DE69531019D1 - Behandlungsmethode und -vorrichtung für ein resistbeschichtetes Substrat - Google Patents
Behandlungsmethode und -vorrichtung für ein resistbeschichtetes SubstratInfo
- Publication number
- DE69531019D1 DE69531019D1 DE69531019T DE69531019T DE69531019D1 DE 69531019 D1 DE69531019 D1 DE 69531019D1 DE 69531019 T DE69531019 T DE 69531019T DE 69531019 T DE69531019 T DE 69531019T DE 69531019 D1 DE69531019 D1 DE 69531019D1
- Authority
- DE
- Germany
- Prior art keywords
- resist
- treatment method
- coated substrate
- coated
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2037—Exposure with X-ray radiation or corpuscular radiation, through a mask with a pattern opaque to that radiation
- G03F7/2039—X-ray radiation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70933—Purge, e.g. exchanging fluid or gas to remove pollutants
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP09567694A JP3168113B2 (ja) | 1994-04-08 | 1994-04-08 | 減圧チャンバおよびこれを用いた露光装置 |
JP9567694 | 1994-04-08 | ||
JP6961195 | 1995-03-28 | ||
JP06961195A JP3416326B2 (ja) | 1995-03-28 | 1995-03-28 | 処理システム及びこれを用いたデバイス生産方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69531019D1 true DE69531019D1 (de) | 2003-07-17 |
DE69531019T2 DE69531019T2 (de) | 2004-01-08 |
Family
ID=26410787
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69535412T Expired - Lifetime DE69535412D1 (de) | 1994-04-08 | 1995-03-31 | Verarbeitungssystem zur Herstellung von Halbleiterbauelementen |
DE69531019T Expired - Fee Related DE69531019T2 (de) | 1994-04-08 | 1995-03-31 | Behandlungsmethode und -vorrichtung für ein resistbeschichtetes Substrat |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69535412T Expired - Lifetime DE69535412D1 (de) | 1994-04-08 | 1995-03-31 | Verarbeitungssystem zur Herstellung von Halbleiterbauelementen |
Country Status (4)
Country | Link |
---|---|
US (1) | US5871587A (de) |
EP (2) | EP0676672B1 (de) |
KR (1) | KR100241953B1 (de) |
DE (2) | DE69535412D1 (de) |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09218519A (ja) * | 1996-02-09 | 1997-08-19 | Nikon Corp | 露光装置の環境制御方法及び装置 |
KR970067591A (ko) | 1996-03-04 | 1997-10-13 | 오노 시게오 | 투영노광장치 |
KR100542414B1 (ko) * | 1996-03-27 | 2006-05-10 | 가부시키가이샤 니콘 | 노광장치및공조장치 |
JPH10270333A (ja) * | 1997-03-27 | 1998-10-09 | Nikon Corp | 露光装置 |
US6882403B1 (en) * | 1997-04-07 | 2005-04-19 | Nikon Corporation | Lithography system and method |
AU7552498A (en) * | 1997-06-10 | 1998-12-30 | Nikon Corporation | Optical device, method of cleaning the same, projection aligner, and method of producing the same |
JP3926890B2 (ja) * | 1997-06-11 | 2007-06-06 | 東京エレクトロン株式会社 | 処理システム |
JPH11204396A (ja) * | 1998-01-08 | 1999-07-30 | Canon Inc | 半導体製造システムおよびデバイス製造方法 |
JPH11204411A (ja) * | 1998-01-19 | 1999-07-30 | Nikon Corp | 塗布現像露光装置 |
JPH11312640A (ja) * | 1998-02-25 | 1999-11-09 | Canon Inc | 処理装置および該処理装置を用いたデバイス製造方法 |
US6153044A (en) * | 1998-04-30 | 2000-11-28 | Euv Llc | Protection of lithographic components from particle contamination |
US6183564B1 (en) * | 1998-11-12 | 2001-02-06 | Tokyo Electron Limited | Buffer chamber for integrating physical and chemical vapor deposition chambers together in a processing system |
EP1143491A4 (de) * | 1998-11-19 | 2003-11-26 | Nikon Corp | Optisches bauelement, belichtungssystem, laserstrahlquelle, gaszuführungsverfahren, belichtungsverfahren und bauelementherstellungsverfahren |
US6313953B1 (en) * | 1999-01-15 | 2001-11-06 | Donaldson Company, Inc. | Gas chemical filtering for optimal light transmittance; and methods |
AU4779700A (en) * | 1999-05-27 | 2000-12-18 | Nikon Corporation | Exposure system, method of manufacturing device, and method of environmental control of exposure system |
DE10007059A1 (de) * | 2000-02-16 | 2001-08-23 | Aixtron Ag | Verfahren und Vorrichtung zur Herstellung von beschichteten Substraten mittels Kondensationsbeschichtung |
JP2001345263A (ja) * | 2000-03-31 | 2001-12-14 | Nikon Corp | 露光装置及び露光方法、並びにデバイス製造方法 |
WO2001075501A1 (fr) * | 2000-03-31 | 2001-10-11 | Nikon Corporation | Procede et dispositif de soutien d'un element optique, dispositif optique, appareil d'exposition, et procede de fabrication d'un dispositif |
JP4560182B2 (ja) * | 2000-07-06 | 2010-10-13 | キヤノン株式会社 | 減圧処理装置、半導体製造装置およびデバイス製造方法 |
US7118780B2 (en) * | 2001-03-16 | 2006-10-10 | Semiconductor Energy Laboratory Co., Ltd. | Heat treatment method |
CN100530491C (zh) * | 2001-05-28 | 2009-08-19 | 佳能株式会社 | 电子源制造设备 |
JP3890258B2 (ja) * | 2001-05-28 | 2007-03-07 | キヤノン株式会社 | 電子源の製造方法、および、電子源の製造装置 |
EP1394611A1 (de) * | 2002-08-30 | 2004-03-03 | ASML Netherlands BV | Lithographischer Apparat, Methode zur Herstellung einer Vorrichtung und damit hergestellte Vorrichtung |
EP1396759A3 (de) * | 2002-08-30 | 2006-08-02 | ASML Netherlands B.V. | Lithographischer Apparat, Verfahren zur Herstellung eines Artikels und damit erzeugter Artikel |
JP2004158510A (ja) * | 2002-11-01 | 2004-06-03 | Canon Inc | デバイス製造装置 |
DE10253162B4 (de) * | 2002-11-14 | 2005-11-03 | Infineon Technologies Ag | Verfahren zum Spülen einer optischen Linse |
US6770895B2 (en) | 2002-11-21 | 2004-08-03 | Asml Holding N.V. | Method and apparatus for isolating light source gas from main chamber gas in a lithography tool |
US6919573B2 (en) | 2003-03-20 | 2005-07-19 | Asml Holding N.V | Method and apparatus for recycling gases used in a lithography tool |
JP4350429B2 (ja) * | 2003-06-05 | 2009-10-21 | キヤノン株式会社 | 露光装置、およびデバイスの製造方法 |
US20090017206A1 (en) * | 2007-06-16 | 2009-01-15 | Applied Materials, Inc. | Methods and apparatus for reducing the consumption of reagents in electronic device manufacturing processes |
NL1036153A1 (nl) | 2007-11-08 | 2009-05-11 | Asml Netherlands Bv | Method and system for determining a suppression factor of a suppression system and a lithographic apparatus. |
TW201001542A (en) * | 2008-03-24 | 2010-01-01 | Applied Materials Inc | Methods and apparatus for using reduced purity silane to deposit silicon |
US8827695B2 (en) * | 2008-06-23 | 2014-09-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Wafer's ambiance control |
US8888086B2 (en) * | 2011-05-11 | 2014-11-18 | Sematech, Inc. | Apparatus with surface protector to inhibit contamination |
EP2876674A1 (de) * | 2013-11-25 | 2015-05-27 | Roth & Rau AG | Vorrichtung zur Rückgewinnung von Inertgas aus Schleusenkammern |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6196344A (ja) * | 1984-10-18 | 1986-05-15 | Toshiba Corp | クリ−ンル−ム |
JPS6266039A (ja) * | 1985-09-19 | 1987-03-25 | Hitachi Ltd | 清浄作業室設備 |
JPS62268941A (ja) * | 1986-05-16 | 1987-11-21 | Hitachi Plant Eng & Constr Co Ltd | クリ−ンル−ム |
EP0322205A3 (de) * | 1987-12-23 | 1990-09-12 | Texas Instruments Incorporated | Automatische photolithographische Behandlungskammer |
JPH02156625A (ja) * | 1988-12-09 | 1990-06-15 | Canon Inc | 直動案内装置 |
JPH03175224A (ja) * | 1989-12-04 | 1991-07-30 | Hitachi Reinetsu Kk | クリーンルームにおける清浄度制御装置 |
US5353323A (en) * | 1994-02-02 | 1994-10-04 | Kabushiki Kaisha Toshiba | X-ray exposure apparatus |
-
1995
- 1995-03-31 DE DE69535412T patent/DE69535412D1/de not_active Expired - Lifetime
- 1995-03-31 DE DE69531019T patent/DE69531019T2/de not_active Expired - Fee Related
- 1995-03-31 EP EP95302173A patent/EP0676672B1/de not_active Expired - Lifetime
- 1995-03-31 EP EP00201366A patent/EP1026549B1/de not_active Expired - Lifetime
- 1995-04-04 KR KR1019950007780A patent/KR100241953B1/ko not_active IP Right Cessation
-
1996
- 1996-04-03 US US08/625,710 patent/US5871587A/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP0676672A3 (de) | 1996-07-10 |
EP1026549B1 (de) | 2007-02-28 |
EP1026549A3 (de) | 2000-08-16 |
DE69535412D1 (de) | 2007-04-12 |
EP1026549A2 (de) | 2000-08-09 |
EP0676672A2 (de) | 1995-10-11 |
KR950030212A (ko) | 1995-11-24 |
US5871587A (en) | 1999-02-16 |
DE69531019T2 (de) | 2004-01-08 |
EP0676672B1 (de) | 2003-06-11 |
KR100241953B1 (ko) | 2000-03-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |