DE69119672D1 - Plasmabearbeitungsverfahren - Google Patents

Plasmabearbeitungsverfahren

Info

Publication number
DE69119672D1
DE69119672D1 DE69119672T DE69119672T DE69119672D1 DE 69119672 D1 DE69119672 D1 DE 69119672D1 DE 69119672 T DE69119672 T DE 69119672T DE 69119672 T DE69119672 T DE 69119672T DE 69119672 D1 DE69119672 D1 DE 69119672D1
Authority
DE
Germany
Prior art keywords
processing method
plasma processing
plasma
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69119672T
Other languages
English (en)
Other versions
DE69119672T2 (de
Inventor
Yoshio Fukasawa
Kenji Momose
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of DE69119672D1 publication Critical patent/DE69119672D1/de
Application granted granted Critical
Publication of DE69119672T2 publication Critical patent/DE69119672T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32321—Discharge generated by other radiation

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • ing And Chemical Polishing (AREA)
DE69119672T 1990-09-07 1991-09-06 Plasmabearbeitungsverfahren Expired - Fee Related DE69119672T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2237665A JP3004699B2 (ja) 1990-09-07 1990-09-07 プラズマ処理方法

Publications (2)

Publication Number Publication Date
DE69119672D1 true DE69119672D1 (de) 1996-06-27
DE69119672T2 DE69119672T2 (de) 1996-10-31

Family

ID=17018694

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69119672T Expired - Fee Related DE69119672T2 (de) 1990-09-07 1991-09-06 Plasmabearbeitungsverfahren

Country Status (6)

Country Link
US (1) US5246529A (de)
EP (1) EP0474244B1 (de)
JP (1) JP3004699B2 (de)
KR (1) KR0155565B1 (de)
DE (1) DE69119672T2 (de)
TW (1) TW209929B (de)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5560804A (en) * 1991-03-19 1996-10-01 Tokyo Electron Limited Etching method for silicon containing layer
JP2920848B2 (ja) * 1991-03-19 1999-07-19 東京エレクトロン株式会社 シリコン層のエッチング方法
KR100188455B1 (ko) * 1991-05-20 1999-06-01 이노우에 아키라 드라이 에칭방법
US5756401A (en) * 1992-03-23 1998-05-26 Fujitsu Limited Process for the etching of polycide film
FR2694131B1 (fr) * 1992-07-21 1996-09-27 Balzers Hochvakuum Procede et installation pour la fabrication d'un composant, notamment d'un composant optique, et composant optique ainsi obtenu.
JP2793472B2 (ja) * 1993-06-24 1998-09-03 日本電気株式会社 銅微細加工方法および銅微細加工装置
US6008139A (en) * 1996-06-17 1999-12-28 Applied Materials Inc. Method of etching polycide structures
KR100252814B1 (ko) * 1996-11-26 2000-04-15 서평원 교환시스템에서의 데이타 레이트 변환장치
US6303045B1 (en) * 1997-03-20 2001-10-16 Lam Research Corporation Methods and apparatus for etching a nitride layer in a variable-gap plasma processing chamber
US6458254B2 (en) 1997-09-25 2002-10-01 Midwest Research Institute Plasma & reactive ion etching to prepare ohmic contacts
US6289842B1 (en) * 1998-06-22 2001-09-18 Structured Materials Industries Inc. Plasma enhanced chemical vapor deposition system
US6207544B1 (en) * 1998-12-09 2001-03-27 Advanced Micro Devices, Inc. Method of fabricating ultra thin nitride spacers and device incorporating same
DE10226604B4 (de) * 2002-06-14 2006-06-01 Infineon Technologies Ag Verfahren zum Strukturieren einer Schicht
US20060022641A1 (en) * 2004-05-24 2006-02-02 Scalpel Drive Innovation, Llc System, apparatus, and method for increasing particle density and energy by creating a controlled plasma environment into a gaseous media
US20060108069A1 (en) * 2004-11-19 2006-05-25 Samsung Electronics Co., Ltd. Plasma reaction chamber and captive silicon electrode plate for processing semiconductor wafers
US7442274B2 (en) * 2005-03-28 2008-10-28 Tokyo Electron Limited Plasma etching method and apparatus therefor

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0622212B2 (ja) * 1983-05-31 1994-03-23 株式会社東芝 ドライエッチング方法
JPS6114722A (ja) * 1984-06-29 1986-01-22 Toshiba Corp 半導体製造装置
US4673456A (en) * 1985-09-17 1987-06-16 Machine Technology, Inc. Microwave apparatus for generating plasma afterglows
US4664769A (en) * 1985-10-28 1987-05-12 International Business Machines Corporation Photoelectric enhanced plasma glow discharge system and method including radiation means
JPS62115723A (ja) * 1985-11-15 1987-05-27 Nec Corp 半導体製造装置
US4778563A (en) * 1987-03-26 1988-10-18 Applied Materials, Inc. Materials and methods for etching tungsten polycides using silicide as a mask
US4828649A (en) * 1987-07-16 1989-05-09 Texas Instruments Incorporated Method for etching an aluminum film doped with silicon
US4857382A (en) * 1988-04-26 1989-08-15 General Electric Company Apparatus and method for photoetching of polyimides, polycarbonates and polyetherimides
US4908095A (en) * 1988-05-02 1990-03-13 Tokyo Electron Limited Etching device, and etching method
US4937094A (en) * 1988-05-26 1990-06-26 Energy Conversion Devices, Inc. Method of creating a high flux of activated species for reaction with a remotely located substrate
US4997520A (en) * 1988-06-10 1991-03-05 Texas Instruments Incorporated Method for etching tungsten
US5007982A (en) * 1988-07-11 1991-04-16 North American Philips Corporation Reactive ion etching of silicon with hydrogen bromide
US5013398A (en) * 1990-05-29 1991-05-07 Micron Technology, Inc. Anisotropic etch method for a sandwich structure

Also Published As

Publication number Publication date
EP0474244B1 (de) 1996-05-22
JP3004699B2 (ja) 2000-01-31
EP0474244A2 (de) 1992-03-11
KR0155565B1 (ko) 1998-12-01
TW209929B (de) 1993-07-21
KR920007101A (ko) 1992-04-28
JPH04116926A (ja) 1992-04-17
DE69119672T2 (de) 1996-10-31
EP0474244A3 (de) 1992-04-01
US5246529A (en) 1993-09-21

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee