DE69733513D1 - Integrierte Schaltung mit einem Kondensator - Google Patents

Integrierte Schaltung mit einem Kondensator

Info

Publication number
DE69733513D1
DE69733513D1 DE69733513T DE69733513T DE69733513D1 DE 69733513 D1 DE69733513 D1 DE 69733513D1 DE 69733513 T DE69733513 T DE 69733513T DE 69733513 T DE69733513 T DE 69733513T DE 69733513 D1 DE69733513 D1 DE 69733513D1
Authority
DE
Germany
Prior art keywords
capacitor
integrated circuit
integrated
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69733513T
Other languages
English (en)
Other versions
DE69733513T2 (de
Inventor
Hirohisa Masuda
Masahisa Tashiro
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Publication of DE69733513D1 publication Critical patent/DE69733513D1/de
Application granted granted Critical
Publication of DE69733513T2 publication Critical patent/DE69733513T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/118—Masterslice integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/118—Masterslice integrated circuits
    • H01L27/11803—Masterslice integrated circuits using field effect technology
    • H01L27/11807—CMOS gate arrays

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
DE69733513T 1996-06-26 1997-06-26 Integrierte Schaltung mit einem Kondensator Expired - Fee Related DE69733513T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP8165469A JPH1012825A (ja) 1996-06-26 1996-06-26 半導体集積回路装置
JP16546996 1996-06-26

Publications (2)

Publication Number Publication Date
DE69733513D1 true DE69733513D1 (de) 2005-07-21
DE69733513T2 DE69733513T2 (de) 2006-05-11

Family

ID=15813013

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69733513T Expired - Fee Related DE69733513T2 (de) 1996-06-26 1997-06-26 Integrierte Schaltung mit einem Kondensator

Country Status (7)

Country Link
US (1) US6121645A (de)
EP (1) EP0817272B1 (de)
JP (1) JPH1012825A (de)
KR (1) KR100371678B1 (de)
CN (1) CN1163967C (de)
DE (1) DE69733513T2 (de)
TW (1) TW360981B (de)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6617620B1 (en) * 1999-09-29 2003-09-09 Oki Electric Industry Co., Ltd. Gate array with border element
JP3406270B2 (ja) * 2000-02-17 2003-05-12 沖電気工業株式会社 半導体装置及びその製造方法
JP4092173B2 (ja) 2002-10-24 2008-05-28 Ｎｅｃエレクトロニクス株式会社 半導体集積回路装置
JP4258205B2 (ja) * 2002-11-11 2009-04-30 パナソニック株式会社 半導体装置
JP2004207271A (ja) 2002-12-20 2004-07-22 Nec Electronics Corp Ｓｏｉ基板及び半導体集積回路装置
JP4307919B2 (ja) * 2003-06-27 2009-08-05 三洋電機株式会社 半導体装置の製造方法
CN1305127C (zh) * 2003-09-12 2007-03-14 清华大学 用去耦合电容实现集成电路供电网络噪声优化的快速方法
US7728362B2 (en) 2006-01-20 2010-06-01 International Business Machines Corporation Creating integrated circuit capacitance from gate array structures
JP5230912B2 (ja) 2006-06-08 2013-07-10 ラピスセミコンダクタ株式会社 半導体集積回路装置の製造方法
US8558320B2 (en) * 2009-12-15 2013-10-15 Qualcomm Incorporated Systems and methods employing a physically asymmetric semiconductor device having symmetrical electrical behavior
US9082886B2 (en) * 2011-05-12 2015-07-14 Taiwan Semiconductor Manufacturing Company, Ltd. Adding decoupling function for tap cells
JP5868682B2 (ja) * 2011-12-01 2016-02-24 株式会社ソシオネクスト 半導体装置

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6068662U (ja) * 1983-10-17 1985-05-15 三洋電機株式会社 集積化コンデンサ
JPS60192359A (ja) * 1984-03-14 1985-09-30 Nec Corp 半導体メモリ装置
JPS6341048A (ja) * 1986-08-06 1988-02-22 Mitsubishi Electric Corp 標準セル方式大規模集積回路
JPS63120446A (ja) * 1986-11-08 1988-05-24 Mitsubishi Electric Corp 半導体集積回路装置における電源，接地配線構造
JPS63143843A (ja) * 1986-12-08 1988-06-16 Nippon Telegr & Teleph Corp <Ntt> 半導体集積回路電源配線装置
JPH01278749A (ja) * 1988-04-30 1989-11-09 Seiko Epson Corp 半導体装置
US5307309A (en) * 1988-05-31 1994-04-26 Micron Technology, Inc. Memory module having on-chip surge capacitors
JPH02163960A (ja) * 1988-12-16 1990-06-25 Toshiba Corp 半導体装置
JPH0397245A (ja) * 1989-09-11 1991-04-23 Seiko Epson Corp ゲートアレイ装置
JP3038731B2 (ja) * 1989-10-19 2000-05-08 ソニー株式会社 半導体装置
JPH04196583A (ja) * 1990-11-28 1992-07-16 Seiko Epson Corp 半導体装置
US5343058A (en) * 1991-11-18 1994-08-30 Vlsi Technology, Inc. Gate array bases with flexible routing
JPH05283611A (ja) * 1992-03-31 1993-10-29 Nec Corp 半導体装置
JPH05299578A (ja) * 1992-04-17 1993-11-12 Rohm Co Ltd 半導体装置およびその製法
JP2855975B2 (ja) * 1992-07-06 1999-02-10 富士通株式会社 半導体集積回路
JPH06177267A (ja) * 1992-12-08 1994-06-24 Mitsubishi Electric Corp 半導体装置
KR940018967A (ko) * 1993-01-30 1994-08-19 오가 노리오 반도체장치 및 그 제조방법
US5452245A (en) * 1993-09-07 1995-09-19 Motorola, Inc. Memory efficient gate array cell
JP2919241B2 (ja) * 1993-09-13 1999-07-12 日本電気株式会社 電源配線
JP2682397B2 (ja) * 1993-10-07 1997-11-26 日本電気株式会社 セルベース設計半導体集積回路装置
US5608258A (en) * 1995-03-16 1997-03-04 Zilog, Inc. MOS precision capacitor with low voltage coefficient

Also Published As

Publication number Publication date
CN1163967C (zh) 2004-08-25
US6121645A (en) 2000-09-19
EP0817272A2 (de) 1998-01-07
KR980006436A (ko) 1998-03-30
EP0817272A3 (de) 1998-05-06
TW360981B (en) 1999-06-11
CN1173740A (zh) 1998-02-18
KR100371678B1 (ko) 2003-05-12
EP0817272B1 (de) 2005-06-15
JPH1012825A (ja) 1998-01-16
DE69733513T2 (de) 2006-05-11

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee