MY132494A - Polishing apparatus and polishing method for silicon wafers - Google Patents

Polishing apparatus and polishing method for silicon wafers

Info

Publication number
MY132494A
MY132494A MYPI97001183A MYPI19971183A MY132494A MY 132494 A MY132494 A MY 132494A MY PI97001183 A MYPI97001183 A MY PI97001183A MY PI19971183 A MYPI19971183 A MY PI19971183A MY 132494 A MY132494 A MY 132494A
Authority
MY
Malaysia
Prior art keywords
polishing
polishing slurry
semiconductor wafers
turn table
silicon wafers
Prior art date
Application number
MYPI97001183A
Other languages
English (en)
Inventor
Fukami Teruaki
Azito Toshio
Suzuki Kiyoshi
Original Assignee
Shinetsu Handotai Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Handotai Kk filed Critical Shinetsu Handotai Kk
Publication of MY132494A publication Critical patent/MY132494A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • B24B55/03—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant designed as a complete equipment for feeding or clarifying coolant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
MYPI97001183A 1996-03-25 1997-03-20 Polishing apparatus and polishing method for silicon wafers MY132494A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP6799796 1996-03-25
JP05450497A JP3384530B2 (ja) 1996-03-25 1997-03-10 半導体ウェーハの研磨装置および研磨方法

Publications (1)

Publication Number Publication Date
MY132494A true MY132494A (en) 2007-10-31

Family

ID=26395260

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI97001183A MY132494A (en) 1996-03-25 1997-03-20 Polishing apparatus and polishing method for silicon wafers

Country Status (4)

Country Link
EP (1) EP0798079B1 (ja)
JP (1) JP3384530B2 (ja)
DE (1) DE69703312T2 (ja)
MY (1) MY132494A (ja)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001121407A (ja) 1999-10-21 2001-05-08 Nec Corp 研磨装置
JP4657412B2 (ja) * 1999-12-10 2011-03-23 エルエスアイ コーポレーション 半導体ウェハを研磨する装置及び方法
JP4510362B2 (ja) * 2001-11-30 2010-07-21 俊郎 土肥 Ｃｍｐ装置およびｃｍｐ方法
JP2004075859A (ja) * 2002-08-19 2004-03-11 Chubu Kiresuto Kk 研磨スラリーの清浄化法
WO2004084287A1 (ja) * 2003-03-18 2004-09-30 Nomura Micro Science Co., Ltd. 半導体研磨スラリー精製用素材、半導体研磨スラリー精製用モジュールおよび半導体研磨スラリーの精製方法
JP4551167B2 (ja) * 2004-09-14 2010-09-22 日本化学工業株式会社 半導体ウェーハの研磨装置及びこれを用いた研磨方法
JP2006346753A (ja) * 2005-06-13 2006-12-28 Nomura Micro Sci Co Ltd 金属汚染された研磨スラリーの除染方法
TWI417430B (zh) * 2006-08-25 2013-12-01 Applied Materials Inc 基板研磨液之使用點處理方法與系統
JP2010167551A (ja) 2008-12-26 2010-08-05 Nomura Micro Sci Co Ltd 使用済みスラリーの再生方法
US9259668B2 (en) * 2012-02-17 2016-02-16 Jsr Corporation Cleaning method of immersion liquid, immersion liquid cleaning composition, and substrate
CN104552002A (zh) * 2014-12-29 2015-04-29 苏州用朴合金工具有限公司 基于硬质合金杆的cbn砂轮加工的冷却液循环利用系统
JP6454599B2 (ja) 2015-05-14 2019-01-16 株式会社ディスコ 研磨装置
JP6844970B2 (ja) * 2016-08-18 2021-03-17 株式会社ディスコ 研磨装置
JP7000102B2 (ja) * 2017-09-29 2022-01-19 株式会社フジミインコーポレーテッド 研磨処理方法および研磨用組成物
JP6946166B2 (ja) * 2017-12-20 2021-10-06 パナソニックＩｐマネジメント株式会社 研磨装置および研磨方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59189987A (ja) * 1983-04-11 1984-10-27 Nec Corp シリコンウエ−ハ−研摩排水の循環利用方法
US5087372A (en) * 1989-03-24 1992-02-11 Asahi Kasei Kogyo Kabushiki Kaisha Method for removing heavy metal ions from contaminated water and a porous membrane usable therefor
JP3150990B2 (ja) * 1991-03-25 2001-03-26 旭化成株式会社 Ｇａ−Ａｓ研磨排水の処理方法
KR100386965B1 (ko) * 1993-08-16 2003-10-10 가부시키 가이샤 에바라 세이사꾸쇼 폴리싱장치내의배기물처리시스템

Also Published As

Publication number Publication date
EP0798079B1 (en) 2000-10-18
EP0798079A3 (en) 1998-03-25
DE69703312T2 (de) 2001-02-22
DE69703312D1 (de) 2000-11-23
JP3384530B2 (ja) 2003-03-10
JPH09314466A (ja) 1997-12-09
EP0798079A2 (en) 1997-10-01

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