DE69632941D1 - Wolfram/Kupfer-Verbundpulver - Google Patents

Wolfram/Kupfer-Verbundpulver

Info

Publication number
DE69632941D1
DE69632941D1 DE69632941T DE69632941T DE69632941D1 DE 69632941 D1 DE69632941 D1 DE 69632941D1 DE 69632941 T DE69632941 T DE 69632941T DE 69632941 T DE69632941 T DE 69632941T DE 69632941 D1 DE69632941 D1 DE 69632941D1
Authority
DE
Germany
Prior art keywords
tungsten
composite powder
copper composite
copper
powder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69632941T
Other languages
English (en)
Other versions
DE69632941T2 (de
Inventor
Leonid P Dorfman
Michael J Scheithauer
David L Houck
Muktesh Paliwal
Gail T Meyers
Frank J Venskytis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Global Tungsten and Powders LLC
Original Assignee
Osram Sylvania Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Sylvania Inc filed Critical Osram Sylvania Inc
Publication of DE69632941D1 publication Critical patent/DE69632941D1/de
Application granted granted Critical
Publication of DE69632941T2 publication Critical patent/DE69632941T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/17—Metallic particles coated with metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/16—Making metallic powder or suspensions thereof using chemical processes
    • B22F9/18—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds
    • B22F9/20—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from solid metal compounds
    • B22F9/22—Making metallic powder or suspensions thereof using chemical processes with reduction of metal compounds starting from solid metal compounds using gaseous reductors
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
    • C01G41/00—Compounds of tungsten
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
    • C04B41/5133—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal with a composition mainly composed of one or more of the refractory metals
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/85—Coating or impregnation with inorganic materials
    • C04B41/88—Metals
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C22C1/045—Alloys based on refractory metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H01H1/021—Composite material
    • H01H1/025—Composite material having copper as the basic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
    • C04B2111/00474—Uses not provided for elsewhere in C04B2111/00
    • C04B2111/00844—Uses not provided for elsewhere in C04B2111/00 for electronic applications
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12181—Composite powder [e.g., coated, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated
    • Y10T428/2993—Silicic or refractory material containing [e.g., tungsten oxide, glass, cement, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Structural Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Composite Materials (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Inorganic Compounds Of Heavy Metals (AREA)
DE69632941T 1995-11-17 1996-11-15 Wolfram/Kupfer-Verbundpulver Expired - Lifetime DE69632941T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US559903 1995-11-17
US08/559,903 US6103392A (en) 1994-12-22 1995-11-17 Tungsten-copper composite powder

Publications (2)

Publication Number Publication Date
DE69632941D1 true DE69632941D1 (de) 2004-08-26
DE69632941T2 DE69632941T2 (de) 2004-12-16

Family

ID=24235537

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69635911T Expired - Lifetime DE69635911T2 (de) 1995-11-17 1996-11-15 Wolfram/Kupfer-Verbundpulver
DE69632941T Expired - Lifetime DE69632941T2 (de) 1995-11-17 1996-11-15 Wolfram/Kupfer-Verbundpulver

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE69635911T Expired - Lifetime DE69635911T2 (de) 1995-11-17 1996-11-15 Wolfram/Kupfer-Verbundpulver

Country Status (7)

Country Link
US (2) US6103392A (de)
EP (2) EP1118403B1 (de)
JP (2) JP3766486B2 (de)
CN (3) CN1068909C (de)
CA (1) CA2190550C (de)
DE (2) DE69635911T2 (de)
HU (1) HU221509B (de)

Families Citing this family (69)

* Cited by examiner, † Cited by third party
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US6375708B1 (en) 1994-12-22 2002-04-23 Osram Sylvania Inc. Alloy for electrical contacts and electrodes and method of making
DE19823341A1 (de) * 1998-05-26 1999-12-02 Wolfgang Semrau Beschichtetes Metallpulver und Verfahren zu seiner Herstellung
US6329065B1 (en) * 1998-08-31 2001-12-11 Kyocera Corporation Wire board and method of producing the same
FR2784690B1 (fr) * 1998-10-16 2001-10-12 Eurotungstene Poudres Poudres metalliques microniques a base de tungstene et/ou de molybdene et de materiaux de transition 3d
CN100431744C (zh) * 2000-03-29 2008-11-12 奥斯兰姆施尔凡尼亚公司 Mo-Cu复合粉末的制备方法
EP1666420A3 (de) * 2000-03-29 2006-06-14 Osram Sylvania, Inc. Verfahren zur Herstellung von Mischoxidpulver auf der Basis von CuMoO4
US7122069B2 (en) * 2000-03-29 2006-10-17 Osram Sylvania Inc. Mo-Cu composite powder
JP4742405B2 (ja) * 2000-06-28 2011-08-10 トヨタ自動車株式会社 燃料改質装置
DE10041194A1 (de) * 2000-08-23 2002-03-07 Starck H C Gmbh Verfahren zur Herstellung von Verbundbauteilen durch Pulver-Spritzgießen und dazu geeignete Verbundpulver
GB0120263D0 (en) * 2001-08-21 2001-10-10 Alphatex Hyperformance Coating Coating composition
KR100462274B1 (ko) * 2001-12-27 2004-12-17 주식회사 나노테크 텅스텐-구리계 복합분말의 제조방법 및 그 제조된복합분말을 이용한 방열판용 소결 합금의 제조방법
KR100468216B1 (ko) * 2002-05-06 2005-01-26 국방과학연구소 텅스텐이 코팅된 텅스텐-구리 복합 분말의 제조 방법 및그의 용도
US20040024482A1 (en) * 2002-07-29 2004-02-05 Dawn White Engineered thermal management devices and methods of the same
US20040156736A1 (en) * 2002-10-26 2004-08-12 Vlad Ocher Homogeneous shaped charge liner and fabrication method
KR100490879B1 (ko) * 2002-11-29 2005-05-24 국방과학연구소 균일한 조직을 갖는 텅스텐-구리(Ｗ－Ｃｕ) 합금 및 그제조 방법
KR100490880B1 (ko) * 2002-11-30 2005-05-24 국방과학연구소 텅스텐-구리 복합재료의 구리 스며나옴 억제 소결법
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CN1327027C (zh) * 2005-02-03 2007-07-18 西安建筑科技大学 一种钨铜或钨银复合材料的制备工艺
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MX2007013600A (es) 2005-05-05 2008-01-24 Starck H C Gmbh Metodo para revestir una superficie de bustrato y producto revestido.
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WO2007096986A1 (ja) * 2006-02-24 2007-08-30 Ibiden Co., Ltd. 端面加熱装置、ハニカム集合体の端面乾燥方法、及び、ハニカム構造体の製造方法
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CN100411779C (zh) * 2006-10-13 2008-08-20 武汉理工大学 一种用于制备高密度合金的钨-铜复合粉末的制备方法
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KR101230262B1 (ko) * 2010-10-12 2013-02-06 국방과학연구소 경사기능층을 가지는 텅스텐-구리 합금의 제조방법
CN102161097A (zh) * 2011-01-29 2011-08-24 中南大学 一种新型细晶钨铜电极材料的制备方法
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CN102389971B (zh) * 2011-11-04 2013-02-13 合肥工业大学 一种La掺杂W-Cu复合粉末的制备方法
CN103187544B (zh) 2011-12-28 2015-07-22 比亚迪股份有限公司 一种电池的负极密封组件及其制作方法、以及一种锂离子电池
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CN103464742B (zh) * 2013-09-18 2016-01-20 武汉理工大学 一种铜包覆银包覆钨的复合包覆粉体的制备方法
JP5753244B2 (ja) * 2013-09-28 2015-07-22 日本タングステン株式会社 接点材料およびそれを用いた遮断器
CN103710555B (zh) * 2013-12-04 2016-01-27 西安理工大学 一种利用流延法制备钨铜片或板的方法
RU2556154C1 (ru) * 2014-01-22 2015-07-10 Акционерное общество "Научно-производственное предприятие "Исток" имени А.И.Шокина" (АО "НПП "Исток" им.Шокина") Способ получения композиционного материала псевдосплава
CN103981389B (zh) * 2014-05-15 2016-06-15 厦门理工学院 一种低温烧结钨骨架制备钨铜合金的方法
AT14301U1 (de) * 2014-07-09 2015-07-15 Plansee Se Verfahren zur Herstellung eines Bauteils
CN104445414B (zh) * 2014-11-02 2017-03-01 华北理工大学 纳米钨酸铜抗菌粉体的制备方法
CN104671283B (zh) * 2014-12-29 2017-03-01 华北理工大学 超声波法及超声‑熔盐法合成钼酸铜纳米片抗菌粉体
CN105107519A (zh) * 2015-09-11 2015-12-02 辽宁石油化工大学 一种原位合成钨酸盐/氧化钨异质结光催化剂的方法
CN105903954B (zh) * 2016-06-28 2017-10-13 大连理工大学 一种制备锡包覆钨粉末的方法
CN106077693B (zh) * 2016-07-22 2018-07-03 合肥工业大学 一种高抗热冲击W-TiC-Y2O3复合材料及其制备方法
US11260451B2 (en) 2017-09-29 2022-03-01 Jx Nippon Mining & Metals Corporation Metal powder for metal additive manufacturing and molded object produced using said metal powder
CN108515179B (zh) * 2018-04-16 2021-06-29 湖南工业大学 一种防止钨铜材料液相烧结过程中铜损失的方法
JP7093549B2 (ja) * 2018-07-27 2022-06-30 国立研究開発法人物質・材料研究機構 触媒、触媒の製造方法、触媒担持担体、分解方法、水素の製造方法、及び、担体
CN109279654B (zh) * 2018-12-06 2021-04-09 盐城工学院 一种铜钨酸的制备方法
RU2707455C1 (ru) * 2019-01-18 2019-11-26 Федеральное государственное бюджетное учреждение науки Институт металлургии и материаловедения им. А.А. Байкова Российской академии наук (ИМЕТ РАН) Сферический порошок псевдосплава на основе вольфрама и способ его получения
CN110480008B (zh) * 2019-09-03 2021-10-15 北京工业大学 一种利用激光3d打印制备三维连通钨基复合材料及方法
CN111299591A (zh) * 2020-04-15 2020-06-19 无锡乐普金属科技有限公司 一种钨铜合金板的制备方法
CN112091217B (zh) * 2020-11-12 2021-02-09 陕西斯瑞新材料股份有限公司 一种采用球形钨粉激光3d打印制造铜钨材料的方法
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EP0774315A3 (de) 1998-07-08
US6103392A (en) 2000-08-15
CN1329956A (zh) 2002-01-09
EP1118403A3 (de) 2005-01-05
CN1192837C (zh) 2005-03-16
HUP9603166A3 (en) 1999-07-28
CN1068909C (zh) 2001-07-25
JPH09143501A (ja) 1997-06-03
CN1329955A (zh) 2002-01-09
EP0774315B1 (de) 2004-07-21
US5956560A (en) 1999-09-21
EP1118403B1 (de) 2006-03-15
CN1191904C (zh) 2005-03-09
DE69632941T2 (de) 2004-12-16
HU9603166D0 (en) 1997-01-28
CA2190550C (en) 2008-09-16
JP2005097112A (ja) 2005-04-14
EP0774315A2 (de) 1997-05-21
CN1160773A (zh) 1997-10-01
EP1118403A2 (de) 2001-07-25
DE69635911D1 (de) 2006-05-11
CA2190550A1 (en) 1997-05-18
HUP9603166A2 (en) 1997-07-28
JP3766486B2 (ja) 2006-04-12
JP4181105B2 (ja) 2008-11-12
HU221509B (en) 2002-10-28
DE69635911T2 (de) 2006-08-17

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