DE69930398D1 - Belichtungssystem mit einem parallelen Verbindungsmechanismus und Belichtungsverfahren - Google Patents
Belichtungssystem mit einem parallelen Verbindungsmechanismus und BelichtungsverfahrenInfo
- Publication number
- DE69930398D1 DE69930398D1 DE69930398T DE69930398T DE69930398D1 DE 69930398 D1 DE69930398 D1 DE 69930398D1 DE 69930398 T DE69930398 T DE 69930398T DE 69930398 T DE69930398 T DE 69930398T DE 69930398 D1 DE69930398 D1 DE 69930398D1
- Authority
- DE
- Germany
- Prior art keywords
- exposure
- link mechanism
- parallel link
- exposure method
- exposure system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/20—Means for supporting or positioning the objects or the material; Means for adjusting diaphragms or lenses associated with the support
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70225—Optical aspects of catadioptric systems, i.e. comprising reflective and refractive elements
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
- G03F7/70725—Stages control
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
- H01J2237/202—Movement
- H01J2237/20207—Tilt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
- H01J2237/202—Movement
- H01J2237/20221—Translation
- H01J2237/20228—Mechanical X-Y scanning
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Atmospheric Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Toxicology (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP1999/005102 WO2001022480A1 (fr) | 1999-09-20 | 1999-09-20 | Mecanisme a attelages paralleles, systeme d'exposition et procede de fabrication, et procede de fabrication de dispositifs |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69930398D1 true DE69930398D1 (de) | 2006-05-11 |
DE69930398T2 DE69930398T2 (de) | 2006-10-19 |
Family
ID=14236757
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69930398T Expired - Fee Related DE69930398T2 (de) | 1999-09-20 | 1999-09-20 | Belichtungssystem mit einem parallelen Verbindungsmechanismus und Belichtungsverfahren |
Country Status (7)
Country | Link |
---|---|
US (1) | US6940582B1 (de) |
EP (1) | EP1137054B1 (de) |
KR (1) | KR100699241B1 (de) |
AU (1) | AU5653699A (de) |
DE (1) | DE69930398T2 (de) |
TW (1) | TW446998B (de) |
WO (1) | WO2001022480A1 (de) |
Families Citing this family (90)
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JP4945864B2 (ja) * | 2000-08-18 | 2012-06-06 | 株式会社ニコン | 保持装置、光学素子保持装置、鏡筒及び露光装置並びにマイクロデバイスの製造方法 |
KR100775796B1 (ko) | 2000-08-18 | 2007-11-12 | 가부시키가이샤 니콘 | 광학소자 유지장치 |
KR100548713B1 (ko) * | 2001-06-20 | 2006-02-02 | 에이에스엠엘 네델란즈 비.브이. | 디바이스제조방법, 이것에 의하여 제조된 디바이스 및상기 방법에 사용하기 위한 마스크 |
EP1271247A1 (de) * | 2001-06-20 | 2003-01-02 | ASML Netherlands B.V. | Verfahren und Maske für Projektionsbelichtung |
US6873478B2 (en) * | 2002-06-21 | 2005-03-29 | Nikon Corporation | Kinematic lens mount with reduced clamping force |
US10503084B2 (en) | 2002-11-12 | 2019-12-10 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US9482966B2 (en) | 2002-11-12 | 2016-11-01 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
SG121819A1 (en) | 2002-11-12 | 2006-05-26 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method |
DE10261775A1 (de) | 2002-12-20 | 2004-07-01 | Carl Zeiss Smt Ag | Vorrichtung zur optischen Vermessung eines Abbildungssystems |
EP1596425A4 (de) * | 2003-02-19 | 2007-08-01 | Nikon Corp | Transferverfahren, belichtungsverfahren und belichtungseinrichtung und bauelementherstellungsverfahren |
US7221463B2 (en) * | 2003-03-14 | 2007-05-22 | Canon Kabushiki Kaisha | Positioning apparatus, exposure apparatus, and method for producing device |
EP3226073A3 (de) | 2003-04-09 | 2017-10-11 | Nikon Corporation | Belichtungsverfahren und -vorrichtung sowie verfahren zur herstellung der vorrichtung |
EP1469348B1 (de) | 2003-04-14 | 2012-01-18 | ASML Netherlands B.V. | Projektionssystem und Verfahren zu dessen Verwendung |
JP2004343075A (ja) | 2003-04-14 | 2004-12-02 | Asml Netherlands Bv | 投影システム及びその使用方法 |
JP4350429B2 (ja) * | 2003-06-05 | 2009-10-21 | キヤノン株式会社 | 露光装置、およびデバイスの製造方法 |
CN100576003C (zh) | 2003-06-06 | 2009-12-30 | 株式会社尼康 | 光学元件保持装置、镜筒、曝光装置及设备的制造方法 |
US7213963B2 (en) | 2003-06-09 | 2007-05-08 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
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TWI251129B (en) * | 2003-06-27 | 2006-03-11 | Asml Netherlands Bv | Lithographic apparatus and integrated circuit manufacturing method |
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KR101599649B1 (ko) | 2003-07-28 | 2016-03-14 | 가부시키가이샤 니콘 | 노광 장치 및 디바이스 제조 방법, 그리고 노광 장치의 제어 방법 |
EP1503244A1 (de) | 2003-07-28 | 2005-02-02 | ASML Netherlands B.V. | Lithographischer Projektionsapparat und Verfahren zur Herstellung einer Vorrichtung |
US7779781B2 (en) | 2003-07-31 | 2010-08-24 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
JP4370924B2 (ja) * | 2003-08-27 | 2009-11-25 | 株式会社ニコン | 真空装置、真空装置の運転方法、露光装置、及び露光装置の運転方法 |
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WO2018181334A1 (ja) | 2017-03-31 | 2018-10-04 | 株式会社ニコン | 造形システム及び造形方法 |
JP7014226B2 (ja) | 2017-05-01 | 2022-02-01 | 株式会社ニコン | 加工装置 |
KR102130441B1 (ko) * | 2017-10-30 | 2020-07-07 | 주식회사 이엠텍 | 탄성 사출 프레임을 구비하는 선형 진동자 |
JP2019121688A (ja) * | 2018-01-05 | 2019-07-22 | 株式会社ニューフレアテクノロジー | 制振システム及び、その制振システムを備える光学装置 |
WO2021126594A1 (en) * | 2019-12-20 | 2021-06-24 | Cymer, Llc | Gas purge systems for a laser source |
CN112977895A (zh) * | 2021-03-31 | 2021-06-18 | 中国科学院长春光学精密机械与物理研究所 | 可折叠可见光与合成孔径雷达复合一体化轻量化结构 |
CN114476075A (zh) * | 2022-01-13 | 2022-05-13 | 中国电子科技集团公司第三研究所 | 一种吊装载荷姿态稳定平台 |
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-
1999
- 1999-09-20 AU AU56536/99A patent/AU5653699A/en not_active Abandoned
- 1999-09-20 KR KR1020017006242A patent/KR100699241B1/ko not_active IP Right Cessation
- 1999-09-20 WO PCT/JP1999/005102 patent/WO2001022480A1/ja active IP Right Grant
- 1999-09-20 DE DE69930398T patent/DE69930398T2/de not_active Expired - Fee Related
- 1999-09-20 EP EP99943411A patent/EP1137054B1/de not_active Expired - Lifetime
- 1999-09-20 US US09/850,749 patent/US6940582B1/en not_active Expired - Fee Related
- 1999-10-05 TW TW088117104A patent/TW446998B/zh not_active IP Right Cessation
Also Published As
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---|---|
KR20010107969A (ko) | 2001-12-07 |
WO2001022480A1 (fr) | 2001-03-29 |
AU5653699A (en) | 2001-04-24 |
EP1137054B1 (de) | 2006-03-15 |
TW446998B (en) | 2001-07-21 |
DE69930398T2 (de) | 2006-10-19 |
US6940582B1 (en) | 2005-09-06 |
EP1137054A4 (de) | 2003-11-19 |
EP1137054A1 (de) | 2001-09-26 |
KR100699241B1 (ko) | 2007-03-27 |
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