TW582626U - Semiconductor package for central-pad chip - Google Patents

Semiconductor package for central-pad chip

Info

Publication number
TW582626U
TW582626U TW91208991U TW91208991U TW582626U TW 582626 U TW582626 U TW 582626U TW 91208991 U TW91208991 U TW 91208991U TW 91208991 U TW91208991 U TW 91208991U TW 582626 U TW582626 U TW 582626U
Authority
TW
Taiwan
Prior art keywords
central
semiconductor package
pad chip
pad
chip
Prior art date
Application number
TW91208991U
Other languages
Chinese (zh)
Inventor
Wen-Chun Liu
Hung-Tsun Lin
Allen Chen
Jung-Jie Liou
Original Assignee
Walsin Advanced Electronics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Walsin Advanced Electronics filed Critical Walsin Advanced Electronics
Priority to TW91208991U priority Critical patent/TW582626U/en
Publication of TW582626U publication Critical patent/TW582626U/en

Links

TW91208991U 2002-06-13 2002-06-13 Semiconductor package for central-pad chip TW582626U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW91208991U TW582626U (en) 2002-06-13 2002-06-13 Semiconductor package for central-pad chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW91208991U TW582626U (en) 2002-06-13 2002-06-13 Semiconductor package for central-pad chip

Publications (1)

Publication Number Publication Date
TW582626U true TW582626U (en) 2004-04-01

Family

ID=32960592

Family Applications (1)

Application Number Title Priority Date Filing Date
TW91208991U TW582626U (en) 2002-06-13 2002-06-13 Semiconductor package for central-pad chip

Country Status (1)

Country Link
TW (1) TW582626U (en)

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MK4K Expiration of patent term of a granted utility model