TW534458U - Improved bonding for semiconductor chip package - Google Patents

Improved bonding for semiconductor chip package

Info

Publication number
TW534458U
TW534458U TW89219927U TW89219927U TW534458U TW 534458 U TW534458 U TW 534458U TW 89219927 U TW89219927 U TW 89219927U TW 89219927 U TW89219927 U TW 89219927U TW 534458 U TW534458 U TW 534458U
Authority
TW
Taiwan
Prior art keywords
semiconductor chip
chip package
improved bonding
bonding
improved
Prior art date
Application number
TW89219927U
Other languages
Chinese (zh)
Inventor
Ching-Feng Chen
Original Assignee
Promax Johnton Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Promax Johnton Corp filed Critical Promax Johnton Corp
Priority to TW89219927U priority Critical patent/TW534458U/en
Publication of TW534458U publication Critical patent/TW534458U/en

Links

TW89219927U 2000-11-17 2000-11-17 Improved bonding for semiconductor chip package TW534458U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW89219927U TW534458U (en) 2000-11-17 2000-11-17 Improved bonding for semiconductor chip package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW89219927U TW534458U (en) 2000-11-17 2000-11-17 Improved bonding for semiconductor chip package

Publications (1)

Publication Number Publication Date
TW534458U true TW534458U (en) 2003-05-21

Family

ID=29212670

Family Applications (1)

Application Number Title Priority Date Filing Date
TW89219927U TW534458U (en) 2000-11-17 2000-11-17 Improved bonding for semiconductor chip package

Country Status (1)

Country Link
TW (1) TW534458U (en)

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees