DE69924415D1 - Heizelement und Verfahren zu seiner Herstellung - Google Patents

Heizelement und Verfahren zu seiner Herstellung

Info

Publication number
DE69924415D1
DE69924415D1 DE69924415T DE69924415T DE69924415D1 DE 69924415 D1 DE69924415 D1 DE 69924415D1 DE 69924415 T DE69924415 T DE 69924415T DE 69924415 T DE69924415 T DE 69924415T DE 69924415 D1 DE69924415 D1 DE 69924415D1
Authority
DE
Germany
Prior art keywords
production
heating element
heating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69924415T
Other languages
English (en)
Other versions
DE69924415T2 (de
Inventor
Yuji Katsuda
Kiyoshi Araki
Tsuneaki Ohashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Publication of DE69924415D1 publication Critical patent/DE69924415D1/de
Application granted granted Critical
Publication of DE69924415T2 publication Critical patent/DE69924415T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
    • H05B3/74—Non-metallic plates, e.g. vitroceramic, ceramic or glassceramic hobs, also including power or control circuits
    • H05B3/748—Resistive heating elements, i.e. heating elements exposed to the air, e.g. coil wire heater
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
    • H05B3/283—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
    • H05B3/74—Non-metallic plates, e.g. vitroceramic, ceramic or glassceramic hobs, also including power or control circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/017—Manufacturing methods or apparatus for heaters
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49083—Heater type
DE69924415T 1998-01-09 1999-01-07 Heizelement und Verfahren zu seiner Herstellung Expired - Lifetime DE69924415T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP1351898 1998-01-09
JP1351898 1998-01-09
JP10300736A JPH11260534A (ja) 1998-01-09 1998-10-22 加熱装置およびその製造方法
JP30073698 1998-10-22

Publications (2)

Publication Number Publication Date
DE69924415D1 true DE69924415D1 (de) 2005-05-04
DE69924415T2 DE69924415T2 (de) 2006-04-20

Family

ID=26349332

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69924415T Expired - Lifetime DE69924415T2 (de) 1998-01-09 1999-01-07 Heizelement und Verfahren zu seiner Herstellung

Country Status (6)

Country Link
US (2) US6204489B1 (de)
EP (1) EP0929205B1 (de)
JP (1) JPH11260534A (de)
KR (1) KR100281953B1 (de)
DE (1) DE69924415T2 (de)
TW (1) TW409484B (de)

