EE03728B1 - Meetod ja seade elektroonikadetailide varjestamiseks montaaziplaadil - Google Patents

Meetod ja seade elektroonikadetailide varjestamiseks montaaziplaadil

Info

Publication number
EE03728B1
EE03728B1 EEP199900170A EE9900170A EE03728B1 EE 03728 B1 EE03728 B1 EE 03728B1 EE P199900170 A EEP199900170 A EE P199900170A EE 9900170 A EE9900170 A EE 9900170A EE 03728 B1 EE03728 B1 EE 03728B1
Authority
EE
Estonia
Prior art keywords
mounting plate
electronic components
shielding electronic
shielding
components
Prior art date
Application number
EEP199900170A
Other languages
English (en)
Estonian (et)
Other versions
EE9900170A (et
Inventor
Larsson Anders
Original Assignee
Telefonaktiebolaget Lm Ericsson (Publ)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefonaktiebolaget Lm Ericsson (Publ) filed Critical Telefonaktiebolaget Lm Ericsson (Publ)
Publication of EE9900170A publication Critical patent/EE9900170A/xx
Publication of EE03728B1 publication Critical patent/EE03728B1/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
EEP199900170A 1996-10-28 1997-10-23 Meetod ja seade elektroonikadetailide varjestamiseks montaaziplaadil EE03728B1 (et)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE9603931A SE511426C2 (sv) 1996-10-28 1996-10-28 Anordning och förfarande vid avskärmning av elektronik
PCT/SE1997/001771 WO1998019508A1 (en) 1996-10-28 1997-10-23 A method and a device for shielding of electronic components on a circuit board

Publications (2)

Publication Number Publication Date
EE9900170A EE9900170A (et) 1999-12-15
EE03728B1 true EE03728B1 (et) 2002-04-15

Family

ID=20404394

Family Applications (1)

Application Number Title Priority Date Filing Date
EEP199900170A EE03728B1 (et) 1996-10-28 1997-10-23 Meetod ja seade elektroonikadetailide varjestamiseks montaaziplaadil

Country Status (12)

Country Link
US (1) US6192577B1 (zh)
EP (1) EP0934688B1 (zh)
JP (1) JP3920355B2 (zh)
KR (1) KR100489860B1 (zh)
CN (1) CN1149907C (zh)
AU (1) AU735228B2 (zh)
BR (1) BR9712584A (zh)
DE (1) DE69732045T2 (zh)
EE (1) EE03728B1 (zh)
HK (1) HK1025211A1 (zh)
SE (1) SE511426C2 (zh)
WO (1) WO1998019508A1 (zh)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7061774B2 (en) * 2000-12-18 2006-06-13 Franklin Zhigang Zhang Computer board with dual shield housing and heat sink expansion zone apparatuses
US6377475B1 (en) * 2001-02-26 2002-04-23 Gore Enterprise Holdings, Inc. Removable electromagnetic interference shield
US6770822B2 (en) * 2002-02-22 2004-08-03 Bridgewave Communications, Inc. High frequency device packages and methods
JP4195975B2 (ja) * 2002-10-16 2008-12-17 パナソニック株式会社 高周波装置
WO2004038555A2 (en) 2002-10-22 2004-05-06 Isys Technologies Robust customizable computer processing system
BR0315570A (pt) 2002-10-22 2005-08-23 Jason A Sullivan Módulo de controle de processamento não-periféricos possuindo propriedades aperfeiçoadas de dissipação de calor
US7075784B2 (en) * 2002-10-22 2006-07-11 Sullivan Jason A Systems and methods for providing a dynamically modular processing unit
EP1445999B1 (en) * 2003-02-07 2007-10-03 Sony Ericsson Mobile Communications AB A method of providing a PWB with a shield can and a PWB therefor
US8399972B2 (en) * 2004-03-04 2013-03-19 Skyworks Solutions, Inc. Overmolded semiconductor package with a wirebond cage for EMI shielding
US20080112151A1 (en) * 2004-03-04 2008-05-15 Skyworks Solutions, Inc. Overmolded electronic module with an integrated electromagnetic shield using SMT shield wall components
US9545009B2 (en) 2007-05-23 2017-01-10 Spectra Logic, Corporation Passive alterable electrical component
US8581113B2 (en) 2007-12-19 2013-11-12 Bridgewave Communications, Inc. Low cost high frequency device package and methods
TWM380706U (en) * 2009-12-10 2010-05-11 Wistron Corp Metal shielding casing and the combination thereof with circuit board
US20120002455A1 (en) * 2010-06-07 2012-01-05 Sullivan Jason A Miniturization techniques, systems, and apparatus relatng to power supplies, memory, interconnections, and leds
KR20120045893A (ko) * 2010-11-01 2012-05-09 삼성전기주식회사 반도체 패키지 모듈
US9679869B2 (en) 2011-09-02 2017-06-13 Skyworks Solutions, Inc. Transmission line for high performance radio frequency applications
US20130082365A1 (en) * 2011-10-03 2013-04-04 International Business Machines Corporation Interposer for ESD, EMI, and EMC
CN103052285A (zh) * 2011-10-14 2013-04-17 成都锐奕信息技术有限公司 带屏蔽框和开有减胶槽的卡片式无线定位终端壳体结构
CN102365014A (zh) * 2011-10-20 2012-02-29 镇江船舶电器有限责任公司 电器箱柜面板元件的屏蔽电磁泄漏结构
US8948712B2 (en) 2012-05-31 2015-02-03 Skyworks Solutions, Inc. Via density and placement in radio frequency shielding applications
KR20190058711A (ko) 2012-06-14 2019-05-29 스카이워크스 솔루션즈, 인코포레이티드 고조파 종단 회로를 포함하는 전력 증폭기 모듈 및 관련된 시스템, 장치, 및 방법
US9295157B2 (en) 2012-07-13 2016-03-22 Skyworks Solutions, Inc. Racetrack design in radio frequency shielding applications
US10206317B2 (en) * 2015-06-29 2019-02-12 Microsoft Technology Licensing, Llc Modular radio frequency shielding
EP3570651A4 (en) * 2017-01-11 2020-11-18 Ningbo Sunny Opotech Co., Ltd. CIRCUIT BOARD, SHAPED LIGHT SENSITIVE ASSEMBLY AND MANUFACTURING METHOD FOR IT, PHOTOGRAPHY MODULE AND ELECTRONIC DEVICE

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2029645B (en) * 1978-08-07 1982-07-14 Mitsumi Electric Co Ltd High-frequency circuit device
US4626963A (en) 1985-02-28 1986-12-02 Rca Corporation Wave solderable RF shield member for a printed circuit board
SU1478388A1 (ru) 1986-02-24 1989-05-07 Предприятие П/Я А-7217 Экранирующий корпус дл радиоэлектронной аппаратуры
JPS62162891U (zh) * 1986-04-03 1987-10-16
US4717990A (en) * 1986-05-30 1988-01-05 Motorola, Inc. Double-shielded housing for RF circuitry
US4761881A (en) * 1986-09-15 1988-08-09 International Business Machines Corporation Single step solder process
US4717989A (en) 1987-03-30 1988-01-05 Motorola Inc. Heat sink, EMI shield and controller module assembly for a portable radio transceiver
US4838475A (en) 1987-08-28 1989-06-13 Motorola, Inc. Method and apparatus for EMI/RFI shielding an infrared energy reflow soldered device
US4890199A (en) 1988-11-04 1989-12-26 Motorola, Inc. Miniature shield with opposing cantilever spring fingers
FI85794C (fi) 1989-07-05 1992-05-25 Nokia Mobira Oy Foerfarande foer att skydda ett kretskort eller en del daerav mot stoerningar som alstrats av elektromagnetisk interferens, och skyddshoelje foer anvaendning i foerfarandet.
US5054193A (en) * 1989-08-28 1991-10-08 Hewlett-Packard Company Printed circuit board fixture and a method of assembling a printed circuit board
JPH03276337A (ja) 1990-03-27 1991-12-06 Toshiba Corp マイクロコントローラ
US5153379A (en) 1990-10-09 1992-10-06 Motorola, Inc. Shielded low-profile electronic component assembly
FR2674680B1 (fr) * 1991-03-26 1993-12-03 Thomson Csf Procede de realisation de connexions coaxiales pour composant electronique, et boitier de composant comportant de telles connexions.
US5202699A (en) 1991-05-30 1993-04-13 Confier Corporation Integrated MMDS antenna and down converter
FI109960B (fi) 1991-09-19 2002-10-31 Nokia Corp Elektroninen laite
US5365410A (en) 1991-10-22 1994-11-15 Nokia Mobile Phones Ltd. Electromagnetic compatibility enclosure
SG48844A1 (en) * 1991-12-27 1998-05-18 Murata Manufacturing Co Piezoelectric acceleration sensor
JP2639280B2 (ja) * 1992-06-10 1997-08-06 松下電器産業株式会社 高密度回路モジュールの製造方法
US5369552A (en) 1992-07-14 1994-11-29 Ncr Corporation Multi-chip module with multiple compartments
DE9214394U1 (de) 1992-10-23 1992-12-17 Siemens AG, 8000 München Befestigung einer Abschirmung mit einer Leiterplatte
JPH06164265A (ja) 1992-11-16 1994-06-10 Toshiba Corp マイクロ波増幅器
US5880403A (en) * 1994-04-01 1999-03-09 Space Electronics, Inc. Radiation shielding of three dimensional multi-chip modules
JPH07116830A (ja) 1993-10-26 1995-05-09 Sony Corp 金属部材の固定方法及び金属部材の固定装置
JPH07142906A (ja) 1993-11-15 1995-06-02 Fuji Elelctrochem Co Ltd 誘電体フィルタの蓋体取付け構造
JPH07212060A (ja) 1994-01-12 1995-08-11 Matsushita Electric Ind Co Ltd 回路モジュール
FI941407A (fi) 1994-03-25 1995-09-26 Lk Products Oy Suodattimen metallikotelo
JP3120655B2 (ja) 1994-04-13 2000-12-25 株式会社村田製作所 シールド用枠体の製造方法
JP3621716B2 (ja) 1994-05-09 2005-02-16 富士通株式会社 高周波プリント回路板ユニット構造
JPH08111580A (ja) 1994-10-12 1996-04-30 Yagi Antenna Co Ltd シールドケースの基板はんだ付け方法
US5599208A (en) 1994-12-14 1997-02-04 The Whitaker Corporation Electrical connector with printed circuit board programmable filter
JP3208075B2 (ja) * 1996-12-02 2001-09-10 アルプス電気株式会社 シールドケース

Also Published As

Publication number Publication date
SE511426C2 (sv) 1999-09-27
AU4888797A (en) 1998-05-22
SE9603931L (sv) 1998-04-29
AU735228B2 (en) 2001-07-05
CN1149907C (zh) 2004-05-12
HK1025211A1 (en) 2000-11-03
CN1242138A (zh) 2000-01-19
BR9712584A (pt) 1999-10-26
KR20000052821A (ko) 2000-08-25
WO1998019508A1 (en) 1998-05-07
DE69732045T2 (de) 2005-06-23
EE9900170A (et) 1999-12-15
EP0934688A1 (en) 1999-08-11
JP2001504990A (ja) 2001-04-10
EP0934688B1 (en) 2004-12-22
JP3920355B2 (ja) 2007-05-30
KR100489860B1 (ko) 2005-05-17
DE69732045D1 (de) 2005-01-27
US6192577B1 (en) 2001-02-27
SE9603931D0 (sv) 1996-10-28

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Legal Events

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KB4A Valid patent at the end of a year

Effective date: 20021231

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HE1A Change of address
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KB4A Valid patent at the end of a year

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KB4A Valid patent at the end of a year

Effective date: 20091231

KB4A Valid patent at the end of a year

Effective date: 20101231

MM4A Lapsed by not paying the annual fees

Effective date: 20141023