DE69835986D1 - Elektrode für halbleitendes Nitrid vom N-Typ, Halbleiterbauelement mit einer solchen Elektrode und Herstellungsverfahren - Google Patents

Elektrode für halbleitendes Nitrid vom N-Typ, Halbleiterbauelement mit einer solchen Elektrode und Herstellungsverfahren

Info

Publication number
DE69835986D1
DE69835986D1 DE69835986T DE69835986T DE69835986D1 DE 69835986 D1 DE69835986 D1 DE 69835986D1 DE 69835986 T DE69835986 T DE 69835986T DE 69835986 T DE69835986 T DE 69835986T DE 69835986 D1 DE69835986 D1 DE 69835986D1
Authority
DE
Germany
Prior art keywords
electrode
manufacturing
semiconductor device
type semiconducting
semiconducting nitride
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69835986T
Other languages
English (en)
Other versions
DE69835986T2 (de
Inventor
Kunio Takeuchi
Nobuhiko Hayashi
Yasuhiko Nomura
Kouji Tominaga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Publication of DE69835986D1 publication Critical patent/DE69835986D1/de
Application granted granted Critical
Publication of DE69835986T2 publication Critical patent/DE69835986T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/40—Materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
    • H01L21/28575—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising AIIIBV compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40—Electrodes ; Multistep manufacturing processes therefor
    • H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/45—Ohmic electrodes
    • H01L29/452—Ohmic electrodes on AIII-BV compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26—Materials of the light emitting region
    • H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
    • H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Led Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Semiconductor Lasers (AREA)
DE69835986T 1997-07-16 1998-07-16 Elektrode eines halbleitenden Nitrids vom N-Typ, ein Halbleiterbauelement mit einer solchen Elektrode und ein Herstellungsverfahren Expired - Lifetime DE69835986T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP19094797A JP3462720B2 (ja) 1997-07-16 1997-07-16 ｎ型窒化物半導体の電極及び前記電極を有する半導体素子並びにその製造方法
JP19094797 1997-07-16

Publications (2)

Publication Number Publication Date
DE69835986D1 true DE69835986D1 (de) 2006-11-09
DE69835986T2 DE69835986T2 (de) 2007-06-14

Family

ID=16266332

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69835986T Expired - Lifetime DE69835986T2 (de) 1997-07-16 1998-07-16 Elektrode eines halbleitenden Nitrids vom N-Typ, ein Halbleiterbauelement mit einer solchen Elektrode und ein Herstellungsverfahren

Country Status (5)

Country Link
US (1) US6130446A (de)
EP (2) EP1710848A1 (de)
JP (1) JP3462720B2 (de)
KR (1) KR100548860B1 (de)
DE (1) DE69835986T2 (de)

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US6335217B1 (en) * 1997-10-10 2002-01-01 Toyoda Gosei Co., Ltd. GaN type semiconductor device fabrication
JP3625377B2 (ja) 1998-05-25 2005-03-02 ローム株式会社 半導体発光素子
JP3449535B2 (ja) * 1999-04-22 2003-09-22 ソニー株式会社 半導体素子の製造方法
JP2000357820A (ja) * 1999-06-15 2000-12-26 Pioneer Electronic Corp 窒化ガリウム系半導体発光素子及びその製造方法
US6812502B1 (en) * 1999-11-04 2004-11-02 Uni Light Technology Incorporation Flip-chip light-emitting device
JP2001217456A (ja) * 2000-02-03 2001-08-10 Sharp Corp 窒化ガリウム系化合物半導体発光素子
WO2002071450A2 (en) * 2001-03-06 2002-09-12 Emcore Corporation Led lead for improved light extraction
JP3912044B2 (ja) * 2001-06-06 2007-05-09 豊田合成株式会社 Ｉｉｉ族窒化物系化合物半導体発光素子の製造方法
US7067849B2 (en) 2001-07-17 2006-06-27 Lg Electronics Inc. Diode having high brightness and method thereof
DE10147791A1 (de) * 2001-09-27 2003-04-10 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines Halbleiterbauelements auf der Basis eines Nitrid-Verbindungshalbleiters
US6949395B2 (en) 2001-10-22 2005-09-27 Oriol, Inc. Method of making diode having reflective layer
US7148520B2 (en) 2001-10-26 2006-12-12 Lg Electronics Inc. Diode having vertical structure and method of manufacturing the same
DE10152922B4 (de) * 2001-10-26 2010-05-12 Osram Opto Semiconductors Gmbh Nitrid-basierendes Halbleiterbauelement
TW523939B (en) * 2001-11-07 2003-03-11 Nat Univ Chung Hsing High-efficient light emitting diode and its manufacturing method
US7193245B2 (en) * 2003-09-04 2007-03-20 Lumei Optoelectronics Corporation High power, high luminous flux light emitting diode and method of making same
US6650018B1 (en) * 2002-05-24 2003-11-18 Axt, Inc. High power, high luminous flux light emitting diode and method of making same
KR100543696B1 (ko) * 2002-09-09 2006-01-20 삼성전기주식회사 고효율 발광 다이오드
KR100484486B1 (ko) * 2002-10-18 2005-04-20 한국전자통신연구원 질화물 반도체 전계 효과 트랜지스터 및 그 제조방법
CA2463719A1 (en) * 2003-04-05 2004-10-05 F. Hoffmann-La Roche Ag Nucleotide analogs with six membered rings
JP2005117020A (ja) * 2003-09-16 2005-04-28 Stanley Electric Co Ltd 窒化ガリウム系化合物半導体素子とその製造方法
KR100576849B1 (ko) * 2003-09-19 2006-05-10 삼성전기주식회사 발광소자 및 그 제조방법
KR20050082251A (ko) * 2004-02-18 2005-08-23 삼성전자주식회사 반도체 레이저 디바이스
US7375380B2 (en) * 2004-07-12 2008-05-20 Rohm Co., Ltd. Semiconductor light emitting device
KR100639990B1 (ko) 2004-12-08 2006-10-31 한국전자통신연구원 급격한 금속-절연체 전이 소자 및 그 제조방법
KR100631898B1 (ko) * 2005-01-19 2006-10-11 삼성전기주식회사 Ｅｓｄ보호 능력을 갖는 질화갈륨계 발광 소자 및 그 제조방법
KR100675220B1 (ko) * 2005-05-18 2007-01-29 삼성전기주식회사 질화물계 반도체 발광소자
JP5242156B2 (ja) * 2005-06-03 2013-07-24 古河電気工業株式会社 Ｉｉｉ−ｖ族窒化物系化合物半導体装置、及び電極形成方法
TWI284421B (en) * 2005-06-21 2007-07-21 Uni Light Technology Inc LED structure for flip-chip package and method thereof
KR20070006027A (ko) * 2005-07-07 2007-01-11 주식회사 엘지화학 확산 방지막이 구비된 발광다이오드 소자 및 이의 제조방법
CN100375303C (zh) * 2005-10-27 2008-03-12 晶能光电（江西）有限公司 含有金锗镍的欧姆电极、铟镓铝氮半导体发光元件及制造方法
JP5092419B2 (ja) * 2007-01-24 2012-12-05 三菱化学株式会社 ＧａＮ系発光ダイオード素子
JP2008244161A (ja) * 2007-03-27 2008-10-09 Toyoda Gosei Co Ltd Ｉｉｉ族窒化物系化合物半導体発光素子の電極形成方法
US9484499B2 (en) 2007-04-20 2016-11-01 Cree, Inc. Transparent ohmic contacts on light emitting diodes with carrier substrates
US8368100B2 (en) * 2007-11-14 2013-02-05 Cree, Inc. Semiconductor light emitting diodes having reflective structures and methods of fabricating same
JP2011040667A (ja) * 2009-08-18 2011-02-24 Sanyo Electric Co Ltd ｎ側電極、窒化物半導体発光素子および窒化物半導体発光素子の製造方法
DE102009028918B4 (de) * 2009-08-26 2014-11-06 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Halbleiterbauelement, Verfahren zur Bestimmung der Struktur eines Transistors und Basisstation für ein Mobilfunknetzwerk
RU2566383C1 (ru) * 2011-09-30 2015-10-27 Соко Кагаку Ко., Лтд. Нитридный полупроводниковый элемент и способ его изготовления
JP6627728B2 (ja) * 2016-11-24 2020-01-08 豊田合成株式会社 発光素子の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0797660B2 (ja) * 1987-10-20 1995-10-18 三洋電機株式会社 ＳｉＣ青色発光ダイオード
US5061985A (en) * 1988-06-13 1991-10-29 Hitachi, Ltd. Semiconductor integrated circuit device and process for producing the same
JP2666228B2 (ja) * 1991-10-30 1997-10-22 豊田合成株式会社 窒化ガリウム系化合物半導体発光素子
US5309001A (en) * 1991-11-25 1994-05-03 Sharp Kabushiki Kaisha Light-emitting diode having a surface electrode of a tree-like form
EP1450415A3 (de) * 1993-04-28 2005-05-04 Nichia Corporation Halbleitervorrichtung aus einer galliumnitridartigen III-V-Halbleiterverbindung
JP3047960B2 (ja) * 1995-09-01 2000-06-05 日亜化学工業株式会社 ｎ型窒化物半導体の電極
US5760423A (en) * 1996-11-08 1998-06-02 Kabushiki Kaisha Toshiba Semiconductor light emitting device, electrode of the same device and method of manufacturing the same device
JP2661009B2 (ja) * 1996-05-16 1997-10-08 豊田合成株式会社 窒化ガリウム系化合物半導体発光素子
JPH1022494A (ja) * 1996-07-03 1998-01-23 Sony Corp オーミック電極およびその形成方法

Also Published As

Publication number Publication date
EP1710848A1 (de) 2006-10-11
EP0892443B1 (de) 2006-09-27
US6130446A (en) 2000-10-10
EP0892443A2 (de) 1999-01-20
JPH1140852A (ja) 1999-02-12
JP3462720B2 (ja) 2003-11-05
KR19990013897A (ko) 1999-02-25
KR100548860B1 (ko) 2006-03-23
EP0892443A3 (de) 2000-05-31
DE69835986T2 (de) 2007-06-14

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