DE69734323D1 - Ptc thermistor und verfahren zur herstellung - Google Patents

Ptc thermistor und verfahren zur herstellung

Info

Publication number
DE69734323D1
DE69734323D1 DE69734323T DE69734323T DE69734323D1 DE 69734323 D1 DE69734323 D1 DE 69734323D1 DE 69734323 T DE69734323 T DE 69734323T DE 69734323 T DE69734323 T DE 69734323T DE 69734323 D1 DE69734323 D1 DE 69734323D1
Authority
DE
Germany
Prior art keywords
manufacture
ptc thermistor
ptc
thermistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69734323T
Other languages
English (en)
Other versions
DE69734323T2 (de
Inventor
Junji Kojima
Kohichi Morimoto
Takashi Ikeda
Naohiro Mikamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Application granted granted Critical
Publication of DE69734323D1 publication Critical patent/DE69734323D1/de
Publication of DE69734323T2 publication Critical patent/DE69734323T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H01C7/028—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient consisting of organic substances
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49085—Thermally variable
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Thermistors And Varistors (AREA)
DE69734323T 1996-12-26 1997-12-25 Ptc thermistor und verfahren zur herstellung Expired - Lifetime DE69734323T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP34725296 1996-12-26
JP34725296 1996-12-26
PCT/JP1997/004830 WO1998029879A1 (fr) 1996-12-26 1997-12-25 Thermistance ctp et son procede de fabrication

Publications (2)

Publication Number Publication Date
DE69734323D1 true DE69734323D1 (de) 2005-11-10
DE69734323T2 DE69734323T2 (de) 2006-03-16

Family

ID=18388963

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69734323T Expired - Lifetime DE69734323T2 (de) 1996-12-26 1997-12-25 Ptc thermistor und verfahren zur herstellung

Country Status (7)

Country Link
US (2) US6188308B1 (de)
EP (1) EP0955643B1 (de)
JP (1) JP3594974B2 (de)
KR (1) KR100326778B1 (de)
CN (1) CN1123894C (de)
DE (1) DE69734323T2 (de)
WO (1) WO1998029879A1 (de)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6020808A (en) * 1997-09-03 2000-02-01 Bourns Multifuse (Hong Kong) Ltd. Multilayer conductive polymer positive temperature coefficent device
US6236302B1 (en) * 1998-03-05 2001-05-22 Bourns, Inc. Multilayer conductive polymer device and method of manufacturing same
US6606023B2 (en) * 1998-04-14 2003-08-12 Tyco Electronics Corporation Electrical devices
US6481094B1 (en) * 1998-07-08 2002-11-19 Matsushita Electric Industrial Co., Ltd. Method of manufacturing chip PTC thermistor
JP2000124003A (ja) * 1998-10-13 2000-04-28 Matsushita Electric Ind Co Ltd チップ形ｐｔｃサーミスタおよびその製造方法
JP2000188205A (ja) * 1998-10-16 2000-07-04 Matsushita Electric Ind Co Ltd チップ形ｐｔｃサ―ミスタ
US6838972B1 (en) 1999-02-22 2005-01-04 Littelfuse, Inc. PTC circuit protection devices
US6640420B1 (en) * 1999-09-14 2003-11-04 Tyco Electronics Corporation Process for manufacturing a composite polymeric circuit protection device
US6854176B2 (en) * 1999-09-14 2005-02-15 Tyco Electronics Corporation Process for manufacturing a composite polymeric circuit protection device
US6965293B2 (en) * 2000-04-08 2005-11-15 Lg Cable, Ltd. Electrical device having PTC conductive polymer
KR100330919B1 (ko) * 2000-04-08 2002-04-03 권문구 피티씨 전도성 폴리머를 포함하는 전기장치
US6593843B1 (en) * 2000-06-28 2003-07-15 Tyco Electronics Corporation Electrical devices containing conductive polymers
US6717506B2 (en) * 2000-11-02 2004-04-06 Murata Manufacturing Co., Ltd. Chip-type resistor element
DE10136378C2 (de) * 2001-07-26 2003-07-31 Norddeutsche Pflanzenzucht Han Männliche Sterilität in Gräsern der Gattung Lolium
US6480094B1 (en) * 2001-08-21 2002-11-12 Fuzetec Technology Co. Ltd. Surface mountable electrical device
US6610417B2 (en) * 2001-10-04 2003-08-26 Oak-Mitsui, Inc. Nickel coated copper as electrodes for embedded passive devices
TW525863U (en) * 2001-10-24 2003-03-21 Polytronics Technology Corp Electric current overflow protection device
JP3857571B2 (ja) * 2001-11-15 2006-12-13 タイコ エレクトロニクス レイケム株式会社 ポリマーｐｔｃサーミスタおよび温度センサ
JP3860515B2 (ja) * 2002-07-24 2006-12-20 ローム株式会社 チップ抵抗器
KR100495133B1 (ko) * 2002-11-28 2005-06-14 엘에스전선 주식회사 피티씨 서미스터
KR100694383B1 (ko) * 2003-09-17 2007-03-12 엘에스전선 주식회사 표면 실장형 서미스터
US7119655B2 (en) * 2004-11-29 2006-10-10 Therm-O-Disc, Incorporated PTC circuit protector having parallel areas of effective resistance
WO2006080805A1 (en) * 2005-01-27 2006-08-03 Ls Cable Ltd. Surface-mounting type thermistor having multi layers and method for manufacturing the same
US20060202791A1 (en) * 2005-03-10 2006-09-14 Chang-Wei Ho Resettable over-current protection device and method for producing the like
JP2008311362A (ja) * 2007-06-13 2008-12-25 Tdk Corp セラミック電子部品
JP2009200212A (ja) * 2008-02-21 2009-09-03 Keihin Corp プリント基板の放熱構造
DE102008056746A1 (de) * 2008-11-11 2010-05-12 Epcos Ag Piezoaktor in Vielschichtbauweise und Verfahren zur Befestigung einer Außenelektrode bei einem Piezoaktor
CN102610341B (zh) * 2011-01-24 2014-03-26 上海神沃电子有限公司 表面贴装型高分子ptc元件及其制造方法
KR101892789B1 (ko) * 2011-09-15 2018-08-28 타이코 일렉트로닉스 저팬 지.케이. Ptc 디바이스
TWI469158B (zh) * 2012-07-31 2015-01-11 Polytronics Technology Corp 過電流保護元件
CN107957132B (zh) * 2016-10-14 2024-06-25 国网新疆电力有限公司塔城供电公司 一种具备ptc加热器的电热风机及其应用
CN107946010A (zh) * 2017-11-15 2018-04-20 江苏苏杭电子有限公司 基于线路板生产工艺加工热敏电阻半导体的加工工艺
CN108389666A (zh) * 2018-05-08 2018-08-10 苏州天鸿电子有限公司 一种能够确保电阻均温的电阻件
CN112018317A (zh) * 2020-09-18 2020-12-01 珠海冠宇电池股份有限公司 一种极耳及制备方法、电池
CN117497265A (zh) * 2022-07-15 2024-02-02 东莞令特电子有限公司 小封装式ptc器件

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1337929A (en) * 1972-05-04 1973-11-21 Standard Telephones Cables Ltd Thermistors
JPS5823921B2 (ja) * 1978-02-10 1983-05-18 日本電気株式会社 電圧非直線抵抗器
JPS6110203A (ja) * 1984-06-25 1986-01-17 株式会社村田製作所 有機正特性サ−ミスタ
US4689475A (en) * 1985-10-15 1987-08-25 Raychem Corporation Electrical devices containing conductive polymers
ATE51462T1 (de) * 1985-12-17 1990-04-15 Siemens Bauelemente Ohg Elektrisches bauelement in chip-bauweise.
JPS6387705A (ja) * 1986-09-30 1988-04-19 日本メクトロン株式会社 Ｐｔｃ素子
JPS63117416A (ja) * 1986-11-06 1988-05-21 株式会社村田製作所 積層形多端子電子部品
JPS63300507A (ja) 1987-05-30 1988-12-07 Murata Mfg Co Ltd 積層型セラミック電子部品の電極形成方法
JPH02137212A (ja) * 1988-11-17 1990-05-25 Murata Mfg Co Ltd 複合電子部品
JPH047802A (ja) * 1990-04-25 1992-01-13 Daito Tsushinki Kk Ｐｔｃ素子
JPH0465427A (ja) 1990-07-05 1992-03-02 Tonen Corp ポリシラン―ポリシロキサンブロック共重合体およびその製造法
JP2559846Y2 (ja) * 1990-10-18 1998-01-19 ティーディーケイ株式会社 積層磁器電子部品
JP2833242B2 (ja) * 1991-03-12 1998-12-09 株式会社村田製作所 Ｎｔｃサーミスタ素子
JPH05299201A (ja) * 1992-02-17 1993-11-12 Murata Mfg Co Ltd チップｐｔｃサーミスタ
DE4221309A1 (de) * 1992-06-29 1994-01-05 Abb Research Ltd Strombegrenzendes Element
JP3286855B2 (ja) * 1992-11-09 2002-05-27 株式会社村田製作所 チップ型ｐｔｃサーミスタの製造方法
JPH06267709A (ja) * 1993-03-15 1994-09-22 Murata Mfg Co Ltd 正特性サーミスタ
JPH06302404A (ja) * 1993-04-16 1994-10-28 Murata Mfg Co Ltd 積層型正特性サ−ミスタ
KR100327876B1 (ko) * 1993-09-15 2002-10-12 타이코 일렉트로닉스 코포레이션 Ptc저항소자를포함하는전기어셈블리
CN1054941C (zh) 1994-05-16 2000-07-26 雷伊化学公司 有聚合物正温度系数电阻元件的电路保护器件
JP3605115B2 (ja) * 1994-06-08 2004-12-22 レイケム・コーポレイション 導電性ポリマーを含有する電気デバイス

Also Published As

Publication number Publication date
KR100326778B1 (ko) 2002-03-12
DE69734323T2 (de) 2006-03-16
WO1998029879A1 (fr) 1998-07-09
KR20000062369A (ko) 2000-10-25
EP0955643A4 (de) 2000-05-17
JP3594974B2 (ja) 2004-12-02
US6188308B1 (en) 2001-02-13
US6438821B1 (en) 2002-08-27
CN1242100A (zh) 2000-01-19
CN1123894C (zh) 2003-10-08
EP0955643B1 (de) 2005-10-05
EP0955643A1 (de) 1999-11-10

Similar Documents

Publication Publication Date Title
DE69734323D1 (de) Ptc thermistor und verfahren zur herstellung
DE69739555D1 (de) Umgossene verglassung und verfahren zur herstellung
DE69723752D1 (de) Silikonkautschukpulver und Verfahren zur Herstellung
DE19781457T1 (de) Thermoelektrisches Element und Verfahren zur Herstellung desselben
ATE197122T1 (de) Hämorrhoidenzusammensetzungen und verfahren zur verwendung
DE19983016T1 (de) Airbag-Abdeckung und Verfahren zur Herstellung derselben
DE69739763D1 (de) Halbleiteranordnung und Verfahren zur Herstellung
DE69506950D1 (de) Graphitschaummaterialien und Verfahren zur Herstellung derselben
DE60030684D1 (de) Kugelzoneartiges dichtelement und verfahren zur herstellung
DE69512304D1 (de) Verbund-Polymer-Implantat und Verfahren zur Herstellung desselben
DE59708984D1 (de) Beleuchtungsleiste und Verfahren zur Herstellung
DE69830608D1 (de) Spiralförmig geformte gegenstände und verfahren zur herstellung
DE69635445D1 (de) Alkalialuminiumhydroxycarbonatzusammensetzung und verfahren zur herstellung
DE69817269D1 (de) Tastschalter und Verfahren zur Herstellung der Taste
DE69617772D1 (de) Thermistor-Vorrichtung und Verfahren zur Herstellung
DE69516772D1 (de) Verbundene Gegenstände und Verfahren zur Herstellung derselben
DE59502030D1 (de) Schlaucheinheit und Verfahren zur Herstellung derselben
DE69709059D1 (de) Nahrungsmittelhülle mit verbesserten Abschälungseigenschaften und Verfahren zur Herstellung davon
DE69832282D1 (de) Polysilazan-amine und verfahren zur herstellung
DE69407659D1 (de) RTV-Organopolysiloxanzusammensetzung und Verfahren zur Herstellung
DE69839600D1 (de) Ferroelektrisches speicherelement und verfahren zur herstellung
DE69736286D1 (de) Verfahren zur herstellung und transformation von manioka protoplasten
DE69525296D1 (de) Etikettenband und Verfahren zur Herstellung desselben
DE19882526T1 (de) Kohlenstoffheizelement und Verfahren zur Herstellung desselben
DE19580280T1 (de) Schleifmaterialbogen und Verfahren zur Herstellung desselben

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: PANASONIC CORP., KADOMA, OSAKA, JP

8320 Willingness to grant licences declared (paragraph 23)