Families Citing this family (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11260534A (ja) * 1998-01-09 1999-09-24 Ngk Insulators Ltd 加熱装置およびその製造方法
JP3892609B2 (ja) * 1999-02-16 2007-03-14 株式会社東芝 ホットプレートおよび半導体装置の製造方法
WO2001019139A1 (fr) * 1999-09-07 2001-03-15 Ibiden Co., Ltd. Plaque chauffante en ceramique
WO2001031978A1 (fr) * 1999-10-22 2001-05-03 Ibiden Co., Ltd. Plaque chauffante en ceramique
DE60021848T2 (de) * 1999-11-19 2006-06-08 Ibiden Co., Ltd. Keramisches heizgerät
JP3567855B2 (ja) * 2000-01-20 2004-09-22 住友電気工業株式会社 半導体製造装置用ウェハ保持体
JP4028149B2 (ja) * 2000-02-03 2007-12-26 日本碍子株式会社 加熱装置
US6494955B1 (en) * 2000-02-15 2002-12-17 Applied Materials, Inc. Ceramic substrate support
US6693789B2 (en) * 2000-04-05 2004-02-17 Sumitomo Osaka Cement Co., Ltd. Susceptor and manufacturing method thereof
JP3851489B2 (ja) 2000-04-27 2006-11-29 日本発条株式会社 静電チャック
JP4328003B2 (ja) * 2000-10-19 2009-09-09 日本碍子株式会社 セラミックヒーター
JP2002134484A (ja) * 2000-10-19 2002-05-10 Asm Japan Kk 半導体基板保持装置
JP4156788B2 (ja) * 2000-10-23 2008-09-24 日本碍子株式会社 半導体製造装置用サセプター
JP4618885B2 (ja) * 2000-12-27 2011-01-26 京セラ株式会社 加熱装置及びそれを用いた光モジュールの製造方法
US6623563B2 (en) * 2001-01-02 2003-09-23 Applied Materials, Inc. Susceptor with bi-metal effect
US6554907B2 (en) 2001-01-02 2003-04-29 Applied Materials, Inc. Susceptor with internal support
JP3956620B2 (ja) * 2001-01-16 2007-08-08 日立化成工業株式会社 静電チャック
JP2002220282A (ja) * 2001-01-24 2002-08-09 Tokuyama Corp 窒化アルミニウム焼結体とその製造方法
GB0103929D0 (en) * 2001-02-19 2001-04-04 Microtherm Int Ltd Base for an electric heater and method of manufacture
JP2002313781A (ja) * 2001-04-11 2002-10-25 Sumitomo Electric Ind Ltd 基板処理装置
JP3582518B2 (ja) * 2001-04-18 2004-10-27 住友電気工業株式会社 抵抗発熱体回路パターンとそれを用いた基板処理装置
JP4331427B2 (ja) * 2001-10-03 2009-09-16 住友電気工業株式会社 半導体製造装置に使用される給電用電極部材
JP3888531B2 (ja) * 2002-03-27 2007-03-07 日本碍子株式会社 セラミックヒーター、セラミックヒーターの製造方法、および金属部材の埋設品
JP2003317906A (ja) * 2002-04-24 2003-11-07 Sumitomo Electric Ind Ltd セラミックスヒータ
JP3963788B2 (ja) * 2002-06-20 2007-08-22 信越化学工業株式会社 静電吸着機能を有する加熱装置
JP4082985B2 (ja) * 2002-11-01 2008-04-30 信越化学工業株式会社 静電吸着機能を有する加熱装置及びその製造方法
JP2004200462A (ja) 2002-12-19 2004-07-15 Nhk Spring Co Ltd 静電チャックおよびその製造方法
JP3910145B2 (ja) 2003-01-06 2007-04-25 日本発条株式会社 溶射被膜およびその製造方法
US20040216678A1 (en) * 2003-03-03 2004-11-04 Sumitomo Electric Industries, Ltd. Wafer Holder for Semiconductor Manufacturing Equipment and Semiconductor Manufacturing Equipment in Which It Is Installed
US6998587B2 (en) * 2003-12-18 2006-02-14 Intel Corporation Apparatus and method for heating micro-components mounted on a substrate
US7369393B2 (en) * 2004-04-15 2008-05-06 Saint-Gobain Ceramics & Plastics, Inc. Electrostatic chucks having barrier layer
JP4148180B2 (ja) * 2004-04-23 2008-09-10 住友電気工業株式会社 半導体製造装置用ウェハ保持体
JP4987238B2 (ja) * 2005-03-25 2012-07-25 日本碍子株式会社 窒化アルミニウム焼結体、半導体製造用部材及び窒化アルミニウム焼結体の製造方法
CN100521835C (zh) * 2005-12-29 2009-07-29 梁敏玲 电阻膜加热装置的制造方法及所形成的电阻膜加热装置
KR100940456B1 (ko) 2005-12-30 2010-02-04 주식회사 코미코 질화 알루미늄 소결체 및 이를 포함하는 반도체 제조장치용 부재
KR100794960B1 (ko) 2006-06-07 2008-01-16 (주)나노테크 하이브리드형 히터 제조방법
US7763831B2 (en) * 2006-12-15 2010-07-27 Ngk Insulators, Ltd. Heating device
US8129208B2 (en) * 2007-02-07 2012-03-06 Tokuyama Corporation n-Type conductive aluminum nitride semiconductor crystal and manufacturing method thereof
TWI459851B (zh) * 2007-09-10 2014-11-01 Ngk Insulators Ltd heating equipment
KR101177749B1 (ko) * 2007-11-27 2012-08-29 주식회사 코미코 세라믹 히터, 이의 제조 방법 및 이를 갖는 박막 증착 장치
KR20090079540A (ko) * 2008-01-18 2009-07-22 주식회사 코미코 기판 지지 장치 및 이를 갖는 기판 처리 장치
JP4712836B2 (ja) * 2008-07-07 2011-06-29 信越化学工業株式会社 耐腐食性積層セラミックス部材
JP5416570B2 (ja) * 2009-12-15 2014-02-12 住友電気工業株式会社 加熱冷却デバイスおよびそれを搭載した装置
JP2013008949A (ja) * 2011-05-26 2013-01-10 Hitachi Kokusai Electric Inc 基板載置台、基板処理装置及び半導体装置の製造方法
JP5895387B2 (ja) * 2011-07-21 2016-03-30 住友電気工業株式会社 半導体基板加熱用基板保持体
JP6527524B2 (ja) * 2014-02-07 2019-06-05 インテグリス・インコーポレーテッド 静電チャックおよびその作製方法
JP6219229B2 (ja) * 2014-05-19 2017-10-25 東京エレクトロン株式会社 ヒータ給電機構
KR20170138052A (ko) * 2016-06-06 2017-12-14 어플라이드 머티어리얼스, 인코포레이티드 최적의 박막 증착 또는 에칭 프로세스들을 위한 특성들을 갖는 정전 척
JP6903959B2 (ja) * 2017-03-10 2021-07-14 富士フイルムビジネスイノベーション株式会社 発熱部材、加熱装置、定着装置及び画像形成装置
JP7125265B2 (ja) * 2018-02-05 2022-08-24 日本特殊陶業株式会社 基板加熱装置及びその製造方法
KR102630201B1 (ko) * 2019-01-23 2024-01-29 주식회사 미코세라믹스 세라믹 히터
CN113574653A (zh) * 2019-03-14 2021-10-29 朗姆研究公司 层状陶瓷结构
CN114340896B (zh) * 2019-07-01 2024-04-02 阔斯泰公司 具有腐蚀保护层的多区氮化硅晶片加热器组件、和制造及使用其的方法
CN114342060A (zh) * 2019-07-29 2022-04-12 应用材料公司 具有改善的高温吸附的半导体基板支撑件
WO2021080953A1 (en) * 2019-10-21 2021-04-29 Lam Research Corporation Monolithic anisotropic substrate supports

Family Cites Families (13)

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Publication number Priority date Publication date Assignee Title
US5303067A (en) 1990-11-28 1994-04-12 Sindo Ricoh Co., Ltd. Computer connection circuit in facsimile
US5280156A (en) * 1990-12-25 1994-01-18 Ngk Insulators, Ltd. Wafer heating apparatus and with ceramic substrate and dielectric layer having electrostatic chucking means
JP2938679B2 (ja) * 1992-06-26 1999-08-23 信越化学工業株式会社 セラミックス製静電チャック
US5800618A (en) * 1992-11-12 1998-09-01 Ngk Insulators, Ltd. Plasma-generating electrode device, an electrode-embedded article, and a method of manufacturing thereof
JP3323924B2 (ja) * 1993-01-29 2002-09-09 東京エレクトロン株式会社 静電チャック
JPH07297268A (ja) * 1993-12-27 1995-11-10 Shin Etsu Chem Co Ltd 静電チャック付セラミックスヒーター
JPH07307377A (ja) 1993-12-27 1995-11-21 Shin Etsu Chem Co Ltd 静電チャック付セラミックスヒーター
US5668524A (en) * 1994-02-09 1997-09-16 Kyocera Corporation Ceramic resistor and electrostatic chuck having an aluminum nitride crystal phase
JP3393714B2 (ja) * 1994-09-29 2003-04-07 京セラ株式会社 クランプリング
JPH08227933A (ja) * 1995-02-20 1996-09-03 Shin Etsu Chem Co Ltd 静電吸着機能を有するウエハ加熱装置
JPH09105677A (ja) * 1995-10-12 1997-04-22 Isuzu Ceramics Kenkyusho:Kk セラミックシース型部品及びその製造方法
DE29623184U1 (de) 1996-12-04 1997-11-27 Karlsruhe Forschzent Heizbares keramisches Element
JPH11260534A (ja) * 1998-01-09 1999-09-24 Ngk Insulators Ltd 加熱装置およびその製造方法

Also Published As

Publication number Publication date
EP0929205A2 (de) 1999-07-14
US6294771B2 (en) 2001-09-25
JPH11260534A (ja) 1999-09-24
KR19990066884A (ko) 1999-08-16
US20010006172A1 (en) 2001-07-05
KR100281953B1 (ko) 2001-02-15
EP0929205A3 (de) 1999-09-01
EP0929205B1 (de) 2005-03-30
TW409484B (en) 2000-10-21
DE69924415T2 (de) 2006-04-20
US6204489B1 (en) 2001-03-20

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Legal Events

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8364 No opposition during term of opposition