DE69508379D1 - Zusammenbau einer hochintegrierten schaltung, der leiter eines leiterrahmens mit leitenden bahnen verbindet - Google Patents

Zusammenbau einer hochintegrierten schaltung, der leiter eines leiterrahmens mit leitenden bahnen verbindet

Info

Publication number
DE69508379D1
DE69508379D1 DE69508379T DE69508379T DE69508379D1 DE 69508379 D1 DE69508379 D1 DE 69508379D1 DE 69508379 T DE69508379 T DE 69508379T DE 69508379 T DE69508379 T DE 69508379T DE 69508379 D1 DE69508379 D1 DE 69508379D1
Authority
DE
Germany
Prior art keywords
lead
assembling
integrated circuit
highly integrated
circuit connecting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69508379T
Other languages
English (en)
Other versions
DE69508379T2 (de
Inventor
Satya Chillara
Shahram Mostafazadeh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
National Semiconductor Corp
Original Assignee
National Semiconductor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by National Semiconductor Corp filed Critical National Semiconductor Corp
Application granted granted Critical
Publication of DE69508379D1 publication Critical patent/DE69508379D1/de
Publication of DE69508379T2 publication Critical patent/DE69508379T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
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    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/4985—Flexible insulating substrates
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    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49861—Lead-frames fixed on or encapsulated in insulating substrates
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    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
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    • H01L2924/19101—Disposition of discrete passive components
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10659—Different types of terminals for the same component, e.g. solder balls combined with leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
DE69508379T 1994-09-16 1995-09-15 Zusammenbau einer hochintegrierten schaltung, der leiter eines leiterrahmens mit leitenden bahnen verbindet Expired - Fee Related DE69508379T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/307,270 US5442230A (en) 1994-09-16 1994-09-16 High density integrated circuit assembly combining leadframe leads with conductive traces
PCT/US1995/011691 WO1996008841A1 (en) 1994-09-16 1995-09-15 A high density integrated circuit assembly combining leadframe leads with conductive traces

Publications (2)

Publication Number Publication Date
DE69508379D1 true DE69508379D1 (de) 1999-04-22
DE69508379T2 DE69508379T2 (de) 1999-11-04

Family

ID=23188986

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69508379T Expired - Fee Related DE69508379T2 (de) 1994-09-16 1995-09-15 Zusammenbau einer hochintegrierten schaltung, der leiter eines leiterrahmens mit leitenden bahnen verbindet

Country Status (5)

Country Link
US (1) US5442230A (de)
EP (1) EP0729645B1 (de)
KR (1) KR100360077B1 (de)
DE (1) DE69508379T2 (de)
WO (1) WO1996008841A1 (de)

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Publication number Priority date Publication date Assignee Title
US5808357A (en) * 1992-06-02 1998-09-15 Fujitsu Limited Semiconductor device having resin encapsulated package structure
US5569955A (en) * 1994-09-16 1996-10-29 National Semiconductor Corporation High density integrated circuit assembly combining leadframe leads with conductive traces
US5581122A (en) * 1994-10-25 1996-12-03 Industrial Technology Research Institute Packaging assembly with consolidated common voltage connections for integrated circuits
US5705851A (en) * 1995-06-28 1998-01-06 National Semiconductor Corporation Thermal ball lead integrated package
JP3123638B2 (ja) * 1995-09-25 2001-01-15 株式会社三井ハイテック 半導体装置
US5739581A (en) * 1995-11-17 1998-04-14 National Semiconductor Corporation High density integrated circuit package assembly with a heatsink between stacked dies
US6734545B1 (en) 1995-11-29 2004-05-11 Hitachi, Ltd. BGA type semiconductor device and electronic equipment using the same
JP3294490B2 (ja) * 1995-11-29 2002-06-24 株式会社日立製作所 Ｂｇａ型半導体装置
KR970053688A (ko) * 1995-12-30 1997-07-31 황인길 솔더볼과 리드를 입출력 단자로 사용하는 반도체 패키지
US5854512A (en) * 1996-09-20 1998-12-29 Vlsi Technology, Inc. High density leaded ball-grid array package
JPH10270623A (ja) * 1997-03-24 1998-10-09 Sumitomo Metal Mining Co Ltd ボールグリッドアレイ用リードフレームおよびこれを用いた半導体装置、並びにその製造方法
JP3570858B2 (ja) * 1997-07-03 2004-09-29 株式会社ルネサステクノロジ リードフレーム先端配置設計方法
KR100290784B1 (ko) 1998-09-15 2001-07-12 박종섭 스택 패키지 및 그 제조방법
WO2002009181A1 (en) * 2000-07-20 2002-01-31 Vertical Circuits, Inc. Vertically integrated chip on chip circuit stack
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DE69508379T2 (de) 1999-11-04
KR100360077B1 (ko) 2003-01-15
EP0729645A1 (de) 1996-09-04
WO1996008841A1 (en) 1996-03-21
KR960706193A (ko) 1996-11-08
EP0729645B1 (de) 1999-03-17
US5442230A (en) 1995-08-15

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