DE69915874D1 - Gedruckte leiterplatte und verfahren zu deren herstellung - Google Patents

Gedruckte leiterplatte und verfahren zu deren herstellung

Info

Publication number
DE69915874D1
DE69915874D1 DE69915874T DE69915874T DE69915874D1 DE 69915874 D1 DE69915874 D1 DE 69915874D1 DE 69915874 T DE69915874 T DE 69915874T DE 69915874 T DE69915874 T DE 69915874T DE 69915874 D1 DE69915874 D1 DE 69915874D1
Authority
DE
Germany
Prior art keywords
boards
conductive via
dielectric
printed circuit
transmission line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69915874T
Other languages
English (en)
Other versions
DE69915874T2 (de
Inventor
S Cohen
W Gailus
P Stokoe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Amphenol Corp
Original Assignee
Teradyne Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teradyne Inc filed Critical Teradyne Inc
Publication of DE69915874D1 publication Critical patent/DE69915874D1/de
Application granted granted Critical
Publication of DE69915874T2 publication Critical patent/DE69915874T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09718—Clearance holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09845—Stepped hole, via, edge, bump or conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/1059—Connections made by press-fit insertion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0455—PTH for surface mount device [SMD], e.g. wherein solder flows through the PTH during mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308—Adaptations of leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE69915874T 1998-12-02 1999-12-02 Gedruckte leiterplatte und verfahren zu deren herstellung Expired - Lifetime DE69915874T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/204,118 US6181219B1 (en) 1998-12-02 1998-12-02 Printed circuit board and method for fabricating such board
US204118 1998-12-02
PCT/US1999/028488 WO2000033624A1 (en) 1998-12-02 1999-12-02 Printed circuit board and method for fabricating such board

Publications (2)

Publication Number Publication Date
DE69915874D1 true DE69915874D1 (de) 2004-04-29
DE69915874T2 DE69915874T2 (de) 2005-03-03

Family

ID=22756707

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69915874T Expired - Lifetime DE69915874T2 (de) 1998-12-02 1999-12-02 Gedruckte leiterplatte und verfahren zu deren herstellung

Country Status (9)

Country Link
US (1) US6181219B1 (de)
EP (1) EP1138180B1 (de)
JP (3) JP4743965B2 (de)
CN (1) CN1199528C (de)
AT (1) ATE262775T1 (de)
AU (1) AU1930000A (de)
CA (1) CA2352820A1 (de)
DE (1) DE69915874T2 (de)
WO (1) WO2000033624A1 (de)

Families Citing this family (45)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6663442B1 (en) * 2000-01-27 2003-12-16 Tyco Electronics Corporation High speed interconnect using printed circuit board with plated bores
US6499214B2 (en) * 2000-05-26 2002-12-31 Visteon Global Tech, Inc. Method of making a circuit board
US6441319B1 (en) * 2000-12-28 2002-08-27 Nortel Networks Limited Inserted components for via connection of signal tracks to achieve continuous impedance matching in multi-layer substrate
WO2004005874A1 (ja) * 2002-07-05 2004-01-15 Nsk Ltd. 電動パワーステアリング装置
US20040115968A1 (en) * 2002-12-17 2004-06-17 Cohen Thomas S. Connector and printed circuit board for reducing cross-talk
US20050201065A1 (en) * 2004-02-13 2005-09-15 Regnier Kent E. Preferential ground and via exit structures for printed circuit boards
US7852635B1 (en) * 2004-05-25 2010-12-14 Lineage Power Corporation Multi-connection via
US7155821B1 (en) * 2004-06-30 2007-01-02 Emc Corporation Techniques for manufacturing a circuit board having a countersunk via
US7145083B2 (en) * 2004-07-13 2006-12-05 Nortel Networks Limited Reducing or eliminating cross-talk at device-substrate interface
US7053729B2 (en) * 2004-08-23 2006-05-30 Kyocera America, Inc. Impedence matching along verticle path of microwave vias in multilayer packages
US7718904B2 (en) * 2005-11-15 2010-05-18 Intel Corporation Enhancing shock resistance in semiconductor packages
US7484971B2 (en) * 2005-11-29 2009-02-03 Amphenol Corporation Electronic component with high density, low cost attachment
US7244126B2 (en) * 2005-12-09 2007-07-17 Tyco Electronics Corporation Electrical connector having a circuit board with controlled impedance
US20080087460A1 (en) * 2006-10-17 2008-04-17 Pat Fung Apparatus and method for a printed circuit board that reduces capacitance loading of through-holes
US8102057B2 (en) * 2006-12-27 2012-01-24 Hewlett-Packard Development Company, L.P. Via design for flux residue mitigation
US7999192B2 (en) 2007-03-14 2011-08-16 Amphenol Corporation Adjacent plated through holes with staggered couplings for crosstalk reduction in high speed printed circuit boards
JP4912204B2 (ja) * 2007-04-16 2012-04-11 アイカ工業株式会社 多層プリント配線板
US7578707B2 (en) 2007-09-12 2009-08-25 Amphenol Corporation Modular board to board connector
US8431831B2 (en) * 2008-10-08 2013-04-30 Oracle America, Inc. Bond strength and interconnection in a via
JP4613237B2 (ja) * 2008-12-10 2011-01-12 新光電気工業株式会社 リードピン付配線基板及びリードピン
JP4920754B2 (ja) * 2010-01-21 2012-04-18 新光電気工業株式会社 リードピン付き配線基板
US7963776B1 (en) * 2010-03-23 2011-06-21 Tyco Electronics Corporation Electrical connector assembly having direct connection terminals
US8123572B2 (en) 2010-04-02 2012-02-28 Tyco Electronics Corporation Electrical components having a contact configured to engage a via of a circuit board
JP2012094664A (ja) * 2010-10-27 2012-05-17 Fujitsu Ltd 基板ユニット、ネットワーク装置および基板ユニットの製造方法
CN103025082B (zh) * 2011-09-21 2015-08-05 英业达股份有限公司 一种印刷电路板的制造方法和一种印刷电路板结构
KR20130077477A (ko) * 2011-12-29 2013-07-09 삼성전자주식회사 파워 반도체 소자 및 그 제조 방법
US9668345B2 (en) * 2012-03-30 2017-05-30 Hitachi Chemical Company, Ltd. Multilayer wiring board with metal foil wiring layer, wire wiring layer, and interlayer conduction hole
US8721352B2 (en) * 2012-05-09 2014-05-13 Tyco Electronics Corporation System for interconnecting printed circuit boards
US9880198B2 (en) * 2013-02-11 2018-01-30 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. High bandwidth signal probe tip
CN103298251B (zh) * 2013-05-23 2016-05-25 华为技术有限公司 一种印刷电路板及其制作方法
CN104064896A (zh) * 2014-06-06 2014-09-24 华为技术有限公司 弯式连接器和连接器组件及通信组件
CN107534259B (zh) * 2014-11-21 2020-12-08 安费诺公司 用于高速、高密度电连接器的配套背板
CN109076700B (zh) 2016-03-08 2021-07-30 安费诺公司 用于高速、高密度电连接器的背板占板区
US10201074B2 (en) 2016-03-08 2019-02-05 Amphenol Corporation Backplane footprint for high speed, high density electrical connectors
US20170318673A1 (en) * 2016-04-29 2017-11-02 Arista Networks, Inc. Connector for printed circuit board
US10251270B2 (en) * 2016-09-15 2019-04-02 Innovium, Inc. Dual-drill printed circuit board via
US10667393B2 (en) * 2018-01-04 2020-05-26 Dell Products, L.P. Stepped vias for next generation speeds
TWI830739B (zh) * 2018-06-11 2024-02-01 美商安芬諾股份有限公司 包含用於高速且高密度之電連接器的連接器佔位面積之印刷電路板和互連系統以及其製造方法
CN109743834B (zh) * 2018-12-28 2020-07-28 苏州浪潮智能科技有限公司 一种优化usb链路阻抗的方法
TW202109986A (zh) 2019-05-20 2021-03-01 美商安芬諾股份有限公司 高密度高速電連接器
CN110361599B (zh) * 2019-06-26 2021-12-07 深圳市广和通无线股份有限公司 阻抗控制的方法
US11637403B2 (en) 2020-01-27 2023-04-25 Amphenol Corporation Electrical connector with high speed mounting interface
CN115315855A (zh) 2020-01-27 2022-11-08 安费诺有限公司 具有高速安装接口的电连接器
CN116321696B (zh) * 2023-05-17 2023-08-15 深圳国人无线通信有限公司 一种pcb板
CN117436379B (zh) * 2023-12-21 2024-04-09 成都行芯科技有限公司 一种通孔压缩方法、装置、电子设备及存储介质

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3193789A (en) 1962-08-01 1965-07-06 Sperry Rand Corp Electrical circuitry
US3243498A (en) 1964-12-24 1966-03-29 Ibm Method for making circuit connections to internal layers of a multilayer circuit card and circuit card produced thereby
FR1552207A (de) 1967-11-22 1969-01-03
JPS5596882A (en) 1979-01-19 1980-07-23 Hoshizaki Electric Co Ltd Method and device for bottom flowwdown type ice making
SE426894B (sv) * 1981-06-30 1983-02-14 Ericsson Telefon Ab L M Impedansriktig koaxialovergang for mikrovagssignaler
JPS58106968A (ja) 1981-12-18 1983-06-25 Canon Inc 撮像装置
JPS58106968U (ja) * 1982-01-18 1983-07-21 富士通株式会社 プリント配線板
JPH0234461B2 (ja) 1983-06-20 1990-08-03 Intaanashonaru Bijinesu Mashiinzu Corp Hienkeipinanaakitasojudentaikibanoyobisonoseizohoho
US4598470A (en) 1983-06-20 1986-07-08 International Business Machines Corporation Method for providing improved electrical and mechanical connection between I/O pin and transverse via substrate
JPS6042896A (ja) 1983-08-18 1985-03-07 日本電気株式会社 印刷配線板の製造方法
JPS60227496A (ja) 1984-04-26 1985-11-12 日本電気株式会社 多層印刷配線板の製造方法
HU191139B (en) 1984-05-23 1987-01-28 Mta Koezponti Fizikai Kutato Intezete,Hu Method and arrangement for increasinf reliability of metallization of holes at manufacturing printed circuits
JPS6112054A (ja) 1984-06-22 1986-01-20 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション 半導体パツケ−ジ製造方法
JPS6273697A (ja) 1985-09-26 1987-04-04 富士通株式会社 多層セラミツク回路基板の製造方法
JPS62229896A (ja) 1986-03-29 1987-10-08 株式会社東芝 印刷配線基板
JPS62235795A (ja) 1986-04-04 1987-10-15 松下電工株式会社 プリント配線用基板
JPS63258046A (ja) * 1987-04-15 1988-10-25 Toshiba Corp 半導体集積回路装置
US4859806A (en) 1988-05-17 1989-08-22 Microelectronics And Computer Technology Corporation Discretionary interconnect
JPH0294693A (ja) 1988-09-30 1990-04-05 Nec Corp 同軸形スルーホールを有するプリント配線板
US4906198A (en) 1988-12-12 1990-03-06 International Business Machines Corporation Circuit board assembly and contact pin for use therein
US5038252A (en) 1989-01-26 1991-08-06 Teradyne, Inc. Printed circuit boards with improved electrical current control
JPH02249291A (ja) * 1989-03-23 1990-10-05 Hitachi Cable Ltd プリント配線基板
US5118300A (en) * 1991-05-23 1992-06-02 Amp Incorporated Active electrical connector
JP2522478Y2 (ja) * 1991-11-08 1997-01-16 アルプス電気株式会社 印刷配線板
JP3091020B2 (ja) * 1992-06-08 2000-09-25 新光電気工業株式会社 高周波用配線基板
JP3100232B2 (ja) 1992-06-29 2000-10-16 新光電気工業株式会社 高周波用電子部品の信号線路
JPH0637416A (ja) * 1992-07-14 1994-02-10 Fujitsu Ltd プリント配線板
US5266912A (en) * 1992-08-19 1993-11-30 Micron Technology, Inc. Inherently impedance matched multiple integrated circuit module
US5399104A (en) * 1992-09-28 1995-03-21 Mckenzie Socket Technology, Inc. Socket for multi-lead integrated circuit packages
JPH0828581B2 (ja) 1993-05-31 1996-03-21 日本電気株式会社 多層印刷配線板およびその製造方法
EP0692841B1 (de) * 1994-07-15 1998-09-30 Berg Electronics Manufacturing B.V. Zusammenbau eines abgeschirmten Verbinders und einer Leiterplatte mit kontaktierten Löchern
JPH08139503A (ja) * 1994-11-15 1996-05-31 Mitsubishi Electric Corp 高周波半導体装置用基板
US5487218A (en) 1994-11-21 1996-01-30 International Business Machines Corporation Method for making printed circuit boards with selectivity filled plated through holes
JPH08250912A (ja) * 1995-03-14 1996-09-27 Japan Radio Co Ltd ストリップラインの垂直給電部
US5568107A (en) 1995-05-01 1996-10-22 Apple Computer, Inc. Transmission line having impedance set by reference plane fenestration
US5689216A (en) * 1996-04-01 1997-11-18 Hughes Electronics Direct three-wire to stripline connection
JPH09321433A (ja) 1996-05-29 1997-12-12 Oki Electric Ind Co Ltd 多層プリント配線板のバイアホール
US5718606A (en) * 1996-10-30 1998-02-17 Component Equipment Company, Inc. Electrical connector between a pair of printed circuit boards

Also Published As

Publication number Publication date
ATE262775T1 (de) 2004-04-15
AU1930000A (en) 2000-06-19
EP1138180B1 (de) 2004-03-24
JP4743965B2 (ja) 2011-08-10
WO2000033624A1 (en) 2000-06-08
US6181219B1 (en) 2001-01-30
JP2007243205A (ja) 2007-09-20
EP1138180A1 (de) 2001-10-04
CN1329812A (zh) 2002-01-02
CN1199528C (zh) 2005-04-27
JP2002531960A (ja) 2002-09-24
DE69915874T2 (de) 2005-03-03
CA2352820A1 (en) 2000-06-08
JP4669496B2 (ja) 2011-04-13
JP2011040785A (ja) 2011-02-24

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: AMPHENOL CORPORATION, WALLINGFORD, CONN., US