DE3852291T2 - Automatische Bandmontagen-Packung für einen Halbleiterchip mit Entkupplung. - Google Patents
Automatische Bandmontagen-Packung für einen Halbleiterchip mit Entkupplung.Info
- Publication number
- DE3852291T2 DE3852291T2 DE3852291T DE3852291T DE3852291T2 DE 3852291 T2 DE3852291 T2 DE 3852291T2 DE 3852291 T DE3852291 T DE 3852291T DE 3852291 T DE3852291 T DE 3852291T DE 3852291 T2 DE3852291 T2 DE 3852291T2
- Authority
- DE
- Germany
- Prior art keywords
- decoupling
- semiconductor chip
- tape assembly
- automatic tape
- assembly package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/642—Capacitive arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12044—OLED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US07/145,808 US4903113A (en) | 1988-01-15 | 1988-01-15 | Enhanced tab package |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3852291D1 DE3852291D1 (de) | 1995-01-12 |
DE3852291T2 true DE3852291T2 (de) | 1995-05-24 |
Family
ID=22514647
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3852291T Expired - Fee Related DE3852291T2 (de) | 1988-01-15 | 1988-12-13 | Automatische Bandmontagen-Packung für einen Halbleiterchip mit Entkupplung. |
Country Status (4)
Country | Link |
---|---|
US (1) | US4903113A (de) |
EP (1) | EP0324244B1 (de) |
JP (1) | JPH01181540A (de) |
DE (1) | DE3852291T2 (de) |
Families Citing this family (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5068712A (en) * | 1988-09-20 | 1991-11-26 | Hitachi, Ltd. | Semiconductor device |
US5072283A (en) * | 1988-04-12 | 1991-12-10 | Bolger Justin C | Pre-formed chip carrier cavity package |
US5687109A (en) * | 1988-05-31 | 1997-11-11 | Micron Technology, Inc. | Integrated circuit module having on-chip surge capacitors |
US5640762A (en) | 1988-09-30 | 1997-06-24 | Micron Technology, Inc. | Method and apparatus for manufacturing known good semiconductor die |
US4992850A (en) * | 1989-02-15 | 1991-02-12 | Micron Technology, Inc. | Directly bonded simm module |
USRE36325E (en) * | 1988-09-30 | 1999-10-05 | Micron Technology, Inc. | Directly bonded SIMM module |
US5121053A (en) * | 1988-10-11 | 1992-06-09 | Hewlett-Packard Company | Tab frame and process of testing same |
US4992849A (en) * | 1989-02-15 | 1991-02-12 | Micron Technology, Inc. | Directly bonded board multiple integrated circuit module |
US5255156A (en) * | 1989-02-22 | 1993-10-19 | The Boeing Company | Bonding pad interconnection on a multiple chip module having minimum channel width |
US5459634A (en) * | 1989-05-15 | 1995-10-17 | Rogers Corporation | Area array interconnect device and method of manufacture thereof |
JPH0336614A (ja) * | 1989-07-03 | 1991-02-18 | Mitsumi Electric Co Ltd | 回路モジュール |
JP2751450B2 (ja) * | 1989-08-28 | 1998-05-18 | セイコーエプソン株式会社 | テープキャリアの実装構造及びその実装方法 |
US5053922A (en) * | 1989-08-31 | 1991-10-01 | Hewlett-Packard Company | Demountable tape-automated bonding system |
US5142444A (en) * | 1989-08-31 | 1992-08-25 | Hewlett-Packard Company | Demountable tape-automated bonding system |
US5156983A (en) * | 1989-10-26 | 1992-10-20 | Digtial Equipment Corporation | Method of manufacturing tape automated bonding semiconductor package |
US5006963A (en) * | 1989-12-18 | 1991-04-09 | Mcdonnell Douglas Corporation | Selectable chip carrier |
US5200642A (en) * | 1989-12-19 | 1993-04-06 | Lsi Logic Corporation | Internal capacitor arrangement for semiconductor device assembly |
US5313102A (en) * | 1989-12-22 | 1994-05-17 | Texas Instruments Incorporated | Integrated circuit device having a polyimide moisture barrier coating |
US5200364A (en) * | 1990-01-26 | 1993-04-06 | Texas Instruments Incorporated | Packaged integrated circuit with encapsulated electronic devices |
US5006486A (en) * | 1990-01-29 | 1991-04-09 | Motorola, Inc. | Direct contact TAB method |
US5031025A (en) * | 1990-02-20 | 1991-07-09 | Unisys Corporation | Hermetic single chip integrated circuit package |
JPH0727927B2 (ja) * | 1990-03-12 | 1995-03-29 | 株式会社東芝 | テープキャリア |
JPH03283459A (ja) * | 1990-03-30 | 1991-12-13 | Hitachi Ltd | 半導体集積回路装置 |
FR2668651A1 (fr) * | 1990-10-29 | 1992-04-30 | Sgs Thomson Microelectronics | Circuit integre a boitier moule comprenant un dispositif de reduction de l'impedance dynamique. |
JPH0828394B2 (ja) * | 1990-11-28 | 1996-03-21 | 三菱電機株式会社 | 半導体装置 |
US5140496A (en) * | 1991-01-02 | 1992-08-18 | Honeywell, Inc. | Direct microcircuit decoupling |
US6219908B1 (en) * | 1991-06-04 | 2001-04-24 | Micron Technology, Inc. | Method and apparatus for manufacturing known good semiconductor die |
US5309324A (en) * | 1991-11-26 | 1994-05-03 | Herandez Jorge M | Device for interconnecting integrated circuit packages to circuit boards |
US5212402A (en) * | 1992-02-14 | 1993-05-18 | Motorola, Inc. | Semiconductor device with integral decoupling capacitor |
JP3138539B2 (ja) * | 1992-06-30 | 2001-02-26 | 三菱電機株式会社 | 半導体装置及びcob基板 |
US5311057A (en) * | 1992-11-27 | 1994-05-10 | Motorola Inc. | Lead-on-chip semiconductor device and method for making the same |
US5367763A (en) * | 1993-09-30 | 1994-11-29 | Atmel Corporation | TAB testing of area array interconnected chips |
GB2284928B (en) * | 1993-12-17 | 1997-07-30 | Michael Lawrence Mcgeary | Laminated tape |
US6127196A (en) * | 1995-09-29 | 2000-10-03 | Intel Corporation | Method for testing a tape carrier package |
SG83700A1 (en) * | 1999-01-28 | 2001-10-16 | United Microelectronics Corp | Multi-chip chip scale package |
JP3615126B2 (ja) | 2000-07-11 | 2005-01-26 | 寛治 大塚 | 半導体回路装置 |
US7190069B2 (en) * | 2001-10-02 | 2007-03-13 | Cardiac Pacemakers, Inc. | Method and system of tape automated bonding |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2205800B1 (de) * | 1972-11-09 | 1976-08-20 | Honeywell Bull Soc Ind | |
JPS5546572A (en) * | 1978-09-30 | 1980-04-01 | Toshiba Corp | Tape carrier for mounting integrated circuit chips |
JPS5854499B2 (ja) * | 1979-03-20 | 1983-12-05 | 富士通株式会社 | 半導体装置の製造方法 |
JPS5636147A (en) * | 1979-08-31 | 1981-04-09 | Matsushita Electric Ind Co Ltd | Semiconductor device and its manufacture |
US4577214A (en) * | 1981-05-06 | 1986-03-18 | At&T Bell Laboratories | Low-inductance power/ground distribution in a package for a semiconductor chip |
USH416H (en) * | 1981-08-31 | 1988-01-05 | Rogers Corporation | High capacitance flexible circuit |
US4587548A (en) * | 1982-04-26 | 1986-05-06 | Amp Incorporated | Lead frame with fusible links |
JPS5954249A (ja) * | 1982-09-22 | 1984-03-29 | Fujitsu Ltd | 半導体装置 |
US4551746A (en) * | 1982-10-05 | 1985-11-05 | Mayo Foundation | Leadless chip carrier apparatus providing an improved transmission line environment and improved heat dissipation |
US4539472A (en) * | 1984-01-06 | 1985-09-03 | Horizon Technology, Inc. | Data processing card system and method of forming same |
US4647959A (en) * | 1985-05-20 | 1987-03-03 | Tektronix, Inc. | Integrated circuit package, and method of forming an integrated circuit package |
US4774635A (en) * | 1986-05-27 | 1988-09-27 | American Telephone And Telegraph Company At&T Bell Laboratories | Semiconductor package with high density I/O lead connection |
-
1988
- 1988-01-15 US US07/145,808 patent/US4903113A/en not_active Expired - Lifetime
- 1988-11-17 JP JP63289037A patent/JPH01181540A/ja active Granted
- 1988-12-13 EP EP88311767A patent/EP0324244B1/de not_active Expired - Lifetime
- 1988-12-13 DE DE3852291T patent/DE3852291T2/de not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE3852291D1 (de) | 1995-01-12 |
US4903113A (en) | 1990-02-20 |
EP0324244A3 (en) | 1990-04-25 |
EP0324244A2 (de) | 1989-07-19 |
EP0324244B1 (de) | 1994-11-30 |
JPH0534826B2 (de) | 1993-05-25 |
JPH01181540A (ja) | 1989-07-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |