TW543922U - Ultra-thin type semiconductor device package structure - Google Patents

Ultra-thin type semiconductor device package structure

Info

Publication number
TW543922U
TW543922U TW91216013U TW91216013U TW543922U TW 543922 U TW543922 U TW 543922U TW 91216013 U TW91216013 U TW 91216013U TW 91216013 U TW91216013 U TW 91216013U TW 543922 U TW543922 U TW 543922U
Authority
TW
Taiwan
Prior art keywords
ultra
semiconductor device
type semiconductor
package structure
device package
Prior art date
Application number
TW91216013U
Other languages
Chinese (zh)
Inventor
Jeng-He Shiu
Yi-Hua Jang
Guei-Hua Liou
Original Assignee
Taiwan Ic Packaging Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Ic Packaging Corp filed Critical Taiwan Ic Packaging Corp
Priority to TW91216013U priority Critical patent/TW543922U/en
Publication of TW543922U publication Critical patent/TW543922U/en

Links

TW91216013U 2002-10-09 2002-10-09 Ultra-thin type semiconductor device package structure TW543922U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW91216013U TW543922U (en) 2002-10-09 2002-10-09 Ultra-thin type semiconductor device package structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW91216013U TW543922U (en) 2002-10-09 2002-10-09 Ultra-thin type semiconductor device package structure

Publications (1)

Publication Number Publication Date
TW543922U true TW543922U (en) 2003-07-21

Family

ID=29708934

Family Applications (1)

Application Number Title Priority Date Filing Date
TW91216013U TW543922U (en) 2002-10-09 2002-10-09 Ultra-thin type semiconductor device package structure

Country Status (1)

Country Link
TW (1) TW543922U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113793810A (en) * 2021-09-22 2021-12-14 宁波港波电子有限公司 Chip glue overflow prevention packaging method and packaging structure
CN113809037A (en) * 2021-09-22 2021-12-17 宁波港波电子有限公司 Chip packaging structure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113793810A (en) * 2021-09-22 2021-12-14 宁波港波电子有限公司 Chip glue overflow prevention packaging method and packaging structure
CN113809037A (en) * 2021-09-22 2021-12-17 宁波港波电子有限公司 Chip packaging structure

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MK4K Expiration of patent term of a granted utility model