DE69703312T2 - Vorrichtung und Verfahren zum Polieren von Halbleiterscheiben - Google Patents
Vorrichtung und Verfahren zum Polieren von HalbleiterscheibenInfo
- Publication number
- DE69703312T2 DE69703312T2 DE69703312T DE69703312T DE69703312T2 DE 69703312 T2 DE69703312 T2 DE 69703312T2 DE 69703312 T DE69703312 T DE 69703312T DE 69703312 T DE69703312 T DE 69703312T DE 69703312 T2 DE69703312 T2 DE 69703312T2
- Authority
- DE
- Germany
- Prior art keywords
- polishing
- polishing slurry
- slurry
- heavy metal
- turntable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005498 polishing Methods 0.000 title claims description 109
- 235000012431 wafers Nutrition 0.000 title claims description 40
- 239000004065 semiconductor Substances 0.000 title claims description 16
- 238000000034 method Methods 0.000 title claims description 7
- 239000002002 slurry Substances 0.000 claims description 82
- 229910001385 heavy metal Inorganic materials 0.000 claims description 34
- 150000002500 ions Chemical class 0.000 claims description 30
- NBZBKCUXIYYUSX-UHFFFAOYSA-N iminodiacetic acid Chemical compound OC(=O)CNCC(O)=O NBZBKCUXIYYUSX-UHFFFAOYSA-N 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 229910021645 metal ion Inorganic materials 0.000 claims description 6
- 238000007517 polishing process Methods 0.000 claims description 6
- 150000002605 large molecules Chemical class 0.000 claims description 5
- 239000013522 chelant Substances 0.000 claims description 4
- 229920001429 chelating resin Polymers 0.000 description 14
- 238000011109 contamination Methods 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 239000010802 sludge Substances 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- -1 Ni2+ ions Chemical class 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 239000003637 basic solution Substances 0.000 description 2
- 229940075614 colloidal silicon dioxide Drugs 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- AMBZRUJVCSJZSX-UHFFFAOYSA-N 4-imino-3-oxobutanoic acid Chemical compound OC(=O)CC(=O)C=N AMBZRUJVCSJZSX-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 238000002231 Czochralski process Methods 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 238000005341 cation exchange Methods 0.000 description 1
- 239000003729 cation exchange resin Substances 0.000 description 1
- 229940023913 cation exchange resins Drugs 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 239000008119 colloidal silica Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
- B24B55/03—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant designed as a complete equipment for feeding or clarifying coolant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6799796 | 1996-03-25 | ||
| JP05450497A JP3384530B2 (ja) | 1996-03-25 | 1997-03-10 | 半導体ウェーハの研磨装置および研磨方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE69703312D1 DE69703312D1 (de) | 2000-11-23 |
| DE69703312T2 true DE69703312T2 (de) | 2001-02-22 |
Family
ID=26395260
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE69703312T Expired - Fee Related DE69703312T2 (de) | 1996-03-25 | 1997-03-19 | Vorrichtung und Verfahren zum Polieren von Halbleiterscheiben |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP0798079B1 (ja) |
| JP (1) | JP3384530B2 (ja) |
| DE (1) | DE69703312T2 (ja) |
| MY (1) | MY132494A (ja) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001121407A (ja) | 1999-10-21 | 2001-05-08 | Nec Corp | 研磨装置 |
| JP4657412B2 (ja) * | 1999-12-10 | 2011-03-23 | エルエスアイ コーポレーション | 半導体ウェハを研磨する装置及び方法 |
| JP4510362B2 (ja) * | 2001-11-30 | 2010-07-21 | 俊郎 土肥 | Ｃｍｐ装置およびｃｍｐ方法 |
| JP2004075859A (ja) * | 2002-08-19 | 2004-03-11 | Chubu Kiresuto Kk | 研磨スラリーの清浄化法 |
| WO2004084287A1 (ja) * | 2003-03-18 | 2004-09-30 | Nomura Micro Science Co., Ltd. | 半導体研磨スラリー精製用素材、半導体研磨スラリー精製用モジュールおよび半導体研磨スラリーの精製方法 |
| JP4551167B2 (ja) * | 2004-09-14 | 2010-09-22 | 日本化学工業株式会社 | 半導体ウェーハの研磨装置及びこれを用いた研磨方法 |
| JP2006346753A (ja) * | 2005-06-13 | 2006-12-28 | Nomura Micro Sci Co Ltd | 金属汚染された研磨スラリーの除染方法 |
| TWI417430B (zh) * | 2006-08-25 | 2013-12-01 | Applied Materials Inc | 基板研磨液之使用點處理方法與系統 |
| JP2010167551A (ja) | 2008-12-26 | 2010-08-05 | Nomura Micro Sci Co Ltd | 使用済みスラリーの再生方法 |
| US9259668B2 (en) * | 2012-02-17 | 2016-02-16 | Jsr Corporation | Cleaning method of immersion liquid, immersion liquid cleaning composition, and substrate |
| CN104552002A (zh) * | 2014-12-29 | 2015-04-29 | 苏州用朴合金工具有限公司 | 基于硬质合金杆的cbn砂轮加工的冷却液循环利用系统 |
| JP6454599B2 (ja) | 2015-05-14 | 2019-01-16 | 株式会社ディスコ | 研磨装置 |
| JP6844970B2 (ja) * | 2016-08-18 | 2021-03-17 | 株式会社ディスコ | 研磨装置 |
| JP7000102B2 (ja) * | 2017-09-29 | 2022-01-19 | 株式会社フジミインコーポレーテッド | 研磨処理方法および研磨用組成物 |
| JP6946166B2 (ja) * | 2017-12-20 | 2021-10-06 | パナソニックＩｐマネジメント株式会社 | 研磨装置および研磨方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59189987A (ja) * | 1983-04-11 | 1984-10-27 | Nec Corp | シリコンウエ−ハ−研摩排水の循環利用方法 |
| US5087372A (en) * | 1989-03-24 | 1992-02-11 | Asahi Kasei Kogyo Kabushiki Kaisha | Method for removing heavy metal ions from contaminated water and a porous membrane usable therefor |
| JP3150990B2 (ja) * | 1991-03-25 | 2001-03-26 | 旭化成株式会社 | Ｇａ−Ａｓ研磨排水の処理方法 |
| KR100386965B1 (ko) * | 1993-08-16 | 2003-10-10 | 가부시키 가이샤 에바라 세이사꾸쇼 | 폴리싱장치내의배기물처리시스템 |
-
1997
- 1997-03-10 JP JP05450497A patent/JP3384530B2/ja not_active Expired - Fee Related
- 1997-03-19 DE DE69703312T patent/DE69703312T2/de not_active Expired - Fee Related
- 1997-03-19 EP EP97104697A patent/EP0798079B1/en not_active Expired - Lifetime
- 1997-03-20 MY MYPI97001183A patent/MY132494A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| EP0798079B1 (en) | 2000-10-18 |
| MY132494A (en) | 2007-10-31 |
| EP0798079A3 (en) | 1998-03-25 |
| DE69703312D1 (de) | 2000-11-23 |
| JP3384530B2 (ja) | 2003-03-10 |
| JPH09314466A (ja) | 1997-12-09 |
| EP0798079A2 (en) | 1997-10-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |