DE69510518D1 - Flammhemmende wärmehärtbare Harzmischungen - Google Patents
Flammhemmende wärmehärtbare HarzmischungenInfo
- Publication number
- DE69510518D1 DE69510518D1 DE69510518T DE69510518T DE69510518D1 DE 69510518 D1 DE69510518 D1 DE 69510518D1 DE 69510518 T DE69510518 T DE 69510518T DE 69510518 T DE69510518 T DE 69510518T DE 69510518 D1 DE69510518 D1 DE 69510518D1
- Authority
- DE
- Germany
- Prior art keywords
- flame retardant
- thermosetting resin
- resin blends
- retardant thermosetting
- blends
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/5399—Phosphorus bound to nitrogen
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/2933—Coated or with bond, impregnation or core
- Y10T428/2938—Coating on discrete and individual rods, strands or filaments
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Fireproofing Substances (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US32007094A | 1994-10-07 | 1994-10-07 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69510518D1 true DE69510518D1 (de) | 1999-08-05 |
DE69510518T2 DE69510518T2 (de) | 2000-03-30 |
Family
ID=23244747
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69510518T Expired - Lifetime DE69510518T2 (de) | 1994-10-07 | 1995-10-05 | Flammhemmende wärmehärtbare Harzmischungen |
Country Status (4)
Country | Link |
---|---|
US (2) | US5652285A (de) |
EP (1) | EP0708141B1 (de) |
JP (1) | JP3821870B2 (de) |
DE (1) | DE69510518T2 (de) |
Families Citing this family (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5847327A (en) * | 1996-11-08 | 1998-12-08 | W.L. Gore & Associates, Inc. | Dimensionally stable core for use in high density chip packages |
JP3362217B2 (ja) * | 1998-07-14 | 2003-01-07 | 大塚化学株式会社 | 難燃性樹脂組成物 |
JP3364679B2 (ja) | 1998-08-26 | 2003-01-08 | 大塚化学株式会社 | 粉末状難燃剤 |
US6093758A (en) * | 1999-06-16 | 2000-07-25 | The Penn State Research Foundation | Phosphorylation of phosphazenes |
WO2001070889A2 (en) * | 2000-03-22 | 2001-09-27 | Bemis Manufacturing Company | Flame-resistant-thermoset coating |
US6632872B1 (en) | 2000-09-19 | 2003-10-14 | 3M Innovative Properties Company | Adhesive compositions including self-assembling molecules, adhesives, articles, and methods |
US6534179B2 (en) * | 2001-03-27 | 2003-03-18 | International Business Machines Corporation | Halogen free triazines, bismaleimide/epoxy polymers, prepregs made therefrom for circuit boards and resin coated articles, and use |
WO2002098886A1 (fr) * | 2001-06-05 | 2002-12-12 | Chemipro Kasei Kaisha, Limited | Phosphazenes cycliques et procede d'elaboration, ignifugeants a base de tels phosphazenes, et compositions de resines et articles moules contenant ces ignifugeants |
US6577492B2 (en) * | 2001-07-10 | 2003-06-10 | 3M Innovative Properties Company | Capacitor having epoxy dielectric layer cured with aminophenylfluorenes |
US6624213B2 (en) | 2001-11-08 | 2003-09-23 | 3M Innovative Properties Company | High temperature epoxy adhesive films |
