DE69908591D1 - Vorrichtung zum Laden von Halbleiterscheiben - Google Patents
Vorrichtung zum Laden von HalbleiterscheibenInfo
- Publication number
- DE69908591D1 DE69908591D1 DE69908591T DE69908591T DE69908591D1 DE 69908591 D1 DE69908591 D1 DE 69908591D1 DE 69908591 T DE69908591 T DE 69908591T DE 69908591 T DE69908591 T DE 69908591T DE 69908591 D1 DE69908591 D1 DE 69908591D1
- Authority
- DE
- Germany
- Prior art keywords
- wafer
- present
- load station
- descend
- nozzles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 235000012431 wafers Nutrition 0.000 title abstract 13
- 239000004065 semiconductor Substances 0.000 title 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 3
- 238000000151 deposition Methods 0.000 abstract 1
- 239000008213 purified water Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q17/00—Arrangements for observing, indicating or measuring on machine tools
- B23Q17/006—Arrangements for observing, indicating or measuring on machine tools for indicating the presence of a work or tool in its holder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US7512998P | 1998-02-14 | 1998-02-14 | |
US75129P | 1998-02-14 | ||
PCT/US1999/002699 WO1999041022A1 (en) | 1998-02-14 | 1999-02-09 | Accurate positioning of a wafer |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69908591D1 true DE69908591D1 (de) | 2003-07-10 |
DE69908591T2 DE69908591T2 (de) | 2004-04-29 |
Family
ID=22123745
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69908591T Expired - Fee Related DE69908591T2 (de) | 1998-02-14 | 1999-02-09 | Vorrichtung zum Laden von Halbleiterscheiben |
Country Status (7)
Country | Link |
---|---|
US (7) | US6102057A (de) |
EP (1) | EP1084001B1 (de) |
JP (1) | JP2002503044A (de) |
KR (1) | KR100545680B1 (de) |
AT (1) | ATE242064T1 (de) |
DE (1) | DE69908591T2 (de) |
WO (1) | WO1999041022A1 (de) |
Families Citing this family (48)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6102057A (en) * | 1998-02-14 | 2000-08-15 | Strasbaugh | Lifting and rinsing a wafer |
JP2000150836A (ja) * | 1998-11-06 | 2000-05-30 | Canon Inc | 試料の処理システム |
US6672358B2 (en) * | 1998-11-06 | 2004-01-06 | Canon Kabushiki Kaisha | Sample processing system |
TW484184B (en) * | 1998-11-06 | 2002-04-21 | Canon Kk | Sample separating apparatus and method, and substrate manufacturing method |
US7425250B2 (en) * | 1998-12-01 | 2008-09-16 | Novellus Systems, Inc. | Electrochemical mechanical processing apparatus |
US6464571B2 (en) * | 1998-12-01 | 2002-10-15 | Nutool, Inc. | Polishing apparatus and method with belt drive system adapted to extend the lifetime of a refreshing polishing belt provided therein |
US6716086B1 (en) * | 1999-06-14 | 2004-04-06 | Applied Materials Inc. | Edge contact loadcup |
JP3245833B2 (ja) * | 1999-07-08 | 2002-01-15 | 日本エー・エス・エム株式会社 | 半導体基板アライナー装置および方法 |
US6425280B1 (en) * | 1999-07-30 | 2002-07-30 | International Business Machines Corporation | Wafer alignment jig for wafer-handling systems |
US6386947B2 (en) * | 2000-02-29 | 2002-05-14 | Applied Materials, Inc. | Method and apparatus for detecting wafer slipouts |
