ATE262775T1 - Gedruckte leiterplatte und verfahren zu deren herstellung - Google Patents
Gedruckte leiterplatte und verfahren zu deren herstellungInfo
- Publication number
- ATE262775T1 ATE262775T1 AT99962969T AT99962969T ATE262775T1 AT E262775 T1 ATE262775 T1 AT E262775T1 AT 99962969 T AT99962969 T AT 99962969T AT 99962969 T AT99962969 T AT 99962969T AT E262775 T1 ATE262775 T1 AT E262775T1
- Authority
- AT
- Austria
- Prior art keywords
- boards
- printed circuit
- conductive via
- circuit board
- dielectric
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/024—Dielectric details, e.g. changing the dielectric material around a transmission line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09718—Clearance holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09845—Stepped hole, via, edge, bump or conductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/1059—Connections made by press-fit insertion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/0455—PTH for surface mount device [SMD], e.g. wherein solder flows through the PTH during mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/204,118 US6181219B1 (en) | 1998-12-02 | 1998-12-02 | Printed circuit board and method for fabricating such board |
PCT/US1999/028488 WO2000033624A1 (en) | 1998-12-02 | 1999-12-02 | Printed circuit board and method for fabricating such board |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE262775T1 true ATE262775T1 (de) | 2004-04-15 |
Family
ID=22756707
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT99962969T ATE262775T1 (de) | 1998-12-02 | 1999-12-02 | Gedruckte leiterplatte und verfahren zu deren herstellung |
Country Status (9)
Country | Link |
---|---|
US (1) | US6181219B1 (de) |
EP (1) | EP1138180B1 (de) |
JP (3) | JP4743965B2 (de) |
CN (1) | CN1199528C (de) |
AT (1) | ATE262775T1 (de) |
AU (1) | AU1930000A (de) |
CA (1) | CA2352820A1 (de) |
DE (1) | DE69915874T2 (de) |
WO (1) | WO2000033624A1 (de) |
Families Citing this family (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6663442B1 (en) * | 2000-01-27 | 2003-12-16 | Tyco Electronics Corporation | High speed interconnect using printed circuit board with plated bores |
US6499214B2 (en) * | 2000-05-26 | 2002-12-31 | Visteon Global Tech, Inc. | Method of making a circuit board |
US6441319B1 (en) * | 2000-12-28 | 2002-08-27 | Nortel Networks Limited | Inserted components for via connection of signal tracks to achieve continuous impedance matching in multi-layer substrate |
JP4379332B2 (ja) * | 2002-07-05 | 2009-12-09 | 日本精工株式会社 | 電動パワーステアリング装置 |
US20040115968A1 (en) * | 2002-12-17 | 2004-06-17 | Cohen Thomas S. | Connector and printed circuit board for reducing cross-talk |
US20050201065A1 (en) * | 2004-02-13 | 2005-09-15 | Regnier Kent E. | Preferential ground and via exit structures for printed circuit boards |
US7852635B1 (en) * | 2004-05-25 | 2010-12-14 | Lineage Power Corporation | Multi-connection via |
US7155821B1 (en) * | 2004-06-30 | 2007-01-02 | Emc Corporation | Techniques for manufacturing a circuit board having a countersunk via |
US7145083B2 (en) * | 2004-07-13 | 2006-12-05 | Nortel Networks Limited | Reducing or eliminating cross-talk at device-substrate interface |
US7053729B2 (en) * | 2004-08-23 | 2006-05-30 | Kyocera America, Inc. | Impedence matching along verticle path of microwave vias in multilayer packages |
US7718904B2 (en) * | 2005-11-15 | 2010-05-18 | Intel Corporation | Enhancing shock resistance in semiconductor packages |
US7484971B2 (en) * | 2005-11-29 | 2009-02-03 | Amphenol Corporation | Electronic component with high density, low cost attachment |
US7244126B2 (en) * | 2005-12-09 | 2007-07-17 | Tyco Electronics Corporation | Electrical connector having a circuit board with controlled impedance |
US20080087460A1 (en) * | 2006-10-17 | 2008-04-17 | Pat Fung | Apparatus and method for a printed circuit board that reduces capacitance loading of through-holes |
US8102057B2 (en) * | 2006-12-27 | 2012-01-24 | Hewlett-Packard Development Company, L.P. | Via design for flux residue mitigation |
US7999192B2 (en) | 2007-03-14 | 2011-08-16 | Amphenol Corporation | Adjacent plated through holes with staggered couplings for crosstalk reduction in high speed printed circuit boards |
JP4912204B2 (ja) * | 2007-04-16 | 2012-04-11 | アイカ工業株式会社 | 多層プリント配線板 |
US7578707B2 (en) | 2007-09-12 | 2009-08-25 | Amphenol Corporation | Modular board to board connector |
US8431831B2 (en) * | 2008-10-08 | 2013-04-30 | Oracle America, Inc. | Bond strength and interconnection in a via |
JP4613237B2 (ja) * | 2008-12-10 | 2011-01-12 | 新光電気工業株式会社 | リードピン付配線基板及びリードピン |
JP4920754B2 (ja) * | 2010-01-21 | 2012-04-18 | 新光電気工業株式会社 | リードピン付き配線基板 |
US7963776B1 (en) * | 2010-03-23 | 2011-06-21 | Tyco Electronics Corporation | Electrical connector assembly having direct connection terminals |
US8123572B2 (en) | 2010-04-02 | 2012-02-28 | Tyco Electronics Corporation | Electrical components having a contact configured to engage a via of a circuit board |
JP2012094664A (ja) * | 2010-10-27 | 2012-05-17 | Fujitsu Ltd | 基板ユニット、ネットワーク装置および基板ユニットの製造方法 |
CN103025082B (zh) * | 2011-09-21 | 2015-08-05 | 英业达股份有限公司 | 一种印刷电路板的制造方法和一种印刷电路板结构 |
KR20130077477A (ko) * | 2011-12-29 | 2013-07-09 | 삼성전자주식회사 | 파워 반도체 소자 및 그 제조 방법 |
US9668345B2 (en) * | 2012-03-30 | 2017-05-30 | Hitachi Chemical Company, Ltd. | Multilayer wiring board with metal foil wiring layer, wire wiring layer, and interlayer conduction hole |
US8721352B2 (en) * | 2012-05-09 | 2014-05-13 | Tyco Electronics Corporation | System for interconnecting printed circuit boards |
US9880198B2 (en) * | 2013-02-11 | 2018-01-30 | Lenovo Enterprise Solutions (Singapore) Pte. Ltd. | High bandwidth signal probe tip |
CN103298251B (zh) * | 2013-05-23 | 2016-05-25 | 华为技术有限公司 | 一种印刷电路板及其制作方法 |
CN104064896A (zh) * | 2014-06-06 | 2014-09-24 | 华为技术有限公司 | 弯式连接器和连接器组件及通信组件 |
US9775231B2 (en) * | 2014-11-21 | 2017-09-26 | Amphenol Corporation | Mating backplane for high speed, high density electrical connector |
US10201074B2 (en) | 2016-03-08 | 2019-02-05 | Amphenol Corporation | Backplane footprint for high speed, high density electrical connectors |
WO2017155997A1 (en) | 2016-03-08 | 2017-09-14 | Amphenol Corporation | Backplane footprint for high speed, high density electrical connectors |
US20170318673A1 (en) * | 2016-04-29 | 2017-11-02 | Arista Networks, Inc. | Connector for printed circuit board |
US10251270B2 (en) * | 2016-09-15 | 2019-04-02 | Innovium, Inc. | Dual-drill printed circuit board via |
US10667393B2 (en) * | 2018-01-04 | 2020-05-26 | Dell Products, L.P. | Stepped vias for next generation speeds |
CN112425274A (zh) * | 2018-06-11 | 2021-02-26 | 安费诺有限公司 | 高速、高密度电连接器的底板覆盖区 |
CN109743834B (zh) * | 2018-12-28 | 2020-07-28 | 苏州浪潮智能科技有限公司 | 一种优化usb链路阻抗的方法 |
US11289830B2 (en) | 2019-05-20 | 2022-03-29 | Amphenol Corporation | High density, high speed electrical connector |
CN110361599B (zh) * | 2019-06-26 | 2021-12-07 | 深圳市广和通无线股份有限公司 | 阻抗控制的方法 |
CN115298912A (zh) | 2020-01-27 | 2022-11-04 | 安费诺有限公司 | 具有高速安装接口的电连接器 |
TW202147717A (zh) | 2020-01-27 | 2021-12-16 | 美商安芬諾股份有限公司 | 具有高速安裝界面之電連接器 |
CN116321696B (zh) * | 2023-05-17 | 2023-08-15 | 深圳国人无线通信有限公司 | 一种pcb板 |
CN117436379B (zh) * | 2023-12-21 | 2024-04-09 | 成都行芯科技有限公司 | 一种通孔压缩方法、装置、电子设备及存储介质 |
Family Cites Families (38)
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US3193789A (en) | 1962-08-01 | 1965-07-06 | Sperry Rand Corp | Electrical circuitry |
US3243498A (en) | 1964-12-24 | 1966-03-29 | Ibm | Method for making circuit connections to internal layers of a multilayer circuit card and circuit card produced thereby |
FR1552207A (de) | 1967-11-22 | 1969-01-03 | ||
JPS5596882A (en) | 1979-01-19 | 1980-07-23 | Hoshizaki Electric Co Ltd | Method and device for bottom flowwdown type ice making |
SE426894B (sv) * | 1981-06-30 | 1983-02-14 | Ericsson Telefon Ab L M | Impedansriktig koaxialovergang for mikrovagssignaler |
JPS58106968A (ja) | 1981-12-18 | 1983-06-25 | Canon Inc | 撮像装置 |
JPS58106968U (ja) * | 1982-01-18 | 1983-07-21 | 富士通株式会社 | プリント配線板 |
JPH0234461B2 (ja) | 1983-06-20 | 1990-08-03 | Intaanashonaru Bijinesu Mashiinzu Corp | Hienkeipinanaakitasojudentaikibanoyobisonoseizohoho |
US4598470A (en) | 1983-06-20 | 1986-07-08 | International Business Machines Corporation | Method for providing improved electrical and mechanical connection between I/O pin and transverse via substrate |
JPS6042896A (ja) | 1983-08-18 | 1985-03-07 | 日本電気株式会社 | 印刷配線板の製造方法 |
JPS60227496A (ja) | 1984-04-26 | 1985-11-12 | 日本電気株式会社 | 多層印刷配線板の製造方法 |
HU191139B (en) | 1984-05-23 | 1987-01-28 | Mta Koezponti Fizikai Kutato Intezete,Hu | Method and arrangement for increasinf reliability of metallization of holes at manufacturing printed circuits |
JPS6112054A (ja) | 1984-06-22 | 1986-01-20 | インタ−ナショナル ビジネス マシ−ンズ コ−ポレ−ション | 半導体パツケ−ジ製造方法 |
JPS6273697A (ja) | 1985-09-26 | 1987-04-04 | 富士通株式会社 | 多層セラミツク回路基板の製造方法 |
JPS62229896A (ja) | 1986-03-29 | 1987-10-08 | 株式会社東芝 | 印刷配線基板 |
JPS62235795A (ja) | 1986-04-04 | 1987-10-15 | 松下電工株式会社 | プリント配線用基板 |
JPS63258046A (ja) * | 1987-04-15 | 1988-10-25 | Toshiba Corp | 半導体集積回路装置 |
US4859806A (en) | 1988-05-17 | 1989-08-22 | Microelectronics And Computer Technology Corporation | Discretionary interconnect |
JPH0294693A (ja) | 1988-09-30 | 1990-04-05 | Nec Corp | 同軸形スルーホールを有するプリント配線板 |
US4906198A (en) | 1988-12-12 | 1990-03-06 | International Business Machines Corporation | Circuit board assembly and contact pin for use therein |
US5038252A (en) | 1989-01-26 | 1991-08-06 | Teradyne, Inc. | Printed circuit boards with improved electrical current control |
JPH02249291A (ja) * | 1989-03-23 | 1990-10-05 | Hitachi Cable Ltd | プリント配線基板 |
US5118300A (en) * | 1991-05-23 | 1992-06-02 | Amp Incorporated | Active electrical connector |
JP2522478Y2 (ja) * | 1991-11-08 | 1997-01-16 | アルプス電気株式会社 | 印刷配線板 |
JP3091020B2 (ja) * | 1992-06-08 | 2000-09-25 | 新光電気工業株式会社 | 高周波用配線基板 |
JP3100232B2 (ja) | 1992-06-29 | 2000-10-16 | 新光電気工業株式会社 | 高周波用電子部品の信号線路 |
JPH0637416A (ja) * | 1992-07-14 | 1994-02-10 | Fujitsu Ltd | プリント配線板 |
US5266912A (en) * | 1992-08-19 | 1993-11-30 | Micron Technology, Inc. | Inherently impedance matched multiple integrated circuit module |
US5399104A (en) * | 1992-09-28 | 1995-03-21 | Mckenzie Socket Technology, Inc. | Socket for multi-lead integrated circuit packages |
JPH0828581B2 (ja) | 1993-05-31 | 1996-03-21 | 日本電気株式会社 | 多層印刷配線板およびその製造方法 |
EP0692841B1 (de) * | 1994-07-15 | 1998-09-30 | Berg Electronics Manufacturing B.V. | Zusammenbau eines abgeschirmten Verbinders und einer Leiterplatte mit kontaktierten Löchern |
JPH08139503A (ja) * | 1994-11-15 | 1996-05-31 | Mitsubishi Electric Corp | 高周波半導体装置用基板 |
US5487218A (en) | 1994-11-21 | 1996-01-30 | International Business Machines Corporation | Method for making printed circuit boards with selectivity filled plated through holes |
JPH08250912A (ja) * | 1995-03-14 | 1996-09-27 | Japan Radio Co Ltd | ストリップラインの垂直給電部 |
US5568107A (en) | 1995-05-01 | 1996-10-22 | Apple Computer, Inc. | Transmission line having impedance set by reference plane fenestration |
US5689216A (en) * | 1996-04-01 | 1997-11-18 | Hughes Electronics | Direct three-wire to stripline connection |
JPH09321433A (ja) | 1996-05-29 | 1997-12-12 | Oki Electric Ind Co Ltd | 多層プリント配線板のバイアホール |
US5718606A (en) * | 1996-10-30 | 1998-02-17 | Component Equipment Company, Inc. | Electrical connector between a pair of printed circuit boards |
-
1998
- 1998-12-02 US US09/204,118 patent/US6181219B1/en not_active Expired - Lifetime
-
1999
- 1999-12-02 AU AU19300/00A patent/AU1930000A/en not_active Abandoned
- 1999-12-02 WO PCT/US1999/028488 patent/WO2000033624A1/en active IP Right Grant
- 1999-12-02 EP EP99962969A patent/EP1138180B1/de not_active Expired - Lifetime
- 1999-12-02 JP JP2000586144A patent/JP4743965B2/ja not_active Expired - Lifetime
- 1999-12-02 AT AT99962969T patent/ATE262775T1/de not_active IP Right Cessation
- 1999-12-02 CN CNB99813967XA patent/CN1199528C/zh not_active Expired - Fee Related
- 1999-12-02 DE DE69915874T patent/DE69915874T2/de not_active Expired - Lifetime
- 1999-12-02 CA CA002352820A patent/CA2352820A1/en not_active Abandoned
-
2007
- 2007-04-10 JP JP2007102789A patent/JP4669496B2/ja not_active Expired - Lifetime
-
2010
- 2010-10-22 JP JP2010237237A patent/JP2011040785A/ja not_active Ceased
Also Published As
Publication number | Publication date |
---|---|
CN1329812A (zh) | 2002-01-02 |
JP2007243205A (ja) | 2007-09-20 |
AU1930000A (en) | 2000-06-19 |
US6181219B1 (en) | 2001-01-30 |
CA2352820A1 (en) | 2000-06-08 |
JP2002531960A (ja) | 2002-09-24 |
DE69915874D1 (de) | 2004-04-29 |
JP4669496B2 (ja) | 2011-04-13 |
DE69915874T2 (de) | 2005-03-03 |
CN1199528C (zh) | 2005-04-27 |
WO2000033624A1 (en) | 2000-06-08 |
EP1138180B1 (de) | 2004-03-24 |
JP2011040785A (ja) | 2011-02-24 |
JP4743965B2 (ja) | 2011-08-10 |
EP1138180A1 (de) | 2001-10-04 |
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