EP0037535B1 - Galvanisches Bad zur Abscheidung von Gold- und Goldlegierungsüberzügen - Google Patents
Galvanisches Bad zur Abscheidung von Gold- und Goldlegierungsüberzügen Download PDFInfo
- Publication number
- EP0037535B1 EP0037535B1 EP81102316A EP81102316A EP0037535B1 EP 0037535 B1 EP0037535 B1 EP 0037535B1 EP 81102316 A EP81102316 A EP 81102316A EP 81102316 A EP81102316 A EP 81102316A EP 0037535 B1 EP0037535 B1 EP 0037535B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- gold
- bath
- acid
- potassium
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
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- 238000000576 coating method Methods 0.000 title claims abstract description 18
- 229910001020 Au alloy Inorganic materials 0.000 title claims abstract description 6
- 239000003353 gold alloy Substances 0.000 title claims abstract description 6
- 239000010931 gold Substances 0.000 title claims description 33
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims description 32
- 229910052737 gold Inorganic materials 0.000 title claims description 31
- 238000000151 deposition Methods 0.000 title description 7
- 238000007747 plating Methods 0.000 title 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 21
- 239000002253 acid Substances 0.000 claims abstract description 14
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 13
- 229910052738 indium Inorganic materials 0.000 claims abstract description 11
- 150000003839 salts Chemical class 0.000 claims abstract description 11
- 229910052718 tin Inorganic materials 0.000 claims abstract description 11
- 150000001412 amines Chemical class 0.000 claims abstract description 9
- 229910052793 cadmium Inorganic materials 0.000 claims abstract description 9
- 229910017052 cobalt Inorganic materials 0.000 claims abstract description 9
- 239000010941 cobalt Substances 0.000 claims abstract description 9
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 9
- 239000011701 zinc Substances 0.000 claims abstract description 9
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 claims abstract description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 8
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims abstract description 8
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical compound NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 claims abstract description 7
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims abstract description 6
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 6
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910052700 potassium Inorganic materials 0.000 claims abstract description 6
- 239000011591 potassium Substances 0.000 claims abstract description 6
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 17
- 229910002065 alloy metal Inorganic materials 0.000 claims description 16
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 13
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 12
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 6
- 230000008021 deposition Effects 0.000 claims description 6
- 229960003975 potassium Drugs 0.000 claims description 5
- 150000007513 acids Chemical class 0.000 claims description 4
- 239000003792 electrolyte Substances 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 229910000402 monopotassium phosphate Inorganic materials 0.000 claims description 3
- 239000001117 sulphuric acid Substances 0.000 claims description 3
- 235000019796 monopotassium phosphate Nutrition 0.000 claims description 2
- PJNZPQUBCPKICU-UHFFFAOYSA-N phosphoric acid;potassium Chemical compound [K].OP(O)(O)=O PJNZPQUBCPKICU-UHFFFAOYSA-N 0.000 claims description 2
- CHKVPAROMQMJNQ-UHFFFAOYSA-M potassium bisulfate Chemical compound [K+].OS([O-])(=O)=O CHKVPAROMQMJNQ-UHFFFAOYSA-M 0.000 claims description 2
- 239000001508 potassium citrate Substances 0.000 claims description 2
- 229960002635 potassium citrate Drugs 0.000 claims description 2
- QEEAPRPFLLJWCF-UHFFFAOYSA-K potassium citrate (anhydrous) Chemical compound [K+].[K+].[K+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O QEEAPRPFLLJWCF-UHFFFAOYSA-K 0.000 claims description 2
- 235000011082 potassium citrates Nutrition 0.000 claims description 2
- 239000001120 potassium sulphate Substances 0.000 claims 1
- 235000011149 sulphuric acid Nutrition 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 11
- 239000012535 impurity Substances 0.000 abstract description 4
- 229910052751 metal Inorganic materials 0.000 abstract description 4
- 239000002184 metal Substances 0.000 abstract description 4
- 150000002739 metals Chemical class 0.000 abstract description 2
- 238000005275 alloying Methods 0.000 abstract 1
- 239000008139 complexing agent Substances 0.000 description 9
- 239000011135 tin Substances 0.000 description 8
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
- 230000002378 acidificating effect Effects 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 229910019142 PO4 Inorganic materials 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 150000004700 cobalt complex Chemical class 0.000 description 3
- 235000021317 phosphate Nutrition 0.000 description 3
- NNFCIKHAZHQZJG-UHFFFAOYSA-N potassium cyanide Chemical compound [K+].N#[C-] NNFCIKHAZHQZJG-UHFFFAOYSA-N 0.000 description 3
- -1 tetracyano gold (III) Chemical compound 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 2
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 2
- DBVJJBKOTRCVKF-UHFFFAOYSA-N Etidronic acid Chemical compound OP(=O)(O)C(O)(C)P(O)(O)=O DBVJJBKOTRCVKF-UHFFFAOYSA-N 0.000 description 2
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 238000004070 electrodeposition Methods 0.000 description 2
- IZLAVFWQHMDDGK-UHFFFAOYSA-N gold(1+);cyanide Chemical compound [Au+].N#[C-] IZLAVFWQHMDDGK-UHFFFAOYSA-N 0.000 description 2
- MGFYIUFZLHCRTH-UHFFFAOYSA-N nitrilotriacetic acid Chemical compound OC(=O)CN(CC(O)=O)CC(O)=O MGFYIUFZLHCRTH-UHFFFAOYSA-N 0.000 description 2
- 150000003009 phosphonic acids Chemical class 0.000 description 2
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 2
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- GSMCZRMXOTVCGF-UHFFFAOYSA-N 2-bromo-1-(5-methyl-1,2-oxazol-3-yl)ethanone Chemical compound CC1=CC(C(=O)CBr)=NO1 GSMCZRMXOTVCGF-UHFFFAOYSA-N 0.000 description 1
- BDDLHHRCDSJVKV-UHFFFAOYSA-N 7028-40-2 Chemical compound CC(O)=O.CC(O)=O.CC(O)=O.CC(O)=O BDDLHHRCDSJVKV-UHFFFAOYSA-N 0.000 description 1
- FCKYPQBAHLOOJQ-UHFFFAOYSA-N Cyclohexane-1,2-diaminetetraacetic acid Chemical compound OC(=O)CN(CC(O)=O)C1CCCCC1N(CC(O)=O)CC(O)=O FCKYPQBAHLOOJQ-UHFFFAOYSA-N 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- 229910003771 Gold(I) chloride Inorganic materials 0.000 description 1
- 229910003803 Gold(III) chloride Inorganic materials 0.000 description 1
- 239000007836 KH2PO4 Substances 0.000 description 1
- QPCDCPDFJACHGM-UHFFFAOYSA-N N,N-bis{2-[bis(carboxymethyl)amino]ethyl}glycine Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(=O)O)CCN(CC(O)=O)CC(O)=O QPCDCPDFJACHGM-UHFFFAOYSA-N 0.000 description 1
- 241000080590 Niso Species 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- YDONNITUKPKTIG-UHFFFAOYSA-N [Nitrilotris(methylene)]trisphosphonic acid Chemical compound OP(O)(=O)CN(CP(O)(O)=O)CP(O)(O)=O YDONNITUKPKTIG-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000001464 adherent effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000000337 buffer salt Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 150000001860 citric acid derivatives Chemical class 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000004870 electrical engineering Methods 0.000 description 1
- HCFPRFJJTHMING-UHFFFAOYSA-N ethane-1,2-diamine;hydron;chloride Chemical compound [Cl-].NCC[NH3+] HCFPRFJJTHMING-UHFFFAOYSA-N 0.000 description 1
- 230000029142 excretion Effects 0.000 description 1
- 150000002343 gold Chemical class 0.000 description 1
- FDWREHZXQUYJFJ-UHFFFAOYSA-M gold monochloride Chemical compound [Cl-].[Au+] FDWREHZXQUYJFJ-UHFFFAOYSA-M 0.000 description 1
- RJHLTVSLYWWTEF-UHFFFAOYSA-K gold trichloride Chemical compound Cl[Au](Cl)Cl RJHLTVSLYWWTEF-UHFFFAOYSA-K 0.000 description 1
- JGLCONSOSSTGDG-UHFFFAOYSA-N gold(3+);tetracyanide Chemical compound [Au+3].N#[C-].N#[C-].N#[C-].N#[C-] JGLCONSOSSTGDG-UHFFFAOYSA-N 0.000 description 1
- 238000005338 heat storage Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910000337 indium(III) sulfate Inorganic materials 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 239000012452 mother liquor Substances 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 229960003330 pentetic acid Drugs 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 229910000343 potassium bisulfate Inorganic materials 0.000 description 1
- GNSKLFRGEWLPPA-UHFFFAOYSA-M potassium dihydrogen phosphate Chemical compound [K+].OP(O)([O-])=O GNSKLFRGEWLPPA-UHFFFAOYSA-M 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 1
- 229960001124 trientine Drugs 0.000 description 1
- 239000010930 yellow gold Substances 0.000 description 1
- 229910001097 yellow gold Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/62—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of gold
Definitions
- the invention relates to a gold bath for the electrodeposition of high-gloss and ductile gold alloy coatings based on potassium cyanoaurate (III), which contains an acid, at least one of the alloy metals cobalt, nickel, indium, tin, zinc or cadmium in the form of water-soluble salts and a complexing agent contains a pH of less than 3.
- III potassium cyanoaurate
- the majority of gold coatings are deposited today from weakly acidic electrolytes that operate in the pH range from 3.5 to 5. They contain the gold in the form of potassium dicyanoaurate (I), KAu (CN), and as a buffer salts of weak inorganic or organic acids such as phosphates, citrates or phosphonates.
- the properties of the deposited layers are strongly influenced by adding metal salts, especially nickel, cobalt or indium. These baths are obtained under conditions in which 0.2 to 0.5% of Ni or Co are also deposited, coatings which are shiny, have a hardness of 150 to 180 HV and have good resistance to mechanical abrasion. From about 5 ⁇ m, these coatings are practically non-porous. They are characterized by good electrical conductivity and low contact resistance.
- the coatings from these baths also have considerable disadvantages.
- Your ductility is low. With slight mechanical deformation, cracks form. They contain a relatively large amount (approx. 1%) of non-metallic impurities, which presumably lead to malfunctions in low-voltage electrical contacts. Presumably also because of these impurities, the contact resistance does not remain constant during thermal loading and affects the function of electrical devices.
- the content of the alloy metal in the coating is strongly dependent on the current density and the pH value, so that the working conditions must be kept within narrow limits in order to obtain coatings of constant quality.
- the average current density is limited to about 1 A / dm l , the bath temperature must not be higher than 40 ° C, and in most baths the pH must be kept between 3.5 and 4.
- the layers are often only milky or matt. It is not possible to work at pH values below 3.5, since the KAu (CN) 2 disintegrates at pH 3 with the excretion of gold cyanide, AuCN. Nevertheless, attempts were made to use such baths at pH values below 3 (for example DE-AS No. 1262723, US Pat. No. 2978390), but the results were unsatisfactory.
- No. 3,598,706 describes a process for the preparation of tetracyano gold (III) acid and a bath on this basis.
- No. 4168214 describes a hydrochloric acid bath for the pre-gilding of stainless steel, the tetracyano gold (III) complex being formed by reaction of gold (III) chloride with potassium cyanide in the bath and a pH between 0.1 and 1. 5 is set.
- This bath also contains alloy metals such as nickel, cobalt, tin or indium, and ethylenediamine hydrochloride as a complexing agent.
- a pure alloy bath for the deposition of gold / tin coatings based on KAu (CN) 4 in the hydrochloric acid medium is claimed in DE-OS No. 2658003.
- Baths in which the trivalent gold is present have the disadvantage compared to baths based on monovalent gold salts that only a third of the amount of gold is deposited due to the differences in value with the same current densities and times.
- This disadvantage can only be compensated for by using correspondingly high current densities.
- Another major disadvantage is the high chloride content in these baths, which causes an unpleasant chlorine development at the anode. If the baths also contain hydrochloric acid, there are also corrosion problems on the systems.
- potassium cyanoaurate (III) which contains an acid, at least one of the alloy metals cobalt, nickel, indium, tin, zinc or cadmium in the form of water-soluble salts and a complexing agent contains at a pH value of less than 3, which provides high-gloss and ductile coatings even at high current densities and at which no chlorine development occurs.
- the electrolyte contains, in addition to an amine, an aminocarboxylic acid or phosphonic acid as complexing agent, 20 to 200 g / l of sulfuric acid, phosphoric acid, citric acid or mixtures thereof.
- a pH range from 0.4 to 2.5 is particularly advantageous.
- Baths containing 1 to 20 g / l gold in the form of catium cyanoaurate (III), 10 to 200 g / l sulfuric acid, phosphoric acid and / or citric acid, 0.1 to 20 g / l at least one of the alloy metals cobalt, nickel have proven successful , Indium, zinc, tin or cadmium in the form of water-soluble salts and 1 to 100 g / l of an amine, an aminocarboxylic acid or a phosphonic acid, which are able to form a complex with the alloy metal.
- salts of the acids used such as, for example, potassium dihydrogen phosphate, potassium hydrogen sulfate or potassium citrate.
- complex shiny gold layers can be deposited over a wide current density range from acidic electrolytes based on the tetracyanoaurate (III) if the baths contain alloy metals and at the same time suitable complexing agents and suitable acids.
- Alloy metals can be Co, Ni, In, Sn, Zn or Cd.
- Suitable complexing agents are amines, aminocarboxylic acids or phosphonic acids. If the alloy metals are only added in the form of simple salts, as in the baths known hitherto, the metal distribution in the coating is uneven, since in general the amount of the alloy metal deposited is strongly dependent on the current density.
- the properties of the deposited layers from the bath according to the invention have particular advantages compared to the coatings from the so-called weakly acidic gold baths.
- the layers are not only hard and wear-resistant, but also very ductile. They can be deposited in a thin layer with little pores.
- the contact resistance is low and remains constant even during heat storage.
- the content of non-metallic impurities is very low.
- the bath according to the invention is advantageously used in the pH range from 0.4 to 2.5. Both significantly lower and significantly higher pH values lead to the decomposition of the gold complex with the separation of insoluble gold (I) cyanide.
- the bath is preferably operated at pH values between 0.6 and 2.0.
- the bath can be used at room temperature, but higher temperatures up to 60 ° C are advantageous to increase the deposition rate.
- the applicable current density range is extremely wide. Shiny layers are achieved above all with current densities of 0.2 to at least 10 A / dm 2 .
- the gold content is increased to 8 g / l, the bath is heated to 50 ° C. and the deposition is repeated at a current density of 8 A / dm 2 . 3 gm of gold are now deposited in 10 minutes. The cover is also light yellow and shiny. Approx. 0.5% cobalt is detected in both layers.
- the copper base of the second sample is dissolved with 3: 1 dilute nitric acid. A ductile gold foil is obtained which does not break even when it is bent.
- the cobalt complex solution used when preparing the bath becomes like prepared as follows: 47.8 g of CoSO 4 .7H 2 O, corresponding to 10 g of Co, are dissolved in about 600 ml of water with heating, 222 ml of 1-hydroxyethane-1,1-diphosphonic acid are added 60% and made up to 1 liter.
- An adherent gold layer of 0.2 ⁇ m is deposited on a cathode made of 18Cr8Ni steel in 5 min at a current density of 2 A / dm 2 .
- the pH is adjusted to 2.0 and the bath is heated to 40 ° C.
- a current density of 5 A / dm l a 2.5 ⁇ m thick glossy gold layer is deposited on a copper sheet in 10 minutes.
- Gold contains 0.4% Ni.
- the pH of the bath is adjusted to 1.8.
- a shiny, light yellow gold layer of 2 ⁇ m thickness is deposited on a nickel-plated copper sheet in 10 min.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AT81102316T ATE6527T1 (de) | 1980-04-03 | 1981-03-27 | Galvanisches bad zur abscheidung von gold- und goldlegierungsueberzuegen. |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3012999A DE3012999C2 (de) | 1980-04-03 | 1980-04-03 | Bad und Verfahren zur galvanischen Abscheidung von hochglänzenden und duktiler Goldlegierungsüberzügen |
| DE3012999 | 1980-04-03 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| EP0037535A2 EP0037535A2 (de) | 1981-10-14 |
| EP0037535A3 EP0037535A3 (en) | 1981-11-04 |
| EP0037535B1 true EP0037535B1 (de) | 1984-03-07 |
Family
ID=6099206
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP81102316A Expired EP0037535B1 (de) | 1980-04-03 | 1981-03-27 | Galvanisches Bad zur Abscheidung von Gold- und Goldlegierungsüberzügen |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US4391679A (enrdf_load_stackoverflow) |
| EP (1) | EP0037535B1 (enrdf_load_stackoverflow) |
| JP (1) | JPS56152989A (enrdf_load_stackoverflow) |
| AT (1) | ATE6527T1 (enrdf_load_stackoverflow) |
| DE (1) | DE3012999C2 (enrdf_load_stackoverflow) |
| HK (1) | HK30986A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4040526A1 (de) * | 1989-12-19 | 1991-06-20 | H E Finishing Sa | Bad zur galvanischen abscheidung von goldlegierungen |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4470886A (en) * | 1983-01-04 | 1984-09-11 | Omi International Corporation | Gold alloy electroplating bath and process |
| DE3347594A1 (de) * | 1983-01-04 | 1984-07-12 | Omi International Corp., Warren, Mich. | Bad zur galvanischen abscheidung einer verschleissfesten goldlegierung und verfahren zur abscheidung einer verschleissfesten goldlegierung unter verwendung dieses bades |
| US4559121A (en) * | 1983-09-12 | 1985-12-17 | Vac-Tec Systems, Inc. | Method and apparatus for evaporation arc stabilization for permeable targets |
| US4448659A (en) * | 1983-09-12 | 1984-05-15 | Vac-Tec Systems, Inc. | Method and apparatus for evaporation arc stabilization including initial target cleaning |
| US4559125A (en) * | 1983-09-12 | 1985-12-17 | Vac-Tec Systems, Inc. | Apparatus for evaporation arc stabilization during the initial clean-up of an arc target |
| CH665656A5 (fr) * | 1983-12-29 | 1988-05-31 | Heinz Emmenegger | Bain d'or acide et utilisation de ce bain en electroplastie. |
| DE3505473C1 (de) * | 1985-02-16 | 1986-06-05 | Degussa Ag, 6000 Frankfurt | Bad zur galvanischen Abscheidung von Gold-Indium-Legierungsueberzuegen |
| DE3509367C1 (de) * | 1985-03-15 | 1986-08-14 | Degussa Ag, 6000 Frankfurt | Bad und Verfahren zur galvanischen Abscheidung von Gold/Zinn-Legierungsueberzuegen |
| CA2365749A1 (en) * | 2001-12-20 | 2003-06-20 | The Governors Of The University Of Alberta | An electrodeposition process and a layered composite material produced thereby |
| WO2005110287A2 (en) * | 2004-05-11 | 2005-11-24 | Technic, Inc. | Electroplating solution for gold-tin eutectic alloy |
| JP4945193B2 (ja) * | 2006-08-21 | 2012-06-06 | ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． | 硬質金合金めっき液 |
| JP5317433B2 (ja) | 2007-06-06 | 2013-10-16 | ローム・アンド・ハース・エレクトロニック・マテリアルズ，エル．エル．シー． | 酸性金合金めっき液 |
| US20090114345A1 (en) * | 2007-11-07 | 2009-05-07 | Sumitomo Metal Mining Co., Ltd. | Method for manufacturing a substrate for mounting a semiconductor element |
| DE102011114931B4 (de) | 2011-10-06 | 2013-09-05 | Umicore Galvanotechnik Gmbh | Verfahren zur selektiveren, elektrolytischen Abscheidung von Gold oder einer Goldlegierung |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2978390A (en) * | 1957-07-22 | 1961-04-04 | Bell Telephone Labor Inc | Gold plating solutions |
| DE1262723B (de) * | 1964-12-16 | 1968-03-07 | Philippi & Co K G | Galvanisches Gold- oder Goldlegierungsbad |
| US3598706A (en) * | 1967-12-11 | 1971-08-10 | Trifari Krussman And Fishel In | Acid gold plating baths |
| ZA734253B (en) * | 1972-07-10 | 1975-02-26 | Degussa | Electrolytic bath |
| US3989800A (en) * | 1973-12-26 | 1976-11-02 | Motorola, Inc. | Alkali metal gold cyanide method |
| US4073700A (en) * | 1975-03-10 | 1978-02-14 | Weisberg Alfred M | Process for producing by electrodeposition bright deposits of gold and its alloys |
| US4013523A (en) * | 1975-12-24 | 1977-03-22 | Oxy Metal Industries Corporation | Tin-gold electroplating bath and process |
| US4168214A (en) * | 1978-06-14 | 1979-09-18 | American Chemical And Refining Company, Inc. | Gold electroplating bath and method of making the same |
-
1980
- 1980-04-03 DE DE3012999A patent/DE3012999C2/de not_active Expired
-
1981
- 1981-03-27 AT AT81102316T patent/ATE6527T1/de not_active IP Right Cessation
- 1981-03-27 EP EP81102316A patent/EP0037535B1/de not_active Expired
- 1981-04-02 US US06/250,142 patent/US4391679A/en not_active Expired - Lifetime
- 1981-04-03 JP JP4950781A patent/JPS56152989A/ja active Granted
-
1986
- 1986-05-01 HK HK309/86A patent/HK30986A/xx not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4040526A1 (de) * | 1989-12-19 | 1991-06-20 | H E Finishing Sa | Bad zur galvanischen abscheidung von goldlegierungen |
| DE4040526C3 (de) * | 1989-12-19 | 1998-05-20 | H E Finishing Sa | Bad zur galvanischen Abscheidung von Goldlegierungen |
Also Published As
| Publication number | Publication date |
|---|---|
| HK30986A (en) | 1986-05-09 |
| EP0037535A2 (de) | 1981-10-14 |
| EP0037535A3 (en) | 1981-11-04 |
| DE3012999C2 (de) | 1984-02-16 |
| ATE6527T1 (de) | 1984-03-15 |
| DE3012999A1 (de) | 1981-10-15 |
| JPS56152989A (en) | 1981-11-26 |
| US4391679A (en) | 1983-07-05 |
| JPH0146597B2 (enrdf_load_stackoverflow) | 1989-10-09 |
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