US6413145B1 (en) | 2000-04-05 | 2002-07-02 | Applied Materials, Inc. | System for polishing and cleaning substrates |
KR100387524B1 (ko) * | 2001-01-26 | 2003-06-18 | 삼성전자주식회사 | 반도체 웨이퍼 위치 상태 감지 시스템과 이를 이용하는 반도체장치 제조 설비 및 그에 따른 웨이퍼 위치 상태 감지방법 |
US6398631B1 (en) * | 2001-02-02 | 2002-06-04 | Memc Electronic Materials, Inc. | Method and apparatus to place wafers into and out of machine |
US6561204B2 (en) * | 2001-09-05 | 2003-05-13 | Silicon Integrated Systems Corp. | Apparatus and method for cleaning wafers with contact holes or via holes |
US6752442B2 (en) | 2001-11-09 | 2004-06-22 | Speedfam-Ipec Corporation | Workpiece handling end-effector and a method for processing workpieces using a workpiece handling end-effector |
US6743722B2 (en) | 2002-01-29 | 2004-06-01 | Strasbaugh | Method of spin etching wafers with an alkali solution |
US7018268B2 (en) * | 2002-04-09 | 2006-03-28 | Strasbaugh | Protection of work piece during surface processing |
JP3978780B2 (ja) | 2002-08-09 | 2007-09-19 | 信越半導体株式会社 | ウエーハの研磨方法及び装置 |
US7101253B2 (en) * | 2002-08-27 | 2006-09-05 | Applied Materials Inc. | Load cup for chemical mechanical polishing |
US6788991B2 (en) | 2002-10-09 | 2004-09-07 | Asm International N.V. | Devices and methods for detecting orientation and shape of an object |
US6729947B1 (en) * | 2002-11-04 | 2004-05-04 | Texas Instruments Incorporated | Semiconductor wafer handler |
US6950774B2 (en) * | 2003-01-16 | 2005-09-27 | Asm America, Inc. | Out-of-pocket detection system using wafer rotation as an indicator |
JP2005123485A (ja) | 2003-10-17 | 2005-05-12 | Ebara Corp | 研磨装置 |
US7044832B2 (en) * | 2003-11-17 | 2006-05-16 | Applied Materials | Load cup for chemical mechanical polishing |
US7648622B2 (en) * | 2004-02-27 | 2010-01-19 | Novellus Systems, Inc. | System and method for electrochemical mechanical polishing |
US20060066333A1 (en) * | 2004-09-30 | 2006-03-30 | Jian-Huei Feng | System and method for aligning wafers |
US8500916B2 (en) * | 2004-11-05 | 2013-08-06 | HGST Netherlands B.V. | Method for aligning wafers within wafer processing equipment |
DE102004057215B4 (de) * | 2004-11-26 | 2008-12-18 | Erich Reitinger | Verfahren und Vorrichtung zum Testen von Halbleiterwafern mittels einer Sondenkarte unter Verwendung eines temperierten Fluidstrahls |
US20070169700A1 (en) * | 2006-01-26 | 2007-07-26 | Gert-Jan Sniders | Sensing system and method for determining the alignment of a substrate holder in a batch reactor |
JP2007234882A (ja) * | 2006-03-01 | 2007-09-13 | Dainippon Screen Mfg Co Ltd | 基板処理装置および基板取り扱い方法 |
KR100739100B1 (ko) * | 2006-03-08 | 2007-07-12 | 주식회사 디엠에스 | 기판이송장치 |
JP5033354B2 (ja) * | 2006-05-29 | 2012-09-26 | 不二越機械工業株式会社 | ワークセンタリング装置 |
US8057601B2 (en) * | 2007-05-09 | 2011-11-15 | Applied Materials, Inc. | Apparatus and method for supporting, positioning and rotating a substrate in a processing chamber |
US8057602B2 (en) * | 2007-05-09 | 2011-11-15 | Applied Materials, Inc. | Apparatus and method for supporting, positioning and rotating a substrate in a processing chamber |
JP2009111024A (ja) * | 2007-10-26 | 2009-05-21 | Applied Materials Inc | 化学機械研磨装置の基板支持部材、および化学機械研磨装置 |
KR101489963B1 (ko) * | 2007-12-13 | 2015-02-04 | 한국에이에스엠지니텍 주식회사 | 박막 증착 장치 및 이를 이용한 증착 방법 |
US8273178B2 (en) * | 2008-02-28 | 2012-09-25 | Asm Genitech Korea Ltd. | Thin film deposition apparatus and method of maintaining the same |
US8454408B2 (en) | 2008-11-26 | 2013-06-04 | Applied Materials, Inc. | Load cup substrate sensing |
CN103293862B (zh) * | 2012-02-22 | 2015-04-15 | 上海微电子装备有限公司 | 硅片边缘保护装置 |
JP6027454B2 (ja) * | 2013-02-05 | 2016-11-16 | 株式会社荏原製作所 | 研磨装置 |
JP6145334B2 (ja) | 2013-06-28 | 2017-06-07 | 株式会社荏原製作所 | 基板処理装置 |
US10269557B2 (en) * | 2015-10-20 | 2019-04-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Apparatus of processing semiconductor substrate |
US10373858B2 (en) | 2016-04-06 | 2019-08-06 | Lam Research Corporation | Chuck for edge bevel removal and method for centering a wafer prior to edge bevel removal |
CN206692727U (zh) * | 2017-04-28 | 2017-12-01 | 京东方科技集团股份有限公司 | 一种基板承载组件及磁控溅射装置 |
US10792736B1 (en) * | 2018-05-26 | 2020-10-06 | Kitagawa-Northtech, Inc. | Lightweight intelligent top-tooling apparatus |
CN110103119A (zh) * | 2018-09-20 | 2019-08-09 | 杭州众硅电子科技有限公司 | 一种抛光装卸部件模块 |
JP7052771B2 (ja) * | 2019-04-15 | 2022-04-12 | 株式会社Sumco | 片面研磨装置へのウェーハ装填装置 |
CN110860502B (zh) * | 2019-12-25 | 2021-07-16 | 徐州双裕电子技术有限公司 | 一种自动清灰传感器 |
Family Cites Families (26)
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US3677276A (en) * | 1970-10-02 | 1972-07-18 | Bowles Fluidics Corp | Interruptible jet sensor |
JPS5435653Y2 (de) * | 1971-11-08 | 1979-10-29 | ||
US4256535A (en) * | 1979-12-05 | 1981-03-17 | Western Electric Company, Inc. | Method of polishing a semiconductor wafer |
US4521995A (en) * | 1980-05-23 | 1985-06-11 | Disco Co., Ltd. | Wafer attracting and fixing device |
US4508161A (en) * | 1982-05-25 | 1985-04-02 | Varian Associates, Inc. | Method for gas-assisted, solid-to-solid thermal transfer with a semiconductor wafer |
US4566726A (en) * | 1984-06-13 | 1986-01-28 | At&T Technologies, Inc. | Method and apparatus for handling semiconductor wafers |
JPH07105345B2 (ja) * | 1985-08-08 | 1995-11-13 | 日電アネルバ株式会社 | 基体処理装置 |
AT389959B (de) * | 1987-11-09 | 1990-02-26 | Sez Semiconduct Equip Zubehoer | Vorrichtung zum aetzen von scheibenfoermigen gegenstaenden, insbesondere von siliziumscheiben |
JPH0736417B2 (ja) * | 1989-10-24 | 1995-04-19 | 株式会社メツクス | ウエハーの位置決め装置 |
US5169408A (en) * | 1990-01-26 | 1992-12-08 | Fsi International, Inc. | Apparatus for wafer processing with in situ rinse |
JPH0770504B2 (ja) * | 1990-12-26 | 1995-07-31 | 信越半導体株式会社 | ウエーハのハンドリング方法及び装置 |
US5267418A (en) * | 1992-05-27 | 1993-12-07 | International Business Machines Corporation | Confined water fixture for holding wafers undergoing chemical-mechanical polishing |
JP2862754B2 (ja) * | 1993-04-19 | 1999-03-03 | 東京エレクトロン株式会社 | 処理装置及び回転部材 |
US5443416A (en) * | 1993-09-09 | 1995-08-22 | Cybeq Systems Incorporated | Rotary union for coupling fluids in a wafer polishing apparatus |
US5582534A (en) * | 1993-12-27 | 1996-12-10 | Applied Materials, Inc. | Orbital chemical mechanical polishing apparatus and method |
US5449316A (en) * | 1994-01-05 | 1995-09-12 | Strasbaugh; Alan | Wafer carrier for film planarization |
US5423716A (en) * | 1994-01-05 | 1995-06-13 | Strasbaugh; Alan | Wafer-handling apparatus having a resilient membrane which holds wafer when a vacuum is applied |
JP3388628B2 (ja) * | 1994-03-24 | 2003-03-24 | 東京応化工業株式会社 | 回転式薬液処理装置 |
US5979475A (en) * | 1994-04-28 | 1999-11-09 | Hitachi, Ltd. | Specimen holding method and fluid treatment method of specimen surface and systems therefor |
US5738574A (en) * | 1995-10-27 | 1998-04-14 | Applied Materials, Inc. | Continuous processing system for chemical mechanical polishing |
JP3580936B2 (ja) * | 1996-02-26 | 2004-10-27 | 株式会社荏原製作所 | ポリッシング装置のプッシャー及びポリッシング装置 |
US5800248A (en) * | 1996-04-26 | 1998-09-01 | Ontrak Systems Inc. | Control of chemical-mechanical polishing rate across a substrate surface |
JP3831043B2 (ja) * | 1997-01-24 | 2006-10-11 | 東京エレクトロン株式会社 | 回転処理装置 |
US5885135A (en) * | 1997-04-23 | 1999-03-23 | International Business Machines Corporation | CMP wafer carrier for preferential polishing of a wafer |
US6062959A (en) * | 1997-11-05 | 2000-05-16 | Aplex Group | Polishing system including a hydrostatic fluid bearing support |
US6102057A (en) * | 1998-02-14 | 2000-08-15 | Strasbaugh | Lifting and rinsing a wafer |
-
1999
- 1999-02-09 US US09/247,109 patent/US6102057A/en not_active Expired - Fee Related
- 1999-02-09 KR KR1020007008698A patent/KR100545680B1/ko not_active IP Right Cessation
- 1999-02-09 AT AT99906813T patent/ATE242064T1/de not_active IP Right Cessation
- 1999-02-09 US US09/247,106 patent/US6131589A/en not_active Expired - Fee Related
- 1999-02-09 DE DE69908591T patent/DE69908591T2/de not_active Expired - Fee Related
- 1999-02-09 US US09/247,107 patent/US6283827B1/en not_active Expired - Fee Related
- 1999-02-09 EP EP99906813A patent/EP1084001B1/de not_active Expired - Lifetime
- 1999-02-09 JP JP2000531259A patent/JP2002503044A/ja active Pending
- 1999-02-09 WO PCT/US1999/002699 patent/WO1999041022A1/en active IP Right Grant
- 1999-02-09 US US09/247,108 patent/US6267642B1/en not_active Expired - Fee Related
-
2000
- 2000-06-30 US US09/608,618 patent/US6505635B1/en not_active Expired - Fee Related
- 2000-08-02 US US09/630,507 patent/US6405740B1/en not_active Expired - Fee Related
-
2001
- 2001-02-09 US US09/780,067 patent/US6796881B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1084001B1 (de) | 2003-06-04 |
EP1084001A1 (de) | 2001-03-21 |
ATE242064T1 (de) | 2003-06-15 |
US6102057A (en) | 2000-08-15 |
US6283827B1 (en) | 2001-09-04 |
DE69908591T2 (de) | 2004-04-29 |
WO1999041022A1 (en) | 1999-08-19 |
US6131589A (en) | 2000-10-17 |
US6505635B1 (en) | 2003-01-14 |
US6405740B1 (en) | 2002-06-18 |
KR20010040804A (ko) | 2001-05-15 |
JP2002503044A (ja) | 2002-01-29 |
US6267642B1 (en) | 2001-07-31 |
EP1084001A4 (de) | 2001-04-18 |
US6796881B1 (en) | 2004-09-28 |
KR100545680B1 (ko) | 2006-01-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |