DE69519259D1 - Verfahren zum harzversiegeln von halbleiterbauteilen - Google Patents

Verfahren zum harzversiegeln von halbleiterbauteilen

Info

Publication number
DE69519259D1
DE69519259D1 DE69519259T DE69519259T DE69519259D1 DE 69519259 D1 DE69519259 D1 DE 69519259D1 DE 69519259 T DE69519259 T DE 69519259T DE 69519259 T DE69519259 T DE 69519259T DE 69519259 D1 DE69519259 D1 DE 69519259D1
Authority
DE
Germany
Prior art keywords
resin sealing
semiconductor components
sealing semiconductor
components
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69519259T
Other languages
English (en)
Other versions
DE69519259T2 (de
Inventor
Isao Yabe
Masahiko Yoneyama
Teruo Nayuki
Hiroaki Shimizu
Katsuhiko Ikai
Kazuhiko Asaumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP205594A external-priority patent/JPH07205191A/ja
Priority claimed from JP336594A external-priority patent/JP3351891B2/ja
Priority claimed from JP9196194A external-priority patent/JPH07290489A/ja
Priority claimed from JP11131494A external-priority patent/JP3545042B2/ja
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Application granted granted Critical
Publication of DE69519259D1 publication Critical patent/DE69519259D1/de
Publication of DE69519259T2 publication Critical patent/DE69519259T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/38—Cutting-off equipment for sprues or ingates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/18—Feeding the material into the injection moulding apparatus, i.e. feeding the non-plastified material into the injection unit
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/38—Cutting-off equipment for sprues or ingates
    • B29C2045/388—Locking pins for retaining the sprue
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
DE69519259T 1994-01-13 1995-01-06 Verfahren zum harzversiegeln von halbleiterbauteilen Expired - Fee Related DE69519259T2 (de)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP205594A JPH07205191A (ja) 1994-01-13 1994-01-13 樹脂成形用装置
JP336594A JP3351891B2 (ja) 1994-01-18 1994-01-18 Ｉｃを実装した回路基板の樹脂封止方法及びその成形金型
JP9196194A JPH07290489A (ja) 1994-04-28 1994-04-28 樹脂成形方法
JP11131494A JP3545042B2 (ja) 1994-05-25 1994-05-25 樹脂成形方法
PCT/JP1995/000007 WO1995019251A1 (fr) 1994-01-13 1995-01-06 Procede de soudage par resine de dispositifs semi-conducteurs

Publications (2)

Publication Number Publication Date
DE69519259D1 true DE69519259D1 (de) 2000-12-07
DE69519259T2 DE69519259T2 (de) 2001-05-17

Family

ID=27453542

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69519259T Expired - Fee Related DE69519259T2 (de) 1994-01-13 1995-01-06 Verfahren zum harzversiegeln von halbleiterbauteilen

Country Status (6)

Country Link
US (1) US5783134A (de)
EP (1) EP0688650B1 (de)
KR (1) KR960700875A (de)
DE (1) DE69519259T2 (de)
TW (1) TW268144B (de)
WO (1) WO1995019251A1 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3351891B2 (ja) * 1994-01-18 2002-12-03 シチズン時計株式会社 Ｉｃを実装した回路基板の樹脂封止方法及びその成形金型
SG64985A1 (en) * 1997-05-06 1999-05-25 Advanced Systems Automation Li Method and apparatus for moulding plastic packages
US5986209A (en) * 1997-07-09 1999-11-16 Micron Technology, Inc. Package stack via bottom leaded plastic (BLP) packaging
KR100611548B1 (ko) * 2000-03-29 2006-08-10 닛토덴코 가부시키가이샤 반도체 장치, 그 제조 공정 및 에폭시 수지 조성물을포함하는 태블릿
US6547452B1 (en) 2000-05-11 2003-04-15 International Business Machines Corporation Alignment systems for subassemblies of overmolded optoelectronic modules
JP3859457B2 (ja) * 2001-03-27 2006-12-20 沖電気工業株式会社 半導体装置の製造方法
KR100423140B1 (ko) * 2001-04-18 2004-03-18 (주)에이치디세미테크 반도체패키지의 몰딩성형장치
US6857865B2 (en) * 2002-06-20 2005-02-22 Ultratera Corporation Mold structure for package fabrication
US7695269B2 (en) * 2006-05-30 2010-04-13 Asm Technology Singapore Pte Ltd. Apparatus and method for in-mold degating
TWI300379B (en) * 2006-09-07 2008-09-01 Quanta Comp Inc Insert-molding mold
US7633055B2 (en) * 2007-03-08 2009-12-15 Lumination Llc Sealed light emitting diode assemblies including annular gaskets and methods of making same
JP2009124012A (ja) * 2007-11-16 2009-06-04 Towa Corp 電子部品の圧縮成形方法及び金型
CN101531041B (zh) * 2008-03-12 2012-03-14 深圳富泰宏精密工业有限公司 模具结构
US7829004B2 (en) * 2008-07-15 2010-11-09 Asm Technology Singapore Pte Ltd Transfer molding method and system for electronic devices
KR101109342B1 (ko) * 2009-07-22 2012-01-31 삼성전기주식회사 역몰딩 장치 및 그를 이용한 하프 몰딩 방법
US20120076888A1 (en) * 2010-09-28 2012-03-29 Cheng Uei Precision Industry Co., Ltd. Mould with the contact prepressing and positioning function
DE102015119235B4 (de) * 2015-11-09 2019-01-10 Selectrona GmbH Vorrichtung zum Spritzgießen und Umspritzen von Objekten
JP6861506B2 (ja) * 2016-11-29 2021-04-21 Ｔｏｗａ株式会社 圧縮成形装置、圧縮成形方法、及び圧縮成形品の製造方法
JP6888525B2 (ja) * 2017-11-06 2021-06-16 株式会社デンソー 通電部材モジュールの製造方法
CN109591255A (zh) * 2018-10-17 2019-04-09 武汉格罗夫氢能汽车有限公司 一种可实现预浸料模压工艺富树脂凸台一体成型的方法
CN113910515B (zh) * 2021-10-29 2024-04-26 西安微电子技术研究所 一种电源模块内部加固散热垫片的装置及方法

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Also Published As

Publication number Publication date
TW268144B (de) 1996-01-11
US5783134A (en) 1998-07-21
EP0688650A4 (de) 1997-06-11
EP0688650A1 (de) 1995-12-27
WO1995019251A1 (fr) 1995-07-20
DE69519259T2 (de) 2001-05-17
KR960700875A (ko) 1996-02-24
EP0688650B1 (de) 2000-11-02

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Legal Events

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8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee