US5776220A
(en)
*
|
1994-09-19 |
1998-07-07 |
Corning Incorporated |
Method and apparatus for breaking brittle materials
|
US5622540A
(en)
*
|
1994-09-19 |
1997-04-22 |
Corning Incorporated |
Method for breaking a glass sheet
|
WO1996020062A1
(fr)
*
|
1994-12-23 |
1996-07-04 |
Kondratenko Vladimir Stepanovi |
Procede de coupe de materiaux non metalliques et dispositif de mise en ×uvre dudit procede
|
JP5081086B2
(ja)
*
|
1995-06-26 |
2012-11-21 |
コーニング インコーポレイテッド |
平面ガラスシートの製造方法およびガラス基板の分割方法
|
JPH09150286A
(ja)
*
|
1995-06-26 |
1997-06-10 |
Corning Inc |
脆弱性材料切断方法および装置
|
JPH0929472A
(ja)
*
|
1995-07-14 |
1997-02-04 |
Hitachi Ltd |
割断方法、割断装置及びチップ材料
|
JP3923526B2
(ja)
*
|
1995-08-31 |
2007-06-06 |
コーニング インコーポレイテッド |
壊れやすい材料の分断方法および装置
|
US5816897A
(en)
*
|
1996-09-16 |
1998-10-06 |
Corning Incorporated |
Method and apparatus for edge finishing glass
|
JPH10128567A
(ja)
*
|
1996-10-30 |
1998-05-19 |
Nec Kansai Ltd |
レーザ割断方法
|
MY120533A
(en)
*
|
1997-04-14 |
2005-11-30 |
Schott Ag |
Method and apparatus for cutting through a flat workpiece made of brittle material, especially glass.
|
DE19715537C2
(de)
*
|
1997-04-14 |
1999-08-05 |
Schott Glas |
Verfahren und Vorrichtung zum Durchtrennen von flachen Werkstücken aus sprödem Material, insbesondere aus Glas
|
AU8673898A
(en)
|
1997-08-07 |
1999-03-01 |
Pharos Optics, Inc. |
Dental laser and method of using same
|
EP0903327A3
(en)
*
|
1997-09-17 |
1999-07-28 |
Nec Corporation |
Method for separating non-metal material
|
JP3498895B2
(ja)
*
|
1997-09-25 |
2004-02-23 |
シャープ株式会社 |
基板の切断方法および表示パネルの製造方法
|
DE19809103A1
(de)
*
|
1998-03-04 |
1999-09-23 |
Jenoptik Jena Gmbh |
Optische Anordnung zur Strahlformung
|
FR2779755B1
(fr)
*
|
1998-06-10 |
2000-07-21 |
Saint Gobain Vitrage |
Panneau transparent pour batiment ameliorant la luminosite naturelle a l'interieur du batiment
|
DE19830237C2
(de)
*
|
1998-07-07 |
2001-10-04 |
Schott Spezialglas Gmbh |
Verfahren und Vorrichtung zum Schneiden eines Werkstückes aus sprödbrüchigem Werkstoff
|
US6407360B1
(en)
*
|
1998-08-26 |
2002-06-18 |
Samsung Electronics, Co., Ltd. |
Laser cutting apparatus and method
|
DE19851353C1
(de)
|
1998-11-06 |
1999-10-07 |
Schott Glas |
Verfahren und Vorrichtung zum Schneiden eines Laminats aus einem sprödbrüchigen Werkstoff und einem Kunststoff
|
US6420678B1
(en)
|
1998-12-01 |
2002-07-16 |
Brian L. Hoekstra |
Method for separating non-metallic substrates
|
US6259058B1
(en)
|
1998-12-01 |
2001-07-10 |
Accudyne Display And Semiconductor Systems, Inc. |
Apparatus for separating non-metallic substrates
|
US6252197B1
(en)
|
1998-12-01 |
2001-06-26 |
Accudyne Display And Semiconductor Systems, Inc. |
Method and apparatus for separating non-metallic substrates utilizing a supplemental mechanical force applicator
|
DE19856347C2
(de)
*
|
1998-12-07 |
2002-12-19 |
Schott Spezialglas Gmbh |
Verfahren und Vorrichtung zum Schneiden eines dünnen Werkstücks aus sprödbrüchigem Werkstoff
|
KR100553119B1
(ko)
*
|
1999-01-15 |
2006-02-22 |
삼성전자주식회사 |
레이저를 이용한 절단장치
|
KR100543367B1
(ko)
*
|
1999-01-15 |
2006-01-20 |
삼성전자주식회사 |
액정표시기 패널의 절단방법
|
US6327875B1
(en)
|
1999-03-09 |
2001-12-11 |
Corning Incorporated |
Control of median crack depth in laser scoring
|
US6325704B1
(en)
*
|
1999-06-14 |
2001-12-04 |
Corning Incorporated |
Method for finishing edges of glass sheets
|
KR100626983B1
(ko)
|
1999-06-18 |
2006-09-22 |
미쓰보시 다이야몬도 고교 가부시키가이샤 |
레이저를 이용한 스크라이브 방법
|
US6795274B1
(en)
|
1999-09-07 |
2004-09-21 |
Asahi Glass Company, Ltd. |
Method for manufacturing a substantially circular substrate by utilizing scribing
|
US6664503B1
(en)
|
1999-09-07 |
2003-12-16 |
Asahi Glass Company, Ltd. |
Method for manufacturing a magnetic disk
|
DE19952331C1
(de)
*
|
1999-10-29 |
2001-08-30 |
Schott Spezialglas Gmbh |
Verfahren und Vorrichtung zum schnellen Schneiden eines Werkstücks aus sprödbrüchigem Werkstoff mittels Laserstrahlen
|
AU1227501A
(en)
*
|
1999-11-01 |
2001-05-14 |
P.T.G. Precision Technology Center Llc |
Laser driven glass cut-initiation
|
US6501047B1
(en)
|
1999-11-19 |
2002-12-31 |
Seagate Technology Llc |
Laser-scribing brittle substrates
|
US6489588B1
(en)
|
1999-11-24 |
2002-12-03 |
Applied Photonics, Inc. |
Method and apparatus for separating non-metallic materials
|
DE19959921C1
(de)
*
|
1999-12-11 |
2001-10-18 |
Schott Spezialglas Gmbh |
Verfahren und Vorrichtung zum Durchtrennen von flachen Werkstücken aus sprödbrüchigem Material
|
DE19963939B4
(de)
*
|
1999-12-31 |
2004-11-04 |
Schott Spezialglas Gmbh |
Verfahren und Vorrichtung zum Durchtrennen von flachen Werkstücken aus sprödbrüchigem Material
|
DE10001292C1
(de)
*
|
2000-01-14 |
2001-11-29 |
Schott Spezialglas Gmbh |
Verfahren und Vorrichtung zum Heraustrennen von kreisringförmigen Glasscheiben aus Glasplatten
|
DE10016628A1
(de)
|
2000-04-04 |
2001-10-18 |
Schott Glas |
Verfahren zum Herstellen von kleinen Dünnglasscheiben und größere Dünnglasscheibe als Halbfabrikat für dieses Herstellen
|
KR100634976B1
(ko)
*
|
2000-04-27 |
2006-10-16 |
미쓰보시 다이야몬도 고교 가부시키가이샤 |
유리 절단장치
|
AU2001261402A1
(en)
*
|
2000-05-11 |
2001-11-20 |
Ptg Precision Technology Center Limited Llc |
System for cutting brittle materials
|
JP2001345289A
(ja)
*
|
2000-05-31 |
2001-12-14 |
Nec Corp |
半導体装置の製造方法
|
DE10030388A1
(de)
*
|
2000-06-21 |
2002-01-03 |
Schott Glas |
Verfahren zur Herstellung von Glassubstraten für elektronische Speichermedien
|
JP4786783B2
(ja)
|
2000-08-18 |
2011-10-05 |
日本板硝子株式会社 |
ガラス板の切断方法及び記録媒体用ガラス円盤
|
DE10041519C1
(de)
|
2000-08-24 |
2001-11-22 |
Schott Spezialglas Gmbh |
Verfahren und Vorrichtung zum Durchschneiden einer Flachglasplatte in mehrere Rechteckplatten
|
JP4659300B2
(ja)
*
|
2000-09-13 |
2011-03-30 |
浜松ホトニクス株式会社 |
レーザ加工方法及び半導体チップの製造方法
|
KR100673073B1
(ko)
*
|
2000-10-21 |
2007-01-22 |
삼성전자주식회사 |
레이저 빔을 이용한 비금속 기판의 절단 방법 및 장치
|
KR20020047479A
(ko)
*
|
2000-12-13 |
2002-06-22 |
김경섭 |
비금속재료의 레이저 절단 방법
|
US20020170318A1
(en)
*
|
2001-04-02 |
2002-11-21 |
Andreas Gartner |
Brief summary of the invention
|
TW592867B
(en)
*
|
2001-06-11 |
2004-06-21 |
Mitsuboshi Diamond Ind Co Ltd |
An apparatus and a method for scribing brittle substrates
|
RU2206525C2
(ru)
*
|
2001-07-25 |
2003-06-20 |
Кондратенко Владимир Степанович |
Способ резки хрупких неметаллических материалов
|
EP1422201A4
(de)
*
|
2001-07-25 |
2008-07-30 |
Vladimir Stepanovi Kondratenko |
Schneidverfahren für spröde nichtmetallmaterialien (zwei varianten)
|
TW583046B
(en)
*
|
2001-08-10 |
2004-04-11 |
Mitsuboshi Diamond Ind Co Ltd |
Method and device for scribing brittle material substrate
|
US7749867B2
(en)
*
|
2002-03-12 |
2010-07-06 |
Hamamatsu Photonics K.K. |
Method of cutting processed object
|
ES2377521T3
(es)
|
2002-03-12 |
2012-03-28 |
Hamamatsu Photonics K.K. |
Método para dividir un sustrato
|
TWI326626B
(en)
*
|
2002-03-12 |
2010-07-01 |
Hamamatsu Photonics Kk |
Laser processing method
|
US6787732B1
(en)
|
2002-04-02 |
2004-09-07 |
Seagate Technology Llc |
Method for laser-scribing brittle substrates and apparatus therefor
|
US6744009B1
(en)
|
2002-04-02 |
2004-06-01 |
Seagate Technology Llc |
Combined laser-scribing and laser-breaking for shaping of brittle substrates
|
FR2839508B1
(fr)
*
|
2002-05-07 |
2005-03-04 |
Saint Gobain |
Vitrage decoupe sans rompage
|
JP2004042423A
(ja)
*
|
2002-07-11 |
2004-02-12 |
Mitsuboshi Diamond Industrial Co Ltd |
スクライブ装置
|
TWI520269B
(zh)
|
2002-12-03 |
2016-02-01 |
Hamamatsu Photonics Kk |
Cutting method of semiconductor substrate
|
KR100497820B1
(ko)
*
|
2003-01-06 |
2005-07-01 |
로체 시스템즈(주) |
유리판절단장치
|
FR2852250B1
(fr)
*
|
2003-03-11 |
2009-07-24 |
Jean Luc Jouvin |
Fourreau de protection pour canule, un ensemble d'injection comportant un tel fourreau et aiguille equipee d'un tel fourreau
|
US8685838B2
(en)
*
|
2003-03-12 |
2014-04-01 |
Hamamatsu Photonics K.K. |
Laser beam machining method
|
TWI248920B
(en)
*
|
2003-03-21 |
2006-02-11 |
Rorze Systems Corp |
Apparatus for cutting glass plate
|
JP2004343008A
(ja)
*
|
2003-05-19 |
2004-12-02 |
Disco Abrasive Syst Ltd |
レーザ光線を利用した被加工物分割方法
|
DE10327360B4
(de)
*
|
2003-06-16 |
2012-05-24 |
Curamik Electronics Gmbh |
Verfahren zum Herstellen eines Keramik-Metall-Substrates
|
DE10330179A1
(de)
*
|
2003-07-02 |
2005-01-20 |
Jenoptik Automatisierungstechnik Gmbh |
Verfahren zum Trennen flacher Werkstücke aus Keramik
|
US7473656B2
(en)
*
|
2003-10-23 |
2009-01-06 |
International Business Machines Corporation |
Method for fast and local anneal of anti-ferromagnetic (AF) exchange-biased magnetic stacks
|
DE10358872A1
(de)
*
|
2003-12-16 |
2005-02-24 |
Schott Ag |
Verfahren zum Brechen von flachem oder gebogenem sprödbrüchigen Material entlang einer geritzten, geschlossenen Freiformkontur
|
DE102004012402B3
(de)
*
|
2004-03-13 |
2005-08-25 |
Schott Ag |
Verfahren zum Freiformschneiden von gewölbten Substraten aus sprödbrüchigem Material
|
DE102004014276A1
(de)
*
|
2004-03-22 |
2005-10-13 |
Grenzebach Maschinenbau Gmbh |
Verfahren zum Laserschneiden von Flachglas
|
DE102004014277A1
(de)
*
|
2004-03-22 |
2005-10-20 |
Fraunhofer Ges Forschung |
Verfahren zum laserthermischen Trennen von Flachgläsern
|
KR101043674B1
(ko)
|
2004-05-11 |
2011-06-23 |
엘지디스플레이 주식회사 |
스크라이빙 장치 및 방법
|
US20060021977A1
(en)
*
|
2004-07-30 |
2006-02-02 |
Menegus Harry E |
Process and apparatus for scoring a brittle material incorporating moving optical assembly
|
MX2007001159A
(es)
*
|
2004-07-30 |
2007-09-25 |
Mitsuboshi Diamond Ind Co Ltd |
Metodo para formar una grieta media en un sustrato y aparato para formar una grieta media en un sustrato.
|
US7820941B2
(en)
*
|
2004-07-30 |
2010-10-26 |
Corning Incorporated |
Process and apparatus for scoring a brittle material
|
WO2006025994A2
(en)
*
|
2004-08-31 |
2006-03-09 |
Gyrotron Technology, Inc. |
A method of separating non-metallic material using microwave radiation
|
US7726532B2
(en)
|
2004-10-25 |
2010-06-01 |
Mitsuboshi Diamond Industrial Co., Ltd. |
Method and apparatus for forming cracks
|
US20060179722A1
(en)
*
|
2005-02-02 |
2006-08-17 |
Spindler Robert G |
Edge treatment for glass panes
|
DE102005013783B4
(de)
*
|
2005-03-22 |
2007-08-16 |
Jenoptik Automatisierungstechnik Gmbh |
Verfahren zum Trennen von spröden Materialien mittels Laser mit unsymmetrischer Strahlungsdichteverteilung
|
US20060249553A1
(en)
*
|
2005-05-06 |
2006-11-09 |
Ljerka Ukrainczyk |
Ultrasonic induced crack propagation in a brittle material
|
US20070039990A1
(en)
*
|
2005-05-06 |
2007-02-22 |
Kemmerer Marvin W |
Impact induced crack propagation in a brittle material
|
JP2006315017A
(ja)
*
|
2005-05-11 |
2006-11-24 |
Canon Inc |
レーザ切断方法および被切断部材
|
US20060261118A1
(en)
*
|
2005-05-17 |
2006-11-23 |
Cox Judy K |
Method and apparatus for separating a pane of brittle material from a moving ribbon of the material
|
DE102005024497B4
(de)
*
|
2005-05-27 |
2008-06-19 |
Schott Ag |
Verfahren zum mechanischen Brechen von geritzten flachen Werkstücken aus sprödbrüchigem Material
|
US20060280920A1
(en)
*
|
2005-06-10 |
2006-12-14 |
Abbott John S Iii |
Selective contact with a continuously moving ribbon of brittle material to dampen or reduce propagation or migration of vibrations along the ribbon
|
WO2007018586A1
(en)
*
|
2005-07-28 |
2007-02-15 |
Gyrotron Technology, Inc. |
A method of separating non-metallic material using microwave radiation
|
US20080236199A1
(en)
*
|
2005-07-28 |
2008-10-02 |
Vladislav Sklyarevich |
Method of Separating Non-Metallic Material Using Microwave Radiation
|
WO2007018592A1
(en)
*
|
2005-07-28 |
2007-02-15 |
Gyrotron Technology, Inc. |
A method of separating non-metallic material using microwave radiation
|
DE102005038027A1
(de)
|
2005-08-06 |
2007-02-08 |
Jenoptik Automatisierungstechnik Gmbh |
Verfahren zum Durchtrennen von spröden Flachmaterialien
|
US9138913B2
(en)
*
|
2005-09-08 |
2015-09-22 |
Imra America, Inc. |
Transparent material processing with an ultrashort pulse laser
|
DE102006042280A1
(de)
|
2005-09-08 |
2007-06-06 |
IMRA America, Inc., Ann Arbor |
Bearbeitung von transparentem Material mit einem Ultrakurzpuls-Laser
|
DE102005046479B4
(de)
|
2005-09-28 |
2008-12-18 |
Infineon Technologies Austria Ag |
Verfahren zum Spalten von spröden Materialien mittels Trenching Technologie
|
US20090230102A1
(en)
*
|
2005-10-28 |
2009-09-17 |
Masanobu Soyama |
Method for Creating Scribe Line on Brittle Material Substrate and Apparatus for Creating Scribe Line
|
DE102005062230A1
(de)
*
|
2005-12-21 |
2007-06-28 |
Jenoptik Automatisierungstechnik Gmbh |
Verfahren und Vorrichtung zum Trennen von Scheiben aus sprödem Material, insbesondere von Wafern
|
KR100972488B1
(ko)
*
|
2005-12-29 |
2010-07-26 |
엘지디스플레이 주식회사 |
레이저를 이용한 액정표시소자 절단장치 및 절단방법, 이를이용한 액정표시소자 제조방법
|
DE102006018622B3
(de)
*
|
2005-12-29 |
2007-08-09 |
H2B Photonics Gmbh |
Vorrichtung zum durchtrennenden Bearbeiten von Bauteilen aus sprödbrüchigem Material
|
DE102006024825A1
(de)
|
2006-05-23 |
2007-11-29 |
Jenoptik Automatisierungstechnik Gmbh |
Verfahren und Vorrichtung zum Randbeschneiden eines Floatglasbandes
|
DE102006033217A1
(de)
*
|
2006-07-14 |
2008-01-17 |
Jenoptik Automatisierungstechnik Gmbh |
Verfahren zur Erzeugung optisch wahrnehmbarer laserinduzierter Risse in sprödes Material
|
US9362439B2
(en)
*
|
2008-05-07 |
2016-06-07 |
Silicon Genesis Corporation |
Layer transfer of films utilizing controlled shear region
|
DE102006054592B3
(de)
*
|
2006-11-20 |
2008-02-14 |
Lisa Dräxlmaier GmbH |
Unsichtbares Laserschwächen im Materialverbund
|
TWI466836B
(zh)
*
|
2007-02-28 |
2015-01-01 |
Ceramtec Ag |
製造構件的方法
|
US7982162B2
(en)
*
|
2007-05-15 |
2011-07-19 |
Corning Incorporated |
Method and apparatus for scoring and separating a brittle material with a single beam of radiation
|
US7971012B2
(en)
*
|
2007-05-15 |
2011-06-28 |
Pitney Bowes Inc. |
Mail processing computer automatic recovery system and method
|
US20090085254A1
(en)
*
|
2007-09-28 |
2009-04-02 |
Anatoli Anatolyevich Abramov |
Laser scoring with flat profile beam
|
DE102007056115A1
(de)
|
2007-11-15 |
2009-05-20 |
Freiberger Compound Materials Gmbh |
Verfahren zum Trennen von Einkristallen
|
US8011207B2
(en)
*
|
2007-11-20 |
2011-09-06 |
Corning Incorporated |
Laser scoring of glass sheets at high speeds and with low residual stress
|
CN101462822B
(zh)
*
|
2007-12-21 |
2012-08-29 |
鸿富锦精密工业(深圳)有限公司 |
具有通孔的脆性非金属工件及其加工方法
|
CN101468875A
(zh)
*
|
2007-12-24 |
2009-07-01 |
鸿富锦精密工业(深圳)有限公司 |
脆性非金属基材及其切割方法
|
FR2926374B1
(fr)
*
|
2008-01-11 |
2010-03-26 |
Atto Holding S Ar L |
Montre comportant une carrure usinee dans un bloc de materiau extra-dur
|
US20090178298A1
(en)
*
|
2008-01-15 |
2009-07-16 |
Anatoli Anatolyevich Abramov |
Device for fluid removal after laser scoring
|
CN101497493B
(zh)
*
|
2008-02-01 |
2012-12-26 |
鸿富锦精密工业(深圳)有限公司 |
激光切割装置
|
DE102008007632A1
(de)
*
|
2008-02-04 |
2009-08-06 |
Limo Patentverwaltung Gmbh & Co. Kg |
Verfahren zum Laserschneiden eines nichtmetallischen Werkstücks
|
JP5345334B2
(ja)
*
|
2008-04-08 |
2013-11-20 |
株式会社レミ |
脆性材料の熱応力割断方法
|
US8035901B2
(en)
*
|
2008-04-30 |
2011-10-11 |
Corning Incorporated |
Laser scoring with curved trajectory
|
US8053704B2
(en)
*
|
2008-05-27 |
2011-11-08 |
Corning Incorporated |
Scoring of non-flat materials
|
US8258427B2
(en)
*
|
2008-05-30 |
2012-09-04 |
Corning Incorporated |
Laser cutting of glass along a predetermined line
|
US8051679B2
(en)
*
|
2008-09-29 |
2011-11-08 |
Corning Incorporated |
Laser separation of glass sheets
|
DE102008052006B4
(de)
*
|
2008-10-10 |
2018-12-20 |
3D-Micromac Ag |
Verfahren und Vorrichtung zur Herstellung von Proben für die Transmissionselektronenmikroskopie
|
DE102008042855B4
(de)
|
2008-10-15 |
2011-08-25 |
MDI Schott Advanced Processing GmbH, 55120 |
Verfahren zum Brechen von geschlossenen Freiformkonturen aus sprödbrüchigem Material
|
US20110300692A1
(en)
*
|
2008-10-29 |
2011-12-08 |
Oerlikon Solar Ag, Trubbach |
Method for dividing a semiconductor film formed on a substrate into plural regions by multiple laser beam irradiation
|
US9346130B2
(en)
*
|
2008-12-17 |
2016-05-24 |
Electro Scientific Industries, Inc. |
Method for laser processing glass with a chamfered edge
|
US8347651B2
(en)
*
|
2009-02-19 |
2013-01-08 |
Corning Incorporated |
Method of separating strengthened glass
|
KR20120004456A
(ko)
*
|
2009-03-20 |
2012-01-12 |
코닝 인코포레이티드 |
정밀 레이저 스코어링
|
US20100252959A1
(en)
*
|
2009-03-27 |
2010-10-07 |
Electro Scientific Industries, Inc. |
Method for improved brittle materials processing
|
DE102009043602B4
(de)
|
2009-05-14 |
2012-10-11 |
Jenoptik Automatisierungstechnik Gmbh |
Verfahren zum Kantenverrunden spröder Flachmaterialien
|
US8269138B2
(en)
*
|
2009-05-21 |
2012-09-18 |
Corning Incorporated |
Method for separating a sheet of brittle material
|
US8706288B2
(en)
*
|
2009-05-21 |
2014-04-22 |
Electro Scientific Industries, Inc. |
Apparatus and method for non-contact sensing of transparent articles
|
EP2450169A4
(en)
*
|
2009-07-03 |
2012-11-21 |
Asahi Glass Co Ltd |
CUTTING METHOD AND CUTTING DEVICE FOR A SUBSTRATE OF SPRING MATERIAL AND VEHICLE GLASS OBTAINED IN THIS CUTTING METHOD
|
US8932510B2
(en)
*
|
2009-08-28 |
2015-01-13 |
Corning Incorporated |
Methods for laser cutting glass substrates
|
US8426767B2
(en)
*
|
2009-08-31 |
2013-04-23 |
Corning Incorporated |
Methods for laser scribing and breaking thin glass
|
US8171753B2
(en)
|
2009-11-18 |
2012-05-08 |
Corning Incorporated |
Method for cutting a brittle material
|
US8946590B2
(en)
|
2009-11-30 |
2015-02-03 |
Corning Incorporated |
Methods for laser scribing and separating glass substrates
|
CH702451A1
(de)
*
|
2009-12-17 |
2011-06-30 |
Micromachining Ag |
Verfahren zum Trennen einer Materialschicht mittels eines Schneidstrahls.
|
FI20105011A0
(fi)
*
|
2010-01-08 |
2010-01-08 |
Lappeenrannan Teknillinen Ylio |
Menetelmä materiaalin työstämiseksi laserlaitteen avulla
|
US20110240644A1
(en)
*
|
2010-04-05 |
2011-10-06 |
Steven Donald Kimmell |
Thermoplastic containers with easy access defined by laser-induced rupturable areas
|
JPWO2011142464A1
(ja)
*
|
2010-05-14 |
2013-07-22 |
旭硝子株式会社 |
切断方法および切断装置
|
JP2012016735A
(ja)
*
|
2010-07-09 |
2012-01-26 |
Mitsubishi Materials Corp |
レーザ加工装置およびレーザ加工方法
|
TWI513670B
(zh)
*
|
2010-08-31 |
2015-12-21 |
Corning Inc |
分離強化玻璃基板之方法
|
US8887529B2
(en)
|
2010-10-29 |
2014-11-18 |
Corning Incorporated |
Method and apparatus for cutting glass ribbon
|
US8584490B2
(en)
|
2011-02-18 |
2013-11-19 |
Corning Incorporated |
Laser cutting method
|
CN103813812B
(zh)
|
2011-02-23 |
2016-08-10 |
新星湾药物有限公司 |
具有监视器的角膜接触镜片清洁系统
|
RU2478083C2
(ru)
*
|
2011-03-25 |
2013-03-27 |
Учреждение образования "Гомельский государственный университет имени Франциска Скорины" |
Способ разделения кристаллического кварца под действием термоупругих напряжений
|
RU2479496C2
(ru)
*
|
2011-03-25 |
2013-04-20 |
Учреждение образования "Гомельский государственный университет имени Франциска Скорины" |
Способ разделения хрупких неметаллических материалов под действием термоупругих напряжений
|
US9034458B2
(en)
|
2011-05-27 |
2015-05-19 |
Corning Incorporated |
Edge-protected product and finishing method
|
DE102011084129A1
(de)
|
2011-10-07 |
2013-04-11 |
Schott Ag |
Glasfolie mit speziell ausgebildeter Kante
|
DE102011084128A1
(de)
|
2011-10-07 |
2013-04-11 |
Schott Ag |
Verfahren zum Schneiden eines Dünnglases mit spezieller Ausbildung der Kante
|
DE102011084131A1
(de)
|
2011-10-07 |
2013-04-11 |
Schott Ag |
Glasfolie mit speziell ausgebildeter Kante
|
RU2486628C1
(ru)
*
|
2011-12-14 |
2013-06-27 |
Федеральное государственное военное образовательное учреждение высшего профессионального образования Военная академия Ракетных войск стратегического назначения имени Петра Великого МО РФ |
Способ обработки неметаллических материалов
|
US10357850B2
(en)
|
2012-09-24 |
2019-07-23 |
Electro Scientific Industries, Inc. |
Method and apparatus for machining a workpiece
|
US9828278B2
(en)
|
2012-02-28 |
2017-11-28 |
Electro Scientific Industries, Inc. |
Method and apparatus for separation of strengthened glass and articles produced thereby
|
CN104136967B
(zh)
|
2012-02-28 |
2018-02-16 |
伊雷克托科学工业股份有限公司 |
用于分离增强玻璃的方法及装置及由该增强玻璃生产的物品
|
CN104114506B
(zh)
|
2012-02-29 |
2017-05-24 |
伊雷克托科学工业股份有限公司 |
加工强化玻璃的方法和装置及藉此制造的物品
|
US9938180B2
(en)
|
2012-06-05 |
2018-04-10 |
Corning Incorporated |
Methods of cutting glass using a laser
|
JP5991860B2
(ja)
*
|
2012-06-19 |
2016-09-14 |
三星ダイヤモンド工業株式会社 |
ガラス基板の加工方法
|
KR101355807B1
(ko)
*
|
2012-09-11 |
2014-02-03 |
로체 시스템즈(주) |
비금속 재료의 곡선 절단방법
|
US9610653B2
(en)
|
2012-09-21 |
2017-04-04 |
Electro Scientific Industries, Inc. |
Method and apparatus for separation of workpieces and articles produced thereby
|
DE102012111698A1
(de)
|
2012-12-03 |
2014-03-20 |
Solarworld Innovations Gmbh |
Verfahren und Vorrichtung zum Bearbeiten mindestens eines kristallinen Silizium-Wafers oder eines Solarzellen-Wafers
|
WO2014144322A1
(en)
|
2013-03-15 |
2014-09-18 |
Kinestral Technologies, Inc. |
Laser cutting strengthened glass
|
RU2543222C1
(ru)
*
|
2013-08-23 |
2015-02-27 |
Общество С Ограниченной Ответственностью "Ласком" |
Способ притупления острых кромок стеклоизделий
|
TW201524539A
(zh)
|
2013-10-31 |
2015-07-01 |
Novabay Pharmaceuticals Inc |
絕熱之隱形眼鏡清洗系統
|
US11053156B2
(en)
|
2013-11-19 |
2021-07-06 |
Rofin-Sinar Technologies Llc |
Method of closed form release for brittle materials using burst ultrafast laser pulses
|
US9517929B2
(en)
|
2013-11-19 |
2016-12-13 |
Rofin-Sinar Technologies Inc. |
Method of fabricating electromechanical microchips with a burst ultrafast laser pulses
|
US10252507B2
(en)
|
2013-11-19 |
2019-04-09 |
Rofin-Sinar Technologies Llc |
Method and apparatus for forward deposition of material onto a substrate using burst ultrafast laser pulse energy
|
US10005152B2
(en)
|
2013-11-19 |
2018-06-26 |
Rofin-Sinar Technologies Llc |
Method and apparatus for spiral cutting a glass tube using filamentation by burst ultrafast laser pulses
|
CN105939973B
(zh)
*
|
2013-12-03 |
2019-08-20 |
康宁股份有限公司 |
用于切断玻璃板的设备和方法
|
US10144088B2
(en)
|
2013-12-03 |
2018-12-04 |
Rofin-Sinar Technologies Llc |
Method and apparatus for laser processing of silicon by filamentation of burst ultrafast laser pulses
|
US10442719B2
(en)
*
|
2013-12-17 |
2019-10-15 |
Corning Incorporated |
Edge chamfering methods
|
US9397314B2
(en)
*
|
2013-12-23 |
2016-07-19 |
Universal Display Corporation |
Thin-form light-enhanced substrate for OLED luminaire
|
US9260337B2
(en)
|
2014-01-09 |
2016-02-16 |
Corning Incorporated |
Methods and apparatus for free-shape cutting of flexible thin glass
|
DE102014205066A1
(de)
*
|
2014-03-19 |
2015-10-08 |
Schott Ag |
Vorgespannter Glasartikel mit Laserinnengravur und Herstellverfahren
|
DE102014106817A1
(de)
|
2014-05-14 |
2015-11-19 |
Schott Ag |
Verfahren und Vorrichtung zur Herstellung eines Dünnglas-Bands und verfahrensgemäß hergestelltes Dünnglas-Band
|
DE102014113150A1
(de)
|
2014-09-12 |
2016-03-17 |
Schott Ag |
Glaselement mit niedriger Bruchwahrscheinlichkeit
|
KR101817388B1
(ko)
*
|
2014-09-30 |
2018-01-10 |
주식회사 엘지화학 |
편광판의 절단 방법 및 이를 이용하여 절단된 편광판
|
WO2016073807A1
(en)
*
|
2014-11-07 |
2016-05-12 |
Corning Incorporated |
Method of cutting a laminate glass article
|
TW201628751A
(zh)
*
|
2014-11-20 |
2016-08-16 |
康寧公司 |
彈性玻璃基板之回饋控制的雷射切割
|
RU2573622C1
(ru)
*
|
2014-11-27 |
2016-01-20 |
Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Новгородский государственный университет имени Ярослава Мудрого" |
Способ эрозионного копирования карбидокремниевых структур
|
DE102014119064A1
(de)
|
2014-12-18 |
2016-06-23 |
Schott Ag |
Glasfilm mit speziell ausgebildeter Kante, Verfahren zu dessen Herstellung sowie dessen Verwendung
|
EP3102358A4
(en)
|
2015-01-13 |
2017-10-25 |
Rofin-Sinar Technologies, Inc. |
Method and system for scribing brittle material followed by chemical etching
|
GB201505042D0
(en)
|
2015-03-25 |
2015-05-06 |
Nat Univ Ireland |
Methods and apparatus for cutting a substrate
|
TWI543834B
(zh)
|
2015-04-24 |
2016-08-01 |
納諾股份有限公司 |
脆性物件切斷裝置及其切斷方法
|
US11420894B2
(en)
|
2015-04-24 |
2022-08-23 |
Nanoplus Ltd. |
Brittle object cutting apparatus and cutting method thereof
|
US20160318790A1
(en)
*
|
2015-04-30 |
2016-11-03 |
Rofin-Sinar Technologies Inc. |
Method and system for scribing heat processed transparent materials
|
KR102077667B1
(ko)
|
2015-08-10 |
2020-02-14 |
쌩-고벵 글래스 프랑스 |
박형 유리 층의 절단 방법
|
KR102300061B1
(ko)
*
|
2016-03-22 |
2021-09-09 |
실텍트라 게엠베하 |
분리될 고형체의 결합된 레이저 처리 방법
|
RU2679496C2
(ru)
*
|
2016-04-19 |
2019-02-11 |
Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Ульяновский государственный технический университет" |
Способ контурной лазерной резки
|
RU179186U1
(ru)
*
|
2017-07-24 |
2018-05-03 |
Федеральное государственное бюджетное учреждение науки Институт проблем механики им. А.Ю. Ишлинского Российской академии наук (ИПМех РАН) |
Устройство для удаления газообразных продуктов лазерной резки
|
CN108971772B
(zh)
*
|
2018-08-29 |
2020-08-14 |
杭州千皓科技有限公司 |
一种激光光学玻璃切割的裂片工艺
|
WO2020130165A1
(ko)
*
|
2018-12-18 |
2020-06-25 |
이석준 |
취성재료의 레이저 절단 가공방법
|
CN112705858B
(zh)
*
|
2020-11-09 |
2022-10-04 |
浙江圣石激光科技股份有限公司 |
一种弧面玻璃的加工方法
|
CN113955935A
(zh)
*
|
2021-11-12 |
2022-01-21 |
安徽千辉节能玻璃科技有限公司 |
一种全自动节能low-e玻璃切割机
|