DE69622463D1 - Ionenstrahl-Bearbeitungsapparat - Google Patents

Ionenstrahl-Bearbeitungsapparat

Info

Publication number
DE69622463D1
DE69622463D1 DE69622463T DE69622463T DE69622463D1 DE 69622463 D1 DE69622463 D1 DE 69622463D1 DE 69622463 T DE69622463 T DE 69622463T DE 69622463 T DE69622463 T DE 69622463T DE 69622463 D1 DE69622463 D1 DE 69622463D1
Authority
DE
Germany
Prior art keywords
processing apparatus
ion beam
beam processing
ion
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69622463T
Other languages
English (en)
Other versions
DE69622463T2 (de
Inventor
Satoshi Ichimura
Tadashi Sato
Kenzo Kobayashi
Shotaro Ohishi
Hisao Oonuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Application granted granted Critical
Publication of DE69622463D1 publication Critical patent/DE69622463D1/de
Publication of DE69622463T2 publication Critical patent/DE69622463T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/026—Means for avoiding or neutralising unwanted electrical charges on tube components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J27/00—Ion beam tubes
    • H01J27/02—Ion sources; Ion guns
    • H01J27/16—Ion sources; Ion guns using high-frequency excitation, e.g. microwave excitation
    • H01J27/18—Ion sources; Ion guns using high-frequency excitation, e.g. microwave excitation with an applied axial magnetic field
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/305—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating or etching
    • H01J37/3053—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating or etching for evaporating or etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/004—Charge control of objects or beams
    • H01J2237/0041—Neutralising arrangements

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Combustion & Propulsion (AREA)
  • High Energy & Nuclear Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Toxicology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Plasma Technology (AREA)
  • Electron Sources, Ion Sources (AREA)
  • Drying Of Semiconductors (AREA)
  • ing And Chemical Polishing (AREA)
  • Physical Vapour Deposition (AREA)
DE69622463T 1995-04-28 1996-04-26 Ionenstrahl-Bearbeitungsapparat Expired - Fee Related DE69622463T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP07105884A JP3123735B2 (ja) 1995-04-28 1995-04-28 イオンビーム処理装置

Publications (2)

Publication Number Publication Date
DE69622463D1 true DE69622463D1 (de) 2002-08-29
DE69622463T2 DE69622463T2 (de) 2003-05-08

Family

ID=14419365

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69622463T Expired - Fee Related DE69622463T2 (de) 1995-04-28 1996-04-26 Ionenstrahl-Bearbeitungsapparat

Country Status (5)

Country Link
US (1) US5750987A (de)
EP (2) EP1132946A1 (de)
JP (1) JP3123735B2 (de)
KR (1) KR100388594B1 (de)
DE (1) DE69622463T2 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6271529B1 (en) * 1997-12-01 2001-08-07 Ebara Corporation Ion implantation with charge neutralization
US6184532B1 (en) 1997-12-01 2001-02-06 Ebara Corporation Ion source
JP3364830B2 (ja) 1998-06-09 2003-01-08 株式会社日立製作所 イオンビーム加工装置
JP4222707B2 (ja) * 2000-03-24 2009-02-12 東京エレクトロン株式会社 プラズマ処理装置及び方法、ガス供給リング及び誘電体
US6703628B2 (en) 2000-07-25 2004-03-09 Axceliss Technologies, Inc Method and system for ion beam containment in an ion beam guide
US6541781B1 (en) * 2000-07-25 2003-04-01 Axcelis Technologies, Inc. Waveguide for microwave excitation of plasma in an ion beam guide
KR100382720B1 (ko) * 2000-08-30 2003-05-09 삼성전자주식회사 반도체 식각 장치 및 이를 이용한 반도체 소자의 식각 방법
JP4061857B2 (ja) * 2001-04-27 2008-03-19 株式会社日立製作所 光学ユニット及びそれを用いた映像表示装置
JP3641716B2 (ja) * 2001-05-23 2005-04-27 株式会社日立製作所 イオンビーム加工装置およびその方法
US7298091B2 (en) * 2002-02-01 2007-11-20 The Regents Of The University Of California Matching network for RF plasma source
US20040227106A1 (en) * 2003-05-13 2004-11-18 Halling Alfred M. System and methods for ion beam containment using localized electrostatic fields in an ion beam passageway
US6891174B2 (en) * 2003-07-31 2005-05-10 Axcelis Technologies, Inc. Method and system for ion beam containment using photoelectrons in an ion beam guide
KR20070106982A (ko) 2004-12-20 2007-11-06 베리안 세미콘덕터 이큅먼트 어소시에이츠, 인크. 저에너지 고전류 리본 빔 이온주입장치에서 빔 중성화의개선
JP4345895B2 (ja) * 2005-10-20 2009-10-14 日新イオン機器株式会社 イオン源の運転方法およびイオン注入装置
JP4229145B2 (ja) * 2006-06-28 2009-02-25 日新イオン機器株式会社 イオンビーム照射装置
JP2008174777A (ja) 2007-01-17 2008-07-31 Hitachi Kokusai Electric Inc 薄膜形成装置
WO2010036422A2 (en) * 2008-06-10 2010-04-01 The Regents Of The University Of California Plasma driven neutron/gamma generator
CN104878392B (zh) * 2015-06-24 2017-05-31 安徽纯源镀膜科技有限公司 离子束清洗刻蚀设备
RU2624000C2 (ru) * 2015-10-26 2017-06-30 Российская Федерация, от имени которой выступает Государственная корпорация по атомной энергии "Росатом" (Госкорпорация "Росатом") Генератор высокочастотного излучения на основе разряда с полым катодом
KR102446318B1 (ko) * 2020-07-24 2022-09-23 박흥균 반도체 패키지용 폴리머 경화공정장치

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2581244B1 (fr) * 1985-04-29 1987-07-10 Centre Nat Rech Scient Source d'ions du type triode a une seule chambre d'ionisation a excitation haute frequence et a confinement magnetique du type multipolaire
JPH0711072B2 (ja) * 1986-04-04 1995-02-08 株式会社日立製作所 イオン源装置
JPH0610348B2 (ja) * 1986-07-28 1994-02-09 三菱電機株式会社 イオン注入装置
JPH0689465B2 (ja) * 1986-12-22 1994-11-09 株式会社日立製作所 エツチング装置
KR930004115B1 (ko) * 1988-10-31 1993-05-20 후지쓰 가부시끼가이샤 애싱(ashing)처리방법 및 장치
JP2704438B2 (ja) * 1989-09-04 1998-01-26 東京エレクトロン株式会社 イオン注入装置
KR910016054A (ko) * 1990-02-23 1991-09-30 미다 가쓰시게 마이크로 전자 장치용 표면 처리 장치 및 그 방법
JPH04351838A (ja) * 1991-05-28 1992-12-07 Hitachi Ltd イオンビーム装置の中性化器
JPH0547338A (ja) * 1991-08-16 1993-02-26 Nissin Electric Co Ltd イオンビーム中性化装置
JP3243807B2 (ja) * 1991-09-20 2002-01-07 日新電機株式会社 イオン照射装置
JPH05234562A (ja) * 1992-02-21 1993-09-10 Hitachi Ltd イオンビーム中性化装置
US5466929A (en) * 1992-02-21 1995-11-14 Hitachi, Ltd. Apparatus and method for suppressing electrification of sample in charged beam irradiation apparatus
JP3401801B2 (ja) * 1992-06-17 2003-04-28 株式会社日立製作所 イオンビーム装置
JP3331542B2 (ja) * 1992-08-28 2002-10-07 川崎マイクロエレクトロニクス株式会社 表面処理装置及び方法
JP3054302B2 (ja) * 1992-12-02 2000-06-19 アプライド マテリアルズ インコーポレイテッド イオン注入中の半導体ウェハにおける帯電を低減するプラズマ放出システム
JP3460239B2 (ja) * 1992-12-28 2003-10-27 日新電機株式会社 イオン処理装置

Also Published As

Publication number Publication date
KR960039136A (ko) 1996-11-21
DE69622463T2 (de) 2003-05-08
EP0740327A3 (de) 1998-03-04
KR100388594B1 (ko) 2003-09-19
EP0740327B1 (de) 2002-07-24
JPH08296069A (ja) 1996-11-12
EP1132946A1 (de) 2001-09-12
EP0740327A2 (de) 1996-10-30
JP3123735B2 (ja) 2001-01-15
US5750987A (en) 1998-05-12

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee