SG83700A1 - Multi-chip chip scale package - Google Patents

Multi-chip chip scale package

Info

Publication number
SG83700A1
SG83700A1 SG9900243A SG1999000243A SG83700A1 SG 83700 A1 SG83700 A1 SG 83700A1 SG 9900243 A SG9900243 A SG 9900243A SG 1999000243 A SG1999000243 A SG 1999000243A SG 83700 A1 SG83700 A1 SG 83700A1
Authority
SG
Singapore
Prior art keywords
chip
scale package
chip scale
package
chip chip
Prior art date
Application number
SG9900243A
Inventor
Hsuan Min-Chih
Lin Cheng-Te
Original Assignee
United Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United Microelectronics Corp filed Critical United Microelectronics Corp
Priority to SG9900243A priority Critical patent/SG83700A1/en
Publication of SG83700A1 publication Critical patent/SG83700A1/en

Links

SG9900243A 1999-01-28 1999-01-28 Multi-chip chip scale package SG83700A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG9900243A SG83700A1 (en) 1999-01-28 1999-01-28 Multi-chip chip scale package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG9900243A SG83700A1 (en) 1999-01-28 1999-01-28 Multi-chip chip scale package

Publications (1)

Publication Number Publication Date
SG83700A1 true SG83700A1 (en) 2001-10-16

Family

ID=20430271

Family Applications (1)

Application Number Title Priority Date Filing Date
SG9900243A SG83700A1 (en) 1999-01-28 1999-01-28 Multi-chip chip scale package

Country Status (1)

Country Link
SG (1) SG83700A1 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4903113A (en) * 1988-01-15 1990-02-20 International Business Machines Corporation Enhanced tab package
JPH04279052A (en) * 1991-01-16 1992-10-05 Nec Yamagata Ltd Semiconductor integrated circuit device
US5438224A (en) * 1992-04-23 1995-08-01 Motorola, Inc. Integrated circuit package having a face-to-face IC chip arrangement

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4903113A (en) * 1988-01-15 1990-02-20 International Business Machines Corporation Enhanced tab package
JPH04279052A (en) * 1991-01-16 1992-10-05 Nec Yamagata Ltd Semiconductor integrated circuit device
US5438224A (en) * 1992-04-23 1995-08-01 Motorola, Inc. Integrated circuit package having a face-to-face IC chip arrangement

Similar Documents

Publication Publication Date Title
SG104279A1 (en) Enhanced chip scale package for flip chips
SG99346A1 (en) High performance multi-chip ic package
SG91352A1 (en) Semiconductor package
SG93192A1 (en) Face-to-face multi chip package
EP1087447A4 (en) Light-emitting semiconductor chip
SG89386A1 (en) Semiconductor package including stacked chips
GB2332092B (en) Encapsulating semiconductor chips
AU4974500A (en) Chip scale package
SG93191A1 (en) Multi-chip chip-scale integrated circuit package
SG83700A1 (en) Multi-chip chip scale package
SG85103A1 (en) Multi-chip chip scale package
TW428875U (en) Multi-chip IC packaging structure
TW413397U (en) Chip scale semiconductor package structure
TW413399U (en) Micro chip scale package
TW408855U (en) Chip scale package with die pad
TW529770U (en) Chip scale package
TW462536U (en) Chip package structure
TW420377U (en) Packaging structure of multi-chip IC
TW539241U (en) A multi-chip package
TW560699U (en) Structure of chip package
TW414362U (en) Semiconductor package with chip pad above the chip
TW497757U (en) Multi-chip packaging structure
TW420382U (en) Planar packaging of chips on the lead
TW426226U (en) Thin chip scale package without gold bonding wires
TW588858U (en) Multi-chip package