DE69401040T2 - Gehäusestruktur für Mikrowellenschaltung - Google Patents

Gehäusestruktur für Mikrowellenschaltung

Info

Publication number
DE69401040T2
DE69401040T2 DE69401040T DE69401040T DE69401040T2 DE 69401040 T2 DE69401040 T2 DE 69401040T2 DE 69401040 T DE69401040 T DE 69401040T DE 69401040 T DE69401040 T DE 69401040T DE 69401040 T2 DE69401040 T2 DE 69401040T2
Authority
DE
Germany
Prior art keywords
heat
ground conductor
circuit
circuit module
arrangement according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69401040T
Other languages
German (de)
English (en)
Other versions
DE69401040D1 (de
Inventor
Yuhei Kosugi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Application granted granted Critical
Publication of DE69401040D1 publication Critical patent/DE69401040D1/de
Publication of DE69401040T2 publication Critical patent/DE69401040T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/2049—Pressing means used to urge contact, e.g. springs
    • H10W40/77—
    • H10W44/20—
    • H10W72/07251—
    • H10W72/20—
    • H10W72/877—
    • H10W72/884—
    • H10W90/724—
    • H10W90/734—
    • H10W90/736—
    • H10W90/754—

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
DE69401040T 1993-07-12 1994-07-09 Gehäusestruktur für Mikrowellenschaltung Expired - Fee Related DE69401040T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17172593 1993-07-12

Publications (2)

Publication Number Publication Date
DE69401040D1 DE69401040D1 (de) 1997-01-16
DE69401040T2 true DE69401040T2 (de) 1997-06-05

Family

ID=15928522

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69401040T Expired - Fee Related DE69401040T2 (de) 1993-07-12 1994-07-09 Gehäusestruktur für Mikrowellenschaltung

Country Status (7)

Country Link
US (1) US5500556A (enExample)
EP (1) EP0634890B1 (enExample)
CN (1) CN1047717C (enExample)
AU (1) AU676324B2 (enExample)
CA (1) CA2127736C (enExample)
DE (1) DE69401040T2 (enExample)
TW (1) TW256982B (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10343429B4 (de) * 2002-10-14 2007-08-16 Heidelberger Druckmaschinen Ag Anordnung zum Kühlen eines auf einer Leiterplatte angeordneten elektrischen Bauelementes
DE102007052593B4 (de) * 2007-01-09 2011-02-03 Sew-Eurodrive Gmbh & Co. Kg Kühlanordnung und elektrisches Gerät mit einer solchen
DE102014220127A1 (de) * 2014-10-06 2016-04-07 Robert Bosch Gmbh Halbleiteranordnung mit einer Wärmesenke und einem Andruckelement
EP4043154A1 (de) * 2021-02-16 2022-08-17 Hilti Aktiengesellschaft Vorspanneinrichtung für eine platine
WO2023083823A1 (de) * 2021-11-09 2023-05-19 Rolls-Royce Deutschland Ltd & Co Kg Leiterplattenanordnung
WO2024037945A1 (en) * 2022-08-16 2024-02-22 Valeo Equipements Electriques Moteur An elastic member for electric power converter

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CA2130498C (en) * 1993-08-26 2000-02-22 Yoshiyuki Imanaka Ink jet recording head and recording apparatus using same
JPH0846098A (ja) * 1994-07-22 1996-02-16 Internatl Business Mach Corp <Ibm> 直接的熱伝導路を形成する装置および方法
US5517753A (en) * 1995-04-06 1996-05-21 International Business Machines Corporation Adjustable spacer for flat plate cooling applications
US5892245A (en) * 1996-11-11 1999-04-06 Emulation Technology, Inc. Ball grid array package emulator
FR2758908B1 (fr) * 1997-01-24 1999-04-16 Thomson Csf Boitier d'encapsulation hyperfrequences bas cout
US6075703A (en) * 1997-03-26 2000-06-13 Samsung Electronics Co., Ltd. Heat sink assembly
DE19752797A1 (de) * 1997-11-28 1999-06-10 Bosch Gmbh Robert Kühlvorrichtung für ein auf einer Leiterplatte angeordnetes, wärmeerzeugendes Bauelement
US5965937A (en) * 1997-12-15 1999-10-12 Intel Corporation Thermal interface attach mechanism for electrical packages
US5920120A (en) * 1997-12-19 1999-07-06 Intel Corporation Assembly for dissipatating heat from a semiconductor chip wherein a stress on the semiconductor chip due to a thermally conductive member is partially relieved
FR2773942B1 (fr) * 1998-01-19 2000-04-21 Ferraz Composant electronique de puissance et son procede de fabrication
US6703640B1 (en) * 1998-01-20 2004-03-09 Micron Technology, Inc. Spring element for use in an apparatus for attaching to a semiconductor and a method of attaching
US6456100B1 (en) 1998-01-20 2002-09-24 Micron Technology, Inc. Apparatus for attaching to a semiconductor
JP3496752B2 (ja) 1998-02-19 2004-02-16 シャープ株式会社 マイクロ波・ミリ波装置
JP3609935B2 (ja) * 1998-03-10 2005-01-12 シャープ株式会社 高周波半導体装置
FR2776435B1 (fr) * 1998-03-19 2000-04-28 Alsthom Cge Alcatel Amplificateur a grand gain
US5912804A (en) * 1998-05-08 1999-06-15 Schumacher Electric Corporation Diode holder with spring clamped heat sink
US6566879B1 (en) * 2000-02-29 2003-05-20 Koninklijke Philips Electronics, N.V. Apparatus for effecting heat transfer from power semiconductors
JP4060510B2 (ja) * 2000-03-02 2008-03-12 カルソニックカンセイ株式会社 パワー素子の放熱部材への取付構造
US6903541B2 (en) * 2001-05-25 2005-06-07 Tyco Electronics Corporation Film-based microwave and millimeter-wave circuits and sensors
US6700195B1 (en) * 2003-03-26 2004-03-02 Delphi Technologies, Inc. Electronic assembly for removing heat from a flip chip
GB0308305D0 (en) * 2003-04-10 2003-05-14 Hewlett Packard Development Co Digital message encryption and authentication
US7068510B2 (en) * 2003-12-04 2006-06-27 International Business Machines Corporation Dissipating heat reliably in computer systems
WO2010050972A1 (en) * 2008-10-31 2010-05-06 Hewlett-Packard Development Company, L.P. Assembly-supporting spring between rigid connectors
EP2440005B1 (de) * 2010-10-08 2015-12-23 Eberspächer catem GmbH & Co. KG Elektrische Heizvorrichtung und Verfahren zur Herstellung
US8355255B2 (en) * 2010-12-22 2013-01-15 Raytheon Company Cooling of coplanar active circuits
US8363411B2 (en) 2011-03-18 2013-01-29 Eldon Technology Limited Passive, low-profile heat transferring system
US8619427B2 (en) 2011-03-21 2013-12-31 Eldon Technology Limited Media content device chassis with internal extension members
US8681495B2 (en) 2011-03-29 2014-03-25 Eldon Technology Limited Media device having a piezoelectric fan
US9629282B2 (en) * 2011-06-10 2017-04-18 Nec Corporation Electronic device, structure, and heat sink
US8866291B2 (en) * 2012-02-10 2014-10-21 Raytheon Company Flip-chip mounted microstrip monolithic microwave integrated circuits (MMICs)
DE102012218932A1 (de) * 2012-10-17 2014-04-17 Robert Bosch Gmbh Elektronisches Bauteil zur Entwärmung von Slug-up-Komponenten
JP5686127B2 (ja) * 2012-11-16 2015-03-18 日立金属株式会社 信号伝送装置
US9049811B2 (en) * 2012-11-29 2015-06-02 Bose Corporation Circuit cooling
US20140254100A1 (en) * 2013-03-07 2014-09-11 Barracuda Networks, Inc Cooling Apparatus for Fanless Desktop Enclosure of an Elastomericly Suspended Circuit Board
CN103779313B (zh) * 2014-01-24 2017-02-01 嘉兴斯达微电子有限公司 一种带电极压力装置的功率半导体模块
US9698041B2 (en) 2014-06-09 2017-07-04 Applied Materials, Inc. Substrate temperature control apparatus including optical fiber heating, substrate temperature control systems, electronic device processing systems, and methods
CN106471609B (zh) * 2014-07-02 2019-10-15 应用材料公司 用于使用嵌入光纤光学器件及环氧树脂光学散射器的基板温度控制的装置、系统与方法
US9986598B2 (en) 2014-07-02 2018-05-29 Applied Materials, Inc. Temperature control apparatus including groove-routed optical fiber heating, substrate temperature control systems, electronic device processing systems, and processing methods
JP6421491B2 (ja) * 2014-08-13 2018-11-14 富士通株式会社 電子機器
JP6373130B2 (ja) * 2014-09-01 2018-08-15 株式会社エンプラス 電気部品用ソケット
EP2999320A1 (de) * 2014-09-19 2016-03-23 Pentair Technical Solutions GmbH Vorrichtung zur Übertragung von Wärme
GB2543549B (en) * 2015-10-21 2020-04-15 Andor Tech Limited Thermoelectric Heat pump system
WO2017098741A1 (ja) * 2015-12-07 2017-06-15 三菱電機株式会社 マイクロ波モジュール
US10356948B2 (en) * 2015-12-31 2019-07-16 DISH Technologies L.L.C. Self-adjustable heat spreader system for set-top box assemblies
US10973088B2 (en) 2016-04-18 2021-04-06 Applied Materials, Inc. Optically heated substrate support assembly with removable optical fibers
EP3583692B1 (de) * 2017-02-20 2021-04-07 Sew-Eurodrive GmbH & Co. KG Elektronische anordnung mit leistungsmodul, leiterplatte und kühlkörper
WO2020037467A1 (zh) * 2018-08-20 2020-02-27 海能达通信股份有限公司 散热组件及电子设备
US10966008B1 (en) * 2020-01-13 2021-03-30 Bose Corporation Electronic device with force element
CN113257759A (zh) * 2020-02-10 2021-08-13 华为技术有限公司 散热器、单板、电子设备及制造方法
TWI718873B (zh) * 2020-02-18 2021-02-11 四零四科技股份有限公司 具有可活動導熱組件的電子裝置及其相關的散熱模組
CN114567960B (zh) * 2020-11-27 2024-06-11 华为技术有限公司 具有浮动支撑结构的电子设备
CN118175804A (zh) * 2020-12-15 2024-06-11 华为技术有限公司 电子设备
US11908766B2 (en) 2021-04-05 2024-02-20 Jmj Korea Co., Ltd. Cooling system where semiconductor component comprising semiconductor chip and cooling apparatus are joined
KR102569184B1 (ko) * 2021-06-11 2023-08-23 제엠제코(주) 반도체칩을 구비한 반도체 부품과 쿨링장치가 결합된 쿨링시스템
CN113453418A (zh) * 2021-06-28 2021-09-28 浙江挚领科技有限公司 导热装置及其制造方法

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JPS6021611A (ja) * 1983-07-15 1985-02-04 Matsushita Electric Ind Co Ltd マイクロ波電力増幅モジユ−ル
JPS6064503A (ja) * 1983-09-19 1985-04-13 Matsushita Electric Ind Co Ltd マイクロ波回路
JPS60160149A (ja) * 1984-01-26 1985-08-21 Fujitsu Ltd 集積回路装置の冷却方式
JPS6174356A (ja) * 1984-09-19 1986-04-16 Hitachi Comput Eng Corp Ltd 半導体装置
US5345107A (en) * 1989-09-25 1994-09-06 Hitachi, Ltd. Cooling apparatus for electronic device
US5065280A (en) * 1990-08-30 1991-11-12 Hewlett-Packard Company Flex interconnect module
EP0532244B1 (en) * 1991-09-13 1996-12-18 Fuji Electric Co. Ltd. Semiconductor device
KR100485801B1 (ko) * 2002-03-07 2005-04-28 삼성전자주식회사 서로 다른 사설망에 존재하는 네트워크장치들 간의직접접속을 제공하는 망접속장치 및 방법

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10343429B4 (de) * 2002-10-14 2007-08-16 Heidelberger Druckmaschinen Ag Anordnung zum Kühlen eines auf einer Leiterplatte angeordneten elektrischen Bauelementes
DE102007052593B4 (de) * 2007-01-09 2011-02-03 Sew-Eurodrive Gmbh & Co. Kg Kühlanordnung und elektrisches Gerät mit einer solchen
DE102014220127A1 (de) * 2014-10-06 2016-04-07 Robert Bosch Gmbh Halbleiteranordnung mit einer Wärmesenke und einem Andruckelement
EP4043154A1 (de) * 2021-02-16 2022-08-17 Hilti Aktiengesellschaft Vorspanneinrichtung für eine platine
WO2022174946A1 (de) * 2021-02-16 2022-08-25 Hilti Aktiengesellschaft Vorspanneinrichtung für eine platine
WO2023083823A1 (de) * 2021-11-09 2023-05-19 Rolls-Royce Deutschland Ltd & Co Kg Leiterplattenanordnung
WO2024037945A1 (en) * 2022-08-16 2024-02-22 Valeo Equipements Electriques Moteur An elastic member for electric power converter
FR3138977A1 (fr) * 2022-08-16 2024-02-23 VALEO EQUIPEMENTS ELECTRIQUES MOTEUR - Sce PI Un élément élastique pour convertisseur de puissance électrique

Also Published As

Publication number Publication date
CN1109258A (zh) 1995-09-27
AU676324B2 (en) 1997-03-06
US5500556A (en) 1996-03-19
CA2127736A1 (en) 1995-01-13
EP0634890A1 (en) 1995-01-18
AU6738194A (en) 1995-01-19
CA2127736C (en) 1999-03-23
TW256982B (enExample) 1995-09-11
EP0634890B1 (en) 1996-12-04
DE69401040D1 (de) 1997-01-16
CN1047717C (zh) 1999-12-22

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee