TW426226U - Thin chip scale package without gold bonding wires - Google Patents

Thin chip scale package without gold bonding wires

Info

Publication number
TW426226U
TW426226U TW88202422U TW88202422U TW426226U TW 426226 U TW426226 U TW 426226U TW 88202422 U TW88202422 U TW 88202422U TW 88202422 U TW88202422 U TW 88202422U TW 426226 U TW426226 U TW 426226U
Authority
TW
Taiwan
Prior art keywords
bonding wires
chip scale
scale package
gold bonding
thin chip
Prior art date
Application number
TW88202422U
Other languages
Chinese (zh)
Inventor
Rung-Jen Juang
Original Assignee
Chipmos Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chipmos Technologies Inc filed Critical Chipmos Technologies Inc
Priority to TW88202422U priority Critical patent/TW426226U/en
Publication of TW426226U publication Critical patent/TW426226U/en

Links

TW88202422U 1999-02-11 1999-02-11 Thin chip scale package without gold bonding wires TW426226U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW88202422U TW426226U (en) 1999-02-11 1999-02-11 Thin chip scale package without gold bonding wires

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW88202422U TW426226U (en) 1999-02-11 1999-02-11 Thin chip scale package without gold bonding wires

Publications (1)

Publication Number Publication Date
TW426226U true TW426226U (en) 2001-03-11

Family

ID=21644984

Family Applications (1)

Application Number Title Priority Date Filing Date
TW88202422U TW426226U (en) 1999-02-11 1999-02-11 Thin chip scale package without gold bonding wires

Country Status (1)

Country Link
TW (1) TW426226U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8426982B2 (en) 2001-03-30 2013-04-23 Megica Corporation Structure and manufacturing method of chip scale package

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8426982B2 (en) 2001-03-30 2013-04-23 Megica Corporation Structure and manufacturing method of chip scale package
US8748227B2 (en) 2001-03-30 2014-06-10 Megit Acquisition Corp. Method of fabricating chip package
US8912666B2 (en) 2001-03-30 2014-12-16 Qualcomm Incorporated Structure and manufacturing method of chip scale package
US9018774B2 (en) 2001-03-30 2015-04-28 Qualcomm Incorporated Chip package

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MK4K Expiration of patent term of a granted utility model