DE69519259T2 - Verfahren zum harzversiegeln von halbleiterbauteilen - Google Patents

Verfahren zum harzversiegeln von halbleiterbauteilen

Info

Publication number
DE69519259T2
DE69519259T2 DE69519259T DE69519259T DE69519259T2 DE 69519259 T2 DE69519259 T2 DE 69519259T2 DE 69519259 T DE69519259 T DE 69519259T DE 69519259 T DE69519259 T DE 69519259T DE 69519259 T2 DE69519259 T2 DE 69519259T2
Authority
DE
Germany
Prior art keywords
resin sealing
semiconductor components
sealing semiconductor
components
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69519259T
Other languages
English (en)
Other versions
DE69519259D1 (de
Inventor
Isao Yabe
Masahiko Yoneyama
Teruo Nayuki
Hiroaki Shimizu
Katsuhiko Ikai
Kazuhiko Asaumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP205594A external-priority patent/JPH07205191A/ja
Priority claimed from JP336594A external-priority patent/JP3351891B2/ja
Priority claimed from JP9196194A external-priority patent/JPH07290489A/ja
Priority claimed from JP11131494A external-priority patent/JP3545042B2/ja
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Application granted granted Critical
Publication of DE69519259D1 publication Critical patent/DE69519259D1/de
Publication of DE69519259T2 publication Critical patent/DE69519259T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/38—Cutting-off equipment for sprues or ingates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/18—Feeding the material into the injection moulding apparatus, i.e. feeding the non-plastified material into the injection unit
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/38—Cutting-off equipment for sprues or ingates
    • B29C2045/388—Locking pins for retaining the sprue
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
DE69519259T 1994-01-13 1995-01-06 Verfahren zum harzversiegeln von halbleiterbauteilen Expired - Fee Related DE69519259T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP205594A JPH07205191A (ja) 1994-01-13 1994-01-13 樹脂成形用装置
JP336594A JP3351891B2 (ja) 1994-01-18 1994-01-18 Ｉｃを実装した回路基板の樹脂封止方法及びその成形金型
JP9196194A JPH07290489A (ja) 1994-04-28 1994-04-28 樹脂成形方法
JP11131494A JP3545042B2 (ja) 1994-05-25 1994-05-25 樹脂成形方法
PCT/JP1995/000007 WO1995019251A1 (fr) 1994-01-13 1995-01-06 Procede de soudage par resine de dispositifs semi-conducteurs

Publications (2)

Publication Number Publication Date
DE69519259D1 DE69519259D1 (de) 2000-12-07
DE69519259T2 true DE69519259T2 (de) 2001-05-17

Family

ID=27453542

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69519259T Expired - Fee Related DE69519259T2 (de) 1994-01-13 1995-01-06 Verfahren zum harzversiegeln von halbleiterbauteilen

Country Status (6)

Country Link
US (1) US5783134A (de)
EP (1) EP0688650B1 (de)
KR (1) KR960700875A (de)
DE (1) DE69519259T2 (de)
TW (1) TW268144B (de)
WO (1) WO1995019251A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015119235A1 (de) * 2015-11-09 2017-05-11 Selectrona GmbH Vorrichtung zum Spritzgießen und Umspritzen von Objekten

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3351891B2 (ja) * 1994-01-18 2002-12-03 シチズン時計株式会社 Ｉｃを実装した回路基板の樹脂封止方法及びその成形金型
SG64985A1 (en) * 1997-05-06 1999-05-25 Advanced Systems Automation Li Method and apparatus for moulding plastic packages
US5986209A (en) * 1997-07-09 1999-11-16 Micron Technology, Inc. Package stack via bottom leaded plastic (BLP) packaging
KR100611548B1 (ko) * 2000-03-29 2006-08-10 닛토덴코 가부시키가이샤 반도체 장치, 그 제조 공정 및 에폭시 수지 조성물을포함하는 태블릿
US6547452B1 (en) 2000-05-11 2003-04-15 International Business Machines Corporation Alignment systems for subassemblies of overmolded optoelectronic modules
JP3859457B2 (ja) * 2001-03-27 2006-12-20 沖電気工業株式会社 半導体装置の製造方法
KR100423140B1 (ko) * 2001-04-18 2004-03-18 (주)에이치디세미테크 반도체패키지의 몰딩성형장치
US6857865B2 (en) * 2002-06-20 2005-02-22 Ultratera Corporation Mold structure for package fabrication
US7695269B2 (en) * 2006-05-30 2010-04-13 Asm Technology Singapore Pte Ltd. Apparatus and method for in-mold degating
TWI300379B (en) * 2006-09-07 2008-09-01 Quanta Comp Inc Insert-molding mold
US7633055B2 (en) * 2007-03-08 2009-12-15 Lumination Llc Sealed light emitting diode assemblies including annular gaskets and methods of making same
JP2009124012A (ja) * 2007-11-16 2009-06-04 Towa Corp 電子部品の圧縮成形方法及び金型
CN101531041B (zh) * 2008-03-12 2012-03-14 深圳富泰宏精密工业有限公司 模具结构
US7829004B2 (en) * 2008-07-15 2010-11-09 Asm Technology Singapore Pte Ltd Transfer molding method and system for electronic devices
KR101109342B1 (ko) * 2009-07-22 2012-01-31 삼성전기주식회사 역몰딩 장치 및 그를 이용한 하프 몰딩 방법
US20120076888A1 (en) * 2010-09-28 2012-03-29 Cheng Uei Precision Industry Co., Ltd. Mould with the contact prepressing and positioning function
JP6861506B2 (ja) * 2016-11-29 2021-04-21 Ｔｏｗａ株式会社 圧縮成形装置、圧縮成形方法、及び圧縮成形品の製造方法
JP6888525B2 (ja) * 2017-11-06 2021-06-16 株式会社デンソー 通電部材モジュールの製造方法
CN109591255A (zh) * 2018-10-17 2019-04-09 武汉格罗夫氢能汽车有限公司 一种可实现预浸料模压工艺富树脂凸台一体成型的方法
CN113910515B (zh) * 2021-10-29 2024-04-26 西安微电子技术研究所 一种电源模块内部加固散热垫片的装置及方法

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1046916A (fr) * 1951-11-13 1953-12-09 Procédé pour le moulage de bagues d'étanchéité ou autres articles annulaires et moules pour la mise en oeuvre de ce procédé
US3307224A (en) * 1964-08-13 1967-03-07 Union Carbide Corp Apparatus for molding plastic articles
US3537140A (en) * 1967-12-14 1970-11-03 Amedio P Defelice Removing sprues in plastic molds
JPS51137377A (en) * 1975-05-22 1976-11-27 Mitsubishi Electric Corp Manufacturing method for plastic seal type semi conductor
JPS5553544A (en) * 1978-10-16 1980-04-19 Hooker Chemicals Plastics Corp Plunger molding device with runner* which temperature is controlled* and spool portion
JPS5923526A (ja) * 1982-07-30 1984-02-07 Hitachi Ltd トランスフアモ−ルド方法および装置
JPS5961933A (ja) * 1982-10-01 1984-04-09 Hitachi Ltd トランスフア成形機
JPS59154032A (ja) * 1983-02-23 1984-09-03 Toshiba Corp 半導体装置の製造方法
JPS60110416A (ja) * 1983-11-22 1985-06-15 Matsushita Electric Ind Co Ltd 金型装置
JPS62161514A (ja) * 1986-01-10 1987-07-17 Toshiba Mach Co Ltd トランスフア成形方法および装置
GB2198385B (en) * 1986-12-05 1990-02-07 Metal Box Plc Apparatus for injection moulding
JPS63183824A (ja) * 1987-01-27 1988-07-29 Matsushita Electric Works Ltd 封止成形金型
JPH07320B2 (ja) * 1987-02-25 1995-01-11 株式会社日立製作所 半導体封止用トランスファ成形装置
US4954308A (en) * 1988-03-04 1990-09-04 Citizen Watch Co., Ltd. Resin encapsulating method
US5030407A (en) * 1988-04-28 1991-07-09 Schlumberger Industries Method of making cards having graphics elements thereon
JPH03190714A (ja) * 1989-12-21 1991-08-20 Alps Electric Co Ltd ２色成形用金型
JPH03205117A (ja) * 1990-01-05 1991-09-06 Toshiba Corp マルチプランジャー成形金型
JPH0381126A (ja) * 1990-07-17 1991-04-05 Mitsubishi Materials Corp 集積回路素子ケーシングの射出成形装置
IT1247649B (it) * 1990-10-31 1994-12-28 Sgs Thomson Microelectronics Procedimento di incapsulamento in resina di un dispositivo a semiconduttore di potenza montato su dissipatore allontanando i reofori dal dissipatore mediante l'azione del controstampo in fase di chiusura dello stampo
GB2252746B (en) * 1991-01-17 1995-07-12 Towa Corp A method of molding resin to seal an electronic part on a lead frame and apparatus therefor
JPH04291948A (ja) * 1991-03-20 1992-10-16 Fujitsu Ltd 半導体装置及びその製造方法及び放熱フィン
JPH0584776A (ja) * 1991-09-30 1993-04-06 Mitsubishi Electric Corp 積層鋼板のインサート射出成形における金型構造
US5215759A (en) * 1991-10-01 1993-06-01 Chanel, Inc. Cosmetic composition
JP3008610B2 (ja) * 1991-11-22 2000-02-14 松下電器産業株式会社 タブデバイスのモールドプレス装置およびモールドプレス方法
JP2778608B2 (ja) * 1992-02-10 1998-07-23 日本電気株式会社 樹脂モールド型半導体装置の製造方法
US5286426A (en) * 1992-04-01 1994-02-15 Allegro Microsystems, Inc. Assembling a lead frame between a pair of molding cavity plates
JPH05293846A (ja) * 1992-04-20 1993-11-09 Hitachi Ltd 成形装置
US5344795A (en) * 1992-09-22 1994-09-06 Microelectronics And Computer Technology Corporation Method for encapsulating an integrated circuit using a removable heatsink support block
JPH06120278A (ja) * 1992-10-05 1994-04-28 Toshiba Corp 樹脂封止型半導体装置の製造装置
JPH06126771A (ja) * 1992-10-20 1994-05-10 Sony Corp 樹脂成形用金型
FR2702067B1 (fr) * 1993-02-23 1995-04-14 Schlumberger Ind Sa Procédé et dispositif de fabrication de cartes à mémoire.
GB2277295B (en) * 1993-04-23 1995-05-03 Neu Dynamics Corp Encapsulation molding equipment and method
US5302805A (en) * 1993-05-27 1994-04-12 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Welding wire pressure sensor assembly
US5444909A (en) * 1993-12-29 1995-08-29 Intel Corporation Method of making a drop-in heat sink

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015119235A1 (de) * 2015-11-09 2017-05-11 Selectrona GmbH Vorrichtung zum Spritzgießen und Umspritzen von Objekten
DE102015119235B4 (de) 2015-11-09 2019-01-10 Selectrona GmbH Vorrichtung zum Spritzgießen und Umspritzen von Objekten

Also Published As

Publication number Publication date
US5783134A (en) 1998-07-21
KR960700875A (ko) 1996-02-24
EP0688650B1 (de) 2000-11-02
DE69519259D1 (de) 2000-12-07
EP0688650A4 (de) 1997-06-11
WO1995019251A1 (fr) 1995-07-20
EP0688650A1 (de) 1995-12-27
TW268144B (de) 1996-01-11

Similar Documents

Publication Publication Date Title
DE69519259T2 (de) Verfahren zum harzversiegeln von halbleiterbauteilen
DE69519109T2 (de) Verfahren zum ausgeben von dichtungsmaterial
DE69514809T2 (de) Verfahren zum reparieren von substraten
DE69508921D1 (de) Verfahren zum nachweis von staphylokokken
DE69430457T2 (de) Verfahren zum teilweisen Sägen von intergrierter Schaltkreise
DE69719805T2 (de) Verfahren zum erzeugen von elastischen höckern
DE69517526D1 (de) Verfahren zum zusammenfügen von elastischen teilen
DE69624538D1 (de) Verfahren zum Verkleben oder Abdichten
DE69625894T2 (de) Verfahren zum verbinden von hohlplatten aus kunststoffharz
DE69523557T2 (de) Verfahren zum stitchbonden von drähten an integrierten schaltungsbondflächen
DE69730979D1 (de) Verfahren zum entwerfen von luftreifen
DE59812633D1 (de) Verfahren zum Verbinden von Bauteilen
DE69522828D1 (de) Verfahren zum entmetallieren von raffinerieeizätzen
DE69725768D1 (de) Verfahren zum Umhüllen von Paketen
ATE230667T1 (de) Verfahren zum verschweissen von kunststoffteilen
DE69306782D1 (de) Verfahren zum verbinden von perfluorelastomeren
DE69319347D1 (de) Verfahren zum verkleben von oberflächen
DE69329351D1 (de) Verfahren zum Bewerten von Halbleiterscheiben
DE59914127D1 (de) Verfahren zum herstellen von halbleiterbauelementen
DE69727410D1 (de) Verfahren zum Entgräten von Leiterrahmen
DE69722932D1 (de) Verfahren zum wiedergewinnen von harzen
DE69807090T2 (de) Verfahren zum spannen von schraubverbindungen
DE69413556D1 (de) Verfahren zum bürstensiegeltufting
DE69418935D1 (de) Verfahren zum Abdichten von wärmetechnischen Geräten
DE69730736D1 (de) Verfahren zum verbinden von modifizierten polytetrafluorethylengegenständen

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee