JP2009200212A - プリント基板の放熱構造 - Google Patents
プリント基板の放熱構造 Download PDFInfo
- Publication number
- JP2009200212A JP2009200212A JP2008039741A JP2008039741A JP2009200212A JP 2009200212 A JP2009200212 A JP 2009200212A JP 2008039741 A JP2008039741 A JP 2008039741A JP 2008039741 A JP2008039741 A JP 2008039741A JP 2009200212 A JP2009200212 A JP 2009200212A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- layer
- heat
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09572—Solder filled plated through-hole in the final product
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09627—Special connections between adjacent vias, not for grounding vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10969—Metallic case or integral heatsink of component electrically connected to a pad on PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
【解決手段】第1層14a〜第6層14fからなる銅箔パターン22によって構成されたプリント回路基板14の表層には、積層方向に沿って延在し前記プリント回路基板14の内層と非貫通に形成されたインナビア30が設けられ、さらに、前記プリント回路基板14の内層には、積層方向に沿って延在し前記プリント回路基板14の表層と非貫通に形成されたコアビア32が設けられ、前記インナビア30と前記コアビア32とは、積層面に設けられた銅箔パターン22に沿って所定間隔だけオフセットして配置される。
【選択図】図3
Description
14 プリント回路基板(プリント基板)
14a〜14f 層目
18a〜18c 発熱部品
30 インナビア
32 コアビア
38 クリーム半田(半田)
Claims (2)
- 発熱部品を含む電子部品が実装された実装面を有し、積層された複数の層によって構成されたプリント基板の放熱構造であって、
前記プリント基板の表層には、積層方向に沿って延在し前記プリント基板の内層と非貫通に形成されたインナビアが設けられ、
前記プリント基板の内層には、積層方向に沿って延在し前記プリント基板の表層と非貫通に形成されたコアビアが設けられ、
前記インナビアと前記コアビアとは、積層面に沿って所定間隔だけオフセットした位置に配置されることを特徴とするプリント基板の放熱構造。 - 請求項1記載のプリント基板の放熱構造において、
前記電子部品と前記プリント基板とは、半田により電気的に接続され、前記半田は、前記プリント基板の表層に形成された前記インナビアに沿って流動すると共に、前記インナビアで封止されることを特徴とするプリント回路基板の放熱構造。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008039741A JP2009200212A (ja) | 2008-02-21 | 2008-02-21 | プリント基板の放熱構造 |
US12/390,022 US8039752B2 (en) | 2008-02-21 | 2009-02-20 | Heat dissipation structure of a print circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008039741A JP2009200212A (ja) | 2008-02-21 | 2008-02-21 | プリント基板の放熱構造 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2009200212A true JP2009200212A (ja) | 2009-09-03 |
Family
ID=40997197
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008039741A Pending JP2009200212A (ja) | 2008-02-21 | 2008-02-21 | プリント基板の放熱構造 |
Country Status (2)
Country | Link |
---|---|
US (1) | US8039752B2 (ja) |
JP (1) | JP2009200212A (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012066925A1 (ja) * | 2010-11-15 | 2012-05-24 | 日本電産サンキョー株式会社 | 電子機器 |
JP2013514674A (ja) * | 2009-12-17 | 2013-04-25 | コンティ テミック マイクロエレクトロニック ゲゼルシャフト ミット ベシュレンクテル ハフツング | 変速機制御装置として使用するため裸ダイ取付けにより重なり合って設けられる複数の印刷配線板層を持つ印刷配線板 |
JP2017103340A (ja) * | 2015-12-01 | 2017-06-08 | 株式会社アイエイアイ | 回路基板の取付構造 |
WO2020079801A1 (ja) * | 2018-10-18 | 2020-04-23 | 三菱電機株式会社 | 基板収納筐体 |
JP2021005580A (ja) * | 2019-06-25 | 2021-01-14 | 日立オートモティブシステムズ株式会社 | 電子制御装置 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012142391A (ja) * | 2010-12-28 | 2012-07-26 | Sumitomo Electric Ind Ltd | 電気機器および電気機器の製造方法 |
DE102014224732B4 (de) * | 2014-12-03 | 2022-02-10 | Automotive Lighting Reutlingen Gmbh | Leiterplatte für eine Kraftfahrzeugbeleuchtungseinrichtung mit optimierter Entwärmung |
KR102411999B1 (ko) * | 2015-04-08 | 2022-06-22 | 삼성전기주식회사 | 회로기판 |
AT520105B1 (de) * | 2017-06-16 | 2019-10-15 | Zkw Group Gmbh | Leiterplatte |
DE102021109599A1 (de) * | 2021-04-16 | 2022-10-20 | Robert Bosch Gesellschaft mit beschränkter Haftung | Leiterplatte |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH04291991A (ja) * | 1991-03-20 | 1992-10-16 | Fujitsu Ltd | 表面実装部品実装用プリント配線板 |
JPH07176873A (ja) * | 1993-12-17 | 1995-07-14 | Ibiden Co Ltd | 電子部品搭載用基板 |
JPH0878850A (ja) * | 1994-09-08 | 1996-03-22 | Ibiden Co Ltd | プリント配線板 |
JP2003046022A (ja) * | 2001-05-22 | 2003-02-14 | Hitachi Ltd | 電子装置 |
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2008
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-
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- 2009-02-20 US US12/390,022 patent/US8039752B2/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04291991A (ja) * | 1991-03-20 | 1992-10-16 | Fujitsu Ltd | 表面実装部品実装用プリント配線板 |
JPH07176873A (ja) * | 1993-12-17 | 1995-07-14 | Ibiden Co Ltd | 電子部品搭載用基板 |
JPH0878850A (ja) * | 1994-09-08 | 1996-03-22 | Ibiden Co Ltd | プリント配線板 |
JP2003046022A (ja) * | 2001-05-22 | 2003-02-14 | Hitachi Ltd | 電子装置 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013514674A (ja) * | 2009-12-17 | 2013-04-25 | コンティ テミック マイクロエレクトロニック ゲゼルシャフト ミット ベシュレンクテル ハフツング | 変速機制御装置として使用するため裸ダイ取付けにより重なり合って設けられる複数の印刷配線板層を持つ印刷配線板 |
US8895871B2 (en) | 2009-12-17 | 2014-11-25 | Conti Temic Microelectronic Gmbh | Circuit board having a plurality of circuit board layers arranged one over the other having bare die mounting for use as a gearbox controller |
WO2012066925A1 (ja) * | 2010-11-15 | 2012-05-24 | 日本電産サンキョー株式会社 | 電子機器 |
JP2017103340A (ja) * | 2015-12-01 | 2017-06-08 | 株式会社アイエイアイ | 回路基板の取付構造 |
WO2020079801A1 (ja) * | 2018-10-18 | 2020-04-23 | 三菱電機株式会社 | 基板収納筐体 |
JPWO2020079801A1 (ja) * | 2018-10-18 | 2021-04-30 | 三菱電機株式会社 | 基板収納筐体 |
JP7003289B2 (ja) | 2018-10-18 | 2022-01-20 | 三菱電機株式会社 | 基板収納筐体 |
JP2021005580A (ja) * | 2019-06-25 | 2021-01-14 | 日立オートモティブシステムズ株式会社 | 電子制御装置 |
Also Published As
Publication number | Publication date |
---|---|
US20090211788A1 (en) | 2009-08-27 |
US8039752B2 (en) | 2011-10-18 |
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