WO2004094499A1 (ja) * | 2003-04-18 | 2004-11-04 | Kaneka Corporation | 熱硬化性樹脂組成物、それを用いてなる積層体、回路基板 |
US7166651B2 (en) * | 2003-05-19 | 2007-01-23 | Kerr Corporation | Two-part self-adhering dental compositions |
SG110189A1 (en) | 2003-09-26 | 2005-04-28 | Japan Epoxy Resins Co Ltd | Epoxy compound, preparation method thereof, and use thereof |
WO2005085316A1 (ja) | 2004-03-03 | 2005-09-15 | Hitachi Chemical Co., Ltd. | 封止用エポキシ樹脂成形材料及び電子部品装置 |
US8129456B2 (en) * | 2004-09-28 | 2012-03-06 | Isola Usa Corp. | Flame retardant compositions with a phosphorated compound |
JPWO2006043460A1 (ja) | 2004-10-18 | 2008-05-22 | 旭化成ケミカルズ株式会社 | 難燃剤組成物 |
US20080006799A1 (en) * | 2006-07-06 | 2008-01-10 | Bob Fowle | Method for producing a fire retardant gel and product made thereby |
WO2008134024A2 (en) * | 2007-04-25 | 2008-11-06 | Dentsply International Inc. | Self-adhesive dental cement |
JP5510626B2 (ja) * | 2008-08-02 | 2014-06-04 | 株式会社伏見製薬所 | ヒドロキシ基含有環状ホスファゼン化合物およびその製造方法 |
CN101643570B (zh) * | 2009-08-24 | 2011-08-10 | 广东生益科技股份有限公司 | 无卤阻燃型树脂组合物及用其制成的预浸料、层压板与印制电路用层压板 |
CN101691449B (zh) * | 2009-09-04 | 2011-05-18 | 广东生益科技股份有限公司 | 提高苯氧基磷腈化合物阻燃效率的方法及其制成的预浸料、层压板与印制电路用层压板 |
JP2014047342A (ja) * | 2012-09-04 | 2014-03-17 | Fushimi Pharm Co Ltd | マイクロカプセル化難燃剤およびそれを含む難燃性樹脂組成物 |
DE102014002391A1 (de) * | 2014-02-24 | 2015-08-27 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Herstellung flammfester Formteile auf der Basis von Polyamiden und hierfür geeignete Harzzusammensetzung |
KR101940862B1 (ko) * | 2016-11-14 | 2019-04-11 | 주식회사 포스코 | 연료탱크 강판용 복합수지 조성물, 이를 이용한 복합수지코팅강판 및 그 제조방법 |
JP2017082229A (ja) * | 2016-12-21 | 2017-05-18 | 株式会社伏見製薬所 | マイクロカプセル化難燃剤およびそれを含む難燃性樹脂組成物 |
CN110785867B (zh) | 2017-04-26 | 2023-05-02 | Oti照明公司 | 用于图案化表面上覆层的方法和包括图案化覆层的装置 |
AU2018388985B2 (en) * | 2017-12-21 | 2024-03-14 | Huntsman Advanced Materials Americas Llc | Curable epoxy system |
JP2019163404A (ja) * | 2018-03-20 | 2019-09-26 | 株式会社伏見製薬所 | 難燃性樹脂組成物 |
TWI700320B (zh) * | 2018-06-13 | 2020-08-01 | 台燿科技股份有限公司 | 樹脂組合物,以及使用該組合物所製得之預浸漬片、金屬箔積層板與印刷電路板 |
WO2020075748A1 (ja) * | 2018-10-09 | 2020-04-16 | 大塚化学株式会社 | 環状ホスファゼン化合物、樹脂用難燃剤、それを含む樹脂組成物、及びその成形体 |
TWI745627B (zh) * | 2018-10-23 | 2021-11-11 | 台燿科技股份有限公司 | 熱固性樹脂組合物,使用彼所製得之預浸漬片、金屬箔積層板及印刷電路板 |
KR20220009961A (ko) | 2019-04-18 | 2022-01-25 | 오티아이 루미오닉스 인크. | 핵 생성 억제 코팅 형성용 물질 및 이를 포함하는 디바이스 |
CA3137345A1 (en) * | 2019-04-19 | 2020-11-12 | Georgia Tech Research Corporation | High impact strength bismaleimide plastics |
KR20220017918A (ko) | 2019-05-08 | 2022-02-14 | 오티아이 루미오닉스 인크. | 핵 생성 억제 코팅 형성용 물질 및 이를 포함하는 디바이스 |
TW202112969A (zh) * | 2019-07-31 | 2021-04-01 | 日商大塚化學股份有限公司 | 熱硬化性聚醯亞胺樹脂組成物及其成形體 |
JP6830586B1 (ja) * | 2020-07-22 | 2021-02-17 | 株式会社伏見製薬所 | オキサホスホリン環含有構造を有する環状ホスファゼン化合物 |
CN112358507B (zh) * | 2020-10-16 | 2021-12-21 | 华南理工大学 | 一种星型结构含氟磷腈类流动改性剂及其制备方法与应用 |
