DE69401689D1 - Behandlungsvorrichtung und deren Verwendung im Herstellungsverfahren von Bauelementen - Google Patents

Behandlungsvorrichtung und deren Verwendung im Herstellungsverfahren von Bauelementen

Info

Publication number
DE69401689D1
DE69401689D1 DE69401689T DE69401689T DE69401689D1 DE 69401689 D1 DE69401689 D1 DE 69401689D1 DE 69401689 T DE69401689 T DE 69401689T DE 69401689 T DE69401689 T DE 69401689T DE 69401689 D1 DE69401689 D1 DE 69401689D1
Authority
DE
Germany
Prior art keywords
components
manufacturing process
treatment device
treatment
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69401689T
Other languages
English (en)
Other versions
DE69401689T2 (de
Inventor
Takayuki Hasegawa
Yutaka Tanaka
Hidehiko Fujioka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Application granted granted Critical
Publication of DE69401689D1 publication Critical patent/DE69401689D1/de
Publication of DE69401689T2 publication Critical patent/DE69401689T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Epidemiology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Public Health (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Physical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
DE69401689T 1993-07-21 1994-07-20 Behandlungsvorrichtung und deren Verwendung im Herstellungsverfahren von Bauelementen Expired - Lifetime DE69401689T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP18035393 1993-07-21
JP18035693 1993-07-21
JP10100694A JP3200282B2 (ja) 1993-07-21 1994-05-16 処理システム及びこれを用いたデバイス製造方法

Publications (2)

Publication Number Publication Date
DE69401689D1 true DE69401689D1 (de) 1997-03-20
DE69401689T2 DE69401689T2 (de) 1997-06-19

Family

ID=27309366

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69401689T Expired - Lifetime DE69401689T2 (de) 1993-07-21 1994-07-20 Behandlungsvorrichtung und deren Verwendung im Herstellungsverfahren von Bauelementen

Country Status (4)

Country Link
US (3) US5746562A (de)
EP (1) EP0635873B1 (de)
JP (1) JP3200282B2 (de)
DE (1) DE69401689T2 (de)

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* Cited by examiner, † Cited by third party
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JP3200282B2 (ja) * 1993-07-21 2001-08-20 キヤノン株式会社 処理システム及びこれを用いたデバイス製造方法
US5904611A (en) * 1996-05-10 1999-05-18 Canon Kabushiki Kaisha Precision polishing apparatus
US5931626A (en) * 1998-01-16 1999-08-03 Brooks Automation Inc. Robot mounting de-coupling technique
TW559688B (en) 1999-04-19 2003-11-01 Asml Netherlands Bv Lithographic projection apparatus, vacuum apparatus, low-stiffness seal for sealing between vacuum chamber wall and elongate rod, device manufacturing method and integrated circuit manufactured thereof
US6961113B1 (en) * 1999-05-28 2005-11-01 Nikon Corporation Exposure method and apparatus
US8348583B2 (en) * 1999-10-19 2013-01-08 Rorze Corporation Container and loader for substrate
JP2002057100A (ja) * 2000-05-31 2002-02-22 Canon Inc 露光装置、コートデベロップ装置、デバイス製造システム、デバイス製造方法、半導体製造工場および露光装置の保守方法
US6496248B2 (en) * 2000-12-15 2002-12-17 Nikon Corporation Stage device and exposure apparatus and method
US6793766B2 (en) * 2001-01-04 2004-09-21 Applied Materials Inc. Apparatus having platforms positioned for precise centering of semiconductor wafers during processing
US6570644B2 (en) * 2001-06-05 2003-05-27 Nikon Corporation Connection assembly of wafer stage chamber
US20040096300A1 (en) * 2001-06-30 2004-05-20 Ilya Perlov Loadlock chamber
JP3926255B2 (ja) * 2002-11-28 2007-06-06 藤倉ゴム工業株式会社 除振台
JP4156938B2 (ja) * 2003-01-28 2008-09-24 京セラ株式会社 真空チャンバ装置と真空ステージ装置
JP2004282002A (ja) * 2003-02-27 2004-10-07 Tokyo Electron Ltd 基板処理装置及び基板処理方法
JP2005114083A (ja) * 2003-10-09 2005-04-28 Ebara Corp 真空チャンバの除振システム
JP2005142372A (ja) * 2003-11-06 2005-06-02 Tokyo Electron Ltd 基板処理装置及び基板処理方法
JP4564742B2 (ja) 2003-12-03 2010-10-20 キヤノン株式会社 露光装置及びデバイス製造方法
US7078708B2 (en) * 2003-12-24 2006-07-18 Asml Netherlands B.V. Lithographic apparatus and method of manufacturing a device and method of performing maintenance
US7384228B2 (en) * 2004-05-24 2008-06-10 Asml Netherlands B.V. Insertion device, lithographic apparatus with said insertion device and device manufacturing method
JP2006261212A (ja) * 2005-03-15 2006-09-28 Nikon Corp 露光装置
JP2007230739A (ja) * 2006-03-02 2007-09-13 Asyst Shinko Inc ストッカ
US20090206229A1 (en) * 2008-02-15 2009-08-20 Ivan Nesch Dual vibration isolation apparatus
JP5315100B2 (ja) * 2009-03-18 2013-10-16 株式会社ニューフレアテクノロジー 描画装置
JP5783811B2 (ja) * 2010-07-06 2015-09-24 キヤノン株式会社 成膜装置
US20120069317A1 (en) * 2010-09-20 2012-03-22 Jerry Peijster Lithography system arranged on a foundation, and method for arranging a lithography system on said foundation
DE102010048043A1 (de) * 2010-10-15 2012-04-19 Ev Group Gmbh Vorrichtung und Verfahren zur Prozessierung von Wafern
CN103797420A (zh) 2011-09-12 2014-05-14 迈普尔平版印刷Ip有限公司 具有基底板的真空腔室
US9164399B2 (en) * 2012-01-10 2015-10-20 Hermes-Microvision, Inc. Reticle operation system
JP6087573B2 (ja) * 2012-10-23 2017-03-01 キヤノン株式会社 処理装置、それを用いた物品の製造方法
KR101962472B1 (ko) * 2018-06-18 2019-03-26 주식회사 삼화테크 공정챔버의 연결구조

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JPS549584A (en) * 1977-06-23 1979-01-24 Nec Corp X-ray exposure device
US4363217A (en) * 1981-01-29 1982-12-14 Venuti Guy S Vibration damping apparatus
US4394819A (en) * 1982-08-16 1983-07-26 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Vibration isolation and pressure compensation apparatus for sensitive instrumentation
US4764076A (en) * 1986-04-17 1988-08-16 Varian Associates, Inc. Valve incorporating wafer handling arm
CA1331163C (en) * 1986-04-18 1994-08-02 Applied Materials, Inc. Multiple-processing and contamination-free plasma etching system
JPS6380531A (ja) * 1986-09-24 1988-04-11 Mitsubishi Electric Corp Ｘ線リソグラフイ装置
JP2523558B2 (ja) * 1986-12-26 1996-08-14 株式会社日立製作所 処理方法
US4827736A (en) * 1988-07-06 1989-05-09 Daikin Industries, Ltd. Cryogenic refrigeration system for cooling a specimen
DE3921824A1 (de) * 1988-07-11 1990-04-19 Takenaka Corp Daempfungssockel
JP2774527B2 (ja) * 1988-09-30 1998-07-09 キヤノン株式会社 減圧装置
DE68922798T2 (de) * 1988-08-02 1995-11-16 Canon Kk Montierverfahren.
US4959964A (en) * 1988-09-16 1990-10-02 Hitachi, Ltd. Cryostat with refrigerator containing superconductive magnet
JP2728898B2 (ja) * 1988-10-05 1998-03-18 キヤノン株式会社 露光装置
JPH02301126A (ja) * 1989-05-15 1990-12-13 Nec Corp Ｘ線露光装置
JPH0739028B2 (ja) * 1989-06-30 1995-05-01 松下電器産業株式会社 雰囲気炉
EP0447175B1 (de) * 1990-03-13 1997-11-19 Canon Kabushiki Kaisha Belichtungsanordnung mittels Synchrotronstrahlung
US5195113A (en) * 1990-09-28 1993-03-16 Kabushiki Kaisha Toshiba X-ray exposure apparatus and method of positioning the same
JPH04136944A (ja) * 1990-09-28 1992-05-11 Toshiba Corp Ｘ線露光装置
GB2249189B (en) * 1990-10-05 1994-07-27 Canon Kk Exposure apparatus
JP3182158B2 (ja) * 1991-02-25 2001-07-03 キヤノン株式会社 露光装置用のステージ支持装置
US5105557A (en) * 1991-03-11 1992-04-21 Vadasz Jozsef T System for rapidly drying parts
US5154730A (en) * 1991-05-17 1992-10-13 Materials Research Corporation Semiconductor wafer processing module having an inclined rotating wafer handling turret and a method of using the module
EP0540178B1 (de) * 1991-09-30 1998-05-06 Canon Kabushiki Kaisha Röntgenbelichtungsvorrichtung und Verfahren
JP3135315B2 (ja) * 1991-09-30 2001-02-13 キヤノン株式会社 Ｓｒ−ｘ線ミラーの位置決め装置
JP2646414B2 (ja) * 1992-02-21 1997-08-27 キヤノン株式会社 半導体製造装置
JPH0694900A (ja) * 1992-09-10 1994-04-08 Olympus Optical Co Ltd 真空光学系
JP3200282B2 (ja) * 1993-07-21 2001-08-20 キヤノン株式会社 処理システム及びこれを用いたデバイス製造方法
US5643366A (en) * 1994-01-31 1997-07-01 Applied Materials, Inc. Wafer handling within a vacuum chamber using vacuum
US5895549A (en) * 1994-07-11 1999-04-20 Applied Komatsu Technology, Inc. Method and apparatus for etching film layers on large substrates

Also Published As

Publication number Publication date
US6809799B2 (en) 2004-10-26
US5746562A (en) 1998-05-05
EP0635873B1 (de) 1997-02-05
DE69401689T2 (de) 1997-06-19
JPH0786156A (ja) 1995-03-31
US20020061245A1 (en) 2002-05-23
JP3200282B2 (ja) 2001-08-20
US6406245B2 (en) 2002-06-18
US20010041119A1 (en) 2001-11-15
EP0635873A1 (de) 1995-01-25

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Legal Events

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