DE69936131D1 - Verfahren und vorrichtung zur entfernung eines photoresistfilms - Google Patents

Verfahren und vorrichtung zur entfernung eines photoresistfilms

Info

Publication number
DE69936131D1
DE69936131D1 DE69936131T DE69936131T DE69936131D1 DE 69936131 D1 DE69936131 D1 DE 69936131D1 DE 69936131 T DE69936131 T DE 69936131T DE 69936131 T DE69936131 T DE 69936131T DE 69936131 D1 DE69936131 D1 DE 69936131D1
Authority
DE
Germany
Prior art keywords
photoresist film
photoresist
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69936131T
Other languages
English (en)
Other versions
DE69936131T2 (de
DE69936131T9 (de
Inventor
Seiji Noda
Masaki Kuzumoto
Izumi Oya
Makoto Miyamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE69936131D1 publication Critical patent/DE69936131D1/de
Publication of DE69936131T2 publication Critical patent/DE69936131T2/de
Application granted granted Critical
Publication of DE69936131T9 publication Critical patent/DE69936131T9/de
Active legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G03F7/427—Stripping or agents therefor using plasma means only
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
DE69936131T 1998-11-13 1999-11-12 Verfahren und vorrichtung zur entfernung eines photoresistfilms Active DE69936131T9 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP32350398 1998-11-13
JP32350398A JP3869566B2 (ja) 1998-11-13 1998-11-13 フォトレジスト膜除去方法および装置
PCT/JP1999/006324 WO2000030165A1 (fr) 1998-11-13 1999-11-12 Procede et dispositif d'elimination d'un film de photoresine

Publications (3)

Publication Number Publication Date
DE69936131D1 true DE69936131D1 (de) 2007-07-05
DE69936131T2 DE69936131T2 (de) 2008-01-17
DE69936131T9 DE69936131T9 (de) 2008-05-08

Family

ID=18155429

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69936131T Active DE69936131T9 (de) 1998-11-13 1999-11-12 Verfahren und vorrichtung zur entfernung eines photoresistfilms

Country Status (7)

Country Link
US (2) US6517998B1 (de)
EP (1) EP1049142B1 (de)
JP (1) JP3869566B2 (de)
KR (2) KR20010034087A (de)
DE (1) DE69936131T9 (de)
TW (1) TW451335B (de)
WO (1) WO2000030165A1 (de)

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US6440871B1 (en) 2000-08-16 2002-08-27 Micron Technology, Inc. Gas assisted method for applying resist stripper and gas-resist stripper combinations
WO2002027775A1 (fr) * 2000-09-28 2002-04-04 Mitsubishi Denki Kabushiki Kaisha Procede et appareil de traitement de plaquettes
JP4844912B2 (ja) * 2001-08-01 2011-12-28 野村マイクロ・サイエンス株式会社 フォトレジストの除去方法及び除去装置
JP3914842B2 (ja) * 2001-10-23 2007-05-16 有限会社ユーエムエス 有機被膜の除去方法および除去装置
JP4462935B2 (ja) * 2002-03-18 2010-05-12 住友精密工業株式会社 オゾン処理方法及びオゾン処理装置
JP4334844B2 (ja) * 2002-06-26 2009-09-30 東京エレクトロン株式会社 デバイス用溝構造体の製造方法
JP4351862B2 (ja) * 2003-04-21 2009-10-28 積水化学工業株式会社 レジスト除去方法及びレジスト除去装置
WO2004095550A1 (ja) * 2003-04-21 2004-11-04 Sekisui Chemical Co. Ltd. 有機物除去装置、有機物除去方法、オゾン水噴射ノズル、及び、マスク基板用有機物除去装置
WO2004112093A2 (en) 2003-06-06 2004-12-23 P.C.T. Systems, Inc. Method and apparatus to process substrates with megasonic energy
US7202175B2 (en) * 2003-11-07 2007-04-10 Industrial Technology Research Institute Method and apparatus for treating a substrate surface by bubbling
US20060005856A1 (en) * 2004-06-29 2006-01-12 Applied Materials, Inc. Reduction of reactive gas attack on substrate heater
JP4438709B2 (ja) * 2005-07-19 2010-03-24 株式会社Ｓｕｍｃｏ ウェーハの枚葉式エッチング方法
JP4787038B2 (ja) * 2006-03-03 2011-10-05 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
TWI351446B (en) 2006-06-16 2011-11-01 Toshiba Kk Cleaning system and cleaning method
CN101211125B (zh) * 2006-12-25 2010-08-11 中芯国际集成电路制造(上海)有限公司 光刻胶的去除方法
DE102007058503B4 (de) * 2007-12-05 2011-08-25 Siltronic AG, 81737 Verfahren zur nasschemischen Behandlung einer Halbleiterscheibe
JP2009170554A (ja) * 2008-01-11 2009-07-30 Panasonic Corp 半導体装置の製造方法
KR100992269B1 (ko) * 2008-06-02 2010-11-05 삼성전기주식회사 도금층 형성 방법
JP2011145530A (ja) * 2010-01-15 2011-07-28 Hitachi Displays Ltd 表示装置、及び、表示装置の製造方法
US9748120B2 (en) 2013-07-01 2017-08-29 Lam Research Ag Apparatus for liquid treatment of disc-shaped articles and heating system for use in such apparatus
CN104779136A (zh) * 2014-01-10 2015-07-15 上海和辉光电有限公司 一种去除光致抗蚀剂的方法和设备
US9620383B2 (en) * 2014-07-10 2017-04-11 Tokyo Electron Limited Method for uncovering underlying alignment patterns
TWI595332B (zh) * 2014-08-05 2017-08-11 頎邦科技股份有限公司 光阻剝離方法
US10490426B2 (en) 2014-08-26 2019-11-26 Lam Research Ag Method and apparatus for processing wafer-shaped articles
KR101847086B1 (ko) * 2014-11-18 2018-04-10 주식회사 엘지화학 포토레지스트 박리 장치 및 이를 이용한 포토레지스트 박리 방법
US10395928B2 (en) * 2016-06-15 2019-08-27 Nanomedical Diagnostics, Inc. Depositing a passivation layer on a graphene sheet
US10759157B2 (en) 2016-06-15 2020-09-01 Nanomedical Diagnostics, Inc. Systems and methods for transferring graphene
US11056343B2 (en) 2016-06-15 2021-07-06 Cardea Bio, Inc. Providing a temporary protective layer on a graphene sheet
US10903319B2 (en) * 2016-06-15 2021-01-26 Nanomedical Diagnostics, Inc. Patterning graphene with a hard mask coating
JP2022131171A (ja) * 2021-02-26 2022-09-07 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP2022169174A (ja) * 2021-04-27 2022-11-09 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
CN116759348B (zh) * 2023-08-18 2023-11-14 合肥晶合集成电路股份有限公司 补充h2o2液体的控制方法、其控制装置和其控制系统

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JPS57180132A (en) 1981-04-30 1982-11-06 Fujitsu Ltd Washing method of substrate
JPS6236826A (ja) * 1985-08-09 1987-02-17 Tokyo Electron Ltd アツシング方法
US4812201A (en) * 1986-07-25 1989-03-14 Tokyo Electron Limited Method of ashing layers, and apparatus for ashing layers
JPH01206624A (ja) * 1988-02-15 1989-08-18 Koujiyundo Kagaku Kenkyusho:Kk レジストのドライエッチング法
JPH0724265B2 (ja) * 1988-04-13 1995-03-15 日本電気株式会社 半導体基板の洗浄装置
US5378317A (en) * 1990-10-09 1995-01-03 Chlorine Engineers Corp., Ltd. Method for removing organic film
JP2891578B2 (ja) * 1991-11-29 1999-05-17 クロリンエンジニアズ株式会社 基板処理方法
JPH05259139A (ja) * 1992-03-16 1993-10-08 Hitachi Ltd 洗浄装置
JP3150509B2 (ja) * 1992-11-27 2001-03-26 株式会社日立製作所 有機物除去方法及びその方法を使用するための装置
KR940012061A (ko) * 1992-11-27 1994-06-22 가나이 쯔또무 유기물제거방법 및 그 방법을 이용하기 위한 유기물제거장치
US5464480A (en) * 1993-07-16 1995-11-07 Legacy Systems, Inc. Process and apparatus for the treatment of semiconductor wafers in a fluid
JP3320549B2 (ja) * 1994-04-26 2002-09-03 岩手東芝エレクトロニクス株式会社 被膜除去方法および被膜除去剤
KR970053127A (ko) * 1995-12-30 1997-07-29 김주용 반도체 기판의 세정방법
US6701941B1 (en) * 1997-05-09 2004-03-09 Semitool, Inc. Method for treating the surface of a workpiece
TW385489B (en) * 1997-08-26 2000-03-21 Tokyo Electron Ltd Method for processing substrate and device of processing device
JPH11165136A (ja) * 1997-12-05 1999-06-22 Sony Corp レジスト除去方法およびレジスト除去装置
US6080531A (en) * 1998-03-30 2000-06-27 Fsi International, Inc. Organic removal process
JP3348695B2 (ja) * 1999-06-04 2002-11-20 日本電気株式会社 半導体ウェーハ上のフォトレジスト除去方法及び除去装置

Also Published As

Publication number Publication date
TW451335B (en) 2001-08-21
EP1049142A1 (de) 2000-11-02
JP2000150349A (ja) 2000-05-30
US7965372B2 (en) 2011-06-21
EP1049142B1 (de) 2007-05-23
DE69936131T2 (de) 2008-01-17
US20020115025A1 (en) 2002-08-22
US6517998B1 (en) 2003-02-11
KR20030024727A (ko) 2003-03-26
EP1049142A4 (de) 2003-01-02
WO2000030165A1 (fr) 2000-05-25
DE69936131T9 (de) 2008-05-08
KR100514598B1 (ko) 2005-09-13
JP3869566B2 (ja) 2007-01-17
KR20010034087A (ko) 2001-04-25

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