CA3240373A1 (en) | 2020-12-07 | 2022-06-16 | Michael HELANDER | Patterning a conductive deposited layer using a nucleation inhibiting coating and an underlying metallic coating |
WO2024070635A1 (ja) * | 2022-09-29 | 2024-04-04 | 東ソー株式会社 | 環状ホスファゼン化合物、樹脂用添加剤、組成物及び樹脂発泡体 |
Family Cites Families (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3356769A (en) * | 1964-07-13 | 1967-12-05 | American Cyanamid Co | Phosphonitrilic halide derivatives and adducts thereof |
FR1536946A (fr) | 1967-02-28 | 1968-09-02 | Rhodiaceta | Nouveaux composés bis maléamiques |
FR1555564A (fr) | 1967-07-13 | 1969-01-31 | Rhone Poulenc Sa | Nouvelles résines thermostables dérivées de bis-imides d'acides dicarboxyliques non saturés |
BE754723A (fr) | 1969-08-12 | 1971-02-11 | Rhone Poulenc Sa | Procede de preparation de |
US3792117A (en) * | 1971-09-15 | 1974-02-12 | Ethyl Corp | Flame resistant polyester |
US3865783A (en) | 1972-05-18 | 1975-02-11 | Akzona Inc | Flame-retardant polyester |
DE2254128C3 (de) * | 1972-11-04 | 1975-08-14 | Chemische Werke Huels Ag, 4370 Marl | Thermoplastische Formmasse aus Polybuten-I |
US3859249A (en) * | 1972-12-07 | 1975-01-07 | Akzona Inc | Process for manufacture of flame retardant polyester |
US3920616A (en) * | 1974-06-19 | 1975-11-18 | Us Navy | Alkoxy derivatives of hexachlorophosphonitrile chloride |
US4079035A (en) * | 1974-11-21 | 1978-03-14 | Ethyl Corporation | Halophenoxyphosphazene fire retardants and polyesters containing same |
US3996312A (en) * | 1974-11-21 | 1976-12-07 | Ethyl Corporation | Halophenoxyphosphazene fire retardants |
US4029634A (en) * | 1975-05-02 | 1977-06-14 | E. I. Du Pont De Nemours And Company | Flame retardant polymeric compositions containing halogen substituted hexakis-(substituted phenoxy)cyclotriphosphazene |
CH615935A5 (de) | 1975-06-19 | 1980-02-29 | Ciba Geigy Ag | |
JPS5426846A (en) * | 1977-08-02 | 1979-02-28 | Armstrong Cork Co | Phosphazen plasticizing organic polymer blend and foam |
US4551488A (en) * | 1979-12-14 | 1985-11-05 | Kollmorgen Technologies Corporation | Epoxy resin based protective coating composition for printed circuit boards |
US4468497A (en) | 1981-03-30 | 1984-08-28 | Hitco | Elastomer modified bis-maleimide resin |
US4405738A (en) | 1982-03-05 | 1983-09-20 | Akzona Incorporated | Flame retardant additives and flame retardant polyester compositions |
JPS59157163A (ja) | 1983-02-25 | 1984-09-06 | Taoka Chem Co Ltd | α−シアノアクリレ−ト系接着剤 |
US4853286A (en) * | 1984-05-29 | 1989-08-01 | Mitsui Toatsu Chemicals, Incorporated | Wafer processing film |
JPS61120850A (ja) * | 1984-11-16 | 1986-06-07 | Hitachi Ltd | 半導体素子封止用樹脂組成物 |
US4567229A (en) * | 1984-12-18 | 1986-01-28 | Ethyl Corporation | Aryloxy-alkoxy substituted polyphosphazenes |
JPS61190522A (ja) * | 1985-02-19 | 1986-08-25 | Nitto Kasei Kk | 硬化性エポキシ樹脂組成物 |
JP2706767B2 (ja) * | 1985-03-14 | 1998-01-28 | 富士通株式会社 | 作業用ロボット |
US4576806A (en) | 1985-03-29 | 1986-03-18 | Ethyl Corporation | Removal of salt from polyphosphazene |
US4684678A (en) * | 1985-05-30 | 1987-08-04 | Minnesota Mining And Manufacturing Company | Epoxy resin curing agent, process, and composition |
US4614788A (en) * | 1985-08-28 | 1986-09-30 | The Dow Chemical Company | Thermosettable epoxy resin composition |
US4820797A (en) | 1985-10-01 | 1989-04-11 | The Dow Chemical Company | Cyanate functional maleimide thermosetting composition |
US4769440A (en) | 1985-10-01 | 1988-09-06 | The Dow Chemical Company | Cyanate functional maleimide aromatic polycyanate thermosetting composition |
US4608434A (en) | 1985-10-21 | 1986-08-26 | Celanese Corporation | Metal carboxylate/alcohol curing catalyst for polycyanate ester of polyhydric phenol |
JPS62105453A (ja) * | 1985-11-01 | 1987-05-15 | Hitachi Ltd | 半導体装置 |
US4946734A (en) * | 1986-11-21 | 1990-08-07 | Hitachi, Ltd. | Resin composition for printed circuit board and such board formed by use thereof |
US4946908A (en) | 1987-07-15 | 1990-08-07 | Hercules Incorporated | Bismaleimide compositions containing high glass transition temperature and soluble reactive oligomers and composites prepared therefrom |
IT1228923B (it) * | 1987-08-04 | 1991-07-10 | Vamp Srl | Composizione ritardante di fiamma per polimeri e prodotti polimerici autoestinguenti cosi' ottenuti. |
US4882370A (en) | 1988-01-27 | 1989-11-21 | Minnesota Mining And Manufacturing Company | Fiber reinforced composites with improved glass transition temperatures |
JPH01207986A (ja) * | 1988-02-16 | 1989-08-21 | Idemitsu Petrochem Co Ltd | プリント配線基板用複合材 |
JPH0320325A (ja) * | 1989-06-15 | 1991-01-29 | Maruzen Petrochem Co Ltd | 熱硬化性樹脂組成物 |
KR920702018A (ko) * | 1989-08-01 | 1992-08-12 | 미시마 마사요시 | 웨이퍼 가공용 필름 |
US5158999A (en) | 1990-08-13 | 1992-10-27 | Minnesota Mining And Manufacturing Company | Flame retardants |
JPH04154854A (ja) * | 1990-10-18 | 1992-05-27 | Toyoda Gosei Co Ltd | ポリプロピレン樹脂組成物 |
US5225643A (en) | 1992-03-17 | 1993-07-06 | Morton International, Inc. | Differential pressure switch for stored gas pressure vessel |
JPH06104714A (ja) * | 1992-09-21 | 1994-04-15 | Mitsubishi Electric Corp | 半導体集積回路の出力回路 |
-
1995
- 1995-10-02 JP JP25528695A patent/JP3821870B2/ja not_active Expired - Lifetime
- 1995-10-05 EP EP95402219A patent/EP0708141B1/de not_active Expired - Lifetime
- 1995-10-05 DE DE69510518T patent/DE69510518T2/de not_active Expired - Lifetime
-
1996
- 1996-02-08 US US08/598,664 patent/US5652285A/en not_active Expired - Lifetime
- 1996-02-08 US US08/597,428 patent/US5639808A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0708141B1 (de) | 1999-06-30 |
JPH08225714A (ja) | 1996-09-03 |
JP3821870B2 (ja) | 2006-09-13 |
US5652285A (en) | 1997-07-29 |
EP0708141A3 (de) | 1997-03-05 |
US5639808A (en) | 1997-06-17 |
EP0708141A2 (de) | 1996-04-24 |
DE69510518T2 (de) | 2000-03-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |