
FR2639278A1 (fr) | 1990-05-25 |
JPH02262957A (ja) | 1990-10-25 |
KR0150779B1 (ko) | 1998-10-15 |
DK169061B1 (da) | 1994-08-08 |
DK584189A (da) | 1990-05-23 |
IE893728L (en) | 1990-05-22 |
ATE78205T1 (de) | 1992-08-15 |
IE62270B1 (en) | 1995-01-11 |
EP0370843A1 (fr) | 1990-05-30 |
DE68902131D1 (de) | 1992-08-20 |
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