DE69900569D1 - Abdeckbandzuführungs- und behandlungseinrichtung für eine Bauteilezuführungseinrichtung - Google Patents

Abdeckbandzuführungs- und behandlungseinrichtung für eine Bauteilezuführungseinrichtung

Info

Publication number
DE69900569D1
DE69900569D1 DE69900569T DE69900569T DE69900569D1 DE 69900569 D1 DE69900569 D1 DE 69900569D1 DE 69900569 T DE69900569 T DE 69900569T DE 69900569 T DE69900569 T DE 69900569T DE 69900569 D1 DE69900569 D1 DE 69900569D1
Authority
DE
Germany
Prior art keywords
feed
masking tape
treatment device
component
tape feed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69900569T
Other languages
English (en)
Other versions
DE69900569T2 (de
Inventor
Takehisa Ishikawa
Yasuo Muto
Koichi Asai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Corp
Original Assignee
Fuji Machine Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=16039017&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE69900569(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Fuji Machine Manufacturing Co Ltd filed Critical Fuji Machine Manufacturing Co Ltd
Publication of DE69900569D1 publication Critical patent/DE69900569D1/de
Application granted granted Critical
Publication of DE69900569T2 publication Critical patent/DE69900569T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/0215—Interconnecting of containers, e.g. splicing of tapes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H05K13/0419—Feeding with belts or tapes tape feeders
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/934—Apparatus having delaminating means adapted for delaminating a specified article
    • Y10S156/941—Means for delaminating semiconductive product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/19—Delaminating means
    • Y10T156/1978—Delaminating bending means
    • Y10T156/1983—Poking delaminating means

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Automatic Assembly (AREA)
DE69900569T 1998-06-24 1999-06-24 Abdeckbandzuführungs- und behandlungseinrichtung für eine Bauteilezuführungseinrichtung Expired - Lifetime DE69900569T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17789998A JP4242479B2 (ja) 1998-06-24 1998-06-24 トップカバーテープ送り装置

Publications (2)

Publication Number Publication Date
DE69900569D1 true DE69900569D1 (de) 2002-01-24
DE69900569T2 DE69900569T2 (de) 2002-07-18

Family

ID=16039017

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69900569T Expired - Lifetime DE69900569T2 (de) 1998-06-24 1999-06-24 Abdeckbandzuführungs- und behandlungseinrichtung für eine Bauteilezuführungseinrichtung

Country Status (4)

Country Link
US (1) US6269860B1 (de)
EP (1) EP0967850B1 (de)
JP (1) JP4242479B2 (de)
DE (1) DE69900569T2 (de)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3441696B2 (ja) * 1999-04-22 2003-09-02 日本サーボ株式会社 チップマウンター用チップフィーダ
WO2001099484A1 (fr) * 2000-06-20 2001-12-27 Matsushita Electric Industrial Co., Ltd. Dispositif d'alimentation en pieces et procede de collecte de ruban de couverture pour le dispositif
US6631868B2 (en) * 2000-12-14 2003-10-14 Delaware Capital Formation, Inc. Tape feeder with splicing capabilities
US6659705B1 (en) * 2001-01-10 2003-12-09 Delaware Capital Formation, Inc. Cover tape cutting system using a thermal energy source
US7220095B2 (en) 2001-05-24 2007-05-22 Lyndaker David W Self-threading component tape feeder
DE10135289C2 (de) * 2001-07-19 2003-06-18 Siemens Dematic Ag Spannvorrichtung und Bauelemente-Zuführmodul mit einer Spannvorrichtung zum Abziehen von Deckfolien
US7461384B2 (en) * 2002-02-20 2008-12-02 Symbol Technologies, Inc. Software method for emulating a serial port between applications for enabling communications by mobile bar code readers and computer terminals in wireless networks
DE102005023704A1 (de) * 2005-05-23 2006-11-30 Siemens Ag Zuführeinrichtung für elektrische Bauteile, zugehöriges Steuerverfahren und Steuerverfahren für ein entsprechendes Bestücksystem
KR101141711B1 (ko) * 2006-08-09 2012-05-04 삼성테크윈 주식회사 테이프 배출장치 및 테이프 배출방법
JP4595930B2 (ja) * 2006-12-07 2010-12-08 パナソニック株式会社 テープフィーダ
JP4858406B2 (ja) * 2007-10-26 2012-01-18 パナソニック株式会社 テープフィーダ
JP4893660B2 (ja) * 2008-03-03 2012-03-07 パナソニック株式会社 テープフィーダ
JP4814302B2 (ja) * 2008-03-07 2011-11-16 アイパルス株式会社 電子部品用テープフィーダ
JP2009239125A (ja) * 2008-03-27 2009-10-15 Hitachi High-Tech Instruments Co Ltd 部品供給装置
JP2010079814A (ja) * 2008-09-29 2010-04-08 Sanyo Electric Co Ltd 搬送制御装置、搬送装置の制御方法、及び観察装置
JP5641889B2 (ja) * 2010-11-10 2014-12-17 富士機械製造株式会社 スプライシング誤作業防止方法
CN102126130B (zh) * 2011-04-11 2013-02-27 温岭市金悦流水线设备制造有限公司 八工位自动组装设备
KR101837714B1 (ko) * 2011-08-10 2018-03-13 삼성디스플레이 주식회사 표시 장치
US10321618B2 (en) * 2012-03-22 2019-06-11 Fuji Corporation Tape feeder
CN104412731B (zh) * 2012-06-29 2017-09-08 雅马哈发动机株式会社 供料器及供料器控制方法以及电子元件安装装置
JP5995784B2 (ja) * 2013-05-31 2016-09-21 ヤマハ発動機株式会社 部品供給装置、及び部品実装装置
CN107006141B (zh) * 2014-12-03 2019-07-23 株式会社富士 带式供料器
WO2016092706A1 (ja) * 2014-12-12 2016-06-16 富士機械製造株式会社 テープの自動検知装置及び自動検知方法
EP3267778B1 (de) * 2015-03-03 2021-03-03 FUJI Corporation Spulenstützvorrichtung
US10757850B2 (en) * 2015-12-21 2020-08-25 Fuji Corporation Tape feeder and component mounter
CN105563092A (zh) * 2016-02-04 2016-05-11 广东科捷龙机器人有限公司 一种电池盖板液孔塞自动装配机器人
WO2018042509A1 (ja) * 2016-08-30 2018-03-08 富士機械製造株式会社 スプライシング装置
DE112016007424T5 (de) 2016-11-09 2019-08-01 Yamaha Hatsudoki Kabushiki Kaisha Bauteilverifikationssystem
JP6937463B2 (ja) * 2017-10-31 2021-09-22 パナソニックＩｐマネジメント株式会社 部品供給装置および部品装着装置ならびに実装基板の製造方法
CN111165084B (zh) * 2017-10-31 2022-08-05 雅马哈发动机株式会社 元件供给装置及元件安装装置
US10865820B2 (en) * 2018-07-10 2020-12-15 The Boeing Company Apparatuses for and methods of installing pre-molded seal caps

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03152050A (ja) 1989-11-08 1991-06-28 Hitachi Ltd 電子部品供給装置
JPH057097A (ja) 1991-06-27 1993-01-14 Tenryu Technic:Kk チツプマウンタのチツプ部品供給装置
EP0523714B1 (de) * 1991-07-19 1996-12-11 Matsushita Electric Industrial Co., Ltd. Vorrichtung zum Zuführen elektronischer Bauelemente
DE4137191A1 (de) 1991-11-12 1993-05-13 Siemens Ag Einrichtung zur bereitstellung von gegurteten bauelementen
JP2714294B2 (ja) 1991-12-19 1998-02-16 三洋電機株式会社 部品供給装置
JPH06171823A (ja) * 1992-12-09 1994-06-21 Canon Inc ドライフィルムレジスト用保護フィルム除去装置
IT1261174B (it) * 1993-02-03 1996-05-09 Morton Int Inc Procedimento ed apparecchio per la rimozione del foglio di copertura da pannelli laminati.
JP3173206B2 (ja) 1993-02-08 2001-06-04 松下電器産業株式会社 テープフィーダ
DE69737545T2 (de) * 1996-05-13 2007-12-13 Matsushita Electric Industrial Co., Ltd., Kadoma Vorrichtung zum zuführen von elektronischen bauelementen
JPH11135986A (ja) 1997-10-29 1999-05-21 Fuji Mach Mfg Co Ltd 電気部品フィーダ

Also Published As

Publication number Publication date
JP4242479B2 (ja) 2009-03-25
EP0967850B1 (de) 2001-12-12
EP0967850A1 (de) 1999-12-29
DE69900569T2 (de) 2002-07-18
US6269860B1 (en) 2001-08-07
JP2000005942A (ja) 2000-01-11

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Legal Events

Date Code Title Description
8363 Opposition against the patent
8365 Fully valid after opposition proceedings