TW471711U - Improved package bonding of semiconductor chip device - Google Patents

Improved package bonding of semiconductor chip device

Info

Publication number
TW471711U
TW471711U TW89222189U TW89222189U TW471711U TW 471711 U TW471711 U TW 471711U TW 89222189 U TW89222189 U TW 89222189U TW 89222189 U TW89222189 U TW 89222189U TW 471711 U TW471711 U TW 471711U
Authority
TW
Taiwan
Prior art keywords
semiconductor chip
chip device
improved package
package bonding
bonding
Prior art date
Application number
TW89222189U
Other languages
Chinese (zh)
Inventor
Ching-Feng Chen
Original Assignee
Promax Johnton Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Promax Johnton Corp filed Critical Promax Johnton Corp
Priority to TW89222189U priority Critical patent/TW471711U/en
Publication of TW471711U publication Critical patent/TW471711U/en

Links

TW89222189U 2000-12-21 2000-12-21 Improved package bonding of semiconductor chip device TW471711U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW89222189U TW471711U (en) 2000-12-21 2000-12-21 Improved package bonding of semiconductor chip device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW89222189U TW471711U (en) 2000-12-21 2000-12-21 Improved package bonding of semiconductor chip device

Publications (1)

Publication Number Publication Date
TW471711U true TW471711U (en) 2002-01-01

Family

ID=21676345

Family Applications (1)

Application Number Title Priority Date Filing Date
TW89222189U TW471711U (en) 2000-12-21 2000-12-21 Improved package bonding of semiconductor chip device

Country Status (1)

Country Link
TW (1) TW471711U (en)

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees